JP5606920B2 - エピタキシャル成長膜形成用高分子積層基板およびその製造方法 - Google Patents
エピタキシャル成長膜形成用高分子積層基板およびその製造方法 Download PDFInfo
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- JP5606920B2 JP5606920B2 JP2010537670A JP2010537670A JP5606920B2 JP 5606920 B2 JP5606920 B2 JP 5606920B2 JP 2010537670 A JP2010537670 A JP 2010537670A JP 2010537670 A JP2010537670 A JP 2010537670A JP 5606920 B2 JP5606920 B2 JP 5606920B2
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- 229920000642 polymer Polymers 0.000 title claims description 87
- 239000000758 substrate Substances 0.000 title claims description 72
- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 230000015572 biosynthetic process Effects 0.000 title claims description 21
- 239000011888 foil Substances 0.000 claims description 67
- 239000002184 metal Substances 0.000 claims description 48
- 229910052751 metal Inorganic materials 0.000 claims description 48
- 239000013078 crystal Substances 0.000 claims description 44
- 238000000034 method Methods 0.000 claims description 44
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 33
- 230000003746 surface roughness Effects 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 12
- 230000001681 protective effect Effects 0.000 claims description 11
- 238000005097 cold rolling Methods 0.000 claims description 10
- 238000005096 rolling process Methods 0.000 claims description 9
- 230000003213 activating effect Effects 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 238000004544 sputter deposition Methods 0.000 claims description 5
- 238000003475 lamination Methods 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 230000004913 activation Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 235000012431 wafers Nutrition 0.000 description 6
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 5
- 229910002601 GaN Inorganic materials 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 238000000992 sputter etching Methods 0.000 description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
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- 229910052759 nickel Inorganic materials 0.000 description 3
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- 229920001721 polyimide Polymers 0.000 description 3
- 238000001953 recrystallisation Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010924 continuous production Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 229920005570 flexible polymer Polymers 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910018054 Ni-Cu Inorganic materials 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- 229910018481 Ni—Cu Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
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- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000002887 superconductor Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B1/00—Single-crystal growth directly from the solid state
- C30B1/02—Single-crystal growth directly from the solid state by thermal treatment, e.g. strain annealing
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- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
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- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B1/00—Single-crystal growth directly from the solid state
- C30B1/02—Single-crystal growth directly from the solid state by thermal treatment, e.g. strain annealing
- C30B1/04—Isothermal recrystallisation
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0368—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including polycrystalline semiconductors
- H01L31/03682—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including polycrystalline semiconductors including only elements of Group IV of the Periodic Table
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/06—Coating on the layer surface on metal layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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- B32B2255/20—Inorganic coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/514—Oriented
- B32B2307/518—Oriented bi-axially
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/538—Roughness
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/546—Polycrystalline silicon PV cells
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electromagnetism (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Description
しかし、これら単結晶ウェハーは、サイズが大きくても300mmφ程度の切り板であり、リール・トゥ・リール方式のような連続的な生産方式での成膜はできない。
また、Siなどは強度もなく、製造工程での搬送中、ハンドリングが容易でなく注意が必要である。
また、上記単結晶ウェハーでは、基板にフレキシブル性を付与できないことから、使用する用途も限定される。
すなわち、高価な単結晶基板が使用されていること、単結晶基板はサイズも小さいこと、枚葉式の工程処理を行わなければいけないこと、基板が固く、フレキシブル性を持たせることができず、応用面が限定されていること、などである。
そこで、本発明は、上記の問題をすべて解決すべく、高度に結晶配向した表面を持つエピタキシャル成長膜形成用の高分子積層基板及びその製造方法を提供することを目的とする。
(2)本発明のエピタキシャル成長膜形成用高分子積層基板の製造方法は、高分子板の少なくと
も一方の表面にスパッタリングにより金属層を形成する工程と、圧下率90%以上で冷間圧延されたCu若しくはCu合金からなる金属箔の少なくとも一方の表面を活性化する工程と、前記高分子板の金属層表面と、前記金属箔の活性化表面を向かい合わせて積層し圧下率10%以下の冷間圧延を行うことにより、圧下率90%以上で冷間圧延された状態を保ったままの金属箔と高分子板とからなる積層体を得る工程と、圧下率90%以上で冷間圧延された状態を保ったままの金属箔を有する前記積層体を150度以上400度以下で熱処理することにより、前記金属箔をΔφが6°以下かつ(200)面結晶配向率が99%以上となるように2軸結晶配向させる工程と、を有することを特徴とする。
(3)本発明のエピタキシャル成長膜形成用高分子積層基板の製造方法は、前記(1)又は(2)において、前記積層時の冷間圧延の圧下率は10%以下であることを特徴とする。
(4)本発明のエピタキシャル成長膜形成用高分子積層基板の製造方法は、前記(1)〜(3)のいずれかにおいて、前記金属箔側表面の表面粗度をRaで1nm以上40nm以下に調整した2軸結晶配向させたことを特徴とする。
(5)本発明のエピタキシャル成長膜形成用高分子積層基板の製造方法は、前記(1)〜(4)のいずれかにおいて、前記金属箔の厚みが7μm以上50μm以下のものであることを特徴とする。
(6)本発明のエピタキシャル成長膜形成用高分子積層基板の製造方法は、前記(1)〜(5)のいずれかにおいて、前記熱処理温度が150℃以上400℃以下であることを特徴とする。
(7)本発明のエピタキシャル成長膜形成用高分子積層基板の製造方法は、前記(1)〜(6)のいずれかにおいて、前記金属箔が、Ag、Sn、Zn、Zr、O、Nのトータルで0.01%以上1%以下含まれることを特徴とする。
(8)本発明のエピタキシャル成長膜形成用高分子積層基板の製造方法は、前記(1)〜(7)のいずれかにおいて、前記高分子積層基板の製造方法により製造された高分子積層基板の金属面上に、さらに保護膜を形成することを特徴とする。
(9)本発明のエピタキシャル成長膜形成用高分子積層基板は、前記(1)〜(8)のいずれかのエピタキシャル成長膜形成用高分子積層基板の製造方法により製造されたものであることを特徴とする。
図1に示すように、高分子積層基板5Aは、高分子板T1と、高分子板T1の上に積層された金属箔T2からなる。
高分子板T1としては、その使用目的によって選定されるが、貼り合わせる金属箔T2の再結晶熱処理温度150℃〜400℃に耐えられるものであれば適用できるが、中でも、耐熱性に優れ、また一般に普及しているポリイミド、液晶ポリマー、アラミドなどの樹脂フィルムが、高温耐熱性に優れているので好ましく挙げられる。
Cu合金箔T2は、前もって熱処理により結晶配向させた状態で使用しても良いが、ハンドリング中、歪みが入り、結晶配向性を劣化させる危険性があるので、高分子板T1と積層して高分子積層基板としてから高度な結晶配向性を持たせることが望ましい。
圧下率90%未満であると後に行う熱処理においてCuが配向しないおそれがあるからである。
例えば日鉱マテリアルズ社製高圧下圧延Cu箔(HA箔(商品名))や日立電線社製高圧下圧延Cu箔(HX箔(商品名))などが挙げられる。
厚みは7μm以上50μm以下のものが望ましい。より好ましくは12μm〜18μmである。厚みを7μm以上とする理由はCu合金箔T2の強度の確保であり、50μm以下とする理由はCu合金箔T2の加工性確保のためである。
添加元素をトータルで1%以下とする理由は、添加元素とCuは固溶体を形成しているが、トータルで1%を超えると固溶体以外の酸化物等の不純物が増加してしまい、配向に影響がでる可能性があるからである。
よって、好ましくは、トータルで0.01%以上0.1%以下である。
なお、図2に、高分子板T1の両面に金属箔T2を接合した実施形態の高分子積層基板5B示す。
図2の高分子積層基板5Bは、フレキシブルな高分子板T1の両面に結晶配向金属層が積層されているので、両面にエピタキシャル成長膜を成長させる基板とすることができる。
また、接合後にも安定な結晶配向性が得られる表面活性化接合法を用いることも望ましい。
図5に示すように、高分子板24及びCu合金箔26を、幅150mm〜600mmの長尺コイルとして用意し、表面活性化接合装置D1のリコイラー部62,64のそれぞれに設置する。
リコイラー部62,64から搬送された高分子板24及びCu合金箔26は、連続的に表面活性化処理工程へ搬送され、そこで接合する2つの面を予め活性化処理した後、冷間圧接する。
不活性ガスとしては、アルゴン、ネオン、キセノン、クリプトンなどや、これらを少なくとも1種類含む混合気体を適用することができる。
例えば、青色発光ダイオード用に、エピタキシャル成長膜としてGaN膜を半導体化合物として形成する場合、InGaN層又はZnO層をCu合金箔上に保護膜として形成し、その上にGaNを成膜することができる。
保護膜の厚みは、下地のCuの拡散防止として機能させるため、0.1μm以上あればよい。また、エピタキシャル成長膜を維持するためには、10μm以下にすることが好ましい。
保護膜としての形成方法は、スパッタ法、蒸着法、CVD法、MOCVD法、電解メッキ法、無電解メッキ法など考えられるが、何れの方法でもよい。保護膜をNiなどの金属にする場合は、電解メッキ法が経済的に好ましい。また酸化物や窒化物を保護膜とする場合には、比較的基板温度が低温で成膜できるスパッタ法やMOCVD法など好ましい。
図4の高分子積層基板10Bは、フレキシブルな高分子板T1の両面に結晶配向金属層が積層され、それぞれの金属箔T2の上に保護膜T3を形成しているので、両面にエピタキシャル成長膜を成長させる基板とすることができる。
エピタキシャル成長膜の膜厚の膜厚が1nm未満の場合は成膜するものの密着性が確保できす、10μmを超える場合は過剰な厚みとなるからである。
Cu合金箔の表面粗度が購入時、表面粗度Raで40nm以下であれば問題ないが、表面粗度Raが100nmを超えるものもある。
さらに、表面活性化接合を用いて積層する場合には、積層後の加熱によっても変形等が生じる可能性が少ないので、2軸結晶配向が崩れてしまう可能性が少なく、接着剤等を用いる場合よりも有利である。
それぞれ200mm幅の18μm厚の高圧下圧延Cu箔と25μm厚のポリイミドフィルムおよび液晶ポリマーフィルムとを常温表面活性化接合法にて接合後、200℃で5分間熱処理して高分子積層基板を得た。
表1には、このときのCu(200)面がCu箔表面と平行になっている割合、つまり結晶配向率(X線回折により測定したθ/2θ回折ピークの(200)面の回折ピーク強度率:I(200)/ΣI(hkl)×100(%)))と、この(200)面が長手方向〈001〉に平行であることを表す値として2軸配向性指標のΔφ°(X線回折によるNi(111)極点図で得られるφスキャンピーク(α=35°の4本のピークの半値幅の平均値))を示す。
比較例として、熱処理を130℃で処理したとき、および一般の高圧下でない16μm厚の圧延Cu箔を前記常温活性化接合法にて接合後、200℃で5分間熱処理したときのピーク強度率を示す。
また、比較例として示す通常の圧延Cu箔を用いた場合は、熱処理しても結晶配向率は70%以下であった。
また99%以上結晶配向している実施例のΔφは6°と、かなり高度な2軸結晶配向度を示している。
さらに、太陽電池用多結晶シリコン膜の結晶配向化、軽量化やフレキシブル性の付与、発光ダイオード用GaN素子の低価格化などに寄与でき、これまで検討されていない分野でのエピタキシャル成長膜用の新素材として応用が可能となり、産業上極めて有用である。
T2 Cu箔若しくはCu合金箔
T3 保護膜
5A、5B、10A、10B 高分子積層基板
Claims (9)
- 高分子板の少なくとも一方の表面を活性化する工程と、
圧下率90%以上で冷間圧延されたCu若しくはCu合金からなる金属箔の少なくとも一方の表面を活性化する工程と、
前記高分子板の活性化表面と、前記金属箔の活性化表面を向かい合わせて積層し圧下率10%以下の冷間圧延を行うことにより、圧下率90%以上で冷間圧延された状態を保ったままの金属箔と高分子板とからなる積層体を得る工程と、
圧下率90%以上で冷間圧延された状態を保ったままの金属箔を有する前記積層体を150度以上400度以下で熱処理することにより、前記金属箔をΔφが6°以下かつ(200)面結晶配向率が99%以上となるように2軸結晶配向させる工程と、
を有するエピタキシャル成長膜形成用高分子積層基板の製造方法。 - 高分子板の少なくとも一方の表面にスパッタリングにより金属層を形成する工程と、
圧下率90%以上で冷間圧延されたCu若しくはCu合金からなる金属箔の少なくとも一方の表面を活性化する工程と、
前記高分子板の金属層表面と、前記金属箔の活性化表面を向かい合わせて積層し圧下率10%以下の冷間圧延を行うことにより、圧下率90%以上で冷間圧延された状態を保ったままの金属箔と高分子板とからなる積層体を得る工程と、
圧下率90%以上で冷間圧延された状態を保ったままの金属箔を有する前記積層体を150度以上400度以下で熱処理することにより、前記金属箔をΔφが6°以下かつ(200)面結晶配向率が99%以上となるように2軸結晶配向させる工程と、
を有するエピタキシャル成長膜形成用高分子積層基板の製造方法。 - 前記積層時の冷間圧延の圧下率は10%以下であることを特徴とする請求項1又は2に記載のエピタキシャル成長膜形成用高分子積層基板の製造方法。
- 前記金属箔側表面の表面粗度をRaで1nm以上40nm以下に調整した2軸結晶配向させたことを特徴とする請求項1〜3のいずれかに記載のエピタキシャル成長膜形成用高分子積層基板の製造方法。
- 前記金属箔の厚みが7μm以上50μm以下のものであることを特徴とする請求項1〜4のいずれかに記載のエピタキシャル成長膜形成用高分子積層基板の製造方法。
- 前記熱処理温度が150℃以上400℃以下であることを特徴とする請求項1〜5のいずれかに記載のエピタキシャル成長膜形成用高分子積層基板の製造方法。
- 前記金属箔が、Ag、Sn、Zn、Zr、O、Nのトータルで0.01%以上1%以下含まれることを特徴とする請求項1〜6のいずれかに記載のエピタキシャル成長膜形成用高分子積層基板の製造方法。
- 前記高分子積層基板の製造方法により製造された高分子積層基板の金属面上に、さらに保護膜を形成することを特徴とする請求項1〜7のいずれかに記載のエピタキシャル成長膜形成用高分子積層基板の製造方法。
- 請求項1〜8のいずれかに記載のエピタキシャル成長膜形成用高分子積層基板の製造方法により製造されたエピタキシャル成長膜形成用高分子積層基板。
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