CN102376660B - Radiating device - Google Patents

Radiating device Download PDF

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Publication number
CN102376660B
CN102376660B CN 201010257361 CN201010257361A CN102376660B CN 102376660 B CN102376660 B CN 102376660B CN 201010257361 CN201010257361 CN 201010257361 CN 201010257361 A CN201010257361 A CN 201010257361A CN 102376660 B CN102376660 B CN 102376660B
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CN
China
Prior art keywords
heat
loop
liquid
high temp
heat abstractor
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201010257361
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Chinese (zh)
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CN102376660A (en
Inventor
陈松亚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Zhongcai Wyse Education Technology Co ltd
Nantong Shun Saint Construction Engineering Co ltd
Original Assignee
Shenzhen Yuzhan Precision Technology Co ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Shenzhen Yuzhan Precision Technology Co ltd, Hon Hai Precision Industry Co Ltd filed Critical Shenzhen Yuzhan Precision Technology Co ltd
Priority to CN 201010257361 priority Critical patent/CN102376660B/en
Publication of CN102376660A publication Critical patent/CN102376660A/en
Application granted granted Critical
Publication of CN102376660B publication Critical patent/CN102376660B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The invention relates to a radiating device which comprises a loop component and a power component; the loop component forms a closed loop filled with a liquid substance, and the closed loop is mutually contacted with a high-temperature object; the power component supplies power to the radiating device, so that the liquid in the closed loop flows; and heat conduction is carried out between the liquid in the closed loop and the high-temperature object, and when the power component enables the liquid in the closed loop to flow, the liquid in the closed loop radiates the heat of the high-temperature object. The radiating device can quickly radiate the heat of the high-temperature object and has a good effect.

Description

Heat abstractor
Technical field
The present invention relates to a kind of device, particularly a kind of heat abstractor.
Background technology
Be accompanied by the develop rapidly of science and technology, nowadays, product intelligent, high speed emerges in an endless stream, and simultaneously, these products are also had higher requirement to the temperature capacity of process chip or some devices.
In order to allow process chip or device be in a reasonable operating state, can select to take some cooling treatment measures usually, to control its temperature a suitable scope.Now present, general what adopt is that a fan directly is set near chip or device, accelerating distributing of its heat that is produced, thereby reaches the purpose of cooling.Yet this traditional cooling method is difficult in time prove effective in the bigger occasion of some caloric values, so radiating effect is not clearly.
Summary of the invention
In view of this, be necessary to provide a kind of heat abstractor, to address the above problem.
The invention provides a kind of heat abstractor, can carry out radiating treatment to high temp objects.
This heat abstractor comprises a loop assembly and a Power Component, and this loop assembly is formed a closed-loop path that is filled with liquid substance, and this loop and high temp objects are in contact with one another; This Power Component provides power for heat abstractor, makes liquid flow in the closed-loop path; Wherein, carry out heat conduction between the liquid in the loop and the high temp objects, during liquid flow in Power Component makes the loop, the liquid in the loop dispels the heat to high temp objects.
Heat abstractor of the present invention by Power Component is set, makes that the liquid in the loop that the loop assembly forms can circulate, thereby the object that contacts with the loop is carried out radiating treatment fast, and respond well.
Description of drawings
Fig. 1 is the schematic diagram of heat abstractor in an embodiment of the present invention.
Fig. 2 is the exploded view of heat abstractor among Fig. 1.
Fig. 3 is the exploded view of driven member, connector and the connecting tube of heat abstractor among Fig. 2.
The main element symbol description
Heat abstractor 1
The loop assembly 10
Power Component 20
The heat conduction case 101
Return 102
Last pipeline 103
Following pipeline 104
Connecting tube 105
Rotating part 201
Driven member 202
Connector 203
Last pipe ends mouth 1031、1032
Interface conduit 1033
Following pipe ends mouth 1041、1042
The connecting tube two-port 1051、1052
Serrated portion 2031
Embodiment
See also Fig. 1, be the schematic diagram of heat abstractor in an embodiment of the present invention 1.This heat abstractor 1 can be used for being high temp objects, carries out radiating treatment as computer main board, CPU etc.This heat abstractor 1 comprises a loop assembly 10 and a Power Component 20, and this loop assembly 10 comprises a heat conduction case 101 and a return 102, and this heat conduction case 101 fully contacts with the high temp objects that needs heat radiation.This return 102 and this heat conduction case 101 are formed the loop of a closure, are filled with the liquid substance (not shown) in this loop, be used for and with high temp objects that heat conduction case 101 contact between carry out heat and conduct.In the present embodiment, this return 102 is arranged to helical form, thereby has increased area of dissipation in the volume that reduces heat abstractor 1, and this return 102 can be arranged to other shapes in other embodiments.This Power Component 20 is used to heat abstractor 1 that power is provided, and makes the liquid flow that is in the loop.Under the effect of this Power Component 20, this liquid substance that constantly absorbs the high temp objects heat circulates in the loop, and the heat that drives the liquid absorption distributes, thereby high temp objects is dispelled the heat.In the present embodiment, the liquid substance of filling in this loop is water, the contact surface that this heat conduction case 101 contacts with high temp objects arranges greatly as far as possible and contacts with the surface of high temp objects maximum, with the heat transfer area between liquid and the high temp objects in the expansion heat conduction case 101.For example, high temp objects is a strip object, and then the surface, place, long limit with this high temp objects contacts with the contact surface of heat conduction case 101, makes that heat transfer area is maximum.
See also Fig. 2 and Fig. 3.This heat conduction case 101 is provided with port one 011 and port one 012, liquid substance can flow into from a port of heat conduction case 101, flow out from another port, for example liquid substance self-loop pipeline 102 flows into heat conduction case 101 by port one 011, thereby and from port one 012 outflow heat conduction case 101 inflow returns 102.Inside at this heat conduction case 101 can also arrange the conduction trough (not shown), so that liquid substance flows according to the flow direction of conduction trough, thereby the liquid substance after the conduction of transference high temperature substrate body heat can flow out heat conduction case 101 as soon as possible, improve heat transfer efficiency, in the present embodiment, this thermal trough is " it " type structure.
This return 102 comprises pipeline 103 on, once pipeline 104 and a connecting tube 105, and should go up pipeline 103, pipeline 104 and connecting tube 105 comprise two ports respectively, inflow and outflow for liquid respectively down.The port of this heat conduction case 101, time pipeline 104, connecting tube 105 and last pipeline 103 joins end to end successively, constitutes an enclosed construction, and liquid does not circulate in this enclosed construction intermittently.
As shown in Figure 2, in the present embodiment, pipeline 103 port one 031 links to each other with the port one 011 of heat conduction case 101 by a downward interface conduit 1033 on this, and another port 1032 directly links to each other with a port one 052 of connecting tube 105.A port one 042 of this time pipeline 104 links to each other with the another port 1012 of heat conduction case 101, and another port 1041 links to each other with the another port 1051 of connecting tube 105.Should go up pipeline 103, following pipeline 104, connecting tube 105 and heat conduction case 101 and form the loop of a closure together, this liquid substance can flow in this loop.
This Power Component 20 comprises a rotating part 201, a driven member 202 and a connection piece 203, this driven member 202 links to each other with this connector 203, this connector 203 is provided with serrated portion 2031, and serrated portion 2031 is built in the loop, is used for when connector 203 rotates the liquid flow that serrated portion 2031 on it can drive the loop.In the present embodiment, the serrated portion 2031 on this connector 203 is built in the connecting tube 105.
This rotating part 201 rotates under the situation of energising, air is flowed and the generation air-flow towards driven member 202, this air-flow drives driven member 202 and rotates, thereby driving the connector 203 that is connected with driven member 202 rotates, make and rotate in the liquid of serrated portion 2031 in being in the closed-loop path on the connector 203, and then the liquid in the drive loop constantly flows, make the liquid in the heat conduction case 101 that contacts with high temp objects be in the state that constantly flows, when liquid flows through heat conduction case 101, the heat of this high temp objects that contacts with heat conduction case 101 is taken away, when liquid flows in this return 102, the cooling of dispelling the heat, thus by uninterruptedly circulating of liquid high temp objects is lowered the temperature.In the present embodiment, pipeline 103 and following pipeline 104 are arranged to circularly on this, are in the top of rotating part 201, driven member 202 is surrounded, and be in order to increase the area of heat radiation, the raising radiating efficiency on the one hand; On the other hand, in pipeline and liquid self-radiating wherein, the air-flow that the rotation of rotating part 201 and driven member 202 produces also will dispel the heat to pipeline and liquid wherein.
In the present embodiment, this rotating part 201 is a fan, this driven member 202 comprises two electric fans that are in connector 203 both sides respectively, is used for increasing the rotatory force of the connector 203 that is connected with driven member 202, makes serrated portion 2031 can rotate well in liquid.In another embodiment, this driven member 202 includes only an electric fan.In other embodiments, this rotating part 201 is a rotation motor, is connected with connector 203, and connector 203 is provided with serrated portion 2031, and the serrated portion 2031 that the rotation by rotation motor directly drives in the closed-loop path is rotated.

Claims (7)

1. a heat abstractor is used for high temp objects is dispelled the heat, and it is characterized in that this heat abstractor comprises:
One loop assembly, this loop assembly is formed a closed-loop path that is filled with liquid substance;
One Power Component, be used to heat abstractor that power is provided, make liquid flow in the closed-loop path, this Power Component comprises a rotating part, a driven member and a connection piece, this driven member links to each other with this connector, the part of this connector is built in the closed-loop path, contact with liquid substance, this rotating part rotates under the situation of energising, air is flowed and the generation air-flow towards driven member, this air-flow drives driven member and rotates, and places the part of loop liquid to rotate thereby drive connector, drives liquid substance and flows;
Wherein, when heat abstractor dispels the heat to high temp objects, the loop assembly contacts with high temp objects, carry out the heat conduction between liquid in the loop and the high temp objects, when the liquid in the Power Component driving loop constantly flows, this working fluid is constantly taken away the heat of high temp objects, thereby dispels the heat.
2. heat abstractor as claimed in claim 1 is characterized in that, this loop assembly comprises a return and a heat conduction case, and this return and heat conduction case are formed the closed-loop path, and this heat conduction case is used for contacting with high temp objects.
3. heat abstractor as claimed in claim 2, it is characterized in that, this return comprises pipeline on pipeline, the connecting tube and, this time pipeline, connecting tube, last pipeline and heat conduction case include two ports, the port of this heat conduction case, time pipeline, connecting tube and last pipeline joins end to end successively, constitute an enclosed construction, liquid does not circulate in this enclosed construction intermittently.
4. heat abstractor as claimed in claim 2 is characterized in that, this return is arranged to helical form.
5. heat abstractor as claimed in claim 2 is characterized in that, when high temp objects was dispelled the heat, this heat conduction case contacted with the maximum contact surface of high temp objects.
6. heat abstractor as claimed in claim 1 is characterized in that, the part that this connector is built in the closed-loop path is serrated portion.
7. heat abstractor as claimed in claim 1 is characterized in that, this rotating part is a fan, and this driven member is an electric fan or two electric fans.
CN 201010257361 2010-08-19 2010-08-19 Radiating device Expired - Fee Related CN102376660B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201010257361 CN102376660B (en) 2010-08-19 2010-08-19 Radiating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201010257361 CN102376660B (en) 2010-08-19 2010-08-19 Radiating device

Publications (2)

Publication Number Publication Date
CN102376660A CN102376660A (en) 2012-03-14
CN102376660B true CN102376660B (en) 2013-08-28

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1455953A (en) * 2001-11-12 2003-11-12 株式会社日立制作所 Electronic device
CN2650335Y (en) * 2003-07-04 2004-10-20 鸿富锦精密工业(深圳)有限公司 Water-cooled radiating device
CN1653405A (en) * 2002-05-15 2005-08-10 松下电器产业株式会社 A liquid cooling device for a notebook computer
CN1828875A (en) * 2005-02-28 2006-09-06 台达电子工业股份有限公司 Liquid cooling type heat radiation module
CN1835216A (en) * 2005-03-18 2006-09-20 台达电子工业股份有限公司 Liquid cooling radiation module
CN101598318A (en) * 2009-06-24 2009-12-09 蔡州 Heat abstractor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1455953A (en) * 2001-11-12 2003-11-12 株式会社日立制作所 Electronic device
CN1653405A (en) * 2002-05-15 2005-08-10 松下电器产业株式会社 A liquid cooling device for a notebook computer
CN2650335Y (en) * 2003-07-04 2004-10-20 鸿富锦精密工业(深圳)有限公司 Water-cooled radiating device
CN1828875A (en) * 2005-02-28 2006-09-06 台达电子工业股份有限公司 Liquid cooling type heat radiation module
CN1835216A (en) * 2005-03-18 2006-09-20 台达电子工业股份有限公司 Liquid cooling radiation module
CN101598318A (en) * 2009-06-24 2009-12-09 蔡州 Heat abstractor

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