KR101660075B1 - 파티클 오염 제거 방법 - Google Patents

파티클 오염 제거 방법 Download PDF

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Publication number
KR101660075B1
KR101660075B1 KR1020117030247A KR20117030247A KR101660075B1 KR 101660075 B1 KR101660075 B1 KR 101660075B1 KR 1020117030247 A KR1020117030247 A KR 1020117030247A KR 20117030247 A KR20117030247 A KR 20117030247A KR 101660075 B1 KR101660075 B1 KR 101660075B1
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KR
South Korea
Prior art keywords
viscoelastic material
liquid
semiconductor wafer
wafer
carrier gas
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KR1020117030247A
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English (en)
Korean (ko)
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KR20120036864A (ko
Inventor
마크 가와구치
데이비드 무이
마크 윌콕슨
Original Assignee
램 리써치 코포레이션
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Publication of KR20120036864A publication Critical patent/KR20120036864A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0014—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by incorporation in a layer which is removed with the contaminants
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D17/00—Detergent materials or soaps characterised by their shape or physical properties
    • C11D17/04—Detergent materials or soaps characterised by their shape or physical properties combined with or containing other objects
    • C11D17/049—Cleaning or scouring pads; Wipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/40—Specific cleaning or washing processes
    • C11D2111/42—Application of foam or a temporary coating on the surface to be cleaned

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020117030247A 2009-06-16 2010-05-28 파티클 오염 제거 방법 Active KR101660075B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/485,733 2009-06-16
US12/485,733 US9159593B2 (en) 2008-06-02 2009-06-16 Method of particle contaminant removal
PCT/US2010/036754 WO2010147752A1 (en) 2009-06-16 2010-05-28 Method of particle contaminant removal

Publications (2)

Publication Number Publication Date
KR20120036864A KR20120036864A (ko) 2012-04-18
KR101660075B1 true KR101660075B1 (ko) 2016-09-26

Family

ID=43305323

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117030247A Active KR101660075B1 (ko) 2009-06-16 2010-05-28 파티클 오염 제거 방법

Country Status (7)

Country Link
US (1) US9159593B2 (enExample)
JP (1) JP5730298B2 (enExample)
KR (1) KR101660075B1 (enExample)
CN (1) CN102458697B (enExample)
SG (2) SG10201403214PA (enExample)
TW (1) TWI506669B (enExample)
WO (1) WO2010147752A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5762925B2 (ja) * 2010-12-28 2015-08-12 東京エレクトロン株式会社 液処理装置および液処理方法
US11643946B2 (en) * 2013-10-02 2023-05-09 Aerocore Technologies Llc Cleaning method for jet engine
KR20170056631A (ko) * 2014-09-18 2017-05-23 어플라이드 머티어리얼스, 인코포레이티드 엔지니어링된 점성 유체를 이용한 고효율 ｃｍｐ 후 세정을 위한 방법 및 장치
US10276469B2 (en) * 2015-04-17 2019-04-30 Taiwan Semiconductor Manufacturing Co., Ltd Method for forming semiconductor device structure
TWI621171B (zh) * 2015-10-13 2018-04-11 Usun Technology Co Ltd Sheet surface treatment method and structure
JP6715019B2 (ja) * 2016-02-09 2020-07-01 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
KR102093641B1 (ko) * 2018-06-22 2020-04-23 주식회사 로보스타 파티클제거팁 및 그것을 이용한 인덱스형 파티클 제거장치
KR102139605B1 (ko) * 2018-11-06 2020-08-12 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
TWI673789B (zh) * 2018-11-19 2019-10-01 弘塑科技股份有限公司 清洗裝置及方法
NL2026646B1 (en) * 2019-10-22 2021-08-02 Asml Netherlands Bv Membrane cleaning apparatus
US12198944B2 (en) 2020-11-11 2025-01-14 Applied Materials, Inc. Substrate handling in a modular polishing system with single substrate cleaning chambers

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007150375A (ja) 2007-03-19 2007-06-14 Dainippon Screen Mfg Co Ltd 基板処理装置

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3994744A (en) * 1973-10-01 1976-11-30 S. C. Johnson & Son, Inc. No-scrub cleaning method
US4586962A (en) * 1983-09-27 1986-05-06 Gaf Corporation Surface cleaning process
AT389959B (de) * 1987-11-09 1990-02-26 Sez Semiconduct Equip Zubehoer Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben
JPH01135574A (ja) * 1987-11-24 1989-05-29 Osaka Shinku Kogyo Kk 蒸着薄膜形成用基板の清浄方法
US5372652A (en) * 1993-06-14 1994-12-13 International Business Machines Corporation Aerosol cleaning method
US5883169A (en) * 1995-01-26 1999-03-16 Sola International Holdings Ltd. Lens wafers with removable coating
JP3315611B2 (ja) 1996-12-02 2002-08-19 三菱電機株式会社 洗浄用２流体ジェットノズル及び洗浄装置ならびに半導体装置
US6017585A (en) * 1998-02-24 2000-01-25 National Semiconductor Corporation High efficiency semiconductor wafer coating apparatus and method
TW553780B (en) * 1999-12-17 2003-09-21 Sharp Kk Ultrasonic processing device and electronic parts fabrication method using the same
US7204890B2 (en) 2000-01-31 2007-04-17 Henkel Kommanditgesellschaft Auf Aktien Process for removing fine particulate soil from hard surfaces
US7479205B2 (en) 2000-09-22 2009-01-20 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
US6951221B2 (en) * 2000-09-22 2005-10-04 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
JP4532776B2 (ja) 2001-05-07 2010-08-25 パナソニック株式会社 基板洗浄方法及び電子デバイスの製造方法
US6776171B2 (en) * 2001-06-27 2004-08-17 International Business Machines Corporation Cleaning of semiconductor wafers by contaminate encapsulation
JP2004200282A (ja) * 2002-12-17 2004-07-15 Aisin Aw Co Ltd 電子部品実装方法
US7837803B2 (en) * 2003-03-20 2010-11-23 Lam Research Ag Device and method for wet treating disc-shaped articles
US20060151008A1 (en) 2003-03-31 2006-07-13 Hoya Corporation Cleaning method, method for removing foreign particle, cleaning apparatus, and cleaning liquid
US7799141B2 (en) * 2003-06-27 2010-09-21 Lam Research Corporation Method and system for using a two-phases substrate cleaning compound
US8522801B2 (en) * 2003-06-27 2013-09-03 Lam Research Corporation Method and apparatus for cleaning a semiconductor substrate
TWI251857B (en) * 2004-03-09 2006-03-21 Tokyo Electron Ltd Two-fluid nozzle for cleaning substrate and substrate cleaning device
US7655316B2 (en) * 2004-07-09 2010-02-02 Applied Materials, Inc. Cleaning of a substrate support
US7229001B2 (en) * 2005-01-10 2007-06-12 Wen-Tsan Wang Folding collapsible rectangular storage box
US10179351B2 (en) 2005-02-07 2019-01-15 Planar Semiconductor, Inc. Method and apparatus for cleaning flat objects with pulsed liquid jet
US7144299B2 (en) * 2005-05-09 2006-12-05 Intel Corporation Methods and devices for supporting substrates using fluids
US20070054115A1 (en) * 2005-09-08 2007-03-08 International Business Machines Corporation Method for cleaning particulate foreign matter from the surfaces of semiconductor wafers
US8480810B2 (en) 2005-12-30 2013-07-09 Lam Research Corporation Method and apparatus for particle removal
SG154438A1 (en) 2005-12-30 2009-08-28 Lam Res Corp Cleaning compound and method and system for using the cleaning compound
US7723463B2 (en) * 2006-04-12 2010-05-25 Battelle Energy Alliance, Llc Polyphosphazine-based polymer materials
JP2008135557A (ja) 2006-11-28 2008-06-12 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
US20080135070A1 (en) 2006-12-12 2008-06-12 Wei Lu Method and apparatus for active particle and contaminant removal in wet clean processes in semiconductor manufacturing
EP2162498B1 (en) * 2007-06-19 2011-04-13 Cellular Bioengineering, Inc. Method for protecting substrates and removing contaminants from such substrates
US20100258142A1 (en) * 2009-04-14 2010-10-14 Mark Naoshi Kawaguchi Apparatus and method for using a viscoelastic cleaning material to remove particles on a substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007150375A (ja) 2007-03-19 2007-06-14 Dainippon Screen Mfg Co Ltd 基板処理装置

Also Published As

Publication number Publication date
JP2012530379A (ja) 2012-11-29
CN102458697B (zh) 2015-11-25
CN102458697A (zh) 2012-05-16
US20100313917A1 (en) 2010-12-16
TWI506669B (zh) 2015-11-01
SG176793A1 (en) 2012-01-30
WO2010147752A1 (en) 2010-12-23
US9159593B2 (en) 2015-10-13
JP5730298B2 (ja) 2015-06-10
KR20120036864A (ko) 2012-04-18
TW201110193A (en) 2011-03-16
SG10201403214PA (en) 2014-10-30

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