CN102473669B - 图像补偿可寻址的静电卡盘系统 - Google Patents

图像补偿可寻址的静电卡盘系统 Download PDF

Info

Publication number
CN102473669B
CN102473669B CN201080029054.0A CN201080029054A CN102473669B CN 102473669 B CN102473669 B CN 102473669B CN 201080029054 A CN201080029054 A CN 201080029054A CN 102473669 B CN102473669 B CN 102473669B
Authority
CN
China
Prior art keywords
electrode
electrostatic
electrostatic chuck
chuck
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201080029054.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN102473669A (zh
Inventor
马修·汉森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Holding NV
Original Assignee
ASML Holding NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Holding NV filed Critical ASML Holding NV
Publication of CN102473669A publication Critical patent/CN102473669A/zh
Application granted granted Critical
Publication of CN102473669B publication Critical patent/CN102473669B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/703—Non-planar pattern areas or non-planar masks, e.g. curved masks or substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN201080029054.0A 2009-06-30 2010-06-15 图像补偿可寻址的静电卡盘系统 Active CN102473669B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22185709P 2009-06-30 2009-06-30
US61/221,857 2009-06-30
PCT/EP2010/058373 WO2011000689A1 (en) 2009-06-30 2010-06-15 Image-compensating addressable electrostatic chuck system

Publications (2)

Publication Number Publication Date
CN102473669A CN102473669A (zh) 2012-05-23
CN102473669B true CN102473669B (zh) 2015-07-15

Family

ID=42670562

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080029054.0A Active CN102473669B (zh) 2009-06-30 2010-06-15 图像补偿可寻址的静电卡盘系统

Country Status (7)

Country Link
US (1) US8477472B2 (https=)
JP (1) JP5646618B2 (https=)
KR (1) KR101407477B1 (https=)
CN (1) CN102473669B (https=)
NL (1) NL2004890A (https=)
TW (1) TWI420256B (https=)
WO (1) WO2011000689A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2490143B (en) * 2011-04-20 2013-03-13 Rolls Royce Plc Method of manufacturing a component
JP2014167963A (ja) * 2013-02-28 2014-09-11 Toshiba Corp 静電チャック、レチクル、および静電チャック方法
US9472410B2 (en) * 2014-03-05 2016-10-18 Applied Materials, Inc. Pixelated capacitance controlled ESC
US11532497B2 (en) * 2016-06-07 2022-12-20 Applied Materials, Inc. High power electrostatic chuck design with radio frequency coupling
JP2018046179A (ja) * 2016-09-15 2018-03-22 株式会社東芝 静電チャック及び半導体製造装置
KR102584518B1 (ko) * 2018-07-04 2023-10-05 삼성디스플레이 주식회사 정전척 유닛 및 그것을 이용한 박막 증착 장치
TR201905624A2 (tr) * 2019-04-16 2019-07-22 Hidropar Hareket Kontrol Teknolojileri Merkezi Sanayi Ve Ticaret Anonim Sirketi İki cisim arasında kontrol edilebilir elektrostatik çekim kuvveti oluşturulması ve bu çekim kuvveti yardımı ile yapışma sağlanması yöntemi.
EP3809204A1 (en) * 2019-10-18 2021-04-21 ASML Netherlands B.V. Patterning device conditioning system and method
TW202243107A (zh) * 2021-03-18 2022-11-01 荷蘭商Ａｓｍｌ荷蘭公司 用於經改良疊對之夾具電極修改
US12550671B2 (en) 2022-09-14 2026-02-10 International Business Machines Corporation Pixelated chuck for retaining warped semiconductor wafers
CN120530485A (zh) * 2023-01-27 2025-08-22 Asml荷兰有限公司 用于光刻设备的逐步地被激励的静电夹具

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040013956A1 (en) * 2002-06-21 2004-01-22 Nikon Corporation System for correcting aberrations and distortions in EUV lithography
CN1474954A (zh) * 2000-11-22 2004-02-11 鲍尔半导体公司 光调制装置及系统
US20070223173A1 (en) * 2004-03-19 2007-09-27 Hiroshi Fujisawa Bipolar Electrostatic Chuck
DE102004010002B4 (de) * 2004-03-01 2007-10-31 Infineon Technologies Ag Maskenhalter zum Halten einer lithografischen Reflexionsmaske und Verfahren
US20070258079A1 (en) * 2006-05-04 2007-11-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04336928A (ja) * 1991-05-14 1992-11-25 Toto Ltd 圧電ステージ
US5880923A (en) * 1997-06-09 1999-03-09 Applied Materials Inc. Method and apparatus for improved retention of a semiconductor wafer within a semiconductor wafer processing system
DE50114392D1 (de) * 2000-08-02 2008-11-20 Fraunhofer Ges Forschung Mobiler halter für einen wafer
US6493867B1 (en) * 2000-08-08 2002-12-10 Ball Semiconductor, Inc. Digital photolithography system for making smooth diagonal components
US6433917B1 (en) * 2000-11-22 2002-08-13 Ball Semiconductor, Inc. Light modulation device and system
US7199994B1 (en) * 2004-01-12 2007-04-03 Advanced Micro Devices Inc. Method and system for flattening a reticle within a lithography system
CN101326627B (zh) * 2005-12-06 2010-06-09 创意科技股份有限公司 静电卡盘用电极片以及静电卡盘
US20090068765A1 (en) * 2006-03-08 2009-03-12 Kenichi Murooka Method of manufacturing semiconductor device and apparatus for manufacturing semiconductor device
JP2007242893A (ja) * 2006-03-08 2007-09-20 Toshiba Corp パターン転写方法およびパターン転写装置
JP2007319958A (ja) * 2006-05-31 2007-12-13 Tomoegawa Paper Co Ltd 静電チャック部材および静電チャック装置
NL1036511A1 (nl) * 2008-02-13 2009-08-14 Asml Netherlands Bv Movable support, position control system, lithographic apparatus and method of controlling a position of an exchangeable object.

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1474954A (zh) * 2000-11-22 2004-02-11 鲍尔半导体公司 光调制装置及系统
US20040013956A1 (en) * 2002-06-21 2004-01-22 Nikon Corporation System for correcting aberrations and distortions in EUV lithography
DE102004010002B4 (de) * 2004-03-01 2007-10-31 Infineon Technologies Ag Maskenhalter zum Halten einer lithografischen Reflexionsmaske und Verfahren
US20070223173A1 (en) * 2004-03-19 2007-09-27 Hiroshi Fujisawa Bipolar Electrostatic Chuck
US20070258079A1 (en) * 2006-05-04 2007-11-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Also Published As

Publication number Publication date
KR101407477B1 (ko) 2014-06-16
NL2004890A (en) 2011-01-04
TW201120582A (en) 2011-06-16
JP5646618B2 (ja) 2014-12-24
US8477472B2 (en) 2013-07-02
KR20120108960A (ko) 2012-10-05
JP2013527590A (ja) 2013-06-27
US20120087058A1 (en) 2012-04-12
WO2011000689A1 (en) 2011-01-06
CN102473669A (zh) 2012-05-23
TWI420256B (zh) 2013-12-21

Similar Documents

Publication Publication Date Title
CN102473669B (zh) 图像补偿可寻址的静电卡盘系统
CN101101453B (zh) 用于减小波前像差的方法
JP4536088B2 (ja) リソグラフィック装置、収差補正デバイス、およびデバイス製造方法
JP4944184B2 (ja) Ｅｕｖマスク検査システム
JP4639357B2 (ja) 収差補正光学エレメントおよびこれを備えたリソグラフィ装置
US20140002805A1 (en) Electrostatic Clamp Apparatus And Lithographic Apparatus
CN102472961B (zh) 时间差分掩模版检查
JP6609694B2 (ja) 基板ホルダ、リソグラフィ装置、及びデバイスを製造する方法
CN101105639A (zh) 具有灰度滤波器的波前传感器及包括该传感器的光刻设备
JP2006157014A (ja) オーバレイを減少させるための基板テーブルまたはマスクテーブルの表面平坦度情報の使用
TWI853216B (zh) 操作度量衡系統、微影設備及其方法
CN114450636A (zh) 检测辐射束的光刻设备和方法
US20120026480A1 (en) Image-Compensating Addressable Electrostatic Chuck System
CN101911838A (zh) 极紫外辐射源和用于产生极紫外辐射的方法
CN111566776A (zh) 检查工具和确定检查工具的畸变的方法
JP4340270B2 (ja) リソグラフィ装置、パターニング組立体および汚染推定法
US20250130508A1 (en) Lithographic apparatus, substrate table, and manufacturing method
WO2019011606A1 (en) INSPECTION TOOL, LITHOGRAPHIC APPARATUS, LITHOGRAPHIC SYSTEM, INSPECTION METHOD, AND DEVICE MANUFACTURING METHOD
US20060046165A1 (en) Lithographic apparatus, device manufacturing method, calibration method and computer program product
NL2005756A (en) Image-compensating addressable electrostatic chuck system.
NL2006601A (en) An electrostatic clamp apparatus and lithographic apparatus.

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant