CN102427665B - 立体的双面铝基板制作工艺 - Google Patents

立体的双面铝基板制作工艺 Download PDF

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CN102427665B
CN102427665B CN 201110275587 CN201110275587A CN102427665B CN 102427665 B CN102427665 B CN 102427665B CN 201110275587 CN201110275587 CN 201110275587 CN 201110275587 A CN201110275587 A CN 201110275587A CN 102427665 B CN102427665 B CN 102427665B
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aluminium
sheet
aluminium base
double
gong
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CN102427665A (zh
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罗安森
吴干风
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SHENZHEN WANTAI WEIYE TECHNOLOGY Co Ltd
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SHENZHEN WANTAI WEIYE TECHNOLOGY Co Ltd
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Abstract

本发明公开了一种立体的双面铝基板制作工艺,以解决现有技术存在锣铝面方槽时易损害L2层的基材。其特征在于:包括以下步骤:步骤一:先制作合格的双面板;步骤二:将铝基材、N120-1080PP片、阻胶膜和牛皮纸钻铆钉孔及锣方槽;步骤三:将合格的双面板与铝基材、N120-1080PP片、阻胶膜和牛皮纸组合在一起铆钉压合成型;步骤四:后期制板流程。使用该方法压合的双面铝基板,铝基材与双面板结合整齐美观,不易损害L2层的基材,PCB板具有良好的焊接性,通过铝基材面的方槽插零件,简易方便、铝材又起到了高效散热的作用。

Description

立体的双面铝基板制作工艺
技术领域
本实用新型涉及到一种双面铝基板制作,更具体讲涉及到一种立体的双面铝基板制作工艺。
背景技术
随着计算机、通讯和航天科技工业的发展,对大功率和高集成化的高端印制电路板的需求日益迫切。现有技术采用铝基板的特点:散热系数高,为传统玻纤树脂基板(FR-4)的五至二十倍;降低产品运行温度,提高产品功率密度和可靠性,延长产品使用寿命;缩小产品体积,降低硬体及装配成本;取代易碎的陶瓷基板,获得更好的机械耐久力。基于以上特点,铝基板具有了一定的市场前景,现有立体的双面铝基板的制作方法,先制作双面板一起压合后,再锣铝面方槽,露出L2层的插件孔,由于锣铝材方槽时,锣机的深度控制达不到要求,深浅不一,会伤击到L2层的基材,严重影响产品的质量。
发明内容
本发明的目的在于:提供一种立体的双面铝基板制作工艺,以解决现有技术存在锣铝面方槽时易损害L2层的基材。
达到本实用新型的目的所采取的技术方案是:一种立体的双面铝基板制作工艺,其特征在于:包括以下步骤:
步骤一:先制作合格的双面板;
步骤二:将铝基材、N120-1080 PP片、阻胶膜和牛皮纸钻铆钉孔及锣方槽;包括以下步骤:a/经过拉丝面向上一面拉丝的铝基材钻铆钉孔若干个,用铆钉孔做管位锣每个单元内14.5*4.6mm和9.02*4.6mm的长方槽,铝基材单面再次拉丝处理后清洗烘干并且完成烤板待铆合;
b/用铝片将N120-1080 PP片和牛皮纸分别夹于中间,用纸胶封住四个角,钻铆钉孔若干个,用铆钉孔做管位锣单元内15.3*5.4 mm和9.82*5.4mm的两个长方槽后待铆合;
c/用铝片将阻胶膜夹于中间,用纸胶封住四个角,钻铆钉孔若干个后待铆合;
步骤三:将合格的双面板与铝基材、N120-1080 PP片、阻胶膜和牛皮纸组合在一起铆钉压合成型;
步骤四:后期制板流程。
步骤三中包括以下步骤:
a/将按照以下顺序,铝基材、N120-1080 PP片*2、双面板、阻胶膜以及3张牛皮纸进行铆合;
b/采用压板程序单炉完成热压和冷压。
本发明达到的有益效果是:本发明利用不流动的N120-1080 PP片,在压合时确保PP胶不流到PCB板的PAD上,使用耐高温阻胶膜在压合时阻止孔内的PP胶不流到孔口边的焊盘面。使用该方法压合的双面铝基板,铝基材与双面板结合整齐美观,不易损坏L2层的基材,PCB板具有良好的焊接性,通过铝基材面的方槽插零件,简易方便、铝材又起到了高效散热的作用。
附图说明
图1:本发明的工艺流程示意图。
图2:本发明的铆合结构示意图。
具体实施方式
以下结合附图进步详述本发明的方法特征。
参照图1、2,包括以下步骤:
步骤一:先制作合格的双面板;
步骤二:将铝基材、N120-1080 PP片、阻胶膜和牛皮纸钻铆钉孔及锣方槽;a/经过拉丝面向上一面拉丝的铝基材钻铆钉孔8个,用铆钉孔做管位锣每个单元内14.5*4.6mm和9.02*4.6mm的长方槽,铝基材单面再次拉丝处理后清洗烘干并且完成烤板待铆合;
b/用铝片将N120-1080 PP片和牛皮纸分别夹于中间,用纸胶封住四个角,钻铆钉孔8个,用铆钉孔做管位锣单元内15.3*5.4 mm和9.82*5.4mm的两个长方槽后待铆合;
c/用铝片将阻胶膜夹于中间,用纸胶封住四个角,钻铆钉孔8个后待铆合;
步骤三:将合格的双面板与铝基材、N120-1080 PP片、阻胶膜和牛皮纸组合在一起铆钉压合成型。参照图2,a/将按照以下顺序,铝基材、N120-1080 PP片*2、双面板、阻胶膜以及3张牛皮纸进行铆合再排版,排板结构:钢板+HOZ铜箔光面对板+铆合好的组合板+HOZ铜箔光面对板+钢板;b/采用压板程序单炉完成热压和冷压;
步骤四:后期制板流程。
在实施方式中,后期制版流程包括:打靶孔/检测板的涨缩、2次钻孔、印字符、压板曲、V-CU、拉丝成型、飞针测试、高压测试、FQC、烤板、FQA。
本行业的技术人员应该了解,本发明不受上述实施方式的限制,在不脱离本发明精神和范围的前提下本发明还会有各种变化和改进,这些变化和改进都落入要求保护的本发明范围内。本发明要求保护范围由所附的权利要求书及其等同物界定。

Claims (2)

1.一种立体的双面铝基板制作工艺,其特征在于:包括以下步骤:
步骤一:先制作合格的双面板;
步骤二:将铝基材、N120-1080 PP片、阻胶膜和牛皮纸钻铆钉孔及锣方槽,包括以下步骤:
a/经过拉丝面向上一面拉丝的铝基材钻铆钉孔若干个,用铆钉孔做管位锣每个单元内14.5*4.6mm和9.02*4.6mm的长方槽,铝基材单面再次拉丝处理后清洗烘干并且完成烤板待铆合;
b/用铝片将N120-1080 PP片和牛皮纸分别夹于中间,用纸胶封住四个角,钻铆钉孔若干个,用铆钉孔做管位锣单元内15.3*5.4 mm和9.82*5.4mm的两个长方槽后待铆合;
c/用铝片将阻胶膜夹于中间,用纸胶封住四个角,钻铆钉孔若干个后待铆合;
步骤三:将合格的双面板与铝基材、N120-1080 PP片、阻胶膜和牛皮纸组合在一起铆钉压合成型;
步骤四:后期制板流程。
2.根据权利要求1所述的立体的双面铝基板制作工艺,其特征在于:步骤三中包括以下步骤:
a/将按照以下顺序,铝基材、N120-1080 PP片*2、双面板、阻胶膜以及3张牛皮纸进行铆合;
b/采用压板程序单炉完成热压和冷压。
CN 201110275587 2011-09-16 2011-09-16 立体的双面铝基板制作工艺 Expired - Fee Related CN102427665B (zh)

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CN103052264B (zh) * 2012-12-03 2015-04-22 深圳崇达多层线路板有限公司 一种夹心铝基印制线路板压合方法
CN104254196A (zh) * 2014-09-19 2014-12-31 江西景旺精密电路有限公司 一种非对称铜厚双面铝基板及其加工方法

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CN101336052A (zh) * 2008-07-30 2008-12-31 惠州中京电子科技有限公司 印刷电路板塞孔工艺
CN101697661A (zh) * 2009-11-11 2010-04-21 深南电路有限公司 Pcb板堵孔方法以及制作双面pcb板的方法
CN101998768A (zh) * 2010-11-09 2011-03-30 深圳崇达多层线路板有限公司 一种新型的pcb背钻孔制作方法
CN102036476A (zh) * 2010-12-04 2011-04-27 廖萍涛 一种双面金属基线路板及其生产方法

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KR100547360B1 (ko) * 2003-09-16 2006-01-26 삼성전기주식회사 권선 코일이 일체화된 보빈, 이를 채용한 광픽업액추에이터 및 그 제조 방법

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Publication number Priority date Publication date Assignee Title
CN101336052A (zh) * 2008-07-30 2008-12-31 惠州中京电子科技有限公司 印刷电路板塞孔工艺
CN101697661A (zh) * 2009-11-11 2010-04-21 深南电路有限公司 Pcb板堵孔方法以及制作双面pcb板的方法
CN101998768A (zh) * 2010-11-09 2011-03-30 深圳崇达多层线路板有限公司 一种新型的pcb背钻孔制作方法
CN102036476A (zh) * 2010-12-04 2011-04-27 廖萍涛 一种双面金属基线路板及其生产方法

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