CN102473486B - 氧化物超导线材用金属叠层基板的制造方法及氧化物超导线材用金属叠层基板 - Google Patents

氧化物超导线材用金属叠层基板的制造方法及氧化物超导线材用金属叠层基板 Download PDF

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Publication number
CN102473486B
CN102473486B CN2010800280233A CN201080028023A CN102473486B CN 102473486 B CN102473486 B CN 102473486B CN 2010800280233 A CN2010800280233 A CN 2010800280233A CN 201080028023 A CN201080028023 A CN 201080028023A CN 102473486 B CN102473486 B CN 102473486B
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China
Prior art keywords
copper
copper foil
superconducting wire
oxide superconducting
temperature
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CN2010800280233A
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Chinese (zh)
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CN102473486A (zh
Inventor
冈山浩直
黑川哲平
南部光司
矶部刚彦
神代贵史
金子彰
太田肇
大木康太郎
山口高史
大松一也
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Sumitomo Electric Industries Ltd
Toyo Kohan Co Ltd
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Sumitomo Electric Industries Ltd
Toyo Kohan Co Ltd
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Publication of CN102473486A publication Critical patent/CN102473486A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
    • H01B12/02—Superconductive or hyperconductive conductors, cables, or transmission lines characterised by their form
    • H01B12/06—Films or wires on bases or cores
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
    • B32B15/015—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/01—Manufacture or treatment
    • H10N60/0268—Manufacture or treatment of devices comprising copper oxide
    • H10N60/0296—Processes for depositing or forming copper oxide superconductor layers
    • H10N60/0576—Processes for depositing or forming copper oxide superconductor layers characterised by the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • ing And Chemical Polishing (AREA)
CN2010800280233A 2009-07-17 2010-07-08 氧化物超导线材用金属叠层基板的制造方法及氧化物超导线材用金属叠层基板 Active CN102473486B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009169531 2009-07-17
JP2009-169531 2009-07-17
PCT/JP2010/004460 WO2011007527A1 (ja) 2009-07-17 2010-07-08 酸化物超電導線材用金属積層基板の製造方法及び酸化物超電導線材用金属積層基板

Publications (2)

Publication Number Publication Date
CN102473486A CN102473486A (zh) 2012-05-23
CN102473486B true CN102473486B (zh) 2013-07-17

Family

ID=43449139

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CN2010800280233A Active CN102473486B (zh) 2009-07-17 2010-07-08 氧化物超导线材用金属叠层基板的制造方法及氧化物超导线材用金属叠层基板

Country Status (7)

Country Link
US (1) US8815777B2 (enExample)
EP (1) EP2455949B1 (enExample)
JP (1) JP5723773B2 (enExample)
KR (1) KR101680756B1 (enExample)
CN (1) CN102473486B (enExample)
IN (1) IN2012DN00632A (enExample)
WO (1) WO2011007527A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5517196B2 (ja) * 2009-11-20 2014-06-11 東洋鋼鈑株式会社 超電導化合物用基板及びその製造方法
JP5650099B2 (ja) * 2011-11-22 2015-01-07 Jx日鉱日石金属株式会社 超電導膜形成用圧延銅箔
JP5650098B2 (ja) * 2011-11-22 2015-01-07 Jx日鉱日石金属株式会社 超電導膜形成用圧延銅箔
JP5705107B2 (ja) * 2011-12-28 2015-04-22 Jx日鉱日石金属株式会社 超電導膜形成用圧延銅箔
US9002424B2 (en) * 2012-04-16 2015-04-07 Furukawa Electric Co., Ltd. Superconducting film-forming substrate, superconducting wire, and superconducting wire manufacturing method
JP5904869B2 (ja) * 2012-05-11 2016-04-20 Ｊｘ金属株式会社 超電導膜形成用圧延銅箔の製造方法
WO2013180443A1 (ko) * 2012-05-29 2013-12-05 한국생산기술연구원 구리층을 갖는 철계부스바 및 그 제조방법
WO2014054351A1 (ja) * 2012-10-05 2014-04-10 東洋鋼鈑株式会社 エピタキシャル成長用基板及びその製造方法、並びに超電導線材用基板
JP6244142B2 (ja) * 2013-09-04 2017-12-06 東洋鋼鈑株式会社 超電導線材用基板及びその製造方法、並びに超電導線材
US10174420B2 (en) * 2013-09-04 2019-01-08 Toyo Kohan Co., Ltd. Method for forming oxide layer, laminated substrate for epitaxial growth, and method for producing the same
CN104538543B (zh) * 2014-12-11 2017-06-20 西部超导材料科技股份有限公司 一种低温超导线材用NbTi棒的制备方法
CN108138356B (zh) * 2015-10-23 2022-12-23 东洋钢钣株式会社 外延生长用基板及其制造方法
US11840045B2 (en) * 2017-03-29 2023-12-12 Toyo Kohan Co., Ltd. Roll-bonded laminate
JP7074190B2 (ja) * 2018-06-15 2022-05-24 住友電気工業株式会社 超電導線材、積層超電導線材、超電導コイル及び超電導ケーブル
JP7618390B2 (ja) * 2020-04-22 2025-01-21 東洋鋼鈑株式会社 金属積層フィルム及びその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6226858B1 (en) * 1997-06-10 2001-05-08 The Furukawa Electric Co., Ltd. Method of manufacturing an oxide superconductor wire
JP2006127847A (ja) * 2004-10-27 2006-05-18 Sumitomo Electric Ind Ltd 膜形成用配向基板および超電導線材
US20080261072A1 (en) * 2007-04-17 2008-10-23 Naoji Kashima Clad textured metal substrate for forming epitaxial thin film thereon and method for manufacturing the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7816303B2 (en) * 2004-10-01 2010-10-19 American Superconductor Corporation Architecture for high temperature superconductor wire
JP5382911B2 (ja) 2008-11-12 2014-01-08 東洋鋼鈑株式会社 酸化物超電導線材用金属積層基板の製造方法及び該基板を用いた酸化物超電導線材

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6226858B1 (en) * 1997-06-10 2001-05-08 The Furukawa Electric Co., Ltd. Method of manufacturing an oxide superconductor wire
JP2006127847A (ja) * 2004-10-27 2006-05-18 Sumitomo Electric Ind Ltd 膜形成用配向基板および超電導線材
US20080261072A1 (en) * 2007-04-17 2008-10-23 Naoji Kashima Clad textured metal substrate for forming epitaxial thin film thereon and method for manufacturing the same

Also Published As

Publication number Publication date
KR20120038410A (ko) 2012-04-23
EP2455949A4 (en) 2015-04-22
JPWO2011007527A1 (ja) 2012-12-20
JP5723773B2 (ja) 2015-05-27
US20120208703A1 (en) 2012-08-16
US8815777B2 (en) 2014-08-26
IN2012DN00632A (enExample) 2015-08-21
EP2455949A1 (en) 2012-05-23
CN102473486A (zh) 2012-05-23
KR101680756B1 (ko) 2016-11-29
EP2455949B1 (en) 2016-08-31
WO2011007527A1 (ja) 2011-01-20

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