KR101407477B1 - 이미지-보상 어드레서블 정전 척 시스템 - Google Patents

이미지-보상 어드레서블 정전 척 시스템 Download PDF

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Publication number
KR101407477B1
KR101407477B1 KR1020127002327A KR20127002327A KR101407477B1 KR 101407477 B1 KR101407477 B1 KR 101407477B1 KR 1020127002327 A KR1020127002327 A KR 1020127002327A KR 20127002327 A KR20127002327 A KR 20127002327A KR 101407477 B1 KR101407477 B1 KR 101407477B1
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South Korea
Prior art keywords
electrodes
electrostatic
substrate
compensating
chuck
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KR1020127002327A
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English (en)
Korean (ko)
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KR20120108960A (ko
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매튜 한센
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에이에스엠엘 홀딩 엔.브이.
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/703—Non-planar pattern areas or non-planar masks, e.g. curved masks or substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020127002327A 2009-06-30 2010-07-19 이미지-보상 어드레서블 정전 척 시스템 Active KR101407477B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US22185709P 2009-06-30 2009-06-30
PCT/EP2010/058373 WO2011000689A1 (en) 2009-06-30 2010-06-15 Image-compensating addressable electrostatic chuck system

Publications (2)

Publication Number Publication Date
KR20120108960A KR20120108960A (ko) 2012-10-05
KR101407477B1 true KR101407477B1 (ko) 2014-06-16

Family

ID=42670562

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127002327A Active KR101407477B1 (ko) 2009-06-30 2010-07-19 이미지-보상 어드레서블 정전 척 시스템

Country Status (7)

Country Link
US (1) US8477472B2 (https=)
JP (1) JP5646618B2 (https=)
KR (1) KR101407477B1 (https=)
CN (1) CN102473669B (https=)
NL (1) NL2004890A (https=)
TW (1) TWI420256B (https=)
WO (1) WO2011000689A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2490143B (en) * 2011-04-20 2013-03-13 Rolls Royce Plc Method of manufacturing a component
JP2014167963A (ja) * 2013-02-28 2014-09-11 Toshiba Corp 静電チャック、レチクル、および静電チャック方法
US9472410B2 (en) * 2014-03-05 2016-10-18 Applied Materials, Inc. Pixelated capacitance controlled ESC
US11532497B2 (en) * 2016-06-07 2022-12-20 Applied Materials, Inc. High power electrostatic chuck design with radio frequency coupling
JP2018046179A (ja) * 2016-09-15 2018-03-22 株式会社東芝 静電チャック及び半導体製造装置
KR102584518B1 (ko) * 2018-07-04 2023-10-05 삼성디스플레이 주식회사 정전척 유닛 및 그것을 이용한 박막 증착 장치
TR201905624A2 (tr) * 2019-04-16 2019-07-22 Hidropar Hareket Kontrol Teknolojileri Merkezi Sanayi Ve Ticaret Anonim Sirketi İki cisim arasında kontrol edilebilir elektrostatik çekim kuvveti oluşturulması ve bu çekim kuvveti yardımı ile yapışma sağlanması yöntemi.
EP3809204A1 (en) * 2019-10-18 2021-04-21 ASML Netherlands B.V. Patterning device conditioning system and method
TW202243107A (zh) * 2021-03-18 2022-11-01 荷蘭商Ａｓｍｌ荷蘭公司 用於經改良疊對之夾具電極修改
US12550671B2 (en) 2022-09-14 2026-02-10 International Business Machines Corporation Pixelated chuck for retaining warped semiconductor wafers
CN120530485A (zh) * 2023-01-27 2025-08-22 Asml荷兰有限公司 用于光刻设备的逐步地被激励的静电夹具

Citations (4)

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EP1376238A2 (en) * 2002-06-21 2004-01-02 Nikon Corporation A system for correcting aberration and distortion in EUV litography
DE102004010002A1 (de) * 2004-03-01 2005-09-29 Infineon Technologies Ag Maskenhalter zum Halten einer lithografischen Maske und Verfahren
JP2007319958A (ja) * 2006-05-31 2007-12-13 Tomoegawa Paper Co Ltd 静電チャック部材および静電チャック装置
KR20090087834A (ko) * 2008-02-13 2009-08-18 에이에스엠엘 네델란즈 비.브이. 이동가능한 지지체, 위치 제어 시스템, 리소그래피 장치 및교환가능한 대상물의 위치를 제어하는 방법

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JPH04336928A (ja) * 1991-05-14 1992-11-25 Toto Ltd 圧電ステージ
US5880923A (en) * 1997-06-09 1999-03-09 Applied Materials Inc. Method and apparatus for improved retention of a semiconductor wafer within a semiconductor wafer processing system
DE50114392D1 (de) * 2000-08-02 2008-11-20 Fraunhofer Ges Forschung Mobiler halter für einen wafer
US6493867B1 (en) * 2000-08-08 2002-12-10 Ball Semiconductor, Inc. Digital photolithography system for making smooth diagonal components
WO2002042825A1 (en) * 2000-11-22 2002-05-30 Ball Semiconductor, Inc. Light modulation device and system
US6433917B1 (en) * 2000-11-22 2002-08-13 Ball Semiconductor, Inc. Light modulation device and system
US7199994B1 (en) * 2004-01-12 2007-04-03 Advanced Micro Devices Inc. Method and system for flattening a reticle within a lithography system
DE112005000621B4 (de) * 2004-03-19 2019-01-31 Creative Technology Corporation Bipolare elektrostatische Haltevorrichtung
CN101326627B (zh) * 2005-12-06 2010-06-09 创意科技股份有限公司 静电卡盘用电极片以及静电卡盘
US20090068765A1 (en) * 2006-03-08 2009-03-12 Kenichi Murooka Method of manufacturing semiconductor device and apparatus for manufacturing semiconductor device
JP2007242893A (ja) * 2006-03-08 2007-09-20 Toshiba Corp パターン転写方法およびパターン転写装置
US7576832B2 (en) * 2006-05-04 2009-08-18 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1376238A2 (en) * 2002-06-21 2004-01-02 Nikon Corporation A system for correcting aberration and distortion in EUV litography
DE102004010002A1 (de) * 2004-03-01 2005-09-29 Infineon Technologies Ag Maskenhalter zum Halten einer lithografischen Maske und Verfahren
JP2007319958A (ja) * 2006-05-31 2007-12-13 Tomoegawa Paper Co Ltd 静電チャック部材および静電チャック装置
KR20090087834A (ko) * 2008-02-13 2009-08-18 에이에스엠엘 네델란즈 비.브이. 이동가능한 지지체, 위치 제어 시스템, 리소그래피 장치 및교환가능한 대상물의 위치를 제어하는 방법

Also Published As

Publication number Publication date
NL2004890A (en) 2011-01-04
TW201120582A (en) 2011-06-16
JP5646618B2 (ja) 2014-12-24
US8477472B2 (en) 2013-07-02
KR20120108960A (ko) 2012-10-05
JP2013527590A (ja) 2013-06-27
US20120087058A1 (en) 2012-04-12
CN102473669B (zh) 2015-07-15
WO2011000689A1 (en) 2011-01-06
CN102473669A (zh) 2012-05-23
TWI420256B (zh) 2013-12-21

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