CN102498549A - 沟槽式化学机械抛光抛光垫 - Google Patents

沟槽式化学机械抛光抛光垫 Download PDF

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Publication number
CN102498549A
CN102498549A CN2010800414168A CN201080041416A CN102498549A CN 102498549 A CN102498549 A CN 102498549A CN 2010800414168 A CN2010800414168 A CN 2010800414168A CN 201080041416 A CN201080041416 A CN 201080041416A CN 102498549 A CN102498549 A CN 102498549A
Authority
CN
China
Prior art keywords
polishing pad
pad
groove
polishing
overlap joint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010800414168A
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English (en)
Chinese (zh)
Inventor
蔡庆铭
F.孙
刘圣焕
徐嘉成
A.纳曼
邱浩光
D.卡纳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials Inc
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of CN102498549A publication Critical patent/CN102498549A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
CN2010800414168A 2009-07-16 2010-07-15 沟槽式化学机械抛光抛光垫 Pending CN102498549A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US27106809P 2009-07-16 2009-07-16
US61/271,068 2009-07-16
PCT/US2010/042073 WO2011008918A2 (en) 2009-07-16 2010-07-15 Grooved cmp polishing pad

Publications (1)

Publication Number Publication Date
CN102498549A true CN102498549A (zh) 2012-06-13

Family

ID=43450188

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010800414168A Pending CN102498549A (zh) 2009-07-16 2010-07-15 沟槽式化学机械抛光抛光垫

Country Status (7)

Country Link
US (1) US20110014858A1 (ja)
JP (1) JP2012533888A (ja)
KR (1) KR101478414B1 (ja)
CN (1) CN102498549A (ja)
SG (2) SG10201404152UA (ja)
TW (1) TWI519384B (ja)
WO (1) WO2011008918A2 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104736297A (zh) * 2012-12-26 2015-06-24 东洋橡胶工业株式会社 层叠抛光垫的制造方法
CN105793962A (zh) * 2013-10-18 2016-07-20 嘉柏微电子材料股份公司 具有偏置的同心凹槽图案的边缘排除区域的化学机械抛光抛光垫
CN112720282A (zh) * 2020-12-31 2021-04-30 湖北鼎汇微电子材料有限公司 一种抛光垫
CN113829176A (zh) * 2021-08-31 2021-12-24 北京航天控制仪器研究所 一种用于铍材镜体研磨抛光的研磨平板及研磨抛光方法
CN114274043A (zh) * 2021-12-29 2022-04-05 湖北鼎汇微电子材料有限公司 一种抛光垫

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009018434B4 (de) * 2009-04-22 2023-11-30 Ev Group Gmbh Aufnahmeeinrichtung zur Aufnahme von Halbleitersubstraten
DE102011082777A1 (de) * 2011-09-15 2012-02-09 Siltronic Ag Verfahren zum beidseitigen Polieren einer Halbleiterscheibe
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
SG11201703114QA (en) 2014-10-17 2017-06-29 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
KR102609439B1 (ko) 2015-10-30 2023-12-05 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10875146B2 (en) * 2016-03-24 2020-12-29 Rohm And Haas Electronic Materials Cmp Holdings Debris-removal groove for CMP polishing pad
USD816774S1 (en) * 2016-03-25 2018-05-01 Craig Franklin Edevold Spiral pattern for cribbage board
EP3571009A4 (en) * 2017-01-20 2021-01-20 Applied Materials, Inc. THIN PLASTIC POLISHING ARTICLE FOR CMP APPLICATIONS
USD855110S1 (en) * 2017-01-31 2019-07-30 Gary Peterson Game board
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
JP7299970B2 (ja) 2018-09-04 2023-06-28 アプライド マテリアルズ インコーポレイテッド 改良型研磨パッドのための配合物
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040072516A1 (en) * 1997-05-15 2004-04-15 Osterheld Thomas H. Polishing pad having a grooved pattern for use in chemical mechanical polishing apparatus
US6736709B1 (en) * 2000-05-27 2004-05-18 Rodel Holdings, Inc. Grooved polishing pads for chemical mechanical planarization
CN1647255A (zh) * 2002-04-03 2005-07-27 东邦工程株式会社 抛光垫及使用该垫制造半导体衬底的方法
CN101024260A (zh) * 2006-02-24 2007-08-29 三芳化学工业股份有限公司 具有表面纹路的抛光垫和其制造方法与制造装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4615813B2 (ja) * 2000-05-27 2011-01-19 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 化学機械平坦化用の研磨パッド
JP3849582B2 (ja) * 2002-06-03 2006-11-22 Ｊｓｒ株式会社 研磨パッド及び複層型研磨パッド
JP3849594B2 (ja) * 2002-06-28 2006-11-22 Ｊｓｒ株式会社 研磨パッド
EP1369204B1 (en) * 2002-06-03 2006-10-11 JSR Corporation Polishing pad and process for manufacturing a polishing pad
JP2004071985A (ja) * 2002-08-08 2004-03-04 Jsr Corp 半導体ウェハ用研磨パッドの加工方法及び半導体ウェハ用研磨パッド
JP2004167605A (ja) * 2002-11-15 2004-06-17 Rodel Nitta Co 研磨パッドおよび研磨装置
JP3872081B2 (ja) * 2004-12-29 2007-01-24 東邦エンジニアリング株式会社 研磨用パッド
US8192257B2 (en) * 2006-04-06 2012-06-05 Micron Technology, Inc. Method of manufacture of constant groove depth pads

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040072516A1 (en) * 1997-05-15 2004-04-15 Osterheld Thomas H. Polishing pad having a grooved pattern for use in chemical mechanical polishing apparatus
US6736709B1 (en) * 2000-05-27 2004-05-18 Rodel Holdings, Inc. Grooved polishing pads for chemical mechanical planarization
CN1647255A (zh) * 2002-04-03 2005-07-27 东邦工程株式会社 抛光垫及使用该垫制造半导体衬底的方法
CN101024260A (zh) * 2006-02-24 2007-08-29 三芳化学工业股份有限公司 具有表面纹路的抛光垫和其制造方法与制造装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104736297A (zh) * 2012-12-26 2015-06-24 东洋橡胶工业株式会社 层叠抛光垫的制造方法
CN105793962A (zh) * 2013-10-18 2016-07-20 嘉柏微电子材料股份公司 具有偏置的同心凹槽图案的边缘排除区域的化学机械抛光抛光垫
CN105793962B (zh) * 2013-10-18 2019-03-29 嘉柏微电子材料股份公司 具有偏置的同心凹槽图案的边缘排除区域的化学机械抛光抛光垫
CN112720282A (zh) * 2020-12-31 2021-04-30 湖北鼎汇微电子材料有限公司 一种抛光垫
CN113829176A (zh) * 2021-08-31 2021-12-24 北京航天控制仪器研究所 一种用于铍材镜体研磨抛光的研磨平板及研磨抛光方法
CN114274043A (zh) * 2021-12-29 2022-04-05 湖北鼎汇微电子材料有限公司 一种抛光垫
CN114274043B (zh) * 2021-12-29 2023-02-24 湖北鼎汇微电子材料有限公司 一种抛光垫

Also Published As

Publication number Publication date
KR20120042985A (ko) 2012-05-03
JP2012533888A (ja) 2012-12-27
TWI519384B (zh) 2016-02-01
TW201121711A (en) 2011-07-01
SG177625A1 (en) 2012-02-28
WO2011008918A3 (en) 2011-04-28
US20110014858A1 (en) 2011-01-20
KR101478414B1 (ko) 2014-12-31
WO2011008918A2 (en) 2011-01-20
SG10201404152UA (en) 2014-09-26

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Application publication date: 20120613