CN103687423A - Electronic device and radiating module thereof - Google Patents
Electronic device and radiating module thereof Download PDFInfo
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- CN103687423A CN103687423A CN201210328772.9A CN201210328772A CN103687423A CN 103687423 A CN103687423 A CN 103687423A CN 201210328772 A CN201210328772 A CN 201210328772A CN 103687423 A CN103687423 A CN 103687423A
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- fin
- radiator structure
- substrate
- accommodation space
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Abstract
The invention provides an electronic device and a radiating module thereof. The radiating module comprises a first radiating structure and a second radiating structure, wherein the first radiating structure comprises a first baseplate and a plurality of first fins connected with the first baseplate; the second radiating structure comprises a second baseplate and a plurality of second fins connected with the second baseplate; an accommodation space is formed between the first baseplate and the second baseplate; the first fins and the second fins are arranged in the accommodation space at intervals; when the first radiating structure is in a first position relative to the second radiating structure, the height of the accommodation space is the first height; when the first radiating structure is moved to a second position from the first position relative to the second radiating structure, the height of the accommodation space is the second height; the second height is higher than the first height.
Description
Technical field
The present invention relates to a kind of electronic installation, particularly a kind of electronic installation with radiating module.
Background technology
Heat dissipation problem is the portable electronic devices such as notebook computer a great problem in design for a long time always, because the operating frequency of central processing unit (CPU) and graphic process unit (GPU) is more and more higher, therefore can be accompanied by and produce sizable heat energy.In system during the initial stage, in the limited heat-dissipating space of electronic installation, fan dimension is fixing, overclocking operation will cause the difficult control of temperature of dispelling the heat deficiency and making electronic component, yet set up the manufacturing cost that fan can increase electronic installation, thereby increase device thickness increase heat-dissipating space and reduced the portability of portable electronic devices, and can increase manufacturing cost equally; And increase rotation speed of the fan, having the problem that increases noise and power consumption, is a problem demanding prompt solution therefore how to increase radiating rate under same fan and rotating speed.
Summary of the invention
One embodiment of the invention provide a kind of radiating module, comprise one first radiator structure and one second radiator structure, wherein the first radiator structure comprises the first fin of a first substrate and a plurality of connection first substrates, the second radiator structure comprises the second fin of a second substrate and a plurality of connection second substrates, wherein between first substrate and second substrate, form an accommodation space, the first fin and the second fin are positioned at accommodation space and arrange space, when the first radiator structure is with respect to the second radiator structure position during in a primary importance, accommodation space has one first height, when the first radiator structure moves to a second place with respect to the second radiator structure by primary importance, accommodation space has one second height, and second is highly greater than the first height.
Another embodiment of the present invention provides a kind of electronic installation, comprise a body, one and drain pan, one first radiator structure and one second radiator structure of the mutual pivot joint of body, wherein the first radiator structure comprises the first fin of a first substrate and a plurality of connection first substrates, and first substrate connects body, the second radiator structure comprises the second fin of a second substrate and a plurality of connection second substrates, and second substrate connects drain pan.Wherein, between first substrate and second substrate, form an accommodation space, the first fin and the second fin are positioned at accommodation space and arrange space, when drain pan is positioned at a closure state with respect to body, the first radiator structure is positioned at a primary importance with respect to the second radiator structure, and accommodation space has one first height;
Wherein, when drain pan with respect to body by closure state rotation during to an opening, the first radiator structure moves to a second place with respect to the second radiator structure by primary importance, and accommodation space has one second height, wherein second is highly greater than the first height.
Accompanying drawing explanation
Fig. 1 represents the schematic diagram of the radiating module of one embodiment of the invention, and wherein the first radiator structure is positioned at primary importance with respect to the second radiator structure;
Fig. 2 represents the schematic diagram of the radiating module of one embodiment of the invention, and wherein the first radiator structure is positioned at the second place with respect to the second radiator structure;
Fig. 3 represents the schematic diagram of the radiating module of another embodiment of the present invention, and wherein the first radiator structure is positioned at primary importance with respect to the second radiator structure;
Fig. 4 represents the schematic diagram of the radiating module of another embodiment of the present invention, and wherein the first radiator structure is positioned at the second place with respect to the second radiator structure;
Fig. 5 represents the schematic diagram of the electronic installation of another embodiment of the present invention, and wherein drain pan is positioned at closure state with respect to body; And
Fig. 6 represents the schematic diagram of the electronic installation of another embodiment of the present invention, and wherein drain pan is rotated to opening by closure state with respect to body.
Wherein, description of reference numerals is as follows:
The first radiator structure 1; The second radiator structure 2;
Groove 121; Electronic installation E;
Radiating module M; The first height H 1;
The second height H 2; Accommodation space S.
Embodiment
First see also Fig. 1, Fig. 2, the radiating module M of one embodiment of the invention, it is mainly comprised of one first radiator structure 1 and one second radiator structure 2, aforementioned the first radiator structure 1, the second radiator structure 2 have respectively a plurality of the first fins 12, the second fin 22, can increase thus the integral heat sink area of radiating module M.Wherein, the first radiator structure 1 and the second radiator structure 2 be overlapped (Fig. 1) or mutually away from (Fig. 2) mutually, and mutual when overlapped when both, the required space occupying of radiating module M is less; And when both mutually away from time, radiating module M can have preferably radiating effect.
As shown in Figure 1 and Figure 2, aforementioned the first radiator structure 1 comprises a first substrate 11 and a plurality of the first fin 12, and aforementioned the first fin 12 connects first substrate 11; The second radiator structure 2 comprises a second substrate 21 and a plurality of the second fin 22, and aforementioned the second fin 22 connects second substrate 21, wherein between the first fin 12 and between the second fin 22, is preferably mutual equidistant arrangement.By Fig. 1, Fig. 2, can be found out, between first substrate 11 and second substrate 21, be formed with an accommodation space S, aforementioned the first fin 12, the second fin 22 are arranged in accommodation space S and spaced reciprocally and arrange, wherein every a pair of adjacent the first fin 12, the mutual butt of the second fin 22.
In particular, the radiating module M of the present embodiment also can comprise a fan 3(Fig. 1), by fan 3, can drive air to flow through accommodation space S, and the heat on the first fin 12, the second fin 22 is taken away, so that radiating module M can dispel the heat more efficiently.
Then please continue to refer to Fig. 1, when the first radiator structure 1 is positioned at a primary importance with respect to the second radiator structure 2, the first fin 12 butt second substrates 21, and the second fin 22 butt first substrates 11, now accommodation space S has one first height H 1, and the first fin 12, the second fin 22 are in a closed state.Will be appreciated that, when the first fin 12, the second fin 22 arrange during at closed state comparatively tight, and can be less for the space of circulation of air in accommodation space S, and now radiating module M can occupy less volume.
Then refer to Fig. 2, when needing the radiating efficiency of heat radiation module M, aforementioned the first radiator structure 1 can be driven and by aforementioned primary importance (Fig. 1), be moved to a second place (Fig. 2) with respect to the second radiator structure 2 by motor, now the first fin 12, the second fin 22 be respectively away from second substrate 21, first substrate 11, and make accommodation space S have one second height H 2.Will be appreciated that, aforementioned the second height H 2 is greater than the first height H 1, and now the first fin 12, the second fin 22 are arranged comparatively loosely, and making can increase relatively for the space of circulation of air in accommodation space S.Thus, the area of dissipation of radiating module M integral body will increase, so that its radiating efficiency significantly promotes.
As shown in Figure 2, when the first radiator structure 1 is positioned at the second place with respect to the second radiator structure 2, the first adjacent fin 12 and the end of the second fin 22 be butt (as shown in A part in Fig. 2) mutually still, can between the first fin 12, the second fin 22, form heat conduction path thus, and maintain heat transmission between the two.
Then refer to Fig. 3, Fig. 4, the radiating module M of another embodiment of the present invention also comprises a heat pipe 4, wherein one end of heat pipe 4 connects an electronic component (not shown), the other end connects the first radiator structure 1, the second radiator structure 2, wherein the first fin 12 can be formed with groove 121(Fig. 4 corresponding to the position of heat pipe 4), to combine closely with heat pipe 4.As shown in Figure 3, when the first radiator structure 1 is positioned at primary importance with respect to the second radiator structure 2, heat pipe 4 is through accommodation space S, and while butt the first fin 12 and the second fin 22; As shown in Figure 4, when the first radiator structure 1 moves to the second place with respect to the second radiator structure 2 by primary importance, the first fin 12 can move up and be separated with heat pipe 4, and making can increase for the region of circulation of air in accommodation space S, with the radiating efficiency of heat radiation module M integral body.
Refer to again Fig. 5, Fig. 6, the electronic installation E of another embodiment of the present invention comprise aforementioned radiating module M, a body 5 and with the drain pan 6 of body 5 mutual pivot joints, wherein drain pan 6 can be with respect to body 5 rotations to a closure state or an opening.More specifically, electronic installation E can for example, drive drain pan 6 to be rotated to opening by closure state with respect to body 5 by a driver element (motor), to improve radiating efficiency.
Wherein, the first radiator structure 1, the second radiator structure 2 of radiating module M connect respectively body 5 and 3, drain pan 6, one fan is arranged on drain pan 6.When drain pan 6 is positioned at closure state (Fig. 5) with respect to body 5, the first radiator structure 1 is positioned at primary importance with respect to the second radiator structure 2; When drain pan 6 rotates to opening (Fig. 6) with respect to body 5 by closure state, the first radiator structure 1 can move to the second place by primary importance with respect to the second radiator structure 2, with improving heat radiation efficiency.In other words, electronic installation E can be by the relative rotary motion between body 5 and drain pan 6, to facilitate the radiating efficiency of controlling radiating module M integral body.
In sum, the invention provides a kind of radiating module, mainly comprise one first radiator structure and one second radiator structure, wherein the first radiator structure comprises a first substrate and a plurality of the first fin, and the second radiator structure comprises a second substrate and a plurality of the second fin.Wherein, form an accommodation space between first substrate and second substrate, when the first radiator structure is positioned at a primary importance with respect to the second radiator structure, accommodation space has one first height; When the first radiator structure moves to a second place with respect to the second radiator structure by primary importance, accommodation space has one second height, and second be highly greater than the first height, and then makes in accommodation space relatively to increase for the space of circulation of air.Thus, the area of dissipation of radiating module integral body will increase, and its radiating efficiency is further increased.
Although the present invention discloses as above with aforesaid embodiment, so it is not in order to limit the present invention.Those of ordinary skills, without departing from the spirit and scope of the present invention, when making many changes and variation.Therefore protection scope of the present invention is as the criterion with the scope that claims were defined of enclosing.
Claims (10)
1. a radiating module, comprising:
One first radiator structure, comprising:
One first substrate;
A plurality of the first fins, one end of each first fin connects this first substrate;
One second radiator structure, comprising:
One second substrate; And
A plurality of the second fins, one end of each second fin connects this second substrate;
Wherein, between this first substrate and this second substrate, form an accommodation space, described a plurality of the first fin and described a plurality of the second fin are positioned at this accommodation space and arrange space, when this first radiator structure is positioned at a primary importance with respect to this second radiator structure, this accommodation space has one first height; When this first radiator structure moves to a second place with respect to this second radiator structure by this primary importance, this accommodation space have one second height, and this second be highly greater than this first height.
2. radiating module as claimed in claim 1, wherein this radiating module also comprises a fan, this fans drive air flows through this accommodation space.
3. radiating module as claimed in claim 1, wherein said a plurality of the first fins are equidistant arrangement mutually, and described a plurality of the second fin equidistant arrangement mutually.
4. radiating module as claimed in claim 1, wherein said a plurality of the first fins are not connected in one end of this first substrate and the mutual butt in one end that described a plurality of the second fin is not connected in this second substrate.
5. radiating module as claimed in claim 1, wherein this radiating module also comprises a heat pipe, this heat pipe is through this accommodation space and connect described a plurality of the first fin and described a plurality of the second fin.
6. radiating module as claimed in claim 1, wherein when this first radiator structure is positioned at this primary importance with respect to this second radiator structure, described a plurality of first these second substrates of fin butt, and described a plurality of second this first substrate of fin butt.
7. an electronic installation, comprising:
One body;
One drain pan, with the mutual pivot joint of this body; And
One first radiator structure, comprising:
One first substrate, connects this body;
A plurality of the first fins, one end of each first fin connects this first substrate; And
One second radiator structure, comprising:
One second substrate, one end of each second fin connects this drain pan; And
A plurality of the second fins, connect this second substrate;
Wherein, between this first substrate and this second substrate, form an accommodation space, described a plurality of the first fin and described a plurality of the second fin are positioned at this accommodation space and arrange space, when this drain pan is positioned at a closure state with respect to this body, this first radiator structure is positioned at a primary importance with respect to this second radiator structure, and this accommodation space has one first height;
Wherein, when this drain pan rotates to an opening with respect to this body by this closure state, this first radiator structure moves to a second place with respect to this second radiator structure by this primary importance, and this accommodation space have one second height, wherein this second be highly greater than this first height.
8. electronic installation as claimed in claim 7, wherein this electronic installation also comprises a driver element, this driver element is arranged at this body interior, in order to drive this drain pan with respect to this body rotation to this opening or this closure state.
9. electronic installation as claimed in claim 7, wherein this radiating module also comprises a fan, wherein this fans drive air flows through this accommodation space.
10. electronic installation as claimed in claim 7, wherein this radiating module also comprises a heat pipe, this heat pipe is through this accommodation space and connect described a plurality of the first fin and described a plurality of the second fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210328772.9A CN103687423A (en) | 2012-09-07 | 2012-09-07 | Electronic device and radiating module thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210328772.9A CN103687423A (en) | 2012-09-07 | 2012-09-07 | Electronic device and radiating module thereof |
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| Publication Number | Publication Date |
|---|---|
| CN103687423A true CN103687423A (en) | 2014-03-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210328772.9A Pending CN103687423A (en) | 2012-09-07 | 2012-09-07 | Electronic device and radiating module thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN103687423A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107087377A (en) * | 2017-04-28 | 2017-08-22 | 华为技术有限公司 | Heat abstractor, radiator, the method for electronic equipment and radiating control |
| CN111338428A (en) * | 2018-12-18 | 2020-06-26 | 宏碁股份有限公司 | Notebook computer capable of improving heat dissipation capacity through over-frequency keys |
| CN112118703A (en) * | 2019-06-21 | 2020-12-22 | 仁宝电脑工业股份有限公司 | Heat radiation module |
| CN113225976A (en) * | 2020-02-06 | 2021-08-06 | 百度（美国）有限责任公司 | Hybrid heat sink for electronic device cooling |
| US11592882B2 (en) * | 2020-06-05 | 2023-02-28 | Dell Products L.P. | Variable fin stack |
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| CN2720626Y (en) * | 2004-06-25 | 2005-08-24 | 鸿富锦精密工业（深圳）有限公司 | Radiator |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107087377A (en) * | 2017-04-28 | 2017-08-22 | 华为技术有限公司 | Heat abstractor, radiator, the method for electronic equipment and radiating control |
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| CN111338428A (en) * | 2018-12-18 | 2020-06-26 | 宏碁股份有限公司 | Notebook computer capable of improving heat dissipation capacity through over-frequency keys |
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| CN112118703B (en) * | 2019-06-21 | 2023-05-23 | 仁宝电脑工业股份有限公司 | Heat radiation module |
| CN113225976A (en) * | 2020-02-06 | 2021-08-06 | 百度（美国）有限责任公司 | Hybrid heat sink for electronic device cooling |
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| US11886258B2 (en) * | 2020-02-06 | 2024-01-30 | Baidu Usa Llc | Hybrid heat sink for electronics cooling |
| US11592882B2 (en) * | 2020-06-05 | 2023-02-28 | Dell Products L.P. | Variable fin stack |
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Application publication date: 20140326 |