CN102414504A - 模块化发光二极管灯泡 - Google Patents
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Abstract
揭示一种发光二极管式照明装置及其制造方法。该照明装置包括安装在一散热槽上的一LED光源、一电源转接头及一控制器。该电源转接头设置成可与一传统的白炽灯泡电源转接头互换。在电源通过该电源转接头耦接至该装置时,该控制器会提供一平均电流给该LED光源。该平均电流会使该LED光源产生具有一预定标准强度的光线,大致上与各装置间LED光源内的差异无关。在本发明一态样中,该LED光源包括多个串联的LED,这些LED接合至散热槽并利用打线接合彼此串联且连接至该散热槽上的导电布线。
Description
背景技术
发光二极管(LED)为取代白炽灯泡和日光灯源这类传统光源的绝佳候选者。LED具有比白炽灯泡更高的光转换效率以及比这两种传统光源更长的使用寿命。再者,目前LED的转换效率仍在不断改善中。
LED所产生的光线都位于相当窄的光谱频带内。因此,为了生产具备任意颜色的光源,其一般会采用以多个LED组成合成光源的方式,或是将来自单一LED的部分光线转换成第二波长光线来与原本LED所发出的光线混光。例如,可提供人眼感知为白色光的LED型白色光源是可能通过结合红、蓝及绿光LED阵列所发出光线混光来建构,这些LED阵列在每一种颜色上都要能产生正确的光线强度。或者,来自一蓝光LED的部分光线可用来激发黄色荧光材,以产生看起来为白色的光源。
LED一般会封装在封装材料的内部,其内部含有一或多个晶粒(dies)被设置在某种形式的基板上,该基板包括供电给这些晶粒的电源端以及散出这些晶粒所发出热能的一热传表面。在白光LED例子中,LED封装中亦可能含有一荧光层,或是在一红、蓝及绿光光源的例子中,LED封装会含有一控制器来设定各色光LED的相对强度,这些色光光源设计来发出一可选择色域中的色光。之后这些已封装的LED会并入最终的灯泡组件或设置来与一电源配接的其他形式的照明器具中。例如,在要用来取代传统白炽光源的照明器具的例子中,该照明器具可包括一传统卡口式或螺纹式光连接件,其可配接在一对应的白炽灯泡所用的传统照明灯座上。
可惜的是,LED的效能有绝大部分取决于LED的封装方式。LED及任何荧光材涂层的光转换效率皆取决于该LED运作时的温度以及该LED驱动的方式。此外,各LED之间会有相当的差异,尤其是在荧光材转换类型的LED例子中,LED芯片与荧光材涂层的差异皆可能导致最终封装后的LED在效能表现上的差异。虽然LED封装制造商可以对其最终封装后的LED进行分类筛选(bin)来提供更具一致性的产品,不过进行这类分类动作的成本所费不赀。
再者,LED运作时的温度取决于其散热槽及最终照明器具内的散热面。在同一温度与驱动电流下具有相同光输出的不同已封装LED在其他温度的情况下可能会具有相当不同的光输出表现。因此,直到LED封装组装到最终的照明器具前,任何这类变异的程度都无法完全加以判定。
由于现实中并无任何标准化的部件来在LED灯具连接到标准交流电源插座时提供光源一以强度形式表达的标准化输出,故上述现象会对灯具制造商造成负担,因为其必须设置设备来测试所制造的照明器具内的LED封装。因此,灯具制造商必须在其生产线上安装校准设备并加以保养,同时设定所生产的每一种光源的LED功率位准,如此让其所生产的照明器具具有一致的光输出。此举无疑会增加建立该生产线所需的资金。
最后,即使在“白光”LED的例子中也有从“冷白光”至“暖白光”等不同色温的差别。在这类例子中不同的荧光材涂层会被用来制造荧光材转换类型光源内的每一种色彩差异。这些荧光材一般会整合在LED封装内,因此通过改变荧光材来达成不同色温的同时也一并需要更换其LED。据此,灯具制造商必须储备不同的LED/荧光材来源。同样地,末端使用者必须更换整个灯具才能在荧光材转换类型的光源中达到一新的色温。同样地,假若LED故障,则该LED与相关的荧光材都必须进行更换。
发明内容
本发明包括一种基于LED的照明装置及其制造方法。该照明装置包括设置在一散热槽上的一LED光源及一电源转接头。该电源转接头设置成可与传统的白炽灯泡或日光灯电源转接头互换。在本发明的一态样中,当电源通过该电源转接头耦接至该装置时,一控制器会提供平均电流给该LED光源。该平均电流会使该LED光源产生具有一预定标准光强度的光线,其大致上与各装置间LED光源内的差异无关。在本发明的一个态样中,该LED光源包括多个串联的LED,这些LED接合至该散热槽并利用打线接合彼此串联并连接至该散热槽上的导电布线。
在本发明的另一态样中,照明装置含有可互换的球状件(globe),这些球状件内含一荧光层,其将来自该LED光源所产生光谱的部分光线转换成另一光谱。通过更换这些球状件可以改变该照明装置的输出光谱,而不用更换光源。此外,若需要更换该LED光源时则可重复使用这些球状物。
在本发明的另一态样中,该装置含有一第一半波整流器,其将耦接至该电源转接头的一交流电压转换成一第一半波整流电源是具有当该第一半波整流电源用于供电给该光源时会提供该预定光强度的一工作周期。该第一半波整流器可包括一硅控制整流器,其具有选取的一控制信号来提供该预定光强度。该控制信号具有一值,其取决于当光源在散热槽上运作时来自该LED光源的光线的一测量值。在本发明的另一态样中,该LED光源包括第一及第二LED,该第一LED由该第一半波整流器供电,及该第二LED由一第二半波整流器供电,其具有与该第一半波整流电源呈180度异相位的输出。
在本发明的另一态样中,其散热槽适合容纳一光扩散元件,其可扩散并重新导引来自该光源的光线。该装置中亦可含有一光检测器来测量该光扩散元件内的一光强度,该控制器会采用该测量到的光强度来维持该预定的标准强度。
附图说明
图1为根据本发明可连接至任意光扩散件的一光基座单元的截面图。
图2例示可在工厂用来初始化要连接至一传统照明灯座的光基座单元的一初始化结构设置。
图3例示根据本发明一可用在一光基座单元内的一电源电路的具体实施例。
图4例示根据本发明一光基座单元控制器的具体实施例。
图5为根据本发明一态样做为照明装置的一部分的一光基座单元100的部分截面图。
图6为根据本发明另一具体实施例采用一标准化光基座单元的一光源的截面图。
具体实施方式
本发明提供其优点的方式在参照图1后将可更容易地了解,该图1是根据本发明的具有一光基座单元21的照明装置20的截面图,该光基座单元21可与任意的光扩散件31连接。该光基座单元21包括一散热槽22,其上安装有多个LED 23。这些LED的数目取决于其特定用途以及该光基座单元21的额定功率。一控制器24供电给这些LED。为了简化附图,该控制器24与这些LED之间的连接已从附图中省略。发明中会在灯泡中使用螺丝这类标准的一连接件25来将该光基座单元21连接至传统的照明灯座。当然发明中亦可采用“卡口式”(bayonet)连接件这类非旋入式(non-screw-in)的连接件。
如前文中提到的,由于制造LED所用工艺方面的变异,这些LED在其光输出方面可能会有所不同。此外,在某些应用中,LED会被一荧光层26所覆盖,该荧光层可将来自这些LED的部分或全部光线转换成具有不同光谱的光线。例如,白光LED的例子中就常使用黄色的荧光层。为此目的而使用的荧光层其转换效率通常会取决于该荧光层的温度,亦因此,在这些LED与荧光层耦接在该散热槽22上之前实无法预测其光输出。
在本发明的一态样中,该光基座单元21所生成的光线会在这些LED安装到该散热槽22上并为任意荧光层所覆盖后才进行调整。该控制器24供至这些LED的电能会被调整至其光输出位于一预定的指定范围内。之后载明供至这些LED来提供所需光输出的信息会储存在该控制器24中并为该控制器24用来设定供给这些LED的该平均电流。在此方式中,每一基座单元都被调整成提供相同的光输出,因此得以确保采用这些光基座单元21的灯具制造商能够重制其产品。通过采用一固定的电流源来输出要施加在这些LED上的最大电流的方式将可控制通过这些LED的该平均电流。之后该电流源的输出可通过提供该所需平均电流的一工作周期来开启及关闭。或者,可施加一直流信号在这些LED上以调整其中的电流或电压来提供该所需的平均电流位准(level)。
这些LED可由一振荡电压源或一直流电源供电。由于人眼仅能感测到短时间内的该平均光输出,故若光振荡的频率高于每秒30次的最小频率时,人眼就无法察觉该振荡光输出的闪烁。据此,利用改变该振荡波形在该LED受偏压产生光线时的部分将可控制该平均电流。文中产生光线的电压周期部分称之为“工作因数”(duty factor)。通过改变工作周期,本发明在保持其峰值驱动电压固定的同时亦可控制该平均强度。或者,发明中可采用可变式电流源来变更该驱动电压以提供所需的该平均电流。
该控制器所需储存提供给这些LED的该所需的平均电流的数据可通过连接件25或是于该光基座单元21的测试与校准期间供接达的一个别连接件来输入给该控制器。在交流电源线上传递信号(signaling)是为已知的技术,因此文中将不作详细讨论。在本发明的另一态样中,该光基座单元21内包括一受控制器24监控的光检测器27。一光学式的信号可被导引至该光检测器27以提供所需的传递信号。须注意即使该光扩散件31已经接合在该光基座单元21上,此配置方式允许该控制器24以光学方式传递信号。
在本发明的另一态样中,在该光扩散件31接上后的运作期间该光检测器27仍可受监控来让该控制器24补偿该LED的老化。这些LED的光输出一般会随时间而减少,因此在缺乏某些形式的补偿机制下该照明装置20的光输出会变暗。原则上,该装置20的光输出可受到监控,而供至这些LED的该平均电流会被增加来补偿这些LED的老化。通过在该光扩散件31中相对于该光检测器27的位置处提供一透光口28,该控制器24将可监控该照明装置20运作期间该光扩散件31内的光位准。该光扩散件会混合来自不同LED 23的光线,亦因此该光检测器27的输出会与来自该光基座单元21的总光输出有关。须注意由于不同光扩散件几何构造上的差异以及与该光检测器27耦合的光线在效率上的差异,故要判定该光检测器27的输出与该照明装置20所生成光线之间的确切关系是非常困难的。然而,须注意本发明中该控制器24已经用一初始平均电流程式化来确定该光基座单元21的光输出为正确值。因此,该控制器24只需要在该光扩散件31接上后存储该光检测器27的输出并提供该平均电流来维持光输出值即可。在该装置组装后可将一预定的光学信号导引至该照明装置20使该控制器24储存该光检测器27要用的该目标输出值。
在本发明的另一态样中,该光基座单元21含有一温度感测器29来监控该散热槽22的温度。如前文中提到的,这些LED的光线输出会随温度而变。当该控制器24被初始化来提供一标准化的光输出时,在某些预定温度下控制器24所提供的该平均电流会被判定出来。然而,该光基座单元21的运作温度会因为环境条件及/或该光扩散件31的存在而改变。校准期间可测量出每一光基座单元中光输出随温度变化的函数关系以及判定出通过这些LED的平均电流中对应的变化以补偿光输出随温度函数而产生的变化。在基座单元21内含光检测器27的实施例中,假如在该预定温度下存储该光检测器27的输出,则该光检测器27与相关的伺服回路将可提供讨论中的补偿效果。
现在请参照图2,其例示出可用在工厂来初始化要连接至传统照明灯座的光基座单元的初始化结构设置。如前文中指出的,本发明提供一种标准化的光基座单元,其可搭配多种的光扩散件用以建构出可直接取代现有白炽灯泡的照明装置。这些光基座单元在工厂时已经加以设定,使得每一光基座单元在插入所要取代、与白炽灯泡相关的传统照明插座时会输出一预定的光强度。该光基座单元的初始化步骤会在表示为55的LED接合在该散热槽上且沈积任何的荧光层如荧光层56后才执行。在初始化处理期间,光基座单元61会插入一传统的照明灯座53并由一控制器52供电。在此实施例中,该基座单元会利用一非螺纹式的连接件,如卡口式连接器,来进行连接。该光基座单元61所产生的光线会被一光检测器51量测到。该控制器52控制初始化处理期间耦合至LED 55的该平均电流。该控制器52改变该平均电流直到来自该光基座单元61的光输出位于所需的范围内。此电流值之后会传递至光基座单元控制器54储存以在正常运作中使用该值。
如前文中提到的,在本发明的某些实施例中,该光基座单元61含有一个温度感测器57,其可为该基座单元控制器54用来测量该散热槽的温度,以便该基座单元控制器54可补偿该初始化电流所判定的温度与该光基座单元61实际运作时的温度之间的差异。在此初始化处理阶段中,该光基座单元61会受一在控制器52控制下的辐射加热器58加热。针对每一个温度,可提供所需光输出的该平均电流会在基座单元控制器54中判定出并加以储存。在该光基座单元61正常运作期间会内插储存的温度与对应的平均电流的对映表以判定出要施加到该光基座单元61的正确平均电流。
在许多例子中,LED型照明装置所要取代的白炽灯都是由交流电源所驱动。在本发明的一态样中,该光基座单元会含有一个交流转直流转换器,并使用直流电压供电给控制通过LED的平均电流的电路。现在请参照图3,其例示出根据本发明使用在一光基座单元内的一电源电路的具体实施例。在电路70中,假设基座单元控制器76会通过光二极管77所接收的一光信号来与上面所讨论的初始化结构设置通讯。如前面指出的,该光二极管77亦可用来监控接在该光基座单元上的一光扩散件中的光位准。
当该光基座单元通过如上面所讨论的连接件25这类连接件插入一对应的灯座后,交流电源81会供电给该电路70。建置在该连接件25内部的一变压器75可用来将来源电压降至由可施加在这些LED的最大电压所判定出的值。
为了简化本附图,电路70仅表示成具有72和74两个LED。然而,阅者应了解这些LED的每一者皆可为多个LED取代。尤其是多个串联的LED允许该光基座单元在使用可输出远大于这些个别LED驱动电压的峰值电压的变压器75的情况下采用一般设计成在数伏特环境驱动下的LED。此配置方式可减少必须在该光基座单元内传输的电流量值,并因此缩小为此目的所需采用的导体尺寸。同样地,一些这类串联式的LED串亦可以并联方式连接以增加光输出。这些并联式LED串亦可减少因为一或多个个别的LED形成开路(opencircuit)故障而导致的一些装置失效。
通过每一LED的该平均电流都会通过一硅控制整流器(Silicon-controlled rectifier,SCR)来控制。SCR 71控制一半交流周期间通过LED 72的电流,而SCR 73则控制另一半交流周期期间通过LED 74的平均电流。供电给这些LED的交流周期部分会由给这些SCR的控制信号来判定,此步骤在控制器76的控制下。在前述该初始化处理期间正确的控制信号会传递至控制器76。
在本发明的一态样中,控制器76含有一个小型的交流转直流电源转换器78,其提供电能给控制器76内的逻辑电路以及这些SCR控制信号。须注意光源产生光线所需的电源会由该交流电源直接供应,亦因此该小型电源器仅需供电给该控制器内的逻辑电路。
在本发明的一实施例中,该基座单元控制器只含有该交流转直流转换器以及产生给SCRs的这些控制信号的电路。这类实施例中并无发光二极管77。现在请参照图4,其例示出根据本发明的一基座单元控制器的一具体实施例。基座单元控制器90包括一小型的交流转直流转换器95,其于连接至通过总线91供电给该基座单元的交流电源时会生成具有足够电能的直流信号来控制这些SCRs。这些SCR控制信号是通过分割电阻93和可变电阻元件94所构成的电阻分压器内的转换器95的输出而产生。该可变电阻元件94的电阻则由连接至该初始化控制器的一总线92上的信号来加以设定。在初始化处理期间,该初始化控制器直接控制该SCR控制信号并改变该信号直到达成所需的光输出。之后该可变电阻元件94会被设定来提供可在该总线92缺少控制信号的情形下产生该所判定的控制电压的电阻。
可变电阻元件94可由一固定电阻的阵列所构成,其经由链结连接至总线,而这些链结可通过通以超出一预定值的电流来移除。在这类实施例中,这些链结通过该总线92连接至初始化控制器。发明中亦可采用在类比模式下运行的电子式可擦除可编程只读存储器(Electrically Erasable Programmable Read-Only Memory,EEPROM)的实施例来提供由该EEPROM栅极上的电荷所判定的可变电阻。
在本发明的一态样中,该散热槽包括多条电路布线,其用来将许多串联的LED连接至该控制电路。这些LED的数目以及用来供电给这些LED的驱动器电路可以加以变更而不须修改这些布线,因此得以采用相同的光基座单元来建构具有不同光输出的多个照明装置。本发明态样提供其优点的方式通过参照图5将可更容易了解,此图为根据本发明一态样中属于该照明装置一部分的一光基座单元100的部分截面图。该光基座单元100包括一散热槽124,其具有一绝缘层125来将一些导电布线(如布线135和136)与由金属材料制成的散热槽124绝缘。该控制器含有一或多个芯片,如芯片126。LED 131-133是利用导热性的环氧树脂或其他导热性粘着剂直接安装在该散热槽124上的一安装区121内。这些个别的LED会通过打线接合例如打线134串联在一起,之后这些串联的LED串会通过布线135和136连接至该控制器。因为这些串与串之间的连结是利用打线接合方式串接,故所连接的LED数目会随基座单元改变,而不需在该散热槽表面上设置不同的导电布线图案。
在LED通过打线接合连接后,这些LED及打线都会被封装在一透明材料内,以形成一保护盖137。在本发明的一态样中,该保护盖137是通过将一环状物138接附在层125的表面并以硅胶类的一透明材料填入该环状物的方式来形成。若要使用荧光材料,则可将荧光粒子掺入该硅胶内。然而,发明中亦可采用其他方式来提供该保护盖。例如,在这些LED上滴上一滴硅胶或其他材料。在本发明的另一态样中,该保护盖是个别形成并放置在这些LED上,使这些LED与该保护盖的顶面之间留有空隙。该保护盖及/或该保护盖内的封装材可能含有荧光材料来将这些LED所发出的光线波长转换成所需光谱成分的光线。
如前文中指出的,基座单元100中LED的配置可在不改变导电布线结构下加以变更。LED的数量、这些LED的配置,以及这些LED之间的互连都将通过将这些内含晶粒的LED置放在安装区121内的装置以及进行这些特定打线接合步骤的打线接合系统来判定。这两种制造装置的运作皆由电脑程式和数据档来控制,只要让布线图案具有充足的端子进行印刷电路板核心区内的光源与该印刷电路板之间的最终连接即可,其可不受该布线图案影响而加以改变。据此,单一的印刷电路板设计将可适用于许多不同的装置。
亦应注意安装区121内可放入其他晶粒并将这些晶粒连接至LED。例如,提供电流给这些LED的驱动器芯片可安装在该安装区内让散热槽124将这些芯片产生的热量散出。此外,使用多个发出不同光谱频带光线的芯片的LED光源通常会含有控制器来调节其每一光谱频带内所产生的光强度,以生成人眼所能感知的特定色光。假若该控器是特定于该核心区域内施行的特定的光源,这些控制器同样可装设在该印刷电路板的核心区内并连接至这些LED,而不是安装在这些印刷电路板布线上。
现在请参照图6,其为根据本发明一采用标准化光基座单元的光源的另一具体实施例的截面图。光源200由一光基座单元和一独立的球状件所构成,该光基座单元采用接在一标准连接件202上的一标准化散热槽201,该连接件202在此具体实施例中是为一与照明灯座对合的螺纹灯泡连接件,该灯座设计成可容纳一传统的白炽灯泡。
多个LED 210安装在一基板216上,该基板216利用一导热性接合剂接合在一散热槽201上。这些LED可为已封装的芯片或是裸芯片等形式。若使用裸芯片,则可如上面所讨论般在这些芯片上施予一层保护材料。
该基板216亦可含有控制电路211及驱动器212,该两者尺寸经过调整以符合LED特定的电源需求。该基板216较佳是由一高导热性的材料所构成,如此该基板可支撑多条布线207来将多种部件连接至该散热槽201上对接的布线208,以与该连接件202产生连接。
该散热槽201可含有多个表示为203和215的鳍片,以帮助将该基板216上的部件所产生的热能逸散到周遭环境中。这些鳍片可以配置成螺纹状的外观以与该球状件206连接。或者,该球状件206可提供一可挠区段204来让一组相合的突起物218可反转地接合(reversibly engage)在突起物215上,使得该球状件206可”夹”在该散热槽201上。在上述任一配置中,该散热槽201可容纳由制造商或光源消费者所采用的多个不同球状件。因此,消费者只要更换该球状件就可改变光源的色温。此外,当LED或基板内的其他部件故障且需要更换时,该球状件可拿来重复使用。
该球状件206可含有一荧光材来将这些LED产生的部分光线转换成具有不同光谱的光线。原则上,该荧光材可以散布在填入该球状件206的一透明介质内。然而,这种配置方式会将该荧光材所产生的热能困在该球状件206的内部。一般照明系统中所采用的荧光材的效率会随温度而显著减少。这些荧光材会将其上入射的部分光线转换成所需光谱的光线,然而有一大部分的该入射光都会转换成热能。因此,散热在此设计中是一项重要的考量。通过在该球状件206外表面上提供一荧光层205的方式,该荧光材吸收光线所产生的热能可散发到周遭环境中。此外,生成暨发散该热能的表面区域会远大于实施例中这些LED为接近这些LED的荧光层所覆盖的对应区域。
须注意,该荧光层可位于该球状件206的内表面上,或是散布在构成该球状件206的该透明材料内。将该荧光层设置在该内表面上会减少本发明的散热效果;然而此配置将可保护该荧光层免受外界环境影响。将荧光材散布在外壳内保护这些荧光材并改善与该外壳内表面上荧光层有关的散热效果。此外,由于该球状件与散热槽上个别的LED芯片所产生的高温隔绝,故发明中亦可采用将有机荧光材溶解在一塑胶球状件内的方式。再者,因为将该荧光层与LED芯片所生成的热隔绝的缘故,该荧光材可在较低温度下运作。
亦须注意,不同的荧光材成份可被包括于不同的球状件内,因此末端的使用者仅需更换该球状件即可改变光源的色谱。不同的球状件可含有不同荧光材或是具有不同浓度的相同荧光材。例如,在利用转换LED所发出的部分蓝光为黄光以获得白光的LED例子中,其球状件内的荧光材浓度控制了其光源输出中蓝光转换成黄光的比例,亦因此改变该浓度将可使该光源发出光线的光谱产生频移。
此外,不同的球状件可具有不同的形状与尺寸。以此考量,应了解文中所使用的“球状件”一词定义成包括任何形状的物件,不仅是球形或是碗形的物件。例如,以可反转接合方式接合在该光基座单元上的圆柱形物件亦包括在“球状件”一词的范畴中。
前述本发明的具体实施例采用具有转接头的光基座单元,得以让这些光基座单元插入现今白炽灯泡所用的灯座中。然而,发明中亦可采用允许这些光基座单元插入其他传统照明灯座例如日光灯所用的灯座的转接头。为了讨论的目的,传统灯泡电源转接头在文中定义为可接受传统非LED式的灯泡或日光灯架的转接头。
前述本发明的具体实施例已例示了本发明多种态样。然而,应了解揭示在不同特定实施例中的本发明不同态样可相互结合来提供本发明的其他实施例。此外,从前述说明及随附附图中将可进一步明了对本发明的诸多修改。据此,本发明仅受限于所附的权利要求的范畴内。
Claims (25)
1.一种装置,其包括:
一散热槽;
一LED光源,其安装在该散热槽上;
一电源转接头,其设置成可与一传统的灯泡电源转接头互换;及
一控制器,其在电源通过该电源转接头耦接至该装置时会提供一平均电流给该LED光源,该平均电流会使该LED光源产生具有一预定标准强度的光线大致上与装置间该LED光源内的差异无关。
2.如权利要求1所述的装置,其中该传统灯泡电源转接头包括一螺纹型基座,该基座适合旋入一照明灯座中。
3.如权利要求1所述的装置,其中该传统灯泡电源转接头包括一卡口式转接头。
4.如权利要求1所述的装置,其中该传统灯泡电源转接头包括一白炽灯泡转接头。
5.如权利要求1所述的装置,其中该传统灯泡电源转接头包括一日光灯泡转接头。
6.如权利要求1所述的装置,其中该LED光源包括多个串联的LED,所述LED接合至该散热槽并利用打线接合彼此串联。
7.如权利要求1所述的装置,其中该LED光源包括一LED及一荧光层,该荧光层会将来自该LED的光线转换成一具有不同波长的光线。
8.如权利要求6所述的装置,其中所述这些LED中的两个连接至该散热槽上的导电布线。
9.如权利要求1所述的装置,其中该控制器包括安装在该散热槽上的一积体电路。
10.如权利要求1所述的装置,进一步包括一交流转直流转换器将耦接至该电源转接头的一交流电压转换成供电给该控制器的一直流电源。
11.如权利要求1所述的装置,进一步包括一第一半波整流器将耦接至该电源转接头的一交流电压转换成一第一半波整流电源,该第一半波整流电源具有一工作周期是于该第一半波整流电源被用来供电给该光源时提供该预定的光强度。
12.如权利要求11所述的装置,其中该第一半波整流器包括一硅控制整流器,该硅控制整流器具有一控制信号被选来提供该预定的光强度,该控制信号具有一值,该值取决于该光源在该散热槽上运作时来自该LED光源的该光线的一测量值。
13.如权利要求11所述的装置,其中该LED光源包括第一LED和第二LED,其中该第一LED由该第一半波整流器供电,该第二LED由一第二半波整流器供电,该第二整流器具有一与该第一半波整流电源呈180度异相位的输出。
14.如权利要求1所述的装置,其中该散热槽适合收纳一光扩散元件,该光扩散元件会扩散并重新导引来自该光源的光线。
15.如权利要求14所述的装置,进一步包括一光检测器来测量该光扩散元件内一光线强度,该控制器利用该测量的光强度来维持该预定的标准强度。
16.如权利要求1所述的装置,进一步包括覆盖该LED光源的一球状件,该球状件包括一荧光材层位于其一表面上。
17.如权利要求16所述的装置,其中该球状件包括一透明外壳,其中该荧光材沈积在该透明外壳的一表面上。
18.如权利要求16所述的装置,其中该球状件包括一转接头来将该球状件可反转地接合至该光源。
19.如权利要求16所述的装置,其中该球状件包括一透明外壳,该外壳包括一塑料且其中该荧光材为溶解在该塑料内的有机荧光材。
20.一种提供一基座元件来建构LED型照明装置的方法,该方法包括:
提供一基座元件,其包括:
一散热槽;
一LED光源,其安装在该散热槽上;
一电源转接头,其设置成可与一传统的白炽灯泡电源转接头互换;及
一控制器,其在电源通过该电源转接头耦接至该装置时会提供一平均电流给该LED光源,该平均电流使该LED光源产生光线;
使该控制器改变通过该LED光源的该平均电流,同时测量该LED光源产生的一光线强度直到测量到一预定的光线强度;及
储存载明该LED光源产生该预定光线强度的该平均电流的信息,其中该控制器在电源耦接至该电源转接头时会提供该平均电流给该LED光源。
21.如权利要求20所述的方法,其中该控制器包括一硅控制整流器且该信息指定一控制信号给该硅控制整流器。
22.一种包括一基座单元和一第一可分离式球状件的照明系统,该基座单元包括:
一散热槽;
一LED光源,其安装在该散热槽上,该LED光源产生一特征为一第一光谱的光线;及
一电源转接头,其设置成可与一传统的灯泡电源转接头互换;
其中该第一可分离式球状件包括一透明外壳,该外壳上或该外壳内含一第一荧光组成物及包括一转接头用于将该第一可分离式球状件固定至该基座单元,该荧光组成物将来自该LED光源的部分该光线转换成具有不同于该第一光谱的一第二光谱的光线。
23.如权利要求22所述的照明系统,进一步包括一控制器在电源通过该电源转接头耦接至该装置时提供一平均电流给该LED光源,该平均电流使该LED光源产生具有一预定标准强度的光线,大致上与装置间该LED光源内的差异无关。
24.如权利要求22所述的照明系统,其中该第一可分离式球状件包括一塑料且其中该第一荧光组成物包括溶解在该塑料内的一有机荧光材。
25.如权利要求22所述的照明系统,进一步包括一第二可分离式球状件,该第二可分离式球状件具有一第二荧光组成物。
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Also Published As
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JP2012527088A (ja) | 2012-11-01 |
WO2010132153A3 (en) | 2011-01-13 |
KR20120018160A (ko) | 2012-02-29 |
CN102414504B (zh) | 2015-09-23 |
JP5490223B2 (ja) | 2014-05-14 |
KR101754585B1 (ko) | 2017-07-06 |
US20100134047A1 (en) | 2010-06-03 |
DE112010002004T5 (de) | 2013-01-03 |
US20110169407A1 (en) | 2011-07-14 |
TW201044903A (en) | 2010-12-16 |
TWI569681B (zh) | 2017-02-01 |
US7956546B2 (en) | 2011-06-07 |
US8350485B2 (en) | 2013-01-08 |
WO2010132153A2 (en) | 2010-11-18 |
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