CN102543176B - 存储元件和存储装置 - Google Patents

存储元件和存储装置 Download PDF

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Publication number
CN102543176B
CN102543176B CN201110401742.1A CN201110401742A CN102543176B CN 102543176 B CN102543176 B CN 102543176B CN 201110401742 A CN201110401742 A CN 201110401742A CN 102543176 B CN102543176 B CN 102543176B
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CN
China
Prior art keywords
film
layer
magnetization
memory element
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201110401742.1A
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English (en)
Chinese (zh)
Other versions
CN102543176A (zh
Inventor
大森广之
细见政功
别所和宏
肥后丰
山根阳
山根一阳
内田裕行
浅山徹哉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of CN102543176A publication Critical patent/CN102543176A/zh
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Publication of CN102543176B publication Critical patent/CN102543176B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • H10B61/20—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
    • H10B61/22—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors of the field-effect transistor [FET] type
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09—Magnetoresistive devices
    • G01R33/091—Constructional adaptation of the sensor to specific applications
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09—Magnetoresistive devices
    • G01R33/093—Magnetoresistive devices using multilayer structures, e.g. giant magnetoresistance sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09—Magnetoresistive devices
    • G01R33/098—Magnetoresistive devices comprising tunnel junctions, e.g. tunnel magnetoresistance sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/10—Magnetoresistive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/80—Constructional details
    • H10N50/85—Materials of the active region
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/11—Magnetic recording head
    • Y10T428/1107—Magnetoresistive
    • Y10T428/1114—Magnetoresistive having tunnel junction effect
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/11—Magnetic recording head
    • Y10T428/1107—Magnetoresistive
    • Y10T428/1121—Multilayer
    • Y10T428/1129—Super lattice [e.g., giant magneto resistance [GMR] or colossal magneto resistance [CMR], etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/11—Magnetic recording head
    • Y10T428/1107—Magnetoresistive
    • Y10T428/1143—Magnetoresistive with defined structural feature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/11—Magnetic recording head
    • Y10T428/115—Magnetic layer composition

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mram Or Spin Memory Techniques (AREA)
  • Hall/Mr Elements (AREA)
CN201110401742.1A 2010-12-13 2011-12-06 存储元件和存储装置 Expired - Fee Related CN102543176B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010276590A JP2012129225A (ja) 2010-12-13 2010-12-13 記憶素子、メモリ装置
JP2010-276590 2010-12-13

Publications (2)

Publication Number Publication Date
CN102543176A CN102543176A (zh) 2012-07-04
CN102543176B true CN102543176B (zh) 2017-03-01

Family

ID=46199693

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110401742.1A Expired - Fee Related CN102543176B (zh) 2010-12-13 2011-12-06 存储元件和存储装置

Country Status (3)

Country Link
US (1) US8945730B2 (enExample)
JP (1) JP2012129225A (enExample)
CN (1) CN102543176B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9379315B2 (en) * 2013-03-12 2016-06-28 Micron Technology, Inc. Memory cells, methods of fabrication, semiconductor device structures, and memory systems
KR102082328B1 (ko) 2013-07-03 2020-02-27 삼성전자주식회사 수직 자기터널접합을 구비하는 자기 기억 소자
CN104000726B (zh) * 2014-06-09 2017-09-12 嘉兴太美医疗科技有限公司 一种智能药盒系统
JP6616803B2 (ja) * 2017-06-19 2019-12-04 株式会社日立ハイテクノロジーズ 磁気抵抗素子の製造方法、及び磁気抵抗素子
US10832750B2 (en) * 2019-02-22 2020-11-10 Sandisk Technologies Llc Perpendicular spin transfer torque MRAM memory cell with cap layer to achieve lower current density and increased write margin
JP7518524B2 (ja) * 2020-03-13 2024-07-18 国立大学法人京都大学 磁気メモリ素子

Citations (4)

* Cited by examiner, † Cited by third party
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CN101071628A (zh) * 2006-05-12 2007-11-14 索尼株式会社 存储元件和存储器
CN101212018A (zh) * 2006-12-26 2008-07-02 索尼株式会社 存储元件和存储器
CN101226769A (zh) * 2007-01-19 2008-07-23 索尼株式会社 存储元件和存储器
CN101266831A (zh) * 2007-03-15 2008-09-17 索尼株式会社 存储元件和存储器

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CN101114694A (zh) 2002-11-26 2008-01-30 株式会社东芝 磁单元和磁存储器
JP4371781B2 (ja) 2002-11-26 2009-11-25 株式会社東芝 磁気セル及び磁気メモリ
JP2004335931A (ja) * 2003-05-12 2004-11-25 Alps Electric Co Ltd Ｃｐｐ型巨大磁気抵抗効果素子
JP4160945B2 (ja) * 2004-01-30 2008-10-08 Ｔｄｋ株式会社 磁気抵抗効果素子、薄膜磁気ヘッド、ヘッドジンバルアセンブリ、およびハードディスク装置
US8063459B2 (en) * 2007-02-12 2011-11-22 Avalanche Technologies, Inc. Non-volatile magnetic memory element with graded layer
JP2008098523A (ja) * 2006-10-13 2008-04-24 Toshiba Corp 磁気抵抗効果素子および磁気メモリ
JP2009081215A (ja) 2007-09-25 2009-04-16 Toshiba Corp 磁気抵抗効果素子およびそれを用いた磁気ランダムアクセスメモリ
JP2009094104A (ja) * 2007-10-03 2009-04-30 Toshiba Corp 磁気抵抗素子
US8372661B2 (en) * 2007-10-31 2013-02-12 Magic Technologies, Inc. High performance MTJ element for conventional MRAM and for STT-RAM and a method for making the same
FR2931011B1 (fr) * 2008-05-06 2010-05-28 Commissariat Energie Atomique Element magnetique a ecriture assistee thermiquement
JP4772845B2 (ja) * 2008-09-29 2011-09-14 株式会社東芝 磁気ランダムアクセスメモリ及びその製造方法
JP5172808B2 (ja) * 2009-10-13 2013-03-27 株式会社東芝 磁気抵抗効果素子およびそれを用いた磁気ランダムアクセスメモリ
US8300356B2 (en) * 2010-05-11 2012-10-30 Headway Technologies, Inc. CoFe/Ni Multilayer film with perpendicular anistropy for microwave assisted magnetic recording
US8537504B2 (en) * 2010-09-16 2013-09-17 HGST Netherlands B.V. Current-perpendicular-to-plane (CPP) read sensor with ferromagnetic buffer, shielding and seed layers
JP5085703B2 (ja) * 2010-09-17 2012-11-28 株式会社東芝 磁気記録素子および不揮発性記憶装置
US9006704B2 (en) * 2011-02-11 2015-04-14 Headway Technologies, Inc. Magnetic element with improved out-of-plane anisotropy for spintronic applications

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CN101071628A (zh) * 2006-05-12 2007-11-14 索尼株式会社 存储元件和存储器
CN101212018A (zh) * 2006-12-26 2008-07-02 索尼株式会社 存储元件和存储器
CN101226769A (zh) * 2007-01-19 2008-07-23 索尼株式会社 存储元件和存储器
CN101266831A (zh) * 2007-03-15 2008-09-17 索尼株式会社 存储元件和存储器

Also Published As

Publication number Publication date
JP2012129225A (ja) 2012-07-05
US20120148874A1 (en) 2012-06-14
CN102543176A (zh) 2012-07-04
US8945730B2 (en) 2015-02-03

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Granted publication date: 20170301