CN102458697B - 清除颗粒污染物的方法 - Google Patents

清除颗粒污染物的方法 Download PDF

Info

Publication number
CN102458697B
CN102458697B CN201080026545.XA CN201080026545A CN102458697B CN 102458697 B CN102458697 B CN 102458697B CN 201080026545 A CN201080026545 A CN 201080026545A CN 102458697 B CN102458697 B CN 102458697B
Authority
CN
China
Prior art keywords
liquid
viscoelastic
wafer
semiconductor wafer
viscoelastic substance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201080026545.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN102458697A (zh
Inventor
马克·卡瓦古奇
大卫·穆伊
马克·威尔考克森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of CN102458697A publication Critical patent/CN102458697A/zh
Application granted granted Critical
Publication of CN102458697B publication Critical patent/CN102458697B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0014—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by incorporation in a layer which is removed with the contaminants
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D17/00—Detergent materials or soaps characterised by their shape or physical properties
    • C11D17/04—Detergent materials or soaps characterised by their shape or physical properties combined with or containing other objects
    • C11D17/049—Cleaning or scouring pads; Wipes
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/40—Specific cleaning or washing processes
    • C11D2111/42—Application of foam or a temporary coating on the surface to be cleaned

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CN201080026545.XA 2009-06-16 2010-05-28 清除颗粒污染物的方法 Active CN102458697B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/485,733 2009-06-16
US12/485,733 US9159593B2 (en) 2008-06-02 2009-06-16 Method of particle contaminant removal
PCT/US2010/036754 WO2010147752A1 (en) 2009-06-16 2010-05-28 Method of particle contaminant removal

Publications (2)

Publication Number Publication Date
CN102458697A CN102458697A (zh) 2012-05-16
CN102458697B true CN102458697B (zh) 2015-11-25

Family

ID=43305323

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080026545.XA Active CN102458697B (zh) 2009-06-16 2010-05-28 清除颗粒污染物的方法

Country Status (7)

Country Link
US (1) US9159593B2 (enExample)
JP (1) JP5730298B2 (enExample)
KR (1) KR101660075B1 (enExample)
CN (1) CN102458697B (enExample)
SG (2) SG10201403214PA (enExample)
TW (1) TWI506669B (enExample)
WO (1) WO2010147752A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5762925B2 (ja) * 2010-12-28 2015-08-12 東京エレクトロン株式会社 液処理装置および液処理方法
US11643946B2 (en) * 2013-10-02 2023-05-09 Aerocore Technologies Llc Cleaning method for jet engine
KR20170056631A (ko) * 2014-09-18 2017-05-23 어플라이드 머티어리얼스, 인코포레이티드 엔지니어링된 점성 유체를 이용한 고효율 ｃｍｐ 후 세정을 위한 방법 및 장치
US10276469B2 (en) * 2015-04-17 2019-04-30 Taiwan Semiconductor Manufacturing Co., Ltd Method for forming semiconductor device structure
TWI621171B (zh) * 2015-10-13 2018-04-11 Usun Technology Co Ltd Sheet surface treatment method and structure
JP6715019B2 (ja) * 2016-02-09 2020-07-01 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
KR102093641B1 (ko) * 2018-06-22 2020-04-23 주식회사 로보스타 파티클제거팁 및 그것을 이용한 인덱스형 파티클 제거장치
KR102139605B1 (ko) * 2018-11-06 2020-08-12 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
TWI673789B (zh) * 2018-11-19 2019-10-01 弘塑科技股份有限公司 清洗裝置及方法
NL2026646B1 (en) * 2019-10-22 2021-08-02 Asml Netherlands Bv Membrane cleaning apparatus
US12198944B2 (en) 2020-11-11 2025-01-14 Applied Materials, Inc. Substrate handling in a modular polishing system with single substrate cleaning chambers

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6642142B2 (en) * 2001-05-07 2003-11-04 Matsushita Electric Industrial Co., Ltd. Substrate cleaning method and method for producing an electronic device
US6776171B2 (en) * 2001-06-27 2004-08-17 International Business Machines Corporation Cleaning of semiconductor wafers by contaminate encapsulation
US20040206452A1 (en) * 2000-09-22 2004-10-21 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
US20060174920A1 (en) * 2005-02-07 2006-08-10 Planar Semiconductor, Inc. Method and apparatus for cleaning flat objects with pulsed liquid jet
CN2838037Y (zh) * 2004-07-09 2006-11-15 应用材料有限公司 一种从支撑表面清除处理残留物的清洁晶片
US7204890B2 (en) * 2000-01-31 2007-04-17 Henkel Kommanditgesellschaft Auf Aktien Process for removing fine particulate soil from hard surfaces
US20070151583A1 (en) * 2005-12-30 2007-07-05 Lam Research Corporation Method and apparatus for particle removal
US20080135069A1 (en) * 2006-12-12 2008-06-12 Wei Lu Method and apparatus for active particle and contaminant removal in wet clean processes in semiconductor manufacturing

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3994744A (en) * 1973-10-01 1976-11-30 S. C. Johnson & Son, Inc. No-scrub cleaning method
US4586962A (en) * 1983-09-27 1986-05-06 Gaf Corporation Surface cleaning process
AT389959B (de) * 1987-11-09 1990-02-26 Sez Semiconduct Equip Zubehoer Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben
JPH01135574A (ja) * 1987-11-24 1989-05-29 Osaka Shinku Kogyo Kk 蒸着薄膜形成用基板の清浄方法
US5372652A (en) * 1993-06-14 1994-12-13 International Business Machines Corporation Aerosol cleaning method
US5883169A (en) * 1995-01-26 1999-03-16 Sola International Holdings Ltd. Lens wafers with removable coating
JP3315611B2 (ja) 1996-12-02 2002-08-19 三菱電機株式会社 洗浄用２流体ジェットノズル及び洗浄装置ならびに半導体装置
US6017585A (en) * 1998-02-24 2000-01-25 National Semiconductor Corporation High efficiency semiconductor wafer coating apparatus and method
TW553780B (en) * 1999-12-17 2003-09-21 Sharp Kk Ultrasonic processing device and electronic parts fabrication method using the same
US6951221B2 (en) * 2000-09-22 2005-10-04 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
JP2004200282A (ja) * 2002-12-17 2004-07-15 Aisin Aw Co Ltd 電子部品実装方法
US7837803B2 (en) * 2003-03-20 2010-11-23 Lam Research Ag Device and method for wet treating disc-shaped articles
US20060151008A1 (en) 2003-03-31 2006-07-13 Hoya Corporation Cleaning method, method for removing foreign particle, cleaning apparatus, and cleaning liquid
US7799141B2 (en) * 2003-06-27 2010-09-21 Lam Research Corporation Method and system for using a two-phases substrate cleaning compound
US8522801B2 (en) * 2003-06-27 2013-09-03 Lam Research Corporation Method and apparatus for cleaning a semiconductor substrate
TWI251857B (en) * 2004-03-09 2006-03-21 Tokyo Electron Ltd Two-fluid nozzle for cleaning substrate and substrate cleaning device
US7229001B2 (en) * 2005-01-10 2007-06-12 Wen-Tsan Wang Folding collapsible rectangular storage box
US7144299B2 (en) * 2005-05-09 2006-12-05 Intel Corporation Methods and devices for supporting substrates using fluids
US20070054115A1 (en) * 2005-09-08 2007-03-08 International Business Machines Corporation Method for cleaning particulate foreign matter from the surfaces of semiconductor wafers
SG154438A1 (en) 2005-12-30 2009-08-28 Lam Res Corp Cleaning compound and method and system for using the cleaning compound
US7723463B2 (en) * 2006-04-12 2010-05-25 Battelle Energy Alliance, Llc Polyphosphazine-based polymer materials
JP2008135557A (ja) 2006-11-28 2008-06-12 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP4442911B2 (ja) * 2007-03-19 2010-03-31 大日本スクリーン製造株式会社 基板処理装置
EP2162498B1 (en) * 2007-06-19 2011-04-13 Cellular Bioengineering, Inc. Method for protecting substrates and removing contaminants from such substrates
US20100258142A1 (en) * 2009-04-14 2010-10-14 Mark Naoshi Kawaguchi Apparatus and method for using a viscoelastic cleaning material to remove particles on a substrate

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7204890B2 (en) * 2000-01-31 2007-04-17 Henkel Kommanditgesellschaft Auf Aktien Process for removing fine particulate soil from hard surfaces
US20040206452A1 (en) * 2000-09-22 2004-10-21 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
US6642142B2 (en) * 2001-05-07 2003-11-04 Matsushita Electric Industrial Co., Ltd. Substrate cleaning method and method for producing an electronic device
US6776171B2 (en) * 2001-06-27 2004-08-17 International Business Machines Corporation Cleaning of semiconductor wafers by contaminate encapsulation
CN2838037Y (zh) * 2004-07-09 2006-11-15 应用材料有限公司 一种从支撑表面清除处理残留物的清洁晶片
US20060174920A1 (en) * 2005-02-07 2006-08-10 Planar Semiconductor, Inc. Method and apparatus for cleaning flat objects with pulsed liquid jet
US20070151583A1 (en) * 2005-12-30 2007-07-05 Lam Research Corporation Method and apparatus for particle removal
US20080135069A1 (en) * 2006-12-12 2008-06-12 Wei Lu Method and apparatus for active particle and contaminant removal in wet clean processes in semiconductor manufacturing

Also Published As

Publication number Publication date
JP2012530379A (ja) 2012-11-29
CN102458697A (zh) 2012-05-16
US20100313917A1 (en) 2010-12-16
TWI506669B (zh) 2015-11-01
SG176793A1 (en) 2012-01-30
WO2010147752A1 (en) 2010-12-23
KR101660075B1 (ko) 2016-09-26
US9159593B2 (en) 2015-10-13
JP5730298B2 (ja) 2015-06-10
KR20120036864A (ko) 2012-04-18
TW201110193A (en) 2011-03-16
SG10201403214PA (en) 2014-10-30

Similar Documents

Publication Publication Date Title
CN102458697B (zh) 清除颗粒污染物的方法
CN109647769B (zh) 清洗装置
TWI464791B (zh) 自基板移除污染物的方法與設備
US7568488B2 (en) Enhanced wafer cleaning method
US6269511B1 (en) Surface cleaning apparatus
US20080230092A1 (en) Method and apparatus for single-substrate cleaning
CN111589752B (zh) 清洗装置
US20080135069A1 (en) Method and apparatus for active particle and contaminant removal in wet clean processes in semiconductor manufacturing
JP2012530379A5 (enExample)
CN104854681A (zh) 基板液体处理装置和基板液体处理方法
JP2001319908A (ja) 被処理物のウエット処理方法及びその装置
KR20180035902A (ko) 기판 처리 방법 및 기판 처리 장치
US8261758B2 (en) Apparatus and method for cleaning and removing liquids from front and back sides of a rotating workpiece
JP2010114123A (ja) 基板処理装置及び基板洗浄方法
US20050178402A1 (en) Methods and apparatus for cleaning and drying a work piece
TW201246333A (en) Substrate cleaning process
TWI576170B (zh) 晶圓清潔系統及利用晶圓清潔系統清潔晶圓的方法
JP2003266028A (ja) 洗浄装置および洗浄方法
JP7191216B2 (ja) 基板処理方法
JP2005317852A (ja) スピンコータ及び基板裏面の洗浄方法
CN101080805B (zh) 干燥盘状基材的部件和方法
JP3113167B2 (ja) スピン式洗浄装置
KR20010048080A (ko) 캐치컵 세정기

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant