CN202918593U - 一种挠性线路板覆盖膜贴合治具 - Google Patents
一种挠性线路板覆盖膜贴合治具 Download PDFInfo
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- CN202918593U CN202918593U CN 201220669953 CN201220669953U CN202918593U CN 202918593 U CN202918593 U CN 202918593U CN 201220669953 CN201220669953 CN 201220669953 CN 201220669953 U CN201220669953 U CN 201220669953U CN 202918593 U CN202918593 U CN 202918593U
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201220669953 CN202918593U (zh) | 2012-12-07 | 2012-12-07 | 一种挠性线路板覆盖膜贴合治具 |
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| CN 201220669953 CN202918593U (zh) | 2012-12-07 | 2012-12-07 | 一种挠性线路板覆盖膜贴合治具 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104837296A (zh) * | 2015-04-03 | 2015-08-12 | 淳华科技(昆山)有限公司 | 液晶高分子聚合物材料柔性线路板的假接结构及方法 |
| CN107835591A (zh) * | 2017-10-24 | 2018-03-23 | 高德(无锡)电子有限公司 | 一种能够提升软硬结合印刷线路板对位精准度的加工工艺 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104837296A (zh) * | 2015-04-03 | 2015-08-12 | 淳华科技(昆山)有限公司 | 液晶高分子聚合物材料柔性线路板的假接结构及方法 |
| CN104837296B (zh) * | 2015-04-03 | 2018-01-02 | 淳华科技(昆山)有限公司 | 液晶高分子聚合物材料柔性线路板的假接结构及方法 |
| CN107835591A (zh) * | 2017-10-24 | 2018-03-23 | 高德(无锡)电子有限公司 | 一种能够提升软硬结合印刷线路板对位精准度的加工工艺 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Zhang Chengfeng Inventor before: Zeng Xianxi Inventor before: Zhou Gang Inventor before: Zhao Zhiping |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170519 Address after: 516300, Huizhou District, Guangdong City, Huidong Province town of camphor Hill Industrial Zone two Patentee after: Huidong Jian Xiang Electronic Technology Co., Ltd. Address before: 516008 Guangdong province Huizhou City Road seven Lane three, eling Park in Beijing Patentee before: Huizhou China Eagle Electronic Technology Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130501 Termination date: 20181207 |