CN102427665B - 立体的双面铝基板制作工艺 - Google Patents
立体的双面铝基板制作工艺 Download PDFInfo
- Publication number
- CN102427665B CN102427665B CN 201110275587 CN201110275587A CN102427665B CN 102427665 B CN102427665 B CN 102427665B CN 201110275587 CN201110275587 CN 201110275587 CN 201110275587 A CN201110275587 A CN 201110275587A CN 102427665 B CN102427665 B CN 102427665B
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- CN
- China
- Prior art keywords
- aluminium
- sheet
- aluminium base
- double
- gong
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 47
- 239000004411 aluminium Substances 0.000 title claims abstract description 41
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 41
- 239000000758 substrate Substances 0.000 title claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 238000005516 engineering process Methods 0.000 title abstract description 7
- 239000000853 adhesive Substances 0.000 claims abstract description 15
- 230000001070 adhesive effect Effects 0.000 claims abstract description 15
- 238000003825 pressing Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 11
- 238000005491 wire drawing Methods 0.000 claims description 10
- 239000007787 solid Substances 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000007731 hot pressing Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 4
- 230000005855 radiation Effects 0.000 abstract description 2
- 239000002655 kraft paper Substances 0.000 abstract 2
- 238000000465 moulding Methods 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Abstract
Description
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110275587 CN102427665B (zh) | 2011-09-16 | 2011-09-16 | 立体的双面铝基板制作工艺 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110275587 CN102427665B (zh) | 2011-09-16 | 2011-09-16 | 立体的双面铝基板制作工艺 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102427665A CN102427665A (zh) | 2012-04-25 |
| CN102427665B true CN102427665B (zh) | 2013-05-08 |
Family
ID=45961593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110275587 Expired - Fee Related CN102427665B (zh) | 2011-09-16 | 2011-09-16 | 立体的双面铝基板制作工艺 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102427665B (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103052264B (zh) * | 2012-12-03 | 2015-04-22 | 深圳崇达多层线路板有限公司 | 一种夹心铝基印制线路板压合方法 |
| CN104254196A (zh) * | 2014-09-19 | 2014-12-31 | 江西景旺精密电路有限公司 | 一种非对称铜厚双面铝基板及其加工方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101336052A (zh) * | 2008-07-30 | 2008-12-31 | 惠州中京电子科技有限公司 | 印刷电路板塞孔工艺 |
| CN101697661A (zh) * | 2009-11-11 | 2010-04-21 | 深南电路有限公司 | Pcb板堵孔方法以及制作双面pcb板的方法 |
| CN101998768A (zh) * | 2010-11-09 | 2011-03-30 | 深圳崇达多层线路板有限公司 | 一种新型的pcb背钻孔制作方法 |
| CN102036476A (zh) * | 2010-12-04 | 2011-04-27 | 廖萍涛 | 一种双面金属基线路板及其生产方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100547360B1 (ko) * | 2003-09-16 | 2006-01-26 | 삼성전기주식회사 | 권선 코일이 일체화된 보빈, 이를 채용한 광픽업액추에이터 및 그 제조 방법 |
-
2011
- 2011-09-16 CN CN 201110275587 patent/CN102427665B/zh not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101336052A (zh) * | 2008-07-30 | 2008-12-31 | 惠州中京电子科技有限公司 | 印刷电路板塞孔工艺 |
| CN101697661A (zh) * | 2009-11-11 | 2010-04-21 | 深南电路有限公司 | Pcb板堵孔方法以及制作双面pcb板的方法 |
| CN101998768A (zh) * | 2010-11-09 | 2011-03-30 | 深圳崇达多层线路板有限公司 | 一种新型的pcb背钻孔制作方法 |
| CN102036476A (zh) * | 2010-12-04 | 2011-04-27 | 廖萍涛 | 一种双面金属基线路板及其生产方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102427665A (zh) | 2012-04-25 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Manufacturing technology of three-dimensional double-face aluminium substrate Effective date of registration: 20131219 Granted publication date: 20130508 Pledgee: Shenzhen SME credit financing guarantee Group Co., Ltd. Pledgor: Shenzhen Wantai Weiye Technology Co., Ltd. Registration number: 2013990001002 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20150123 Granted publication date: 20130508 Pledgee: Shenzhen SME credit financing guarantee Group Co., Ltd. Pledgor: Shenzhen Wantai Weiye Technology Co., Ltd. Registration number: 2013990001002 |
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| PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Manufacturing technology of three-dimensional double-face aluminium substrate Effective date of registration: 20150126 Granted publication date: 20130508 Pledgee: Shenzhen SME credit financing guarantee Group Co., Ltd. Pledgor: Shenzhen Wantai Weiye Technology Co., Ltd. Registration number: 2015990000065 |
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Application publication date: 20120425 Assignee: Shenzhen ViTek Printing Circuit Board Co., Ltd. Assignor: Shenzhen Wantai Weiye Technology Co., Ltd. Contract record no.: 2015440020195 Denomination of invention: Manufacturing technology of three-dimensional double-face aluminium substrate Granted publication date: 20130508 License type: Exclusive License Record date: 20150602 |
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