CN102470965B - 盖带、盖带的制造方法和电子部件包装体 - Google Patents

盖带、盖带的制造方法和电子部件包装体 Download PDF

Info

Publication number
CN102470965B
CN102470965B CN201080036569.3A CN201080036569A CN102470965B CN 102470965 B CN102470965 B CN 102470965B CN 201080036569 A CN201080036569 A CN 201080036569A CN 102470965 B CN102470965 B CN 102470965B
Authority
CN
China
Prior art keywords
cover strip
layer
temperature
interlayer
quality
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201080036569.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN102470965A (zh
Inventor
吉野正行
小谷野刚宏
政木大典
松木豊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Original Assignee
Asahi Kasei Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2009199529A external-priority patent/JP5456419B2/ja
Priority claimed from JP2010026512A external-priority patent/JP5399287B2/ja
Priority claimed from JP2010147940A external-priority patent/JP5456602B2/ja
Application filed by Asahi Kasei Chemicals Corp filed Critical Asahi Kasei Chemicals Corp
Publication of CN102470965A publication Critical patent/CN102470965A/zh
Application granted granted Critical
Publication of CN102470965B publication Critical patent/CN102470965B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38—Packaging materials of special type or form
    • B65D65/40—Applications of laminates for particular packaging purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2813—Heat or solvent activated or sealable
    • Y10T428/2817—Heat sealable

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Laminated Bodies (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Wrappers (AREA)
CN201080036569.3A 2009-08-31 2010-08-25 盖带、盖带的制造方法和电子部件包装体 Expired - Fee Related CN102470965B (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2009-199529 2009-08-31
JP2009199529A JP5456419B2 (ja) 2009-08-31 2009-08-31 カバーテープ用シュリンクフィルム及びカバーテープ
JP2010026512A JP5399287B2 (ja) 2010-02-09 2010-02-09 カバーテープ
JP2010-026512 2010-02-09
JP2010147940A JP5456602B2 (ja) 2010-06-29 2010-06-29 カバーテープ、カバーテープの製造方法及び電子部品梱包体
JP2010-147940 2010-06-29
PCT/JP2010/064388 WO2011024860A1 (ja) 2009-08-31 2010-08-25 カバーテープ、カバーテープの製造方法及び電子部品梱包体

Publications (2)

Publication Number Publication Date
CN102470965A CN102470965A (zh) 2012-05-23
CN102470965B true CN102470965B (zh) 2014-03-12

Family

ID=43627960

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080036569.3A Expired - Fee Related CN102470965B (zh) 2009-08-31 2010-08-25 盖带、盖带的制造方法和电子部件包装体

Country Status (11)

Country Link
US (1) US8999502B2 (ru)
EP (1) EP2474483A4 (ru)
KR (1) KR101339583B1 (ru)
CN (1) CN102470965B (ru)
CA (1) CA2768507C (ru)
MX (1) MX2012002447A (ru)
MY (1) MY155405A (ru)
RU (1) RU2012112480A (ru)
SG (1) SG178022A1 (ru)
TW (1) TWI478814B (ru)
WO (1) WO2011024860A1 (ru)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009069445A1 (ja) * 2007-11-26 2009-06-04 Lintec Corporation 剥離シート及び粘着体
WO2012020721A1 (ja) * 2010-08-11 2012-02-16 大倉工業株式会社 端子接着用テープの製造方法、および端子接着用テープ
JP5503770B1 (ja) * 2013-03-29 2014-05-28 古河電気工業株式会社 封止剤組成物および該組成物から得られる封止用シート
JP6311572B2 (ja) * 2013-10-30 2018-04-18 日本ポリエチレン株式会社 導電性ポリエチレン樹脂組成物並びにそれを用いた成形品、および積層体
MX2016005175A (es) * 2013-11-01 2016-08-12 Cryovac Inc Pelicula de barrera contra oxigeno de multiples capas que se contraen por calor resistente a deslaminacion que contiene poliester.
TWI580578B (zh) * 2016-07-06 2017-05-01 俊馳材料科技股份有限公司 覆蓋帶與其製程方法
KR102498684B1 (ko) * 2018-04-24 2023-02-09 미쓰이 가가쿠 토세로 가부시키가이샤 점착성 필름 및 전자 장치의 제조 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007182244A (ja) * 2006-01-10 2007-07-19 Matsushita Electric Ind Co Ltd キャリヤテープ、及びトップカバーテープ、並びに電子部品の梱包方法
JP2010076832A (ja) * 2008-09-29 2010-04-08 Denki Kagaku Kogyo Kk カバーテープ

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3631899A (en) * 1965-12-13 1972-01-04 Minnesota Mining & Mfg Heat-shrinkable film and tubing
US3718495A (en) * 1971-02-12 1973-02-27 Minnesota Mining & Mfg Heat-shrinkable pressure-sensitive adhesive tape
JPS5366476A (en) 1976-11-20 1978-06-13 Taisei Onchiyou Kougiyou Kk Separating of odor of organic substance
JPS5453092A (en) 1977-10-03 1979-04-26 Asahi Chem Ind Co Ltd Shrink-wrapping method of tray
JPS5943056B2 (ja) 1978-10-03 1984-10-19 出光石油化学株式会社 収縮包装用ポリエチレン組成物
KR820002058B1 (ko) * 1979-03-01 1982-10-26 미스노 가즈오 열수축성 커버(熱收縮性 cover)
US4596732A (en) * 1980-06-12 1986-06-24 Raychem Corporation Pleated heat-recoverable tape
KR820002058Y1 (ko) 1981-08-13 1982-10-02 일진금속공업주식회사 통 풍 문
US4487994A (en) * 1981-11-09 1984-12-11 Cable Technology Laboratories, Ltd. Electrical cable joint structure and method of manufacture
JPS60116430A (ja) * 1983-11-29 1985-06-22 Ube Ind Ltd 長尺体の被覆法
US5177143A (en) * 1984-08-31 1993-01-05 Raychem Corporation Method of making heat stable polymeric gelloid composition
US5904964A (en) 1989-12-18 1999-05-18 E. I. Du Pont De Nemours And Company Process for manufacturing heat-shrinkable polyethylene film
JPH03189147A (ja) 1989-12-19 1991-08-19 Sekisui Chem Co Ltd 熱収縮性積層フィルム
JP3093020B2 (ja) 1992-02-14 2000-10-03 積水化学工業株式会社 熱収縮性積層フィルム
US5460878A (en) * 1992-10-26 1995-10-24 Applied Extrusion Technologies, Inc. Heat sealable shrink laminate
JPH1053225A (ja) 1996-08-05 1998-02-24 Heisei Polymer Co Ltd 集積物包装用フィルム、集積物の包装方法及び集積物包装体
JP4179585B2 (ja) 2002-03-29 2008-11-12 ユニ・チャーム株式会社 印刷が施された生分解性プラスチックフィルム
JP2005119282A (ja) 2003-09-22 2005-05-12 Okura Ind Co Ltd 食肉包装用フィルム
US7175893B2 (en) * 2004-05-13 2007-02-13 State Of California, Department Of Transportation Corrosion protection method
JP4624721B2 (ja) 2004-05-21 2011-02-02 株式会社プライムポリマー 積層樹脂一軸延伸フィルム
JP4899593B2 (ja) 2005-04-07 2012-03-21 住友ベークライト株式会社 電子部品包装用カバーテープ
ATE532629T1 (de) * 2006-02-16 2011-11-15 Cryovac Inc Co-extrudierte wärmeschrumpfbare polyesterfolie
TWI387536B (zh) 2006-11-10 2013-03-01 Nitto Denko Corp 自捲式積層片及自捲式感壓黏著片
JP2009019063A (ja) 2007-06-11 2009-01-29 Du Pont Mitsui Polychem Co Ltd 熱可塑性樹脂フィルム
JP5225704B2 (ja) 2008-02-15 2013-07-03 旭化成ケミカルズ株式会社 ビニル芳香族炭化水素系樹脂シート

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007182244A (ja) * 2006-01-10 2007-07-19 Matsushita Electric Ind Co Ltd キャリヤテープ、及びトップカバーテープ、並びに電子部品の梱包方法
JP2010076832A (ja) * 2008-09-29 2010-04-08 Denki Kagaku Kogyo Kk カバーテープ

Also Published As

Publication number Publication date
TWI478814B (zh) 2015-04-01
WO2011024860A1 (ja) 2011-03-03
CA2768507C (en) 2014-05-27
TW201136763A (en) 2011-11-01
RU2012112480A (ru) 2013-10-10
MY155405A (en) 2015-10-15
KR20120039669A (ko) 2012-04-25
US8999502B2 (en) 2015-04-07
EP2474483A1 (en) 2012-07-11
CN102470965A (zh) 2012-05-23
EP2474483A4 (en) 2013-12-04
MX2012002447A (es) 2012-03-14
CA2768507A1 (en) 2011-03-03
KR101339583B1 (ko) 2013-12-10
SG178022A1 (en) 2012-03-29
US20120276377A1 (en) 2012-11-01

Similar Documents

Publication Publication Date Title
CN102470965B (zh) 盖带、盖带的制造方法和电子部件包装体
CN110621501B (zh) 用于柔性封装的聚乙烯层板
EP3043399A1 (en) Resin composition for sealant layer of battery packaging material
US20180215884A1 (en) Polyethylene film, laminate and package using the same
EP3369769A1 (en) Polyethylene film, laminate, and package using same
JP6826770B2 (ja) ポリエチレン共押フィルムおよびこれを用いた包装体
JP2023073314A (ja) 食品用包装フィルムおよび食品用包装体
JP5456602B2 (ja) カバーテープ、カバーテープの製造方法及び電子部品梱包体
JP2018008456A (ja) ポリエチレン積層フィルムおよびこれを用いた包装体
WO2018221495A1 (ja) ポリエチレン共押フィルム、ポリエチレン積層フィルムおよびこれらを用いた包装材料
JP2023010777A (ja) 食品用包装フィルムおよび食品用包装体
JPWO2002026495A1 (ja) ラミネート用フィルム及びラミネート体
JP5766206B2 (ja) 二軸延伸エチレン系重合体多層フィルム
JP2018008454A (ja) ポリエチレン共押フィルムおよびこれを用いた包装体
JP2014216345A (ja) 太陽電池用樹脂封止シート
JP7112835B2 (ja) 食品用包装フィルムおよび食品用包装体
JP2020007443A (ja) 食品用包装フィルムおよび食品用包装体
JP2015020750A (ja) カバーテープ及び電子部品梱包体
JP2014031197A (ja) カバーテープ、カバーテープの製造方法及び電子部品梱包体
CN105579231A (zh) 防雾性多层膜、使用其的层叠体和包装材
US6589645B1 (en) Laminated member and method for manufacturing the same
JP2018099842A (ja) 防曇性多層フィルム、これを用いる積層体、及び包装材
JP6969160B2 (ja) ポリエチレン共押フィルムおよびこれを用いた包装材料
JPH1034800A (ja) 熱可塑性多層フィルム
JP7220887B2 (ja) スキンパック蓋材用共押出フィルム

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20160425

Address after: Tokyo, Japan

Patentee after: ASAHI KASEI Kabushiki Kaisha

Address before: Tokyo, Japan

Patentee before: Asahi Kasei Chemicals Corp.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140312

CF01 Termination of patent right due to non-payment of annual fee