CN102427665B - 立体的双面铝基板制作工艺 - Google Patents
立体的双面铝基板制作工艺 Download PDFInfo
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- CN102427665B CN102427665B CN 201110275587 CN201110275587A CN102427665B CN 102427665 B CN102427665 B CN 102427665B CN 201110275587 CN201110275587 CN 201110275587 CN 201110275587 A CN201110275587 A CN 201110275587A CN 102427665 B CN102427665 B CN 102427665B
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CN 201110275587 CN102427665B (zh) | 2011-09-16 | 2011-09-16 | 立体的双面铝基板制作工艺 |
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CN 201110275587 CN102427665B (zh) | 2011-09-16 | 2011-09-16 | 立体的双面铝基板制作工艺 |
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CN102427665A CN102427665A (zh) | 2012-04-25 |
CN102427665B true CN102427665B (zh) | 2013-05-08 |
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CN 201110275587 Expired - Fee Related CN102427665B (zh) | 2011-09-16 | 2011-09-16 | 立体的双面铝基板制作工艺 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103052264B (zh) * | 2012-12-03 | 2015-04-22 | 深圳崇达多层线路板有限公司 | 一种夹心铝基印制线路板压合方法 |
CN104254196A (zh) * | 2014-09-19 | 2014-12-31 | 江西景旺精密电路有限公司 | 一种非对称铜厚双面铝基板及其加工方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101336052A (zh) * | 2008-07-30 | 2008-12-31 | 惠州中京电子科技有限公司 | 印刷电路板塞孔工艺 |
CN101697661A (zh) * | 2009-11-11 | 2010-04-21 | 深南电路有限公司 | Pcb板堵孔方法以及制作双面pcb板的方法 |
CN101998768A (zh) * | 2010-11-09 | 2011-03-30 | 深圳崇达多层线路板有限公司 | 一种新型的pcb背钻孔制作方法 |
CN102036476A (zh) * | 2010-12-04 | 2011-04-27 | 廖萍涛 | 一种双面金属基线路板及其生产方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100547360B1 (ko) * | 2003-09-16 | 2006-01-26 | 삼성전기주식회사 | 권선 코일이 일체화된 보빈, 이를 채용한 광픽업액추에이터 및 그 제조 방법 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101336052A (zh) * | 2008-07-30 | 2008-12-31 | 惠州中京电子科技有限公司 | 印刷电路板塞孔工艺 |
CN101697661A (zh) * | 2009-11-11 | 2010-04-21 | 深南电路有限公司 | Pcb板堵孔方法以及制作双面pcb板的方法 |
CN101998768A (zh) * | 2010-11-09 | 2011-03-30 | 深圳崇达多层线路板有限公司 | 一种新型的pcb背钻孔制作方法 |
CN102036476A (zh) * | 2010-12-04 | 2011-04-27 | 廖萍涛 | 一种双面金属基线路板及其生产方法 |
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CN102427665A (zh) | 2012-04-25 |
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Denomination of invention: Manufacturing technology of three-dimensional double-face aluminium substrate Effective date of registration: 20131219 Granted publication date: 20130508 Pledgee: Shenzhen SME credit financing guarantee Group Co., Ltd. Pledgor: Shenzhen Wantai Weiye Technology Co., Ltd. Registration number: 2013990001002 |
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Date of cancellation: 20150123 Granted publication date: 20130508 Pledgee: Shenzhen SME credit financing guarantee Group Co., Ltd. Pledgor: Shenzhen Wantai Weiye Technology Co., Ltd. Registration number: 2013990001002 |
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PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
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Denomination of invention: Manufacturing technology of three-dimensional double-face aluminium substrate Effective date of registration: 20150126 Granted publication date: 20130508 Pledgee: Shenzhen SME credit financing guarantee Group Co., Ltd. Pledgor: Shenzhen Wantai Weiye Technology Co., Ltd. Registration number: 2015990000065 |
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Application publication date: 20120425 Assignee: Shenzhen ViTek Printing Circuit Board Co., Ltd. Assignor: Shenzhen Wantai Weiye Technology Co., Ltd. Contract record no.: 2015440020195 Denomination of invention: Manufacturing technology of three-dimensional double-face aluminium substrate Granted publication date: 20130508 License type: Exclusive License Record date: 20150602 |
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