CN102420200A - 具有金属垂直互连结构的转接板及其制作方法 - Google Patents
具有金属垂直互连结构的转接板及其制作方法 Download PDFInfo
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- CN102420200A CN102420200A CN2011103623335A CN201110362333A CN102420200A CN 102420200 A CN102420200 A CN 102420200A CN 2011103623335 A CN2011103623335 A CN 2011103623335A CN 201110362333 A CN201110362333 A CN 201110362333A CN 102420200 A CN102420200 A CN 102420200A
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/0557—Disposition the external layer being disposed on a via connection of the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/1302—Disposition
- H01L2224/13025—Disposition the bump connector being disposed on a via connection of the semiconductor or solid-state body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (41)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2011103623335A CN102420200B (zh) | 2011-11-15 | 2011-11-15 | 具有金属垂直互连结构的转接板及其制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN2011103623335A CN102420200B (zh) | 2011-11-15 | 2011-11-15 | 具有金属垂直互连结构的转接板及其制作方法 |
Publications (2)
Publication Number | Publication Date |
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CN102420200A true CN102420200A (zh) | 2012-04-18 |
CN102420200B CN102420200B (zh) | 2013-11-13 |
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CN2011103623335A Active CN102420200B (zh) | 2011-11-15 | 2011-11-15 | 具有金属垂直互连结构的转接板及其制作方法 |
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Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102749167A (zh) * | 2012-06-20 | 2012-10-24 | 北京大学 | 一种含有硅通孔的压力传感器封装结构 |
CN103413800A (zh) * | 2013-08-26 | 2013-11-27 | 江阴长电先进封装有限公司 | 一种用于电子器件封装的硅基转接板结构 |
CN103413768A (zh) * | 2013-08-26 | 2013-11-27 | 江阴长电先进封装有限公司 | 一种用于电子器件封装的硅基转接板的制备方法 |
CN103779266A (zh) * | 2012-10-22 | 2014-05-07 | 南亚科技股份有限公司 | 背面穿硅通孔与金属连线制法、和背面用的光掩模制法 |
CN103904054A (zh) * | 2014-03-31 | 2014-07-02 | 华进半导体封装先导技术研发中心有限公司 | 基于玻璃基板的互连结构及方法 |
CN104051389A (zh) * | 2013-03-12 | 2014-09-17 | 台湾积体电路制造股份有限公司 | 具有焊盘连接件上通孔的叠层封装件 |
CN105575938A (zh) * | 2016-02-26 | 2016-05-11 | 中国科学院微电子研究所 | 一种硅基转接板及其制备方法 |
CN105870093A (zh) * | 2016-05-25 | 2016-08-17 | 武汉光谷创元电子有限公司 | 导体柱及其制造方法、封装芯片的方法和芯片倒装产品 |
CN106252276A (zh) * | 2016-08-08 | 2016-12-21 | 中国电子科技集团公司第五十四研究所 | 基于tsv技术开关矩阵射频单元的制造方法 |
CN108983374A (zh) * | 2018-08-08 | 2018-12-11 | 华进半导体封装先导技术研发中心有限公司 | 一种光模块封装结构及制作方法 |
CN109638148A (zh) * | 2018-12-17 | 2019-04-16 | 合肥本源量子计算科技有限责任公司 | 一种量子芯片在封装盒内的封装方法 |
CN112786530A (zh) * | 2019-11-01 | 2021-05-11 | 美光科技公司 | 封装焊料tsv插入互连 |
CN113174620A (zh) * | 2021-04-22 | 2021-07-27 | 浙江集迈科微电子有限公司 | 一种镀液流速加强型tsv金属柱的电镀方法 |
CN113223999A (zh) * | 2021-04-01 | 2021-08-06 | 光华临港工程应用技术研发(上海)有限公司 | 晶圆键合方法及晶圆键合结构 |
US11587912B2 (en) | 2019-11-01 | 2023-02-21 | Micron Technology, Inc. | High density pillar interconnect conversion with stack to substrate connection |
US11631644B2 (en) | 2019-11-01 | 2023-04-18 | Micron Technology, Inc. | High density pillar interconnect conversion with stack to substrate connection |
WO2023138129A1 (zh) * | 2022-01-21 | 2023-07-27 | 武汉衷华脑机融合科技发展有限公司 | 一种连接线结构及其形成方法 |
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US20060151847A1 (en) * | 2005-01-07 | 2006-07-13 | Yong-Chai Kwon | Image sensor device and method of manufacturing same |
US20070045780A1 (en) * | 2005-09-01 | 2007-03-01 | Salman Akram | Methods of forming blind wafer interconnects, and related structures and assemblies |
CN101582408A (zh) * | 2008-05-12 | 2009-11-18 | 恩益禧电子股份有限公司 | 半导体器件和制造半导体器件的方法 |
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2011
- 2011-11-15 CN CN2011103623335A patent/CN102420200B/zh active Active
Patent Citations (3)
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US20060151847A1 (en) * | 2005-01-07 | 2006-07-13 | Yong-Chai Kwon | Image sensor device and method of manufacturing same |
US20070045780A1 (en) * | 2005-09-01 | 2007-03-01 | Salman Akram | Methods of forming blind wafer interconnects, and related structures and assemblies |
CN101582408A (zh) * | 2008-05-12 | 2009-11-18 | 恩益禧电子股份有限公司 | 半导体器件和制造半导体器件的方法 |
Cited By (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102749167B (zh) * | 2012-06-20 | 2014-11-05 | 北京大学 | 一种含有硅通孔的压力传感器封装结构 |
CN102749167A (zh) * | 2012-06-20 | 2012-10-24 | 北京大学 | 一种含有硅通孔的压力传感器封装结构 |
CN103779266A (zh) * | 2012-10-22 | 2014-05-07 | 南亚科技股份有限公司 | 背面穿硅通孔与金属连线制法、和背面用的光掩模制法 |
CN104051389A (zh) * | 2013-03-12 | 2014-09-17 | 台湾积体电路制造股份有限公司 | 具有焊盘连接件上通孔的叠层封装件 |
CN103413800A (zh) * | 2013-08-26 | 2013-11-27 | 江阴长电先进封装有限公司 | 一种用于电子器件封装的硅基转接板结构 |
CN103413768A (zh) * | 2013-08-26 | 2013-11-27 | 江阴长电先进封装有限公司 | 一种用于电子器件封装的硅基转接板的制备方法 |
CN103413800B (zh) * | 2013-08-26 | 2015-10-28 | 江阴长电先进封装有限公司 | 一种用于电子器件封装的硅基转接板结构 |
CN103413768B (zh) * | 2013-08-26 | 2015-11-25 | 江阴长电先进封装有限公司 | 一种用于电子器件封装的硅基转接板的制备方法 |
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CN103904054A (zh) * | 2014-03-31 | 2014-07-02 | 华进半导体封装先导技术研发中心有限公司 | 基于玻璃基板的互连结构及方法 |
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