CN102459715B - 离子液体在预处理塑料表面以金属化中的用途 - Google Patents
离子液体在预处理塑料表面以金属化中的用途 Download PDFInfo
- Publication number
- CN102459715B CN102459715B CN201080025100.XA CN201080025100A CN102459715B CN 102459715 B CN102459715 B CN 102459715B CN 201080025100 A CN201080025100 A CN 201080025100A CN 102459715 B CN102459715 B CN 102459715B
- Authority
- CN
- China
- Prior art keywords
- ionic liquid
- plastics
- group
- charged ion
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229920003023 plastic Polymers 0.000 title claims abstract description 38
- 239000004033 plastic Substances 0.000 title claims abstract description 38
- 239000002608 ionic liquid Substances 0.000 title claims abstract description 36
- 238000001465 metallisation Methods 0.000 title description 2
- 238000000034 method Methods 0.000 claims abstract description 50
- 239000000203 mixture Substances 0.000 claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 claims abstract description 27
- 239000002184 metal Substances 0.000 claims abstract description 27
- 238000002203 pretreatment Methods 0.000 claims abstract description 16
- 150000003839 salts Chemical group 0.000 claims abstract description 9
- -1 organic cations salt Chemical class 0.000 claims description 93
- 150000002500 ions Chemical class 0.000 claims description 44
- 150000002460 imidazoles Chemical class 0.000 claims description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 229910052799 carbon Inorganic materials 0.000 claims description 9
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 239000011651 chromium Substances 0.000 claims description 8
- 229910052804 chromium Inorganic materials 0.000 claims description 8
- 229920006324 polyoxymethylene Polymers 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 8
- 150000002892 organic cations Chemical class 0.000 claims description 7
- 229920000570 polyether Polymers 0.000 claims description 7
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 229920001169 thermoplastic Polymers 0.000 claims description 6
- 229930040373 Paraformaldehyde Natural products 0.000 claims description 5
- 230000004913 activation Effects 0.000 claims description 5
- 150000001408 amides Chemical class 0.000 claims description 5
- 150000002148 esters Chemical class 0.000 claims description 5
- 239000004417 polycarbonate Substances 0.000 claims description 5
- 229920000515 polycarbonate Polymers 0.000 claims description 5
- 229920000728 polyester Polymers 0.000 claims description 5
- 150000003217 pyrazoles Chemical class 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 4
- 229930182556 Polyacetal Natural products 0.000 claims description 4
- 239000004793 Polystyrene Substances 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 125000002091 cationic group Chemical group 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000004070 electrodeposition Methods 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 4
- 229920000098 polyolefin Polymers 0.000 claims description 4
- 229920002223 polystyrene Polymers 0.000 claims description 4
- 125000001453 quaternary ammonium group Chemical group 0.000 claims description 4
- 239000011135 tin Substances 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- CZPWVGJYEJSRLH-UHFFFAOYSA-N Pyrimidine Chemical compound C1=CN=CN=C1 CZPWVGJYEJSRLH-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 3
- 238000007788 roughening Methods 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 2
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 claims description 2
- 238000009736 wetting Methods 0.000 claims description 2
- 230000000630 rising effect Effects 0.000 claims 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 6
- 125000003118 aryl group Chemical group 0.000 description 14
- 239000002253 acid Substances 0.000 description 13
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 10
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 10
- 125000000217 alkyl group Chemical group 0.000 description 10
- 238000007598 dipping method Methods 0.000 description 10
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 9
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 9
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 8
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 8
- 125000004433 nitrogen atom Chemical group N* 0.000 description 8
- 125000000962 organic group Chemical group 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 229910004283 SiO 4 Inorganic materials 0.000 description 7
- 150000001721 carbon Chemical group 0.000 description 6
- 239000000460 chlorine Substances 0.000 description 6
- 125000004122 cyclic group Chemical group 0.000 description 6
- 125000005843 halogen group Chemical group 0.000 description 6
- 125000001072 heteroaryl group Chemical group 0.000 description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 6
- 150000003949 imides Chemical class 0.000 description 6
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 5
- 125000001931 aliphatic group Chemical group 0.000 description 5
- 125000000753 cycloalkyl group Chemical group 0.000 description 5
- 125000001033 ether group Chemical group 0.000 description 5
- 125000002485 formyl group Chemical group [H]C(*)=O 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 229910019142 PO4 Inorganic materials 0.000 description 4
- ZMZDMBWJUHKJPS-UHFFFAOYSA-M Thiocyanate anion Chemical compound [S-]C#N ZMZDMBWJUHKJPS-UHFFFAOYSA-M 0.000 description 4
- 229910014307 bSiO Inorganic materials 0.000 description 4
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 4
- 150000001768 cations Chemical group 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- JZMJDSHXVKJFKW-UHFFFAOYSA-M methyl sulfate(1-) Chemical compound COS([O-])(=O)=O JZMJDSHXVKJFKW-UHFFFAOYSA-M 0.000 description 4
- 150000002894 organic compounds Chemical class 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 239000010452 phosphate Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- IBZJNLWLRUHZIX-UHFFFAOYSA-N 1-ethyl-3-methyl-2h-imidazole Chemical compound CCN1CN(C)C=C1 IBZJNLWLRUHZIX-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical group CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 3
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 3
- COVZYZSDYWQREU-UHFFFAOYSA-N Busulfan Chemical compound CS(=O)(=O)OCCCCOS(C)(=O)=O COVZYZSDYWQREU-UHFFFAOYSA-N 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- 241000370738 Chlorion Species 0.000 description 3
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 description 3
- 239000005864 Sulphur Substances 0.000 description 3
- 150000004645 aluminates Chemical class 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- KIWBPDUYBMNFTB-UHFFFAOYSA-M ethyl sulfate Chemical compound CCOS([O-])(=O)=O KIWBPDUYBMNFTB-UHFFFAOYSA-M 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- LGRLWUINFJPLSH-UHFFFAOYSA-N methanide Chemical compound [CH3-] LGRLWUINFJPLSH-UHFFFAOYSA-N 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 3
- KAIPKTYOBMEXRR-UHFFFAOYSA-N 1-butyl-3-methyl-2h-imidazole Chemical compound CCCCN1CN(C)C=C1 KAIPKTYOBMEXRR-UHFFFAOYSA-N 0.000 description 2
- MCMFEZDRQOJKMN-UHFFFAOYSA-N 1-butylimidazole Chemical class CCCCN1C=CN=C1 MCMFEZDRQOJKMN-UHFFFAOYSA-N 0.000 description 2
- DVNFMHWKXQEEAH-UHFFFAOYSA-N 1-dodecyl-3-methyl-2h-imidazole Chemical compound CCCCCCCCCCCCN1CN(C)C=C1 DVNFMHWKXQEEAH-UHFFFAOYSA-N 0.000 description 2
- WWUVJRULCWHUSA-UHFFFAOYSA-N 2-methyl-1-pentene Chemical compound CCCC(C)=C WWUVJRULCWHUSA-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- 0 CC(NC(*)=O)=O Chemical compound CC(NC(*)=O)=O 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- KYQCOXFCLRTKLS-UHFFFAOYSA-N Pyrazine Chemical compound C1=CN=CC=N1 KYQCOXFCLRTKLS-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 125000004390 alkyl sulfonyl group Chemical group 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 125000002619 bicyclic group Chemical group 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229940117975 chromium trioxide Drugs 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N chromium trioxide Inorganic materials O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- GAMDZJFZMJECOS-UHFFFAOYSA-N chromium(6+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Cr+6] GAMDZJFZMJECOS-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- UCQFCFPECQILOL-UHFFFAOYSA-N diethyl hydrogen phosphate Chemical compound CCOP(O)(=O)OCC UCQFCFPECQILOL-UHFFFAOYSA-N 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 125000005395 methacrylic acid group Chemical group 0.000 description 2
- FIMHASWLGDDANN-UHFFFAOYSA-M methyl sulfate;tributyl(methyl)azanium Chemical compound COS([O-])(=O)=O.CCCC[N+](C)(CCCC)CCCC FIMHASWLGDDANN-UHFFFAOYSA-M 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 125000006340 pentafluoro ethyl group Chemical group FC(F)(F)C(F)(F)* 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium group Chemical group [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 2
- UZZYXUGECOQHPU-UHFFFAOYSA-N sulfuric acid monooctyl ester Natural products CCCCCCCCOS(O)(=O)=O UZZYXUGECOQHPU-UHFFFAOYSA-N 0.000 description 2
- 125000001889 triflyl group Chemical group FC(F)(F)S(*)(=O)=O 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- DWXPYPYNNXEZIP-UHFFFAOYSA-N 1,3,4,5-tetramethyl-2h-imidazole Chemical class CN1CN(C)C(C)=C1C DWXPYPYNNXEZIP-UHFFFAOYSA-N 0.000 description 1
- CYJHQFPXAZQBSN-UHFFFAOYSA-N 1-butyl-3-dodecyl-2h-imidazole Chemical compound CCCCCCCCCCCCN1CN(CCCC)C=C1 CYJHQFPXAZQBSN-UHFFFAOYSA-N 0.000 description 1
- CALXWMGGCIYLGN-UHFFFAOYSA-N 1-butyl-3-hexyl-2h-imidazole Chemical compound CCCCCCN1CN(CCCC)C=C1 CALXWMGGCIYLGN-UHFFFAOYSA-N 0.000 description 1
- HCGMDEACZUKNDY-UHFFFAOYSA-N 1-butyl-3-methyl-1,2-dihydroimidazol-1-ium;acetate Chemical compound CC(O)=O.CCCCN1CN(C)C=C1 HCGMDEACZUKNDY-UHFFFAOYSA-N 0.000 description 1
- IRSVMGYCAXSOCN-UHFFFAOYSA-N 1-butyl-3-methyl-1,2-dihydroimidazol-1-ium;methyl sulfate Chemical compound COS([O-])(=O)=O.CCCC[NH+]1CN(C)C=C1 IRSVMGYCAXSOCN-UHFFFAOYSA-N 0.000 description 1
- SLZPKTPKHUFPLD-UHFFFAOYSA-N 1-butyl-3-methyl-1,2-dihydroimidazol-1-ium;thiocyanate Chemical compound [S-]C#N.CCCC[NH+]1CN(C)C=C1 SLZPKTPKHUFPLD-UHFFFAOYSA-N 0.000 description 1
- LZYLIOJHLZNDHV-UHFFFAOYSA-N 1-dodecyl-3-octyl-2h-imidazole Chemical compound CCCCCCCCCCCCN1CN(CCCCCCCC)C=C1 LZYLIOJHLZNDHV-UHFFFAOYSA-N 0.000 description 1
- JMTFLSQHQSFNTE-UHFFFAOYSA-N 1-dodecylimidazole Chemical class CCCCCCCCCCCCN1C=CN=C1 JMTFLSQHQSFNTE-UHFFFAOYSA-N 0.000 description 1
- ZXLOSLWIGFGPIU-UHFFFAOYSA-N 1-ethyl-3-methyl-1,2-dihydroimidazol-1-ium;acetate Chemical compound CC(O)=O.CCN1CN(C)C=C1 ZXLOSLWIGFGPIU-UHFFFAOYSA-N 0.000 description 1
- RILPVBCCHVYIJF-UHFFFAOYSA-N 1-ethyl-3-methyl-1,2-dihydroimidazol-1-ium;methanesulfonate Chemical class CS(O)(=O)=O.CCN1CN(C)C=C1 RILPVBCCHVYIJF-UHFFFAOYSA-N 0.000 description 1
- JCTJNVCEWUQPMB-UHFFFAOYSA-N 1-ethyl-3-methyl-1,2-dihydroimidazol-1-ium;methyl sulfate Chemical compound COS([O-])(=O)=O.CC[NH+]1CN(C)C=C1 JCTJNVCEWUQPMB-UHFFFAOYSA-N 0.000 description 1
- AYMDKQQFUZHWGX-UHFFFAOYSA-N 1-ethyl-3-methyl-1,2-dihydroimidazol-1-ium;thiocyanate Chemical compound [S-]C#N.CC[NH+]1CN(C)C=C1 AYMDKQQFUZHWGX-UHFFFAOYSA-N 0.000 description 1
- JRRNETAQGVDLRW-UHFFFAOYSA-N 1-hexadecyl-3-methyl-2h-imidazole Chemical compound CCCCCCCCCCCCCCCCN1CN(C)C=C1 JRRNETAQGVDLRW-UHFFFAOYSA-N 0.000 description 1
- WGVGZVWOOMIJRK-UHFFFAOYSA-N 1-hexyl-3-methyl-2h-imidazole Chemical compound CCCCCCN1CN(C)C=C1 WGVGZVWOOMIJRK-UHFFFAOYSA-N 0.000 description 1
- FIOYZGZRZWNKTB-UHFFFAOYSA-N 1-methyl-3-tetradecyl-2h-imidazole Chemical compound CCCCCCCCCCCCCCN1CN(C)C=C1 FIOYZGZRZWNKTB-UHFFFAOYSA-N 0.000 description 1
- 125000001637 1-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C(*)=C([H])C([H])=C([H])C2=C1[H] 0.000 description 1
- MNAHQWDCXOHBHK-UHFFFAOYSA-N 1-phenylpropane-1,1-diol Chemical compound CCC(O)(O)C1=CC=CC=C1 MNAHQWDCXOHBHK-UHFFFAOYSA-N 0.000 description 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-L 2-(carboxymethyl)-2-hydroxysuccinate Chemical compound [O-]C(=O)CC(O)(C(=O)O)CC([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-L 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- IKAHFTWDTODWID-UHFFFAOYSA-N 2-hydroxyethylazanium;formate Chemical compound [O-]C=O.[NH3+]CCO IKAHFTWDTODWID-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- 125000004398 2-methyl-2-butyl group Chemical group CC(C)(CC)* 0.000 description 1
- MHNNAWXXUZQSNM-UHFFFAOYSA-N 2-methylbut-1-ene Chemical compound CCC(C)=C MHNNAWXXUZQSNM-UHFFFAOYSA-N 0.000 description 1
- 125000001622 2-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C(*)C([H])=C([H])C2=C1[H] 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004105 2-pyridyl group Chemical group N1=C([*])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- 125000004975 3-butenyl group Chemical group C(CC=C)* 0.000 description 1
- XUHHZNLAPUWRHH-UHFFFAOYSA-N 3-butyl-1-methyl-1,2-dihydroimidazol-1-ium;methanesulfonate Chemical class CS(O)(=O)=O.CCCCN1CN(C)C=C1 XUHHZNLAPUWRHH-UHFFFAOYSA-N 0.000 description 1
- 125000004917 3-methyl-2-butyl group Chemical group CC(C(C)*)C 0.000 description 1
- LDTAOIUHUHHCMU-UHFFFAOYSA-N 3-methylpent-1-ene Chemical compound CCC(C)C=C LDTAOIUHUHHCMU-UHFFFAOYSA-N 0.000 description 1
- 125000006201 3-phenylpropyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003349 3-pyridyl group Chemical group N1=C([H])C([*])=C([H])C([H])=C1[H] 0.000 description 1
- 125000004860 4-ethylphenyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000339 4-pyridyl group Chemical group N1=C([H])C([H])=C([*])C([H])=C1[H] 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 229910016467 AlCl 4 Inorganic materials 0.000 description 1
- 229910017008 AsF 6 Inorganic materials 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 125000006725 C1-C10 alkenyl group Chemical group 0.000 description 1
- 125000000739 C2-C30 alkenyl group Chemical group 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 1
- KKUKTXOBAWVSHC-UHFFFAOYSA-N Dimethylphosphate Chemical compound COP(O)(=O)OC KKUKTXOBAWVSHC-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- WRYCSMQKUKOKBP-UHFFFAOYSA-N Imidazolidine Chemical compound C1CNCN1 WRYCSMQKUKOKBP-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- MUBZPKHOEPUJKR-UHFFFAOYSA-L Oxalate Chemical compound [O-]C(=O)C([O-])=O MUBZPKHOEPUJKR-UHFFFAOYSA-L 0.000 description 1
- PCNDJXKNXGMECE-UHFFFAOYSA-N Phenazine Natural products C1=CC=CC2=NC3=CC=CC=C3N=C21 PCNDJXKNXGMECE-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-L Phosphate ion(2-) Chemical compound OP([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-L 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920012196 Polyoxymethylene Copolymer Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical compound C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 1
- 229910018286 SbF 6 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000004902 Softening Agent Substances 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- HKWKKAWXSPLMEF-UHFFFAOYSA-N [Co].[Cl] Chemical compound [Co].[Cl] HKWKKAWXSPLMEF-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 150000001343 alkyl silanes Chemical class 0.000 description 1
- 150000001409 amidines Chemical class 0.000 description 1
- 125000001204 arachidyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 125000004104 aryloxy group Chemical group 0.000 description 1
- 125000002511 behenyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910000085 borane Inorganic materials 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 125000003901 ceryl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- IAQRGUVFOMOMEM-ARJAWSKDSA-N cis-but-2-ene Chemical compound C\C=C/C IAQRGUVFOMOMEM-ARJAWSKDSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- KVMPQUTWRWVTQP-UHFFFAOYSA-N cyanatoboronic acid Chemical compound OB(O)OC#N KVMPQUTWRWVTQP-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000004210 cyclohexylmethyl group Chemical group [H]C([H])(*)C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000004851 cyclopentylmethyl group Chemical group C1(CCCC1)C* 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- ZDIRKWICVFDSNX-UHFFFAOYSA-N diethyl phosphate 1-ethyl-3-methyl-1,2-dihydroimidazol-1-ium Chemical compound P(=O)(OCC)(OCC)O.C(C)N1CN(C=C1)C ZDIRKWICVFDSNX-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-M dihydrogenphosphate Chemical compound OP(O)([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-M 0.000 description 1
- 125000005982 diphenylmethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])(*)C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000005816 fluoropropyl group Chemical group [H]C([H])(F)C([H])([H])C([H])([H])* 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 150000002367 halogens Chemical group 0.000 description 1
- 125000000755 henicosyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002818 heptacosyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 1
- 229940051250 hexylene glycol Drugs 0.000 description 1
- 125000005462 imide group Chemical group 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-M iodide Chemical compound [I-] XMBWDFGMSWQBCA-UHFFFAOYSA-M 0.000 description 1
- 229940006461 iodide ion Drugs 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 125000000468 ketone group Chemical group 0.000 description 1
- 125000002463 lignoceryl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- IWYDHOAUDWTVEP-UHFFFAOYSA-N mandelic acid Chemical group OC(=O)C(O)C1=CC=CC=C1 IWYDHOAUDWTVEP-UHFFFAOYSA-N 0.000 description 1
- 125000002960 margaryl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 125000002819 montanyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001802 myricyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- YPJKMVATUPSWOH-UHFFFAOYSA-N nitrooxidanyl Chemical compound [O][N+]([O-])=O YPJKMVATUPSWOH-UHFFFAOYSA-N 0.000 description 1
- 125000006574 non-aromatic ring group Chemical group 0.000 description 1
- 125000002465 nonacosyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001196 nonadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- CFHIDWOYWUOIHU-UHFFFAOYSA-N oxomethyl Chemical compound O=[CH] CFHIDWOYWUOIHU-UHFFFAOYSA-N 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002460 pentacosyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 125000005538 phosphinite group Chemical group 0.000 description 1
- RYIOLWQRQXDECZ-UHFFFAOYSA-N phosphinous acid Chemical compound PO RYIOLWQRQXDECZ-UHFFFAOYSA-N 0.000 description 1
- XRBCRPZXSCBRTK-UHFFFAOYSA-N phosphonous acid Chemical compound OPO XRBCRPZXSCBRTK-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- TYRGSDXYMNTMML-UHFFFAOYSA-N propyl hydrogen sulfate Chemical compound CCCOS(O)(=O)=O TYRGSDXYMNTMML-UHFFFAOYSA-N 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- DNXIASIHZYFFRO-UHFFFAOYSA-N pyrazoline Chemical compound C1CN=NC1 DNXIASIHZYFFRO-UHFFFAOYSA-N 0.000 description 1
- PBMFSQRYOILNGV-UHFFFAOYSA-N pyridazine Chemical compound C1=CC=NN=C1 PBMFSQRYOILNGV-UHFFFAOYSA-N 0.000 description 1
- 150000003856 quaternary ammonium compounds Chemical class 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 125000000101 thioether group Chemical group 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- IAQRGUVFOMOMEM-ONEGZZNKSA-N trans-but-2-ene Chemical compound C\C=C\C IAQRGUVFOMOMEM-ONEGZZNKSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- 125000002469 tricosyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- UORVGPXVDQYIDP-UHFFFAOYSA-N trihydridoboron Substances B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 1
- 125000002221 trityl group Chemical group [H]C1=C([H])C([H])=C([H])C([H])=C1C([*])(C1=C(C(=C(C(=C1[H])[H])[H])[H])[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ZTWTYVWXUKTLCP-UHFFFAOYSA-N vinylphosphonic acid Chemical group OP(O)(=O)C=C ZTWTYVWXUKTLCP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
Landscapes
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Electroplating Methods And Accessories (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
Abstract
本发明涉及一种用金属涂覆塑料材料的方法,其特征在于用含有至少一种在1巴下熔点低于100℃的盐(下文称为离子液体)的组合物对所述塑料材料进行预处理。
Description
本发明涉及一种用金属涂覆塑料的方法,其中用包含至少一种在1巴下熔点低于100℃的盐(下文称为离子液体)的组合物预处理该塑料。
用金属涂覆塑料零件,也称为塑料电镀,正变得日益重要。塑料电镀方法产生复合材料,该复合材料兼具塑料和金属的优点。塑料可通过简单加工方法如注射成型或挤出而制成几乎任何形状;随后对获得的模制品进行电镀,例如出于装饰性目的或在模制品用作用于电子器件外罩时获得屏蔽效果。
塑料电镀中的关键工艺步骤是塑料表面的预处理。尤其是为了改善金属与塑料表面的粘合性,预处理是必须的。为此,应将塑料表面粗糙化并使其更具亲水性。在通过机械方法首先进行粗糙化之后,目前出于该目的,借助化学品对塑料表面进行溶胀并浸渍。最常用的浸渍溶液为铬/硫酸浸渍溶液(在硫酸中的三氧化铬),尤其是用于ABS(丙烯腈-丁二烯-苯乙烯共聚物)或聚碳酸酯。
铬/硫酸浸渍溶液毒性很强且在实施该工艺、后处理和处置时需要特殊的预防措施。出于在浸渍工艺中的化学过程的原因,例如所用铬化合物的还原,消耗浸渍溶液且无法再利用。
迄今为止,在1巴下熔点低于100℃的盐(称为离子液体)已用于宽范围的工业领域中。
就聚合物而言,已知离子液体作为抗静电剂或作为增塑剂的用途,参见WO2004/005391、WO2007/090755和WO2008/006422。
在本专利申请的优先权日之前尚未公开的欧洲专利申请08156462.7(PF60856)描述了离子液体作为用于聚合物的粘合剂的用途。
本发明目的是提供一种用金属涂覆塑料表面的方法,其中不再需要迄今为止一直使用的不利浸渍组合物。所述方法应在塑料和金属之间产生非常好的粘合性。所用浸渍组合物应易于再利用且应适于作为用于大量塑料的浸渍组合物。
离子液体
本发明方法中所用的组合物包含至少一种在1巴下熔点低于100℃的盐(下文称为离子液体)。
所述离子液体在1巴下优选具有低于70℃,特别优选低于30℃,非常特别优选低于0℃的熔点。
在特别优选的实施方案中,所述离子液体在通常条件(1巴,21℃)下,即在室温下为液体。
优选的离子液体包含至少一种有机化合物作为阳离子,非常特别优选仅包含有机化合物作为阳离子。
合适的有机阳离子尤其为具有杂原子如氮、硫、氧或磷的有机化合物,特别优选具有选自铵基、氧基团、锍基团或基团的阳离子基团的有机化合物。
在具体实施方案中,所述离子液体为具有铵阳离子的盐,此处该术语是指在氮原子上具有定域正电荷的非芳族化合物,即具有四价氮的化合物(季铵化合物),或具有三价氮且在其中一根键为双键的化合物,或在环体系中具有离域正电荷和至少1个氮原子,优选1个或2个氮原子的芳族化合物。
特别优选的有机阳离子为季铵阳离子,该季铵阳离子优选具有4个C1-C12烷基作为氮原子上的取代基。
还特别优选有机阳离子,该有机阳离子包含具有1个或2个氮原子作为环体系成员的杂环体系。单环、双环、芳族或非芳族环体系是可能的。例如可提及双环体系,如WO2008/043837所述。WO2008/043837的双环体系为优选由7员环和6员环构成且包含脒基团的偶氮双环衍生物;可特别提及1,8-偶氮双环[5.4.0]十一碳-7-烯阳离子。
非常特别优选的有机阳离子包含具有1个或2个氮原子作为环体系成员的5或6员环杂体系。
可能的阳离子例如为吡啶阳离子、哒嗪阳离子、嘧啶阳离子、吡嗪阳离子、咪唑阳离子、吡唑阳离子、吡唑啉阳离子、咪唑啉阳离子、噻唑阳离子、三唑阳离子、吡咯烷阳离子和咪唑烷阳离子。这些阳离子例如在WO2005/113702中提及。如果氮原子上或芳族环体系中的正电荷是必须的,则氮原子在每种情况下被有机基团取代,所述有机基团通常具有不超过20个碳原子,优选烃基,特别是C1-C16烷基,特别是C1-C10烷基,尤其优选C1-C4烷基。
环体系的碳原子还可被有机基团取代,所述有机基团通常具有不超过20个碳原子,优选烃基,特别是C1-C16烷基,特别是C1-C10烷基,尤其优选C1-C4烷基。
特别优选的铵阳离子为上述季铵阳离子,咪唑阳离子、嘧啶阳离子和吡唑阳离子,其是指具有咪唑、吡啶或吡唑环体系和任选地,环体系的碳和/或氮原子上的任意取代基的化合物。
非常特别优选咪唑阳离子。
阴离子可为有机或无机阴离子。特别优选的离子液体仅由有机阳离子与下述阴离子之一构成。
所述离子液体的分子量优选小于2000g/mol,特别优选小于1500g/mol,特别优选小于1000g/mol,非常特别优选小于750g/mol;在优选实施方案中,分子量为100-750g/mol或100-500g/mol。
在具体实施方案中,所述离子液体为咪唑化合物,特别优选具有下式的咪唑化合物:
其中:
R1和R3各自相互独立地为具有1-20个碳原子的有机基团,
R2、R4和R5各自相互独立地为H原子或具有1-20个碳原子的有机基团,
X为阴离子,且
n为1、2或3。
优选R1和R3各自相互独立地为包含1-10个碳原子的有机基团。所述基团特别优选为不具有其他杂原子的烃基,例如饱和或不饱和脂族基团、芳族基团或具有芳族和脂族部分二者的烃基。所述烃基非常特别优选C1-C10烷基,C1-C10链烯基,例如烯丙基,苯基,苄基。特别地,所述烃基为C1-C4烷基,例如甲基、乙基、丙基、异丙基或正丁基。
优选R2、R4和R5各自相互独立地为H原子或包含1-10个碳原子的有机基团。R2、R4和R5特别优选各自为H原子或不具有其他杂原子的烃基,例如脂族基团、芳族基团或具有芳族和脂族部分二者的烃基。非常特别优选H原子或C1-C10烷基、苯基或苄基。特别地,所述取代基为H原子或C1-C4烷基,例如甲基、乙基、丙基、异丙基或正丁基。
变量n优选为1。
作为阴离子,原则上可使用与所述阳离子组合得到离子液体的所有阴离子。
所述离子液体的阴离子[Y]n-例如选自如下基团:
下式的卤离子和含卤化合物的基团:
F-、Cl-、Br-、I-、BF4 -、PF6 -、AlCl4 -、Al2Cl7 -、Al3Cl10 -、AlBr4 -、FeCl4 -、BCl4 -、SbF6 -、AsF6 -、ZnCl3 -、SnCl3 -、CuCl2 -、CF3SO3 -、(CF3SO3)2N-、CF3CO2 -、CCl3CO2 -、CN-、SCN-、OCN-、NO2-、NO3-、N(CN)-;
如下通式的硫酸根、亚硫酸根和磺酸根的基团:
SO4 2-、HSO4 -、SO3 2-、HSO3 -、RaOSO3 -、RaSO3 -;
如下通式的磷酸根的基团:
PO4 3-、HPO4 2-、H2PO4 -、RaPO4 2-、HRaPO4 -、RaRbPO4 -;
如下通式的膦酸根和次膦酸根的基团:
RaHPO3 -、RaRbPO2 -、RaRbPO3 -;
如下通式的亚磷酸根的基团:
PO3 3-、HPO3 2-、H2PO3 -、RaPO3 2-、RaHPO3 -、RaRbPO3 -;
如下通式的亚膦酸根和次亚膦酸根(Phosphinite)的基团:
RaRbPO2 -、RaHPO2 -、RaRbPO-、RaHPO-;
如下通式的羧酸根的基团:
RaCOO-;
如下通式的硼酸根的基团:
BO3 3-、HBO3 2-、H2BO3 -、RaRbBO3 -、RaHBO3 -、RaBO3 2-、B(ORa)(ORb)(ORc)(ORd)-、B(HSO4)-、B(RaSO4)-;
如下通式的硼烷酸根的基团:
RaBO2 2-、RaRbBO-;
如下通式的碳酸根和碳酸酯的基团:
HCO3 -、CO3 2-、RaCO3 -;
如下通式的硅酸根和硅酸酯的基团:
SiO4 4-、HSiO4 3-、H2SiO4 2-、H3SiO4 -、RaSiO4 3-、RaRbSiO4 2-、RaRbRcSiO4 -、HRaSiO4 2-、H2RaSiO4 -、HRaRbSiO4 -;
如下通式的烷基硅烷和芳基硅烷盐的基团:
RaSiO3 3-、RaRbSiO2 2-、RaRbRcSiO-、RaRbRcSiO3 -、RaRbRcSiO2 -、RaRbSiO3 2-;
如下通式的羧酰亚胺、二(磺酰基)酰亚胺和磺酰基酰亚胺的基团:
如下通式的甲基化物的基团:
如下通式的醇根和芳氧基化物的基团:
RaO-;
如下通式的卤代金属化物(halometalate)基团:
[MrHalt]s-,
其中M为金属且Hal为氟、氯、溴或碘,r和t为正整数且表示配合物的化学计量比,s为正整数且表示配合物的电荷;
如下通式的硫离子、硫氢根、多硫离子(polysulfide)、多硫氢根(hydrogenpolysulfide)和硫醇根的基团:
S2-、HS-、[Sv]2-、[HSv]-、[RaS]-,
其中v为2-10的正整数;和
配位金属离子基团如Fe(CN)6 3-,Fe(CN)6 4-,MnO4 -,Fe(CO)4 –.。
在上述阴离子中,Ra、Rb、Rc和Rd各自相互独立地为:
氢;
C1-C30烷基及其芳基-、杂芳基-、环烷基-、卤素-、羟基-、氨基-、羧基-、甲酰基-、-O-、-CO-、-CO-O-或–CO-N<取代的衍生物,例如甲基、乙基、1-丙基、2-丙基、1-丁基、2-丁基、2-甲基-1-丙基(异丁基)、2-甲基-2-丙基(叔丁基)、1-戊基、2-戊基、3-戊基、2-甲基-1-丁基、3-甲基-1-丁基、2-甲基-2-丁基、3-甲基-2-丁基、2,2-二甲基-1-丙基、1-己基、2-己基、3-己基、2-甲基-1-戊基、3-甲基-1-戊基、4-甲基-1-戊基、2-甲基-2-戊基、3-甲基-2-戊基、4-甲基-2-戊基、2-甲基-3-戊基、3-甲基-3-戊基、2,2-二甲基-1-丁基、2,3-二甲基-1-丁基、3,3-二甲基-1-丁基、2-乙基-1-丁基、2,3-二甲基-2-丁基、3,3-二甲基-2-丁基、庚基、辛基、壬基、癸基、十一烷基、十二烷基、十三烷基、十四烷基、十五烷基、十六烷基、十七烷基、十八烷基、十九烷基、二十烷基、二十一烷基、二十二烷基、二十三烷基、二十四烷基、二十五烷基、二十六烷基、二十七烷基、二十八烷基、二十九烷基、三十烷基、苯基甲基(苄基)、二苯基甲基、三苯基甲基、2-苯基乙基、3-苯基丙基、环戊基甲基、2-环戊基乙基、3-环戊基丙基、环己基甲基、2-环己基乙基、3-环己基丙基、甲氧基、乙氧基、甲酰基、乙酰基,或CqF2(q-a)+(1-b)H2a+b,其中q≤30,0≤a≤q和b=0或1(例如CF3、C2F5、CH2CH2-C(q-2)F2(q-2)+1、C6F13、C8F17、C10F21、C12F25);
C3-C12环烷基及其芳基-、杂芳基-、环烷基-、卤素-、羟基-、氨基-、羧基-、甲酰基-、-O-、-CO-或–CO-O-取代的衍生物,例如环戊基、2-甲基-1-环戊基、3-甲基-1-环戊基、环己基、2-甲基-1-环己基、3-甲基-1-环己基、4-甲基-1-环己基或CqF2(q-a)-(1-b)H2a-b,其中q≤30,0≤a≤q和b=0或1;
C2-C30链烯基及其芳基-、杂芳基-、环烷基-、卤素-、羟基-、氨基-、羧基-、甲酰基-、-O-、-CO-或–CO-O-取代的衍生物,例如2-丙烯基、3-丁烯基、顺式-2-丁烯基、反式-2-丁烯基或CqF2(q-a)-(1-b)H2a-b,其中q≤30,0≤a≤q和b=0或1;
C3-C12环烯基及其芳基-、杂芳基-、环烷基-、卤素-、羟基-、氨基-、羧基-、甲酰基-、-O-、-CO-或-CO-O-取代的衍生物,例如3-环戊烯基、2-环己烯基、3-环己烯基、2,5-环己二烯基或CqF2(q-a)-3(1-b)H2a-3b,其中q≤30,0≤a≤q和b=0或1;
具有2-30个碳原子的芳基或杂芳基及其烷基-、芳基-、杂芳基-、环烷基-、卤素-、羟基-、氨基-、羧基-、甲酰基-、-O-、-CO-或–CO-O-取代的衍生物,例如苯基、2-甲基苯基(2-甲苯基)、3-甲基苯基(3-甲苯基)、4-甲基苯基、2-乙基苯基、3-乙基苯基、4-乙基苯基、2,3-二甲基苯基、2,4-二甲基苯基、2,5-二甲基苯基、2,6-二甲基苯基、3,4-二甲基苯基、3,5-二甲基苯基、4-苯基苯基、1-萘基、2-萘基、1-吡咯基、2-吡咯基、3-吡咯基、2-吡啶基、3-吡啶基、4-吡啶基或C6F(5-a)Ha,其中0≤a≤5;或
两个基团形成不饱和、饱和或芳族环,其任选被官能团、芳基、烷基、芳氧基、烷氧基、卤素、杂原子和/或杂环取代,并任选被一个或多个氧和/或硫原子和/或被一个或多个取代和未取代的亚氨基间隔。
在上述阴离子中,优选Ra、Rb、Rc和Rd各自相互独立地为氢原子或C1-C12烷基。
非常特别优选的阴离子为氯离子;溴离子;碘离子;硫氰酸根;六氟磷酸根;三氟甲烷磺酸根;甲烷磺酸根;甲酸根;乙酸根;扁桃酸根;硝酸根;亚硝酸根;三氟乙酸根;硫酸根;硫酸氢根;甲基硫酸根;乙基硫酸根;1-丙基硫酸根;1-丁基硫酸根;1-己基硫酸根;1-辛基硫酸根;磷酸根;磷酸二氢根;磷酸氢根;二(C1-C4烷基)磷酸根;丙酸根;四氯铝酸根;Al2Cl7 -;氯锌酸根;氯高铁酸根;二(三氟甲基磺酰基)酰亚胺;二(五氟乙基磺酰基)酰亚胺;二(甲基磺酰基)酰亚胺;二(对甲苯基磺酰基)酰亚胺;三(三氟甲基磺酰基)甲基化物;二(五氟乙基磺酰基)甲基化物;对甲苯磺酸根;四碳基钴酸根;二亚甲基二醇单甲基醚硫酸根;油酸根;硬脂酸根;丙烯酸根;甲基丙烯酸根;马来酸根;柠檬酸氢根;乙烯基膦酸根;二(五氟乙基)次膦酸根;硼酸根如二[水杨酸根合(2-)]硼酸根,二[草酸根合(2-)]硼酸根,二[1,2-苯二醇酸根合(2-)-O,O']硼酸根,四氰基硼酸根,四氟硼酸根;双氰胺根;三(五氟乙基)三氟磷酸根;三(五氟丙基)三氟磷酸根,环状芳基磷酸根如儿茶酚磷酸根(C6H4O2)P(O)O-和氯钴酸根。
非常特别优选的阴离子为氯离子、溴离子、硫酸氢根、四氯铝酸根、硫氰酸根、甲基硫酸根、乙基硫酸根、甲烷磺酸根、甲酸根、乙酸根、二甲基磷酸根、二乙基磷酸根、对甲苯磺酸根、四氟硼酸根和六氟磷酸根。
特别优选包含下列阳离子作为阳离子和下列阴离子作为阴离子的离子液体:
阳离子:
甲基三(1-丁基)铵、2-羟基乙基铵、1-甲基咪唑、1-乙基咪唑、1-(1-丁基)咪唑、1-(1-辛基)咪唑、1-(1-十二烷基)咪唑、1-(1-十四烷基)咪唑、1-(1-十六烷基)咪唑、1,3-二甲基咪唑、1-乙基-3-甲基咪唑、1-(1-丁基)-3-甲基咪唑、1-(1-丁基)-3-乙基咪唑、1-(1-己基)-3-甲基咪唑、1-(1-己基)-3-乙基咪唑、1-(1-己基)-3-丁基咪唑、1-(1-辛基)-3-甲基咪唑、1-(1-辛基)-3-乙基咪唑、1-(1-辛基)-3-丁基咪唑、1-(1-十二烷基)-3-甲基咪唑、1-(1-十二烷基)-3-乙基咪唑、1-(1-十二烷基)-3-丁基咪唑、1-(1-十二烷基)-3-辛基咪唑、1-(1-十四烷基)-3-甲基咪唑、1-(1-十四烷基)-3-乙基咪唑、1-(1-十四烷基)-3-丁基咪唑、1-(1-十四烷基)-3-辛基咪唑、1-(1-十六烷基)-3-甲基咪唑、1-(1-十六烷基)-3-乙基咪唑、1-(1-十六烷基)-3-丁基咪唑、1-(1-十六烷基)-3-辛基咪唑、1,2-二甲基咪唑、1,2,3-三甲基咪唑、1-乙基-2,3-二甲基咪唑、1-(1-丁基)-2,3-二甲基咪唑、1-(1-己基)-2,3-二甲基咪唑、1-(1-辛基)-2,3-二甲基咪唑、1,4-二甲基咪唑、1,3,4-三甲基咪唑、1,4-二甲基-3-乙基咪唑、3-丁基咪唑、1,4-二甲基-3-辛基咪唑、1,4,5-三甲基咪唑、1,3,4,5-四甲基咪唑、1,4,5-三甲基-3-乙基咪唑、1,4,5-三甲基-3-丁基咪唑或1,4,5-三甲基-3-辛基咪唑;
和阴离子:
氯离子、溴离子、硫酸氢根、四氯铝酸根、硫氰酸根、甲基硫酸根、乙基硫酸根、甲烷磺酸根、甲酸根、乙酸根、二甲基磷酸根、二乙基磷酸根、对甲苯磺酸根、四氟硼酸根和六氟磷酸根。
此外,特别优选下列离子液体:
1,3-二甲基咪唑甲基硫酸盐、1,3-二甲基咪唑硫酸氢盐、1,3-二甲基咪唑二甲基磷酸盐、1,3-二甲基咪唑乙酸盐、1-乙基-3-甲基咪唑甲基硫酸盐、1-乙基-3-甲基咪唑硫酸氢盐、1-乙基-3-甲基咪唑硫氰酸盐、1-乙基-3-甲基咪唑乙酸盐、1-乙基-3-甲基咪唑甲烷磺酸盐、1-乙基-3-甲基咪唑二乙基磷酸盐、1-(1-丁基)-3-甲基咪唑甲基硫酸盐、1-(1-丁基)-3-甲基咪唑硫酸氢盐、1-(1-丁基)-3-甲基咪唑硫氰酸盐、1-(1-丁基)-3-甲基咪唑乙酸盐、1-(1-丁基)-3-甲基咪唑甲烷磺酸盐、1-(1-十二烷基)-3-甲基咪唑甲基硫酸盐、1-(1-十二烷基)-3-甲基咪唑硫酸氢盐、1-(1-十四烷基)-3-甲基咪唑甲基硫酸盐、1-(1-十四烷基)-3-甲基咪唑硫酸氢盐、1-(1-十六烷基)-3-甲基咪唑甲基硫酸盐或1-(1-十六烷基)-3-甲基咪唑硫酸氢盐、2-羟基乙基铵甲酸盐或甲基三丁基铵甲基硫酸盐。
组合物的组分
除了离子液体以外,本发明组合物还可包含其他组分。
可能的其他组分例如为借助其设定所需粘度的添加剂。此处尤其可提及水或有机溶剂,优选水和可与所述离子液体混溶的溶剂。如果合适的话,其他添加剂可为增稠剂或流平剂。
所述组合物优选包含大于10重量%,尤其是大于30重量%,特别优选大于50重量%,非常特别优选大于80重量%的离子液体。在特别优选的实施方案中,包含大于90重量%,尤其是大于95重量%的离子液体。在非常特别优选的实施方案中,所述组合物仅由离子液体构成。
所述离子液体和包含所述离子液体或由所述离子液体构成的组合物优选为在20-100℃,尤其是0-100℃(大气压,1巴)的整个温度范围内为液体。聚合物和金属
在本发明方法中,对塑料进行涂覆。所述塑料优选为热塑性聚合物。可将热塑性聚合物熔融并借助各种方法如注射成型、挤出深拉(ExtrusionTiefziehen)或吹塑而形成所需形状。
作为合适的热塑性聚合物,可提及聚酰胺,聚烯烃,聚酯,聚醚,聚缩醛,特别是聚甲醛,聚碳酸酯,聚氨酯,聚丙烯酸酯,聚苯乙烯或苯乙烯共聚物,特别是与丙烯腈的共聚物,例如丙烯腈-丁二烯-苯乙烯共聚物(ABS)。
作为聚酰胺,可提及氨基羧酸的缩聚物,例如6-氨基羧酸或ε-己内酰胺的缩聚物,或二氨基化合物与二羧酸的缩聚物,例如1,6-己二胺与己二酸的缩聚物。
合适的聚烯烃为聚乙烯、聚丙烯和乙烯或丙烯的共聚物。
聚酯为多元醇,例如丁二醇、己二醇、甘油或三羟甲基丙烷与多元羧酸,尤其是邻苯二甲酸及其异构体、己二酸或1,2,4-苯三酸酐的缩聚产物。
作为聚缩醛,尤其可提及聚甲醛(POM)。
聚碳酸酯为碳酸与多元醇,例如双酚A的酯;可提及包含其他多元羧酸作为构成组分的聚酯碳酸酯。
聚醚包含重复的醚基团。工业上特别重要的聚醚例如为尤其包含经由重复的醚基团连接的芳族环体系和酰亚胺基团的聚醚酰亚胺、尤其包含经由重复的醚基团连接的亚苯基和酮基的聚醚酮、在其聚合物主链中包含醚基团和硫醚基团的聚醚硫醚和在其聚合物主链中包含重复的醚基团和砜基团的聚醚砜。
聚氨酯为多官能异氰酸酯与多元醇的加聚物,其中脂族和芳族化合物都是可能的。
聚丙烯酸酯为丙烯酸系单体或甲基丙烯酸系单体的均聚物或共聚物;例如可提及聚甲基丙烯酸甲酯(PMMA)。
最后,还可提及苯乙烯的均聚物和共聚物,例如聚苯乙烯、苯乙烯-丙烯腈共聚物,尤其是丙烯腈-丁二烯-苯乙烯共聚物(ABS)。
特别优选的聚合物为聚酰胺、聚酯、聚醚、聚甲醛和ABS。后者例如以商品名由BASFSE销售。
待涂覆的制品可完全由上述塑料之一而构成。该类制品可具有任何形状且可例如通过热塑性模塑方法如注射成型、挤出深拉和吹塑得到。然而,它们还可包含各种材料;重要的是待涂覆的表面由塑料构成。
在本发明方法,用金属涂覆塑料。可能的金属例如为镍、铝、铜、铬、锡或锌及其合金。所述金属可在一个或多个层中或操作中施加。也可施加不同金属的层。
方法
本发明方法的关键因素是根据权利要求对塑料进行预处理。用金属进行的涂覆以及就该目的而言是必要且可行的程序、制备和后处理的其他措施可参见现有技术中的各种实施方案。
甚至在本发明预处理之前,对待涂覆的塑料表面进行清洁和脱脂也是可行的。所述清洁和脱脂可使用常规清洁剂或洗涤剂进行。
本发明预处理取代了迄今为止用侵蚀性化学品如铬/硫酸(在硫酸中的三氧化铬)进行的常规浸渍。
本发明预处理优选在升高的温度下,优选在30-120℃,特别优选50-120℃的温度下进行。为此该组合物优选具有上述温度。没有必要对待涂覆的塑料零件事先进行单独加热。
在优选实施方案中,将待涂覆的制品浸入优选处于上述温度的组合物中。搅拌该组合物以改善传质,这可根据现有技术借助搅拌器、泵、吹入空气等而进行。或者,可借助电镀中已知的特种设备将工件本身在该组合物中搅拌。
设定所需组合物的量,使得加工零件润湿至所需程度。可将工件整个浸渍或仅部分浸渍。
组合物在塑料表面上的作用时间优选为1-60分钟(min),特别是1-30min,特别优选1-15min。
在接触时间之后,优选通过用水或有机溶剂漂洗而将所述组合物从预处理的制品上除去。
可将所述组合物回收(再循环),如果合适的话,清洁并再利用。
所述组合物的再循环可例如通过借助水或有机溶解将溶解的塑料沉淀并随后通过过滤除去溶解的塑料而进行。
用于沉淀的介质可随后通过蒸馏回收。溶解塑料的挥发性成分还可直接通过蒸馏从该组合物中除去。以此方式可获得提纯的且可再利用的组合物。
本发明预处理仅为在塑料电镀中一起被称为预处理的所有措施的一部分。术语预处理通常包括所有无电工艺。
该预处理尤其包括金属核,例如钯、银或金,优选钯的第一施加,其也称为活化,和用金属的第一涂覆,其中活化类型和第一金属涂覆相互匹配。
已知的活化方法例如为经典胶体活化(施加钯/锡胶体),离子源性活化(施加钯阳离子),直接金属化或以名称UdiqueEnplateMID选择或LDS方法已知的方法。
所述预处理的其他部分通常还为施加第一金属涂层,其通常在无电工艺中进行。通常通过无电工艺施加的第一层(种层)为镍、铜、铬或其合金的层。
预处理之后,最后通过电化学沉积施加金属层,优选上述金属的层。
本发明方法能改善金属层与塑料表面,例如ABS的粘合或对许多塑料来说,可简便地加以改善。所获得的金属层的粘合性非常好,即使是在机械应力或高温的情况下。
实施例
1.1借助EMIM乙酸盐浸渍
通过将其在室温下浸入60ml乙醇中2分钟而对尺寸为60×30×2mm的ABS(丙烯腈-丁二烯三元共聚物,获自BASF的其中在所有实施例中均使用TerluranGP35)板进行预清洁。随后在80℃下将该板浸入80ml搅拌的1-乙基-3-甲基咪唑乙酸盐(EMIM乙酸盐)中10分钟。在浸渍结束后,将该基材用水漂洗并再在室温下浸入60ml搅拌的水(蒸馏水)中5分钟以除去残留盐。通过SEM分析检测离子液体的浸渍效果并显示出新的表面结构。
1.2借助MTBS浸渍
通过将其在室温下浸入60ml乙醇中2分钟而对尺寸为60×30×2mm的Terluran板进行预清洁。随后在80℃下将该板浸入80ml搅拌的甲基三丁基铵甲基硫酸盐(MTBS)中5分钟。在浸渍结束后,将该基材用水漂洗并再在室温下浸入60ml搅拌的水(蒸馏水)中5分钟以除去残留盐。通过SEM分析检测离子液体的浸渍效果并显示出新的表面结构。
Claims (21)
1.一种用金属涂覆塑料的方法,其中用包含至少一种在1巴下熔点低于100℃的盐(下文称为离子液体)的组合物对所述塑料进行预处理而将塑料表面粗糙化并使其更具亲水性,其中所述组合物包含大于80重量%的离子液体,其中所述离子液体为具有有机阳离子的盐,所述有机阳离子选自季铵阳离子、咪唑阳离子、嘧啶阳离子或吡唑阳离子。
2.根据权利要求1的方法,其中所述离子液体为在21℃、1巴下为液体的盐。
3.根据权利要求1或2的方法,其中所述离子液体为具有咪唑阳离子、吡啶阳离子或吡唑阳离子的盐。
4.根据权利要求1或2的方法,其中所述离子液体为具有咪唑阳离子的盐。
5.根据权利要求3的方法,其中所述离子液体为具有咪唑阳离子的盐。
6.根据权利要求1或2的方法,其中所述组合物除了所述离子液体之外还任选包含水或有机溶剂。
7.根据权利要求4的方法,其中所述组合物除了所述离子液体之外还任选包含水或有机溶剂。
8.根据权利要求1或2的方法,其中所述塑料为热塑性聚合物。
9.根据权利要求6的方法,其中所述塑料为热塑性聚合物。
10.根据权利要求1或2的方法,其中所述塑料为聚酰胺,聚烯烃,聚酯,聚醚,聚缩醛,聚碳酸酯,聚氨酯,聚丙烯酸酯,聚苯乙烯或苯乙烯共聚物。
11.根据权利要求8的方法,其中所述塑料为聚酰胺,聚烯烃,聚酯,聚醚,聚缩醛,聚碳酸酯,聚氨酯,聚丙烯酸酯,聚苯乙烯或苯乙烯共聚物。
12.根据权利要求1或2的方法,其中所述塑料为聚甲醛。
13.根据权利要求1或2的方法,其中所述塑料为苯乙烯与丙烯腈的共聚物。
14.根据权利要求1或2的方法,其中所述塑料为丙烯腈-丁二烯/苯乙烯共聚物。
15.根据权利要求1或2的方法,其中待沉积的金属为镍、铝、铜、铬、锡或锌或其合金。
16.根据权利要求10的方法,其中待沉积的金属为镍、铝、铜、铬、锡或锌或其合金。
17.根据权利要求1或2的方法,其中在30-120℃的升高的温度下用所述组合物对塑料进行处理。
18.根据权利要求15的方法,其中在30-120℃的升高的温度下用所述组合物对塑料进行处理。
19.根据权利要求1或2的方法,其中在预处理和如果合适的话,其他加工步骤之后,通过电化学沉积工艺施加一层或多层金属。
20.根据权利要求17的方法,其中在预处理和如果合适的话,其他加工步骤之后,通过电化学沉积工艺施加一层或多层金属。
21.根据权利要求1或2的方法,其中在预处理和如果合适的话,活化或用金属预涂覆之后,通过电化学沉积工艺施加一层或多层金属。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09162184 | 2009-06-08 | ||
EP09162184.7 | 2009-06-08 | ||
PCT/EP2010/057602 WO2010142567A1 (de) | 2009-06-08 | 2010-06-01 | Verwendung von ionischen flüssigkeiten zur vorbehandlung von kunststoffoberflächen zur metallisierung |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102459715A CN102459715A (zh) | 2012-05-16 |
CN102459715B true CN102459715B (zh) | 2015-11-25 |
Family
ID=42556486
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201080025100.XA Active CN102459715B (zh) | 2009-06-08 | 2010-06-01 | 离子液体在预处理塑料表面以金属化中的用途 |
Country Status (10)
Country | Link |
---|---|
US (1) | US9090966B2 (zh) |
EP (1) | EP2440693B1 (zh) |
JP (1) | JP5916604B2 (zh) |
KR (2) | KR20120027474A (zh) |
CN (1) | CN102459715B (zh) |
AU (1) | AU2010257683B2 (zh) |
CA (1) | CA2763967C (zh) |
MY (1) | MY156523A (zh) |
SG (2) | SG10201402353PA (zh) |
WO (1) | WO2010142567A1 (zh) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2747918A1 (en) * | 2011-08-24 | 2014-07-02 | Eckart America Corporation | Ionic liquid release coat for use in metal flake manufacture |
KR101309525B1 (ko) | 2011-12-26 | 2013-09-24 | 전북대학교산학협력단 | 금속-이온성 액체 복합체 박막 및 이의 제조방법 |
US20130299453A1 (en) * | 2012-05-14 | 2013-11-14 | United Technologies Corporation | Method for making metal plated gas turbine engine components |
US20130299355A1 (en) * | 2012-05-14 | 2013-11-14 | United Technologies Corporation | Surface cleaning and activation for electrodeposition in ionic liquids |
PL3527639T3 (pl) * | 2013-11-29 | 2022-03-07 | Proionic Gmbh | Sposób łączenia tworzywa termoplastycznego za pomocą promieniowania mikrofalowego |
WO2017016964A1 (en) * | 2015-07-30 | 2017-02-02 | Basf Se | Process for pretreatment of plastic surfaces for metallization |
WO2017016965A1 (en) | 2015-07-30 | 2017-02-02 | Basf Se | Process for metallizing plastic surfaces |
US20170051410A1 (en) * | 2015-08-20 | 2017-02-23 | Macdermid Acumen, Inc. | Solutions of Organic Salts as Pretreatments for Plastic Prior to Etching |
CN105440638A (zh) * | 2015-12-22 | 2016-03-30 | 芜湖恒坤汽车部件有限公司 | 高强度离合器阻尼垫片材料及其制备方法 |
CN105440631A (zh) * | 2015-12-22 | 2016-03-30 | 芜湖恒坤汽车部件有限公司 | 离合器油壶材料及其制备方法 |
CN105440637A (zh) * | 2015-12-22 | 2016-03-30 | 芜湖恒坤汽车部件有限公司 | 高强度离合器摩擦垫圈材料及其制备方法 |
CN105419287A (zh) * | 2015-12-22 | 2016-03-23 | 芜湖恒坤汽车部件有限公司 | 离合器塑料齿轮材料及其制备方法 |
CN105482418A (zh) * | 2015-12-22 | 2016-04-13 | 芜湖恒坤汽车部件有限公司 | 离合器泵活塞及其制备方法 |
CN106243668B (zh) * | 2016-08-10 | 2018-03-27 | 王田军 | 一种应用于nmt的树脂组合物 |
JP2018104740A (ja) * | 2016-12-22 | 2018-07-05 | ローム・アンド・ハース電子材料株式会社 | 無電解めっき方法 |
WO2018144984A1 (en) * | 2017-02-03 | 2018-08-09 | Massachusetts Institute Of Technology | Task specific ionic liquid-impregnated polymeric surface coatings for antibacterial, antifouling, and metal scavenging activity |
WO2018234638A1 (en) | 2017-06-22 | 2018-12-27 | Helsingin Yliopisto | METHOD FOR ASSEMBLING POLYMERIC BIOMATERIALS |
KR102300834B1 (ko) * | 2019-11-21 | 2021-09-13 | 주식회사 포스코 | 스테인리스강 산세용 이온성 액체 및 이를 이용한 스테인리스강의 산세방법 |
DE102020212302A1 (de) | 2020-09-29 | 2022-03-31 | Contitech Techno-Chemie Gmbh | Kunststoffrohrleitung mit integriertem Anschluss |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2108279A1 (en) * | 1991-04-12 | 1992-10-13 | Hans-Joachim Grapentin | Process for the metallization of non-conductors, in particular circuit boards, and the use of nitrogen- containing quaternary salts in the process |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3684572A (en) * | 1970-07-13 | 1972-08-15 | Du Pont | Electroless nickel plating process for nonconductors |
DE3149919A1 (de) | 1981-12-11 | 1983-06-23 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Verfahren zum haftfesten metallisieren von polyimid |
DE3530617A1 (de) * | 1985-08-23 | 1987-02-26 | Schering Ag | Konditionierungsmittel fuer die behandlung von basismaterialien |
JPS6263676A (ja) * | 1985-09-14 | 1987-03-20 | Agency Of Ind Science & Technol | ポリエチレンテレフタレ−トフイルムの強磁性金属めつき方法 |
DE3741459C1 (de) * | 1987-12-08 | 1989-04-13 | Blasberg Oberflaechentech | Verfahren zur Herstellung durchkontaktierter Leiterplatten |
DE3743740A1 (de) * | 1987-12-23 | 1989-07-06 | Basf Ag | Polymere konditionierungsmittel zur vorbehandlung von nichtmetallischen oberflaechen fuer eine chemische metallisierung |
US4873136A (en) * | 1988-06-16 | 1989-10-10 | General Electric Company | Method for preparing polymer surfaces for subsequent plating thereon, and improved metal-plated plastic articles made therefrom |
DE4227836C2 (de) * | 1992-08-20 | 1997-09-25 | Atotech Deutschland Gmbh | Verfahren zur Metallisierung von Nichtleitern |
ATE382655T1 (de) | 2002-07-05 | 2008-01-15 | Evonik Goldschmidt Gmbh | Polymerzusammensetzungen aus polymeren und ionischen flussigkeiten |
KR100568386B1 (ko) * | 2002-09-10 | 2006-04-05 | 가부시키 가이샤 닛코 마테리알즈 | 금속도금방법 및 전처리제 |
DE102004024967A1 (de) | 2004-05-21 | 2005-12-08 | Basf Ag | Neue Absorptionsmedien für Absorptionswärmepumpen, Absorptionskältemaschinen und Wärmetransformatoren |
JP2006070319A (ja) * | 2004-09-01 | 2006-03-16 | Toyota Motor Corp | 樹脂めっき方法 |
JP2007162037A (ja) * | 2005-12-09 | 2007-06-28 | Okuno Chem Ind Co Ltd | ポリ乳酸樹脂成形品へのめっき方法。 |
EA016428B9 (ru) | 2006-02-07 | 2013-01-30 | Басф Се | Ячеистый полиуретан, его получение, ролики, пленка, половое покрытие, детали внутреннего оснащения автомобилей, антистатическая подошва, защитная подошва и применение ионной жидкости в качестве антистатической добавки |
DE102006031952A1 (de) | 2006-07-11 | 2008-01-17 | Goldschmidt Gmbh | Verwendung von ionischen Flüssigkeiten oder Lösungen aus Metallsalzen in ionischen Flüssigkeiten als Antistatika für Kunststoffe |
US8044120B2 (en) | 2006-10-13 | 2011-10-25 | Basf Aktiengesellschaft | Ionic liquids for solubilizing polymers |
DE102009003011A1 (de) | 2008-05-19 | 2009-11-26 | Basf Se | Verwendung von ionischen Flüssigkeiten als Klebstoff |
-
2010
- 2010-06-01 SG SG10201402353PA patent/SG10201402353PA/en unknown
- 2010-06-01 KR KR1020127000382A patent/KR20120027474A/ko active Application Filing
- 2010-06-01 US US13/375,955 patent/US9090966B2/en not_active Expired - Fee Related
- 2010-06-01 EP EP10722357.0A patent/EP2440693B1/de active Active
- 2010-06-01 CN CN201080025100.XA patent/CN102459715B/zh active Active
- 2010-06-01 AU AU2010257683A patent/AU2010257683B2/en not_active Ceased
- 2010-06-01 CA CA2763967A patent/CA2763967C/en not_active Expired - Fee Related
- 2010-06-01 JP JP2012514419A patent/JP5916604B2/ja active Active
- 2010-06-01 MY MYPI2011005629A patent/MY156523A/en unknown
- 2010-06-01 KR KR1020177012326A patent/KR102055812B1/ko active IP Right Grant
- 2010-06-01 SG SG2011084951A patent/SG176136A1/en unknown
- 2010-06-01 WO PCT/EP2010/057602 patent/WO2010142567A1/de active Application Filing
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2108279A1 (en) * | 1991-04-12 | 1992-10-13 | Hans-Joachim Grapentin | Process for the metallization of non-conductors, in particular circuit boards, and the use of nitrogen- containing quaternary salts in the process |
Also Published As
Publication number | Publication date |
---|---|
CN102459715A (zh) | 2012-05-16 |
WO2010142567A1 (de) | 2010-12-16 |
JP2012529566A (ja) | 2012-11-22 |
MY156523A (en) | 2016-02-26 |
EP2440693A1 (de) | 2012-04-18 |
JP5916604B2 (ja) | 2016-05-11 |
AU2010257683B2 (en) | 2016-09-29 |
CA2763967A1 (en) | 2010-12-16 |
CA2763967C (en) | 2017-08-15 |
AU2010257683A1 (en) | 2011-12-08 |
KR20120027474A (ko) | 2012-03-21 |
SG10201402353PA (en) | 2014-10-30 |
KR102055812B1 (ko) | 2019-12-13 |
US9090966B2 (en) | 2015-07-28 |
KR20170053748A (ko) | 2017-05-16 |
SG176136A1 (en) | 2011-12-29 |
US20120073978A1 (en) | 2012-03-29 |
EP2440693B1 (de) | 2016-08-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102459715B (zh) | 离子液体在预处理塑料表面以金属化中的用途 | |
CN101195911B (zh) | 在具有塑料表面的基底上形成涂布金属层的预处理溶液和方法 | |
CN103173840A (zh) | 一种磨削用电镀金刚石砂轮的制备方法 | |
JP2020045574A (ja) | 非導電性プラスチック表面を金属化するための組成物及び方法 | |
CN108138323B (zh) | 用于金属化的塑料表面的预处理方法 | |
US20180202048A1 (en) | Process for metallizing plastic surfaces | |
WO2012022660A1 (de) | Verfahren zum stromlosen verkupfern von metallischen substraten | |
CN103429672B (zh) | 用于通过转移或通过喷射在固体载体表面上制备有机膜的方法 | |
CN104562116A (zh) | 一种对pet基材进行电镀前预处理的方法 | |
CN103276425B (zh) | 非金属材料表面的金属化处理方法 | |
EP3336135B1 (de) | Verfahren zur modifizierung von kunststoffoberflächen | |
KR101356956B1 (ko) | 낚시 바늘 등의 금속 표면 처리방법 | |
CN105420704A (zh) | 镁或镁合金表面浸镀铜的方法 | |
WO2015167582A1 (en) | Electrochemical deposition of metal on surfaces |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |