CN102484147A - 具有纳米线的多结光生伏打电池 - Google Patents

具有纳米线的多结光生伏打电池 Download PDF

Info

Publication number
CN102484147A
CN102484147A CN2010800266734A CN201080026673A CN102484147A CN 102484147 A CN102484147 A CN 102484147A CN 2010800266734 A CN2010800266734 A CN 2010800266734A CN 201080026673 A CN201080026673 A CN 201080026673A CN 102484147 A CN102484147 A CN 102484147A
Authority
CN
China
Prior art keywords
junction
substrate
nano wire
photovoltaic battery
doped region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN2010800266734A
Other languages
English (en)
Other versions
CN102484147B (zh
Inventor
J.M.奥尔森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sol Voltaics AB
Original Assignee
Sol Voltaics AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sol Voltaics AB filed Critical Sol Voltaics AB
Publication of CN102484147A publication Critical patent/CN102484147A/zh
Application granted granted Critical
Publication of CN102484147B publication Critical patent/CN102484147B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
    • H01L31/078Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier including different types of potential barriers provided for in two or more of groups H01L31/062 - H01L31/075
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0352Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0352Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
    • H01L31/035272Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
    • H01L31/03529Shape of the potential jump barrier or surface barrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/0475PV cell arrays made by cells in a planar, e.g. repetitive, configuration on a single semiconductor substrate; PV cell microarrays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
    • H01L31/061Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being of the point-contact type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
    • H01L31/068Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
    • H01L31/0687Multiple junction or tandem solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
    • H01L31/068Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
    • H01L31/0693Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells the devices including, apart from doping material or other impurities, only AIIIBV compounds, e.g. GaAs or InP solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
    • H01L31/072Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN heterojunction type
    • H01L31/0725Multiple junction or tandem solar cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/544Solar cells from Group III-V materials
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/70Nanostructure
    • Y10S977/762Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/902Specified use of nanostructure
    • Y10S977/932Specified use of nanostructure for electronic or optoelectronic application
    • Y10S977/948Energy storage/generating using nanostructure, e.g. fuel cell, battery
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00Nanotechnology
    • Y10S977/902Specified use of nanostructure
    • Y10S977/932Specified use of nanostructure for electronic or optoelectronic application
    • Y10S977/953Detector using nanostructure
    • Y10S977/954Of radiant energy

Abstract

一种用于将光转换为电能的多结光生伏打电池,所述多结光生伏打电池包括衬底(3),所述衬底(3)具有表面(31),其中所述衬底(3)的所述表面(31)处的区域(4)被掺杂以使得第一p-n结(11)被形成在所述衬底(3)中。光生伏打电池具有纳米线(2),纳米线(2)被布置在所述衬底(3)的所述表面(31)上,在所述掺杂区域(4)位于所述衬底(3)中的位置处,使得第二p-n结(12)被形成在所述纳米线(2)处并与所述第一p-n结(11)串联连接。

Description

具有纳米线的多结光生伏打电池
技术领域
本发明涉及包括作为有源部件的纳米线的光生伏打电池。
背景技术
近年来随着能量价格稳步达到高水平并且随着使用化石燃料的缺点变得越来越明显,对太阳能电池技术的兴趣一直在增加。此外,技术突破暗示着大规模生产高效率光生伏打(太阳能)电池是可能的。
例如,用半导体材料加工整流结(如p-n结和肖特基二极管)以制造用于太阳能电池器件以及光电检测器中的光生伏打电池。光生伏打电池在光照射p-n结时将光转换为电并产生成相反带电粒子对:电子和空穴。这些电荷被整流结分离以产生电流。光电检测器按类似原理工作。
传统的光生伏打电池经常是由至少两个不对称掺杂的半导体层构成的平面器件,其中所述至少两个不对称掺杂的半导体层具有前触头(contact)和后触头。对于传统的光生伏打电池来说,光在由前触头形成的栅格之间进入,在栅格之间,光被n型层和p型层吸收,产生了电子-空穴对。电子-空穴对被p-n结分离,并且横跨光生伏打电池两端生成了电压。通过横跨电池触头两端放置负载而获得有用功率,并因此光生伏打电池将辐射直接转换为有用的电能。
限制从光到电的转换效率的一个因素是横跨p-n结两端的反转电流泄露。对于平面电池,反转电流泄露随着p-n结的面积增加而增加。
有许多种方式来减小平面电池的不期望的反转电流泄露,但是无论使用什么方法,反转电流泄露的减小都受限于p-n结的面积,并且对于平面电池来说,减小面积仅意味着电池更小并因此收集更少的光。通过利用不同的电池几何结构(非平面),可以减小p-n结的面积而不会减小电池的总面积。
一种成功的非平面几何结构是在例如美国专利4,234,352中描述的硅点结(dot-junction)光生伏打电池。在该专利中,披露了点结电池,其中硅衬底的一个表面具有一系列局部掺杂的n+区域和p+区域(点结),使得掺杂区域的面积远小于点结电池的总面积。p+区域形成大体积的p-n结,n+区域形成用于n型触头的低电阻率的区。
然而,即使反转电流泄露是有限的,点结电池的效率仍不是最佳的。例如,由于每个点结是单带隙太阳能电池,由于不能够有效地转换光子在太阳光谱中拥有的宽范围能量而导致效率是有限的。在理想的限制中,只有能量等于带隙能量的光子被有效地转换为电。损失了低于电池材料的带隙的光子;它们或者穿过电池或者仅被转换为材料中的热。由于载流子张弛到带的边缘,因而超过带隙能量的光子中的能量也被损失成热。
因此,即使点结光生伏打电池在减小反转电流泄露方面是有优势的,点结太阳能电池仍具有光子能效率方面的弱势,即,很大部分的太阳光谱被损失成热并且未被转换成电。
此外,专利文献EP1944811反映了背景技术。
发明内容
鉴于前述内容,本发明的目的在于提供对上述技术和现有技术的改进。更具体地,目的在于改进点结光生伏打电池以使得光生伏打电池更有效地将光转换为电。
因此,提供了一种用于将光转换为电能的多结光生伏打电池。该光生伏打电池包括衬底,衬底具有表面,其中衬底的该表面处的区域被掺杂以使得第一p-n结被形成在衬底中。该光生伏打电池具有纳米线,纳米线被布置在衬底的表面上且在掺杂区域位于衬底中的位置处,使得第二p-n结被形成在纳米线处并与第一p-n结串联连接。
“在”纳米线处形成的p-n结的含义包括以下可能性:p-n结的p型部分和n型部分两者都被形成在纳米线中,或者纳米线只包括p-n结的p型部分和n型部分之一而该结的另一部分被形成在衬底中掺杂区域处或者在光生伏打电池的任意其他部分处,例如,在与纳米线连接的触头处。
由于纳米线被布置在衬底的表面上,因而可以改为说从衬底的表面生长纳米线,或者纳米线位于衬底的表面上或表面处。
本发明的光生伏打电池是有优势的,原因在于两个p-n结(二极管)中的每个都可以具有各自的特征带隙能量,该特征带隙能量用于吸收光谱的相应部分上的光。这两个p-n结被选择为组合在一起尽可能多地吸收太阳光谱,从而尽可能多地从太阳能生成电,这增大了太阳能电池的效率。简而言之,由于纳米线被布置在衬底中的掺杂区域处,因而第二p-n结被布置为靠近第一p-n结,因此所得到的光生伏打电池采用所谓的多结光生伏打电池的原理和优势。
此外,由于纳米线被用于形成第二p-n结,实现了附加的优势。这些优势包括,例如,与传统的平面III-V多结太阳能电池相比,由于可以更容易地在纳米线中布置更多的p-n结元件因而可以实现更高的效率值,降低了出于避免位错而对大衬底局域上的完美晶格匹配的需要,并且由于更容易获得更高程度的成份同质而改善了功能性。
通常,第一p-n结是点接触二极管而第二p-n结是轴向光电二极管或径向光电二极管。还应当注意,纳米线可以非常短以使得它具有更像桩的结构而非拉长的结构。然而,即使纳米线可以非常短,除了用于成核(生长)时间的不同时间值之外,该纳米线与较长纳米线的生长方式相同。
通常,可以说,衬底可以包括不同掺杂部分,其中一个部分包括掺杂区域而其余部分未被掺杂或按照与掺杂区域不同的掺杂方式掺杂。衬底的掺杂区域和其余部分之间的功能差异可以在于该区域被掺杂以使得其在衬底中形成第一p-n结。因此,掺杂区域可以由于其掺杂以及形成p-n结而有所不同。
只要可以形成第一p-n结,掺杂区域的精确尺寸就与多结光生伏打电池背后的原理不相关。然而,掺杂区域的尺寸通常可以小于900纳米。更具体地,掺杂区域的尺寸可以在例如100至300纳米的范围内,并且该尺寸可以指掺杂区域的直径,或者在从衬底的表面观看时该尺寸可以指代掺杂区域的深度。
第二p-n结可以被形成在纳米线中,即,纳米线可以被配置为包括第二p-n结,这意味着纳米线可以包括第二结,即,包括该结的p型部分和n型部分,这在生长纳米线并相对于衬底或电触头呈一定关系布置该线时提供了高度的灵活性。
掺杂区域可以通过离子注入、掺杂剂扩散、异质外延和同质外延中的任一种形成,这为在其表面处具有掺杂区域的衬底提供了灵活制造。
纳米线可以与掺杂区域直接接触并且更具体地,纳米线可以生长在(即,可以被“布置在”)掺杂区域上。这非常有优势,原因在于可以确保增大光生伏打电池的效率,这基于理解到在第二p-n结处未吸收的光谱部分可以被第一p-n结吸收。优选地,p-n结被配置为使得具有更短波长的光被第二(上方的)p-n结吸收,而具有较长波长的光被第一(下方的)p-n结吸收。
纳米线可以与掺杂区域有外延关系,为了增大太阳能电池的效率,这提供了这两个p-n结的带隙配置的更好适配。
多结光生伏打电池可以包括第三p-n结,该第三p-n结被布置在第一p-n结和第二p-n结之间。第三p-n结优选地是隧道二极管(Esaki二极管),该隧道二极管在生长纳米线的工艺期间形成,并且满足在第一和第二p-n结之间建立电连接的目的。替代第三p-n结,或作为第三p-n结的补充,多结光生伏打电池可以包括金属导电连接元件,金属导电连接元件被布置在第一p-n结和第二p-n结之间,用于串联连接第一和第二p-n结。
纳米线可以被壳围绕,该壳在表面的法线方向上逐渐变细,该壳被掺杂以使得p-n结被形成在壳和纳米线之间。这允许壳的纵横比的优化,使得更大或更小量的高能光将能够穿过纳米线结构(包括壳)并到达形成在衬底中的第一p-n结。在该特定实施例中,这给出了一种更有效的多结光生伏打电池,这是由于第一(底部)电池可能要不然缺乏光,因此将全部电流限制在该器件中。
衬底可以由半导体材料制成,该半导体材料由硅或掺杂的硅、或者锗或掺杂的锗、或者可选的硅锗合金组成。纳米线可以由包括III-V族半导体材料的半导体材料制成,而III-V材料可以是使掺杂剂原子进入衬底中以产生掺杂区域的扩散源。这些材料选择中的每种选择以及尤其是这些选择的组合允许多结太阳能电池的低成本制造。
承上所述,衬底可以包括III-V材料,III-V材料起掺杂剂原子的作用以产生(一个或多个)掺杂区域。
多结光生伏打电池可以被配置为将衬底的该表面布置为面向光源。当光生伏打电池工作时,这意味着表面的掺杂区域(即,点接触二极管)被布置在衬底的意在面向光的那侧上。这与许多已知的点接触太阳能电池不同,并且当它有效地利用太阳能产生电时,导致第一p-n结和第二p-n结之间的有效协作。
多结光生伏打电池可以包括衬底的该表面处的多个区域,每个区域都被掺杂以使得这些区域在衬底中形成相应的第一p-n结,其中从衬底的表面生长多个纳米线(即,“在衬底的表面上布置多个纳米线”),每个纳米线在相应掺杂区域的位置处,使得每个纳米线形成与相应的第一p-n结串联连接的第二p-n结。
这里,多个意味着多于一个,但是在实践中,至少1×104mm-2对掺杂区域和纳米线(即成对的第一和第二p-n结)被形成在衬底上。
当多结光生伏打电池包括衬底的该表面处的多个区域时,然后每个区域被掺杂使得这些区域形成衬底中的相应的第一p-n结,并且从衬底的该表面生长多个纳米线(即,“在衬底的表面上布置多个纳米线”)。然后每个纳米线被布置在相应的掺杂区域的位置处,使得每个纳米线形成与相应的第一p-n结串联连接的第二p-n结。在多个掺杂区域和纳米线的情况下,如果可应用,则可以针对掺杂区域和纳米线中的几个或全部实施上述各种特征。
附图说明
现在将通过示例的方式参照附图描述本发明的实施例,在附图中:
图1示出了根据本发明的多结太阳能电池,
图2是图1的太阳能电池的局部视图,
图3-7是类似于图2的视图的局部视图,但是示出了太阳能电池的其他实施例,
图8a-8f示出了如何根据第一实施例制造太阳能电池结构,以及
图9a-9e示出了如何根据第二实施例制造太阳能电池结构。
具体实施方式
参照图1,多结光生伏打(太阳能)电池1包括平面衬底3,平面衬底3由p掺杂的Si(硅)制成。衬底3具有上表面31,上表面31意在面向入射在太阳能电池1上的光L,即,上表面31是衬底3的上前侧。例如Al(铝)制成的平面后触头9布置在衬底3的与上表面31相对的下表面上。n掺杂的区域4位于衬底3的上表面31。该区域4是拱顶形的,其中区域4的平面部分与上表面31形成的平面对准。因此,拱顶形区域4的弯曲部分延伸到衬底3中。然而,区域4的广度小于衬底3的总厚度。纳米线2位于衬底3上并在掺杂区域4的中心位置处。这意味着纳米线2的纵向限定的几何轴延伸通过掺杂区域4的中心,或者换句话说,在表面31的法线方向N上看,纳米线2被布置在掺杂区域4的顶部。
优选地,纳米线2与表面31的法线方向N平行,但是还可以被布置为与法线方向N成倾斜关系。
衬底3的上表面31可以被覆盖有SiO2(二氧化硅)绝缘层8,而纳米线2突出通过该层8并因此建立与衬底3的电接触。用于绝缘层8的其他材料包括SixNy,AlxOy,HfO2和SiOxNy
在支撑的绝缘层7中嵌入了纳米线2,绝缘层7为纳米线2提供支撑。支撑层7被布置在绝缘层8的顶部并且在该特定实施例中由绝缘钝化电介质材料制成,绝缘钝化电介质材料诸如SixNy,AlxOy,HfO2,SiOxNy、聚合物、硼磷硅玻璃或旋涂玻璃等。可选地,纳米线被空气围绕。
支撑层7进而被TCO 6(透明导电氧化层)覆盖,TCO 6与纳米线2电接触,这是因为纳米线2的最上方部分突出到TCO 6中。层6可以可替代地由导电聚合物或任意其他透明导体构成。即使未示出,薄金属层也可以被布置在纳米线和TCO之间,用于构成到纳米线的欧姆接触。TCO 6和后触头9进而被配置为连接到使用由多结太阳能电池1生成的电的电器件(未示出)。
进一步参照图2,细节放大地示出了在图1中的多结太阳能电池1中由A表示的部分。此处,p掺杂的衬底3和n掺杂的区域4形成第一p-n结11,即,点接触二极管。当然第一p-n结11由形成了衬底6的p掺杂的Si和掺杂区域4的n掺杂的Si之间的边界的完整表面形成,而不仅是参考标号11示出的部分。
在掺杂区域4上生长纳米线2或纳米线2位于掺杂区域4上,并且纳米线2的最下方部分22由n+掺杂GaAsP(镓砷磷)制成。纳米线2在n+掺杂GaAsP的部分22上的部分形成了纳米线2的中间部分23,并且也由GaAsP制成,但是为P+掺杂的而非n+掺杂的。这意味着重掺杂的(p+-n+)结13被形成在纳米线2的下方部分22和中间部分23之间,结13一般形成隧道二极管。
纳米线2在中间纳米线部分23上的部分形成了纳米线2的上方部分24。该部分24是p掺杂的并且由例如GaAs(砷化镓)制成,并且被n掺杂GaAs的层25围绕,层25从绝缘层8延伸到纳米线2的顶部。此处,p掺杂的上方纳米线部分24和n掺杂的围绕层25形成了第二p-n结12(即所谓的径向二极管),其沿着与n掺杂GaAs层25接触的上方p掺杂GaAs纳米线部分24的圆周表面延伸。
之前描述的形成在纳米线2的下方部分22和中间部分23之间的重掺杂结13被称作“第三p-n结”13并形成所谓的隧道二极管,该隧道二极管在第一p-n结11和第二p-n结12之间建立电连接。
参照图3,细节放大地示出了多结太阳能电池的另一实施例。此处,与图2中的实施例相比较,n-掺杂Si区域4包括重掺杂(n+)Si区域41,区域41具有与掺杂区域4的形状对应的形状,但是几何尺寸小一些,这可以在图3中看出来。此外,图2的n+掺杂GaAsP的纳米线部分22被省略,使得p+掺杂GaAsP的纳米线部分23’在n+-Si区域41上生长。这意味着p+-n+结13’位于纳米线2和衬底3之间的界面处。图3的结13’在功能上对应于图2的结13,而在这两个实施例中结11和12相同。
参照图4,细节放大地示出多结太阳能电池的又一实施例。此处,与图2的实施例相比,n掺杂的围绕GaAs层25在功能上被纳米线2的最上方的n掺杂GaAs的部分25’替代。该最上方部分25’在纳米线2的p掺杂GaAs的部分24’的顶部,而p掺杂GaAs的部分24’被布置在之前描述的纳米线2的中间p+-GaAsP部分23的顶部。图4的p掺杂GaAs的部分24’对应于图4的p掺杂GaAs部分24,这意味着p-n结12’被形成在最上方部分25’和部分24’之间。该结12’形成与图2的结12对应的p-n二极管,而结11和13与图2和图4的实施例中的相同。
参照图5,细节放大地示出了多结太阳能电池的再一实施例。此处,与图4的实施例相比,n掺杂Si区域4包括重掺杂(n+)Si区域41,区域41具有与掺杂区域4的形状对应的形状,但是几何尺寸小一些,这可以在图5中看出来。此外,图4的n+掺杂GaAsP的纳米线部分22被省略,使得p+掺杂GaAsP纳米线部分23’在n+-Si区域41上生长。该p+掺杂GaAsP的部分23’在功能上对应于图4的p+掺杂GaAsP的部分23。因此,p+-n+结13’位于纳米线2和衬底3之间的界面处。图5的结13’在功能上对应于图2或图4的结13,而图4的结12’与图5的结12’相同。
参照图6,示出了多结太阳能电池的又一实施例。其与图2的实施例类似,但不同之处在于:i) 纳米线中仅形成短桩24”的最上方p掺杂部分,ii) 圆锥形的围绕层25”或壳,以及iii) 支撑层7’,其在此处是TCO层。此处,p掺杂的上方纳米线部分24”和n掺杂的围绕壳25”形成第二p-n结12”,该结12”为沿着与n掺杂GaAs层25”接触的上方p掺杂GaAs纳米线部分24”的圆周表面延伸的径向二极管的形式。
代替如图6的实施例中的纳米线围绕层的圆锥形状,围绕层可以具有角锥或圆柱25’’’的形状,在后一种情况中在图7中示出圆柱25’’’。然而,在如同图6的实施例的该实施例中,纳米线2形成了桩,该桩在绝缘层8的上表面81上方延伸较短距离。
在绝缘层表面81上方的该距离或高度优选地小于纳米线的宽度(或直径)的十倍,或者更优选地小于纳米线的宽度的五倍,或者甚至更优选地小于纳米线的宽度的两倍。与已知纳米线相比,图6和图7的实施例的纳米线相当短,并且因此形成在纳米线和围绕层之间的p-n结12”的面积相对小,这导致横跨p-n结两端的反转电流泄露减小。
应当注意,对于所有实施例来说,纳米线可以具有棱柱截面形状,其中具有三个或更多个面。这同样适用于纳米线围绕层。
在工作期间,多结太阳能电池1被布置为使得其前侧面对太阳或其他光源30(例如,室内的灯),其光能量将被用于产生电。一旦太阳能电池1被适当布置,则衬底3的表面31的法线N被指向光源30以使得光L的光线以与法线N成一定角度关系入射在太阳能电池1上。
纳米线2外延地生长在衬底3上,并且第一和第二p-n结11、12、12’各被调谐为从太阳吸收特定光带。衬底3以及掺杂区域4和纳米线部分24、25、24’、25’的带隙相对于彼此并根据传统的适当工艺而被优化。由于线的有限厚度,在衬底和线之间的结处或者线中的任意竖直结中不总是需要晶格匹配。
第一结11和第二结12、12’可选地串联,其中最高带隙材料在顶部。在行进光的方向上,最上方的第二p-n结12、12’接收整个光谱并且在第二p-n结12、12’的带隙之上的光子都在该结12、12’处被吸收。第二结12、12’的带隙之下的光子穿过以到达下方的第一p-n结11,从而在第一p-n结11处被吸收。此处,“上方的”结意味着该结比“下方的”结更接近TCO 6。
在Si衬底的情况下,在该实施例中用于特定材料的带隙(Eg)的一些典型值包括Eg=1.69 eV的线,该带隙近似对应于GaAs0.8P0.2(在理论上效率为48%)。在Ge(锗)衬底的情况下,线可以具有Eg=1.43 eV,近似对应于GaAs(在理论上效率为48%)。线的底部中的材料具有0.2 eV的值,该值高于线的其余部分。然而,在实践中,任何在Si(1.1 eV)的带隙和2.0 eV的带隙之间的带隙对于Si衬底来说都是足够的,而任何在Ge(0.67 eV)的带隙和1.7 eV的带隙之间的带隙对于Ge衬底来说都是足够的。
太阳能电池1利用串列的电连接,这意味着p-n结11、12替代地(alt.)12’或12”、13替代地13’串联电连接并且组合后的电池1具有两个端子,即TCO 6(在图6或图7的实施例的情况中替代地为7’)和平面后触头9。由于p-n结11、12替代地12’或12”、13替代地13’串联连接,因而经过每个结11、12替代地12’或12”、13替代地13’的电流相同。因此第一和第二结11、12替代地12’或12”的带隙如所述地被优化,使得这些结11、12替代地12’或12”的最大功率点电流相同,用于避免效率减小。可替代地,第二(顶部)结的有效光吸收被减小以实现也针对非最佳的带隙组合的电流匹配。第三结13、13’用作第一和第二结11、12、12’、12”之间的连接器。
如所示,相应情况适用于图3-7的实施例的p-n结。
更特别地,衬底3由传统的p掺杂Si晶片制成,通过利用离子注入、掺杂剂扩散、通过在异质外延生长期间的扩散、或者任意其他传统的适当工艺,该Si晶片被设置有n掺杂区域。
参照图8a-8f,例举了制造图2的太阳能电池1的方法。此处,后触头9被附接(图8a)到衬底3,该附接可以在纳米线生长之前或之后根据本领域内任何适当的已知方法来完成。接下来,p掺杂的衬底3的上表面31被覆盖有电介质层8(图8b)。然后,该层8被图案化以在层8中形成孔10,该孔10的直径是20至200纳米(图8c)。孔10将下层衬底3暴露给V族源气体,允许以孔10为中心形成小的n掺杂区域4(图8d)。具体而言,一旦形成孔10,就通过利用扩散掺杂工艺将衬底3(通过孔10)暴露的部分n掺杂有V族材料(诸如P(磷)或As(砷)),使得扩散区域4具有例如约100至300纳米的直径。还可以在以下描述的纳米线2的异质外延生长期间执行衬底的扩散掺杂,即,不需要单独的扩散步骤。上述是优选的掺杂方法;存在对半导体掺杂的许多可替换的已知方法,例如,离子注入,在更适当的情况下则可以使用离子注入。这样形成的掺杂区域4通常具有大约1×1016 cm3或更大的过剩载流子浓度。
此外,衬底3上的纳米线生长被设置在表面31上的电介质模板(template)8中的孔10引导。除了掺杂区域4的中心上的孔10,电介质模板8覆盖衬底的完整上表面31,从而暴露掺杂区域4的区。该孔10仍具有20至200纳米的直径并通过增加掺杂区域4的暴露区中的成核的可能性来引导纳米线成核(生长)。成核可能性增大的该区被称作成核发生位置。
更具体而言,孔10起电介质模板的作用,该模板限定用于纳米线生长的成核发生位置,并且外延生长的竖直站立的纳米线2被形成(图8e)(包括任何纳米线围绕层25或壳25”、25’’’)在衬底表面31的掺杂区域4上,使得该纳米线2对应于上面结合附图描述的纳米线。
用于生长纳米线2的适当方法在本领域中是已知的,并且例如在PCT申请号WO 2007/102781中示出,该申请通过引用结合于此。由此可以得出,通过利用本文描述的方法以外的方法,而不利用粒子作为催化剂,纳米线2可以从衬底3的掺杂区域4生长。
一旦生长了纳米线2,则例如通过利用化学汽相沉积加回蚀(back etch)以显露线,纳米线2的顶部之外的部分都被覆盖有支撑层7。最后,例如通过溅射用TCO 6覆盖支撑层7,使得纳米线2的最上方部分被嵌入在TCO 6中并且与TCO 6电接触(图8f)。可选地,TCO替代支撑层,在该情况下TCO覆盖纳米线。
作为上述制造方法的替代方法,可以在图9a-9e中的所示的工艺中使用催化剂粒子。
此外,衬底3是传统p掺杂Si晶片,其中Al后触头9被附接(图9a)到衬底3的后侧,这如上面提到的在纳米线生长之前或之后且根据本领域中适合的任意已知方法来完成。接下来,或者通过通过绝缘电介质层8中的孔(图8c中的10)沉积,或者通过用绝缘电介质层8覆盖上表面31,通常由金(Au)制成的催化剂粒子15被放置在衬底3的上表面31上。在任一种情况下,粒子15都位于层8中的孔中,使得粒子15的顶部仍被暴露,即,粒子15不被层8覆盖(图9b)。在此之后,允许包含III族和V族的化合物在粒子15上分解。然后,粒子15充满了生长物种,并且由于在粒子15下的更高局部压力和浓度,生长物种扩散到衬底3中在粒子下的区域4处(图9c)。用于扩散的生长物种、时间和温度被选择为使得在粒子15下产生通常直径为例如300纳米的n掺杂拱顶形区域4。
在此之后,通过使用美国专利号7,335,908(该专利通过引用结合于此)中描述的所谓VLS(汽-液-固)机制来生长纳米线2(图9c),使得纳米线2对应于上面结合附图描述的纳米线。上述的掺杂工艺也可以在纳米线2的生长期间继续到一些程度,但是最终结果没有差异。
如之前那样,一旦生长了纳米线2,纳米线2除了最上方部分之外的部分(包括粒子15)都覆盖有支撑层7。最终,支撑层7被TCO 6覆盖,使得纳米线2的最上方部分和完整粒子15被嵌入并因此与TCO 6电接触(图9e)。
对于图3和图5中所示的太阳能电池来说,通过利用产生掺杂区域4时使用的相同扩散掺杂工艺来制造重掺杂(n+)Si区域41,但是可以改用其他工艺设置以使得掺杂区域41通常具有大约1×1019cm3或更大的过剩载流子浓度。对于这些图中示出的太阳能电池来说,通过利用上述任一种方法来生长每个实施例中的纳米线。
在实践中,如图1中所示,多个完全相同的纳米线2、2”、2’’’和相应的掺杂区域4、4’、4”同时形成在衬底3上,这在本领域中是常见的。这导致类似草的结构,其中大量纳米线被布置在衬底3的表面31上并从表面31突出。通常,掺杂区域被布置为相互有一定距离,该距离是掺杂区域的直径的至少两倍。
当然,本文示出的测量值、范围和值可以适用于太阳能电池的特定需要和要求,并且可选地,掺杂部分25和因此的p-n结12可以被其他肖特基势垒替代。
以上描述中的材料意在作为示例,并且上面的全部内容在以下替代方式的任意组合下从理论上说同样有效:硅衬底材料可以替代锗或SixGe1-x合金。线材料等主要在III-V半导体中的Inx-Ga1-xAsyP1-y系中选择,但是Al和Sb分别部分替代III族和V族是可能的,或者利用InxGa1-xN系。材料的实际选择将依赖于详细的分析和试验以实现理想的带隙、吸收和功率转换。
然而,适合用于衬底的材料包括但不限于:Si,GaAs,GaP,GaP:Zn,GaAs,InAs,InP,GaN,Al2O3,SiC,Ge,GaSb,ZnO,InSb,SOI(绝缘体上硅),CdS,ZnSe,CdTe。
用于纳米线和纳米线区段的适合材料包括但不限于:AlGaInN,AlInP,BN,GaInP,GaAs,GaAs(p),GaAsP,GaAllnP,GaN,GaP,GaInAs,GaInN,GaAlInP,GaAlInAsP,GaInSb,Ge,InGaP:Si,InGaP:Zn,InAs,InN,InP,InAsP,InSb,Si,ZnO。可能的施主掺杂剂为Si,Sn,Te,Se,S等,并且受主掺杂剂为Zn,Fe,Mg,Be,Cd等。应当注意,纳米线技术使得可以利用氮化物,诸如GaN,InN和AIN。
尽管在光生伏打电池的上下文中描述本公开内容,但是预期在其他光电子领域中找到应用,诸如用于光电检测器或发光二极管。
尽管已描述和示出本发明的各种实施例,但是本发明不限于这些实施例,而是可以在所附权利要求中限定的主题的范围内按其他方式实现本发明。具体地,每个p-n结的极性可以或者是p在n上或者n在p上(反转),并且可以包括更多的结。

Claims (14)

1.一种用于将光转换为电能的多结光生伏打电池,所述多结光生伏打电池包括衬底(3),所述衬底(3)具有表面(31),其中所述衬底(3)的所述表面(31)处的区域(4)被掺杂以使得第一p-n结(11)被形成在所述衬底(3)中,特征在于,纳米线(2)被布置在所述衬底(3)的所述表面(31)上,在所述掺杂区域(4)位于所述衬底(3)中的位置处,使得第二p-n结(12)被形成在所述纳米线(2)处并与所述第一p-n结(11)串联连接。
2.根据权利要求1所述的多结光生伏打电池,其中所述第二p-n结(12)被形成在所述纳米线(3)中。
3.根据权利要求1或2所述的多结光生伏打电池,其中所述掺杂区域(4)通过异质结、离子注入、掺杂剂扩散和同质外延中的任一种来形成。
4.根据权利要求1至3中任一项所述的多结光生伏打电池,其中所述纳米线(2)与所述掺杂区域(4)直接接触。
5.根据权利要求1至4中任一项所述的多结光生伏打电池,其中所述纳米线(2)生长在所述掺杂区域(4)上。
6.根据权利要求1至5中任一项所述的多结光生伏打电池,其中所述纳米线(2)与所述掺杂区域(4)有外延关系。
7.根据权利要求1至6中任一项所述的多结光生伏打电池,其中第三p-n结(13)被布置在所述第一p-n结(11)和所述第二p-n结(12)之间。
8.根据权利要求1至7中任一项所述的多结光生伏打电池,其中所述纳米线(2)在所述表面(31)的法线方向(N)上被锥形壳(25”)围绕,所述锥形壳(25”)被掺杂为使得p-n结(12”)形成在所述壳(25”)和所述纳米线(2)之间。
9.根据权利要求1至8中任一项所述的多结光生伏打电池,其中所述衬底(3)由半导体材料制成,所述半导体材料由硅或掺杂的硅组成。
10.根据权利要求1至9中任一项所述的多结光生伏打电池,其中所述衬底(3)由半导体材料制成,所述半导体材料由锗或掺杂的锗组成。
11.根据权利要求1至10中任一项所述的多结光生伏打电池,其中所述纳米线(2)由半导体材料制成,所述半导体材料包括III-V族半导体材料。
12.根据权利要求1至11中任一项所述的多结光生伏打电池,其中III-V材料是使掺杂剂原子进入所述衬底(3)中的扩散源,用于产生所述掺杂区域(4)。
13.根据权利要求1至12中任一项所述的多结光生伏打电池,被配置为将所述衬底(3)的所述表面(31)布置成面向光源(30)。
14.根据权利要求1至13中任一项所述的多结光生伏打电池,所述多结光生伏打电池包括所述衬底(3)的所述表面(31)处的多个区域(4,4”),每个区域(4,4”)被掺杂以使得所述区域(4,4”)形成所述衬底(3)中的相应第一p-n结(11,11”),其中从所述衬底(3)的所述表面(31)生长多个纳米线(2,2”),每个纳米线(2,2”)在相应掺杂区域(4,4”)的位置处,使得每个纳米线(2,2”)形成与相应第一p-n结(11,11”)串联连接的第二p-n结(12,12”)。
CN201080026673.4A 2009-04-15 2010-04-13 具有纳米线的多结光生伏打电池 Expired - Fee Related CN102484147B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE0950244-4 2009-04-15
SE0950244 2009-04-15
PCT/SE2010/050396 WO2010120233A2 (en) 2009-04-15 2010-04-13 Multi-junction photovoltaic cell with nanowires

Publications (2)

Publication Number Publication Date
CN102484147A true CN102484147A (zh) 2012-05-30
CN102484147B CN102484147B (zh) 2015-11-25

Family

ID=42983041

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080026673.4A Expired - Fee Related CN102484147B (zh) 2009-04-15 2010-04-13 具有纳米线的多结光生伏打电池

Country Status (6)

Country Link
US (1) US8952354B2 (zh)
EP (1) EP2419938A2 (zh)
JP (1) JP5479574B2 (zh)
KR (1) KR101633953B1 (zh)
CN (1) CN102484147B (zh)
WO (1) WO2010120233A2 (zh)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103050564A (zh) * 2012-12-21 2013-04-17 北京邮电大学 一种基于多节纳米线径向pn结的太阳能电池及制备方法
CN105594000A (zh) * 2013-09-30 2016-05-18 艾利迪公司 具有发光二极管的光电子器件
CN105659390A (zh) * 2013-06-05 2016-06-08 索尔伏打电流公司 太阳能电池结构及其制造方法
CN108231941A (zh) * 2016-12-09 2018-06-29 波音公司 具有图案化发射极的多结太阳能电池和制作该太阳能电池的方法
CN111162141A (zh) * 2019-12-20 2020-05-15 燕山大学 一种多结纳米线太阳能电池的制备方法
CN111180554A (zh) * 2020-01-08 2020-05-19 燕山大学 一种混合结构太阳能电池的制备方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101803035B (zh) 2007-06-19 2016-08-24 昆南诺股份有限公司 基于纳米线的太阳能电池结构
JP5626847B2 (ja) * 2010-04-22 2014-11-19 日本電信電話株式会社 ナノ構造体およびその製造方法
JP2013016787A (ja) * 2011-06-08 2013-01-24 Nissan Motor Co Ltd 太陽電池およびその製造方法
GB201113464D0 (en) * 2011-08-03 2011-09-21 Sunflake As Nanostructure, nanostructure fabrication method and photovoltaic cell incorporating a nanostructure
GB201211038D0 (en) * 2012-06-21 2012-08-01 Norwegian Univ Sci & Tech Ntnu Solar cells
CN104603952B (zh) * 2012-07-06 2017-07-21 昆南诺股份有限公司 径向纳米线江崎二极管装置和方法
US9012883B2 (en) * 2012-12-21 2015-04-21 Sol Voltaics Ab Recessed contact to semiconductor nanowires
WO2014199462A1 (ja) * 2013-06-12 2014-12-18 株式会社日立製作所 太陽電池セルおよびその製造方法
GB2517186A (en) * 2013-08-14 2015-02-18 Norwegian University Of Science And Technology Radial P-N junction nanowire solar cells
EP3016148A1 (en) 2014-10-28 2016-05-04 Sol Voltaics AB Dual layer photovoltaic device
TW201840013A (zh) * 2017-02-02 2018-11-01 瑞典商索爾伏打電流公司 多接面pv應用中具有高透明度之奈米結構子電池
JP7103027B2 (ja) * 2018-07-30 2022-07-20 富士通株式会社 化合物半導体装置、化合物半導体装置の製造方法、発電装置及び電源装置
CN109616553B (zh) * 2018-11-22 2020-06-30 中南大学 一种新型纤锌矿GaAs核壳纳米线光电探测器的制备方法
TW202243225A (zh) * 2021-04-16 2022-11-01 聯華電子股份有限公司 影像感測器結構及其製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1855552A (zh) * 2005-03-16 2006-11-01 通用电气公司 高效的无机纳米杆增强的光电装置
US20080169017A1 (en) * 2007-01-11 2008-07-17 General Electric Company Multilayered Film-Nanowire Composite, Bifacial, and Tandem Solar Cells
WO2008156421A2 (en) * 2007-06-19 2008-12-24 Qunano Ab Nanowire-based solar cell structure
CN100446264C (zh) * 2000-10-19 2008-12-24 量子半导体有限公司 制作和cmos电路集成在一起的异质结光电二极管的方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4234352A (en) 1978-07-26 1980-11-18 Electric Power Research Institute, Inc. Thermophotovoltaic converter and cell for use therein
JP3681423B2 (ja) * 1993-11-02 2005-08-10 松下電器産業株式会社 半導体微細柱の集合体,半導体装置及びそれらの製造方法
US7335908B2 (en) 2002-07-08 2008-02-26 Qunano Ab Nanostructures and methods for manufacturing the same
JP4235440B2 (ja) * 2002-12-13 2009-03-11 キヤノン株式会社 半導体デバイスアレイ及びその製造方法
US7091120B2 (en) * 2003-08-04 2006-08-15 Nanosys, Inc. System and process for producing nanowire composites and electronic substrates therefrom
US20070120254A1 (en) * 2003-12-23 2007-05-31 Koninklijke Philips Electronics N.C. Semiconductor device comprising a pn-heterojunction
JP2009507397A (ja) * 2005-08-22 2009-02-19 キュー・ワン・ナノシステムズ・インコーポレイテッド ナノ構造およびそれを実施する光起電力セル
WO2007102781A1 (en) 2006-03-08 2007-09-13 Qunano Ab Method for metal-free synthesis of epitaxial semiconductor nanowires on si
US20080110486A1 (en) * 2006-11-15 2008-05-15 General Electric Company Amorphous-crystalline tandem nanostructured solar cells
US8003883B2 (en) * 2007-01-11 2011-08-23 General Electric Company Nanowall solar cells and optoelectronic devices
JP5096824B2 (ja) * 2007-07-24 2012-12-12 日本電信電話株式会社 ナノ構造およびナノ構造の作製方法
JP5309386B2 (ja) * 2007-08-20 2013-10-09 国立大学法人北海道大学 半導体発光素子アレー、その製造方法、及び光送信機器
US8491718B2 (en) 2008-05-28 2013-07-23 Karin Chaudhari Methods of growing heteroepitaxial single crystal or large grained semiconductor films and devices thereon
US20100154861A1 (en) * 2008-12-23 2010-06-24 Formfactor, Inc. Printed solar panel

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100446264C (zh) * 2000-10-19 2008-12-24 量子半导体有限公司 制作和cmos电路集成在一起的异质结光电二极管的方法
CN1855552A (zh) * 2005-03-16 2006-11-01 通用电气公司 高效的无机纳米杆增强的光电装置
US20080169017A1 (en) * 2007-01-11 2008-07-17 General Electric Company Multilayered Film-Nanowire Composite, Bifacial, and Tandem Solar Cells
WO2008156421A2 (en) * 2007-06-19 2008-12-24 Qunano Ab Nanowire-based solar cell structure

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103050564A (zh) * 2012-12-21 2013-04-17 北京邮电大学 一种基于多节纳米线径向pn结的太阳能电池及制备方法
CN103050564B (zh) * 2012-12-21 2016-04-06 北京邮电大学 一种基于多节纳米线径向pn结的太阳能电池及制备方法
CN105659390A (zh) * 2013-06-05 2016-06-08 索尔伏打电流公司 太阳能电池结构及其制造方法
CN105659390B (zh) * 2013-06-05 2017-11-14 索尔伏打电流公司 太阳能电池结构及其制造方法
CN105594000A (zh) * 2013-09-30 2016-05-18 艾利迪公司 具有发光二极管的光电子器件
CN105594000B (zh) * 2013-09-30 2018-12-04 艾利迪公司 具有发光二极管的光电子器件
CN108231941A (zh) * 2016-12-09 2018-06-29 波音公司 具有图案化发射极的多结太阳能电池和制作该太阳能电池的方法
CN108231941B (zh) * 2016-12-09 2023-01-31 波音公司 具有图案化发射极的多结太阳能电池和制作该太阳能电池的方法
CN111162141A (zh) * 2019-12-20 2020-05-15 燕山大学 一种多结纳米线太阳能电池的制备方法
CN111180554A (zh) * 2020-01-08 2020-05-19 燕山大学 一种混合结构太阳能电池的制备方法
CN111180554B (zh) * 2020-01-08 2023-01-03 燕山大学 一种混合结构太阳能电池的制备方法

Also Published As

Publication number Publication date
WO2010120233A2 (en) 2010-10-21
JP5479574B2 (ja) 2014-04-23
KR101633953B1 (ko) 2016-06-27
KR20120027235A (ko) 2012-03-21
JP2012524397A (ja) 2012-10-11
CN102484147B (zh) 2015-11-25
US8952354B2 (en) 2015-02-10
EP2419938A2 (en) 2012-02-22
WO2010120233A3 (en) 2011-09-22
US20120032148A1 (en) 2012-02-09

Similar Documents

Publication Publication Date Title
CN102484147B (zh) 具有纳米线的多结光生伏打电池
US10128394B2 (en) Nanowire-based solar cell structure
US10355159B2 (en) Multi-junction solar cell with dilute nitride sub-cell having graded doping
CN101221993B (zh) 纳米壁太阳能电池和光电子器件
CN101221992B (zh) 多层膜-纳米线复合物、双面型和串联型太阳能电池
US7629532B2 (en) Solar cell having active region with nanostructures having energy wells
CN101971367B (zh) 红外线发光元件
US20060162768A1 (en) Low bandgap, monolithic, multi-bandgap, optoelectronic devices
US6613974B2 (en) Tandem Si-Ge solar cell with improved conversion efficiency
CN110192286A (zh) 光伏器件
US20080121271A1 (en) Multi-junction, photovoltaic devices with nanostructured spectral enhancements and methods thereof
CN103280482A (zh) 多结太阳能电池及其制备方法
JP5481665B2 (ja) 多接合型太陽電池
Piazza et al. Nanoscale analysis of electrical junctions in InGaP nanowires grown by template-assisted selective epitaxy
US10944022B2 (en) Solar cell with delta doping layer
Hudait et al. 0.6-eV bandgap In/sub 0.69/Ga/sub 0.31/As thermophotovoltaic devices grown on InAs/sub y/P/sub 1-y/step-graded buffers by molecular beam epitaxy
Hudait et al. High-performance In/sub 0.53/Ga/sub 0.47/As thermophotovoltaic devices grown by solid source molecular beam epitaxy
CN102738266A (zh) 掺杂超晶格结构的太阳能电池及其制备方法
RU2701873C1 (ru) Полупроводниковая структура многопереходного фотопреобразователя
Piazza et al. Nanoscale analyses of axial and radial III-V nanowires for solar cells

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20151125

Termination date: 20180413

CF01 Termination of patent right due to non-payment of annual fee