CN102412209A - 封装基板及使用该封装基板的模块和电气/电子装置 - Google Patents

封装基板及使用该封装基板的模块和电气/电子装置 Download PDF

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Publication number
CN102412209A
CN102412209A CN2011102742479A CN201110274247A CN102412209A CN 102412209 A CN102412209 A CN 102412209A CN 2011102742479 A CN2011102742479 A CN 2011102742479A CN 201110274247 A CN201110274247 A CN 201110274247A CN 102412209 A CN102412209 A CN 102412209A
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CN
China
Prior art keywords
resistance
conductive layer
packaging
base plate
corresponding position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011102742479A
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English (en)
Chinese (zh)
Inventor
花边充广
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of CN102412209A publication Critical patent/CN102412209A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Semiconductor Integrated Circuits (AREA)
CN2011102742479A 2010-09-22 2011-09-15 封装基板及使用该封装基板的模块和电气/电子装置 Pending CN102412209A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-211641 2010-09-22
JP2010211641A JP5581933B2 (ja) 2010-09-22 2010-09-22 パッケージ基板及びこれを用いたモジュール並びに電気・電子機器

Publications (1)

Publication Number Publication Date
CN102412209A true CN102412209A (zh) 2012-04-11

Family

ID=45817006

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011102742479A Pending CN102412209A (zh) 2010-09-22 2011-09-15 封装基板及使用该封装基板的模块和电气/电子装置

Country Status (5)

Country Link
US (1) US8866277B2 (https=)
JP (1) JP5581933B2 (https=)
KR (1) KR20120031121A (https=)
CN (1) CN102412209A (https=)
TW (1) TW201214647A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104051420B (zh) * 2013-03-14 2017-08-15 英特尔公司 用于嵌入式互连桥封装的直接外部互连
TWI719231B (zh) * 2016-11-29 2021-02-21 台灣積體電路製造股份有限公司 半導體裝置及佈局方法
CN115377052A (zh) * 2022-08-25 2022-11-22 飞腾信息技术有限公司 封装基板设计方法及相关设备

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9368477B2 (en) * 2012-08-27 2016-06-14 Invensas Corporation Co-support circuit panel and microelectronic packages
US8987872B2 (en) * 2013-03-11 2015-03-24 Qualcomm Incorporated Electromagnetic interference enclosure for radio frequency multi-chip integrated circuit packages
US9955568B2 (en) * 2014-01-24 2018-04-24 Dell Products, Lp Structure to dampen barrel resonance of unused portion of printed circuit board via
US9824990B2 (en) * 2014-06-12 2017-11-21 Taiwan Semiconductor Manufacturing Company, Ltd. Pad design for reliability enhancement in packages
US9650242B2 (en) 2015-09-22 2017-05-16 International Business Machines Corporation Multi-faced component-based electromechanical device
US10431537B1 (en) * 2018-06-21 2019-10-01 Intel Corporation Electromigration resistant and profile consistent contact arrays
US11488901B2 (en) * 2020-04-29 2022-11-01 Advanced Semiconductor Engineering, Inc. Package structure and method for manufacturing the same
US20240145364A1 (en) * 2022-11-02 2024-05-02 Stmicroelectronics S.R.L. Semiconductor device and corresponding method
EP4372812A1 (en) * 2022-11-16 2024-05-22 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Defining distribution of wiring elements compliant with target current-related value in component carrier with rows of equidistant wiring elements
CN120226154A (zh) * 2022-11-16 2025-06-27 奥特斯奥地利科技与系统技术有限公司 具有连接至相互间隔开的传导区域的位于不同高度处的成排的等距布线元件和另外的布线元件的部件承载件
US12389538B2 (en) * 2023-01-26 2025-08-12 Hewlett Packard Enterprise Development Lp Varying diameters of power-vias in a PCB based on via location

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004134679A (ja) * 2002-10-11 2004-04-30 Dainippon Printing Co Ltd コア基板とその製造方法、および多層配線基板
US20080290495A1 (en) * 2007-03-15 2008-11-27 Hitachi, Ltd. Low noise semiconductor device
CN101542719A (zh) * 2007-03-30 2009-09-23 住友电木株式会社 倒装芯片半导体封装件用接合体、积层材料、密封树脂组合物和电路基板
US7791204B2 (en) * 2005-04-19 2010-09-07 Renesas Technology Corp. Semiconductor device and method of manufacturing the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5665473A (en) * 1994-09-16 1997-09-09 Tokuyama Corporation Package for mounting a semiconductor device
JP2007201030A (ja) * 2006-01-25 2007-08-09 Fujitsu Ltd 電子デバイス
JP2007221014A (ja) 2006-02-20 2007-08-30 Hitachi Ltd 多層配線基板構造

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004134679A (ja) * 2002-10-11 2004-04-30 Dainippon Printing Co Ltd コア基板とその製造方法、および多層配線基板
US7791204B2 (en) * 2005-04-19 2010-09-07 Renesas Technology Corp. Semiconductor device and method of manufacturing the same
US20080290495A1 (en) * 2007-03-15 2008-11-27 Hitachi, Ltd. Low noise semiconductor device
CN101542719A (zh) * 2007-03-30 2009-09-23 住友电木株式会社 倒装芯片半导体封装件用接合体、积层材料、密封树脂组合物和电路基板

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104051420B (zh) * 2013-03-14 2017-08-15 英特尔公司 用于嵌入式互连桥封装的直接外部互连
TWI719231B (zh) * 2016-11-29 2021-02-21 台灣積體電路製造股份有限公司 半導體裝置及佈局方法
CN115377052A (zh) * 2022-08-25 2022-11-22 飞腾信息技术有限公司 封装基板设计方法及相关设备
CN115377051A (zh) * 2022-08-25 2022-11-22 飞腾信息技术有限公司 封装基板、封装基板设计方法及相关设备

Also Published As

Publication number Publication date
TW201214647A (en) 2012-04-01
US20120068322A1 (en) 2012-03-22
JP2012069618A (ja) 2012-04-05
US8866277B2 (en) 2014-10-21
KR20120031121A (ko) 2012-03-30
JP5581933B2 (ja) 2014-09-03

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Application publication date: 20120411