CN102534562A - 基座、化学气相沉积设备和基板加热方法 - Google Patents
基座、化学气相沉积设备和基板加热方法 Download PDFInfo
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- CN102534562A CN102534562A CN2011104486509A CN201110448650A CN102534562A CN 102534562 A CN102534562 A CN 102534562A CN 2011104486509 A CN2011104486509 A CN 2011104486509A CN 201110448650 A CN201110448650 A CN 201110448650A CN 102534562 A CN102534562 A CN 102534562A
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- 239000000758 substrate Substances 0.000 title claims abstract description 120
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000010438 heat treatment Methods 0.000 title claims abstract description 17
- 239000011358 absorbing material Substances 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 27
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 59
- 230000031700 light absorption Effects 0.000 claims description 46
- 230000008033 biological extinction Effects 0.000 claims description 24
- 239000000126 substance Substances 0.000 claims description 19
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 12
- 229910002804 graphite Inorganic materials 0.000 claims description 12
- 239000010439 graphite Substances 0.000 claims description 12
- 239000011222 crystalline ceramic Substances 0.000 claims description 8
- 229910002106 crystalline ceramic Inorganic materials 0.000 claims description 8
- 229910052594 sapphire Inorganic materials 0.000 claims description 8
- 239000010980 sapphire Substances 0.000 claims description 8
- 239000010453 quartz Substances 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims 1
- 238000005229 chemical vapour deposition Methods 0.000 abstract description 44
- 239000004065 semiconductor Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 238000003475 lamination Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 240000001439 Opuntia Species 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (22)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100133341A KR20120071695A (ko) | 2010-12-23 | 2010-12-23 | 화학 기상 증착 장치용 서셉터, 화학 기상 증착 장치 및 화학 기상 증착 장치를 이용한 기판의 가열 방법 |
KR10-2010-0133341 | 2010-12-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102534562A true CN102534562A (zh) | 2012-07-04 |
CN102534562B CN102534562B (zh) | 2014-12-24 |
Family
ID=45445813
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110448650.9A Expired - Fee Related CN102534562B (zh) | 2010-12-23 | 2011-12-22 | 基座、化学气相沉积设备和基板加热方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20120164347A1 (zh) |
EP (1) | EP2469588A2 (zh) |
JP (1) | JP2012134504A (zh) |
KR (1) | KR20120071695A (zh) |
CN (1) | CN102534562B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109103308A (zh) * | 2018-09-18 | 2018-12-28 | 佛山市国星半导体技术有限公司 | 一种led晶圆及其制作方法 |
TWI830351B (zh) * | 2017-09-21 | 2024-01-21 | 美商應用材料股份有限公司 | 用於半導體製程模組的原位設備 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8535445B2 (en) * | 2010-08-13 | 2013-09-17 | Veeco Instruments Inc. | Enhanced wafer carrier |
TWI654666B (zh) | 2014-01-27 | 2019-03-21 | Veeco Instruments, Inc. | 用於化學氣相沉積系統之具有複合半徑容置腔的晶圓載具 |
JP6532424B2 (ja) * | 2016-03-30 | 2019-06-19 | 三菱電機株式会社 | 基板設置部材、ウェハプレート、およびSiCエピタキシャル基板の製造方法 |
JP7345397B2 (ja) * | 2017-06-23 | 2023-09-15 | ジュソン エンジニアリング カンパニー リミテッド | 基板支持装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0758041A (ja) * | 1993-08-20 | 1995-03-03 | Toshiba Ceramics Co Ltd | サセプタ |
JPH1025200A (ja) * | 1996-07-11 | 1998-01-27 | Nippon Sanso Kk | 成膜用基板および電気素子 |
EP1094502A2 (en) * | 1999-10-18 | 2001-04-25 | Micro C Technologies, Inc. | Platform for supporting a semiconductor substrate and method of supporting a substrate during rapid high temperature processing |
JP2010034372A (ja) * | 2008-07-30 | 2010-02-12 | Sumco Corp | 気相成長装置用のサセプタ及び気相成長装置 |
US20100143579A1 (en) * | 2008-12-10 | 2010-06-10 | Sumco Techxiv Corporation | Method and apparatus for manufacturing epitaxial silicon wafer |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6444027B1 (en) * | 2000-05-08 | 2002-09-03 | Memc Electronic Materials, Inc. | Modified susceptor for use in chemical vapor deposition process |
US6634882B2 (en) * | 2000-12-22 | 2003-10-21 | Asm America, Inc. | Susceptor pocket profile to improve process performance |
KR100972976B1 (ko) * | 2008-05-06 | 2010-07-29 | 삼성엘이디 주식회사 | 서셉터 및 이를 구비하는 화학 기상 증착 장치 |
-
2010
- 2010-12-23 KR KR1020100133341A patent/KR20120071695A/ko not_active Application Discontinuation
-
2011
- 2011-12-20 US US13/331,737 patent/US20120164347A1/en not_active Abandoned
- 2011-12-21 EP EP11194723A patent/EP2469588A2/en not_active Withdrawn
- 2011-12-22 JP JP2011281859A patent/JP2012134504A/ja active Pending
- 2011-12-22 CN CN201110448650.9A patent/CN102534562B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0758041A (ja) * | 1993-08-20 | 1995-03-03 | Toshiba Ceramics Co Ltd | サセプタ |
JPH1025200A (ja) * | 1996-07-11 | 1998-01-27 | Nippon Sanso Kk | 成膜用基板および電気素子 |
EP1094502A2 (en) * | 1999-10-18 | 2001-04-25 | Micro C Technologies, Inc. | Platform for supporting a semiconductor substrate and method of supporting a substrate during rapid high temperature processing |
JP2010034372A (ja) * | 2008-07-30 | 2010-02-12 | Sumco Corp | 気相成長装置用のサセプタ及び気相成長装置 |
US20100143579A1 (en) * | 2008-12-10 | 2010-06-10 | Sumco Techxiv Corporation | Method and apparatus for manufacturing epitaxial silicon wafer |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI830351B (zh) * | 2017-09-21 | 2024-01-21 | 美商應用材料股份有限公司 | 用於半導體製程模組的原位設備 |
US11887879B2 (en) | 2017-09-21 | 2024-01-30 | Applied Materials, Inc. | In-situ apparatus for semiconductor process module |
CN109103308A (zh) * | 2018-09-18 | 2018-12-28 | 佛山市国星半导体技术有限公司 | 一种led晶圆及其制作方法 |
Also Published As
Publication number | Publication date |
---|---|
EP2469588A2 (en) | 2012-06-27 |
CN102534562B (zh) | 2014-12-24 |
KR20120071695A (ko) | 2012-07-03 |
JP2012134504A (ja) | 2012-07-12 |
US20120164347A1 (en) | 2012-06-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SAMSUNG ELECTRONICS CO., LTD. Free format text: FORMER OWNER: SAMSUNG LED CO., LTD. Effective date: 20121122 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20121122 Address after: Gyeonggi Do Korea Suwon Applicant after: Samsung Electronics Co., Ltd. Address before: Gyeonggi Do Korea Suwon Applicant before: Samsung LED Co., Ltd. |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141224 Termination date: 20151222 |
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EXPY | Termination of patent right or utility model |