CN102510911A - 层叠结构体及其制造方法 - Google Patents

层叠结构体及其制造方法 Download PDF

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CN102510911A
CN102510911A CN2011800027282A CN201180002728A CN102510911A CN 102510911 A CN102510911 A CN 102510911A CN 2011800027282 A CN2011800027282 A CN 2011800027282A CN 201180002728 A CN201180002728 A CN 201180002728A CN 102510911 A CN102510911 A CN 102510911A
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前川贵诚
栗原敏也
小庄孝志
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JX Nippon Mining and Metals Corp
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Abstract

本发明提供杂质对铟靶的混入得到良好地抑制的层叠结构体及其制造方法。层叠结构体具备背板,在背板上形成的包含由选自Fe、W、Ta、Te、Nb、Mo、S和Si中的1种以上的金属构成的薄膜的杂质扩散防止层,和在杂质扩散防止层上形成的铟靶。

Description

层叠结构体及其制造方法
技术领域
本发明涉及层叠结构体及其制造方法,更具体地说,涉及具备背板和铟靶的层叠结构体及其制造方法。
背景技术
铟用作Cu-In-Ga-Se系(CIGS系)薄膜太阳能电池的光吸收层形成用的溅射靶。
在以往,如专利文献1所公开,铟靶是通过在背板上附着铟合金等后,向模具中浇注铟并进行铸造来制造的。
专利文献1:日本特公昭63-44820号公报。
发明内容
专利文献1中,记载通过在背板上以数μm的厚度形成镍薄膜、由此可以防止背板中的杂质向铟扩散的主旨。但是,在实施例中并未测定铟靶中的杂质浓度。此外,本发明人实施专利文献1中记载的实施例后发现,作为背板的构成元素的铜通过镍薄膜以15ppm含有在铟靶内。
此外,作为接合材料,使用锡等杂质元素与铟的合金时,在溅射使用后将铟靶回收进行再利用时,除去铟以外的杂质元素、管理浓度耗费工夫,在制造效率和制造成本方面存在问题。
因此,本发明的课题在于,提供良好地抑制杂质对铟靶的混入的层叠结构体及其制造方法。
本发明人为了解决上述课题而进行深入地研究后发现,通过在背板与铟靶之间形成包含由特定的金属构成的薄膜的杂质扩散防止层,可以制作良好地抑制杂质对铟靶的混入的层叠结构体,由此可以节省在铟靶的再利用时除去杂质、管理浓度的工夫以及成本。
基于以上发现完成的本发明,在一个方面为层叠结构体,其具备背板,在背板上形成的包含由选自Fe、W、Ta、Te、Nb、Mo、S和Si中的1种以上的金属构成的薄膜的杂质扩散防止层,和在杂质扩散防止层上形成的铟靶。
本发明涉及的层叠结构体在一个实施方式中,杂质扩散防止层通过由Fe构成的薄膜形成。
本发明涉及的层叠结构体在另一个实施方式中,由Fe构成的薄膜通过非电解镀敷形成。
本发明涉及的层叠结构体在进而另一个实施方式中,杂质扩散防止层为5~100μm。
本发明涉及的层叠结构体在进而另一个实施方式中,铟靶中的铜浓度为5ppm以下,铁浓度为8ppm以下。
本发明在另一方面为层叠结构体的制造方法,其具备:准备背板的步骤;在背板上形成包含由选自Fe、W、Ta、Te、Nb、Mo、S和Si中的1种以上的金属构成的薄膜的杂质扩散防止层的步骤;和通过将铟原料在背板上熔化铸造来形成铟靶的步骤。
本发明涉及的层叠结构体的制造方法在一个实施方式中,杂质扩散防止层通过由Fe构成的薄膜形成。
本发明涉及的层叠结构体的制造方法在另一个实施方式中,由Fe构成的薄膜通过非电解镀敷形成。
根据本发明,可以提供良好地抑制杂质对铟靶的混入的层叠结构体及其制造方法。
具体实施方式
本发明涉及的层叠结构体具备背板、在背板上形成的杂质扩散防止层、以及在杂质扩散防止层上形成的铟靶。对背板的形状不特别限定,可以形成为具有规定的厚度和直径的圆盘状。对背板的构成材料不特别限定,例如可以由铜等金属材料形成。如上所述,杂质扩散防止层在背板与铟靶之间形成,具有防止杂质从背板扩散到铟靶的功能。作为杂质扩散防止层的构成材料,选择背板的构成材料不易扩散的材料。作为这种杂质扩散防止层的构成材料,例如可以使用Fe、W、Ta、Te、Nb、Mo、S和Si等。此外,例如背板以铜作为主要构成材料时,优选杂质扩散防止层由良好地抑制铜的扩散的铁形成。此外,由于铁在铟中的固溶限度非常小,几乎没有由于在铟中的熔化而导致的混入。因此,若杂质扩散防止层为铁制的薄膜,则还可以良好地抑制杂质扩散防止层的构成材料本身对铟靶的扩散。杂质扩散防止层的厚度优选为5~100μm。若杂质扩散防止层小于5μm,则得不到充分的杂质扩散防止效果。杂质扩散防止层即使超过100μm,由于杂质扩散防止效果饱和,因此形成更厚的厚膜的必要性小。铟靶由于设置了杂质扩散防止层,杂质混入靶中得到良好地抑制。具体地说,在铟靶中有可能含有铜和铁作为杂质时,优选铜浓度为5ppm以下、铁浓度为8ppm以下,进一步优选铜浓度为3ppm以下、铁浓度为4ppm以下。此外,根据需要,除了杂质扩散防止层之外,在背板与铟靶之间还可以形成用于使它们的接合性良好的薄膜。
接着,按照顺序对本发明涉及的层叠结构体的制造方法的适合例子进行说明。首先,准备具有规定的厚度的背板,在该背板上形成杂质扩散防止层。对杂质扩散防止层的形成方法不特别限定,根据构成材料,可以通过非电解镀敷、溅射、材料的涂布及干燥等来形成。使杂质扩散防止层为铁制的薄膜时,该铁制的薄膜优选通过作为简单且低成本的薄膜形成方法的非电解镀敷来形成。
接着,在形成有杂质扩散防止层的背板上设置圆筒状的铸模。接着将原料铟熔化,浇注到该铸模中。若使用的原料铟含有杂质,则利用该原料制作的太阳能电池的转换效率降低,由于这种原因期望具有更高的纯度,例如可以使用纯度为99.99质量%以上的铟。然后,冷却至室温,形成铟靶。冷却速度可以为利用空气进行的自然放冷。此外,根据需要,可以对铟靶进行表面抛光等表面处理。
如此得到的层叠结构体,可以合适地用作CIGS系薄膜太阳能电池用光吸收层的溅射靶。
[实施例]
以下,同时示出本发明的实施例和比较例,这些实施例是为了更好地理解本发明及其优点而提供的,没有限定发明的意图。
(实施例1)
准备直径250mm、厚度5mm的铜制背板。然后,将铁浓度2mol/L的氯化铁溶液、作为表面活性剂的辛基硫酸钠(0.5×10-3mol/L)和氯化钙(1.5mol/L)混合而成的溶液作为镀敷液,使用该镀敷液通过非电解镀敷,在背板上形成膜厚20μm的铁制的薄膜(杂质扩散防止层)。
接着,形成有铁制的薄膜的背板上的周围用直径205mm、高度7mm的圆筒状的铸模包围,向其内部浇注在160℃下熔化的铟原料(纯度5N)后,冷却至室温,形成圆盘状的铟靶(直径204mm×厚度6mm),由此制造层叠结构体。
(实施例2)
除了使铁制的薄膜的膜厚为100μm之外,在与实施例1相同的条件下制作层叠结构体。
(实施例3)
除了使铁制的薄膜的膜厚为5μm之外,在与实施例1相同的条件下制作层叠结构体。
(实施例4)
除了使铁制的薄膜的膜厚为4μm之外,在与实施例1相同的条件下制作层叠结构体。
(实施例5)
除了使铁制的薄膜的膜厚为120μm之外,在与实施例1相同的条件下制作层叠结构体。
(比较例1)
除了不形成铁制的薄膜之外,在与实施例1相同的条件下制作层叠结构体。
(评价)
对于实施例和比较例中得到的层叠结构体的铟靶,通过ICP分析法测定杂质浓度。
各测定结果如表1所示。
[表1]
Figure 79399DEST_PATH_IMAGE001
可知实施例1~3中,由于铁制的薄膜(杂质扩散防止层)的厚度为5~100μm,铜和铁对铟的扩散得到良好地抑制。
实施例4中,由于形成铁制的薄膜(杂质扩散防止层)的厚度为4μm的稍薄的膜,铟中的铜的浓度比实施例3多。但是,铟中的铜浓度为7ppm,因此可以说铜的扩散得到良好地抑制。
实施例5中,形成铁制的薄膜(杂质扩散防止层)的厚度为120μm的稍厚的膜,铟中的铁的浓度比实施例2多。但是,铟中的铜浓度低于1ppm,因此可以说铜的扩散得到良好地抑制。
比较例1中,未形成铁制的薄膜(杂质扩散防止层),铜对铟靶的扩散量增多,铟靶中的铜浓度非常大、为3000ppm。

Claims (8)

1.层叠结构体,其具备背板,在该背板上形成的包含由选自Fe、W、Ta、Te、Nb、Mo、S和Si中的1种以上的金属构成的薄膜的杂质扩散防止层,和在该杂质扩散防止层上形成的铟靶。
2.如权利要求1所述的层叠结构体,其中,所述杂质扩散防止层通过由Fe构成的薄膜形成。
3.如权利要求2所述的层叠结构体,其中,所述由Fe构成的薄膜通过非电解镀敷形成。
4.如权利要求1~3中任意一项所述的层叠结构体,其中,所述杂质扩散防止层为5~100μm。
5.如权利要求1~4中任意一项所述的层叠结构体,其中,所述铟靶中的铜浓度为5ppm以下,铁浓度为8ppm以下。
6.层叠结构体的制造方法,其具备:
准备背板的步骤,
在所述背板上形成包含由选自Fe、W、Ta、Te、Nb、Mo、S和Si中的1种以上的金属构成的薄膜的杂质扩散防止层的步骤,和
通过将铟原料在所述背板上熔化铸造来形成铟靶的步骤。
7.如权利要求6所述的层叠结构体的制造方法,其中,所述杂质扩散防止层通过由Fe构成的薄膜形成。
8.如权利要求7所述的层叠结构体的制造方法,其中,所述由Fe构成的薄膜通过非电解镀敷形成。
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