TWI664525B - A heat sink device with a flippable fan and a motherboard with the heat sink device - Google Patents

Abstract

A heat dissipating device with a reversible fan is used to dissipate a plurality of electronic parts. The electronic parts are arranged around the central processing unit. The heat dissipation device includes a radiator, a fan group frame, a steering assembly, and a control circuit. The heat sink has a plurality of heat dissipation areas, and each heat dissipation area is used to conduct heat to electronic parts. The fan group frame includes a plurality of fan modules. The fan group frame is arranged on the radiator, and at least one fan module is correspondingly arranged on each heat dissipation area. The steering assembly is connected to the fan group frame, so as to drive each fan module to rotate in an axial direction parallel to the upper surface of the radiator. The control circuit detects the operating states of the electronic components and the central processing unit, and controls the steering assembly to turn at least one fan module in the heat dissipation area according to the operating states.

Description

Radiating device with reversible fan and motherboard with cooling device

A heat radiation device, especially a heat radiation device with a plurality of reversible fans.

With the rapid development of technology, the application level of computers is getting wider and wider, and people's demand for computers is getting higher and higher, especially for applications with complicated calculations and fast response times, such as e-sports, which pays attention to high computer performance and better The stability.

However, regarding the computer's operating performance and stability, the main key lies in the operation of the motherboard, central processing unit, and electronic components. Traditional manufacturers provide high-end central processing units to improve the overall operation of the computer. A large and stable power supply. In this way, a large amount of heat energy will be generated during the operation of the electronic components on the motherboard. In severe cases, it will accumulate inside the host and cannot be easily dissipated to the outside. As a result, the central processing unit and electronic components will be overheated and lost. Reduce operational efficiency.

For electronic parts, such as power parts, they generate a large amount of thermal energy during operation. Generally, metal heat sinks and heat-conducting media are used to conduct heat by contacting the power parts, and conduct heat to the heat sink to achieve the effect of heat dissipation. The presence or absence of air flow around the board surface will affect the efficiency of heat dissipation and the performance of the motherboard.

In addition, the fan module of the traditional CPU's radiator can basically be divided into two heat dissipation modes. One fan's wind direction flows downward from the heat sink to remove heat; the other The wind direction of the fan flows in a direction parallel to the circuit board to remove heat. Although the former can remove the heat generated by some electronic parts, the heat that can be removed is limited, so the heat dissipation effect is limited. For the latter, there is no air current to dissipate the heat generated by the electronic parts, so that the electronic parts continue to wear.

In view of the above problems, one or more embodiments of the present invention provide a heat dissipating device with a reversible fan for dissipating a plurality of electronic components. The electronic components are arranged around a central processing unit. The heat dissipating device includes a heat sink and a fan unit. Frame, steering assembly and control circuit. The heat sink has a plurality of heat dissipation areas, and each heat dissipation area is used to conduct heat to electronic parts. The fan group frame includes a plurality of fan modules. The fan group frame is disposed on the radiator, and at least one fan module is correspondingly disposed on each heat dissipation area. The steering assembly is connected to the fan group frame, so as to drive each fan module to rotate in an axial direction parallel to the upper surface of the radiator. The control circuit signal is connected to the electronic parts, the central processing unit, the fan module and the steering assembly. The control circuit detects the operating states of the electronic parts and the central processing unit, and controls the steering assembly to cause at least one fan module in the heat dissipation area to reverse according to the operating state.

As in the above-mentioned heat dissipating device with a reversible fan, in one embodiment, the control circuit includes a control unit and a detection unit. The detection unit is connected to the control unit. The detection unit detects at least one of the temperature and the clock of the electronic part and the central processing unit, and sends a detection signal to the control unit according to the detection result. The control unit is based on each detection signal, and Corresponds to sending an activation signal to at least one fan module in the heat dissipation area to make it operate. The control unit also correspondingly transmits a flip signal to the steering assembly, so that it drives at least one fan module to flip in the aforementioned axial direction.

As in the above-mentioned heat dissipating device with a reversible fan, in one embodiment, the activation signal includes setting at least one of a rotation speed, a forward rotation and a reverse rotation of the fan module.

As in the above-mentioned heat dissipating device with a reversible fan, in one embodiment, the reversing signal includes setting a turning direction and a reversing angle of the steering module driving the fan module.

As described above, in the heat dissipating device with a reversible fan, in one embodiment, the steering assembly includes a base, a connecting line, and a steering motor. The base is disposed on the circuit board, the steering motor is connected to the fan assembly, and the steering motor is connected via The cable is connected to the base.

A main board includes a circuit board, a plurality of electronic parts, a central processing unit, a radiator, a fan assembly frame, a steering assembly, and a control circuit. The central processing unit and a plurality of electronic parts are arranged on the circuit board. The heat sink is disposed on the electronic parts without contacting the central processing unit, and the heat sink has a plurality of heat dissipation areas. The fan group frame includes a plurality of fan modules. The fan group frame is disposed on the radiator, and at least one fan module is correspondingly disposed on each heat dissipation area. The steering assembly is connected to the fan assembly frame to drive each fan module to flip in an axial direction parallel to the upper surface of the radiator. The control circuit signal is connected to the electronic parts, the central processing unit, the fan module and the steering assembly. The control circuit detects the operating states of the electronic parts and the central processing unit, and controls the steering assembly to cause at least one fan module in the heat dissipation area to reverse according to the operating state.

Like the above motherboard, in one embodiment, the control circuit includes a control unit and a detection unit. The detection unit is connected to the control unit. The detection unit detects at least one of the temperature and clock of the electronic parts and the central processing unit, and transmits at least one detection signal to the control unit according to the detection result. The control unit is based on each detection signal. , And correspondingly sends an activation signal to at least one fan module in the heat dissipation area to make it operate. The control unit also correspondingly transmits a flip signal to the steering assembly, so that it drives at least one fan module to flip in the aforementioned axial direction.

As in the above motherboard, in one embodiment, the activation signal includes setting at least one of a rotation speed, a forward rotation and a reverse rotation of the fan module.

As in the above-mentioned motherboard, in one embodiment, the flip signal includes setting a turning direction and a turning angle of the steering module driving the fan module.

As in the above-mentioned motherboard, in one embodiment, the steering assembly includes a base, a connecting cable, and a steering motor. The base is disposed on the circuit board, and the steering motor is connected to the fan assembly frame. The steering motor is connected to the base via a cable.

The heat dissipating device with a reversible fan disclosed in the embodiments of the present invention generates a large amount of thermal energy during the operation of the central processing unit and the electronic parts. The control circuit detects the temperature of the central processing unit and the electronic parts to control the operation of the fan module accordingly In order to change the temperature of the motherboard, electronic components and CPU, maintain the performance and stability of the motherboard. The control circuit also controls the steering assembly, so that the fan module can be flipped in an axial direction. The different fan module flip angles result in different wind currents, which can timely dissipate heat according to the thermal energy generated by electronic parts or the central processing unit. In addition, the fan module can also be operated in partitions to dissipate heat for specific electronic components, effectively achieving the above-mentioned purpose of maintaining the performance and stability of the motherboard (electronic components, central processing unit).

100‧‧‧Cooling device

200‧‧‧ Motherboard

1‧‧‧ radiator

10 / a ~ f‧‧‧Heat dissipation area

2‧‧‧fan module

20‧‧‧Fan set

21‧‧‧Frame

22‧‧‧fan

3‧‧‧Control circuit

31‧‧‧Control unit

32‧‧‧ Detection Unit

4‧‧‧Electronic parts

5‧‧‧ steering assembly

51‧‧‧ base

52‧‧‧Connecting cable

53‧‧‧Steering motor

6‧‧‧Circuit Board

7‧‧‧Central Processing Unit

X / Y / Z‧‧‧Axis

[FIG. 1A] It is a schematic diagram of an embodiment of a heat dissipation device installation type with a reversible fan according to the present invention.

[FIG. 1B] It is a schematic diagram of an embodiment of a heat dissipation device installation type with a reversible fan according to the present invention.

[FIG. 1C] It is a schematic diagram of an embodiment of a heat dissipation device installation type with a reversible fan according to the present invention.

[Fig. 2A] Schematic structure of one embodiment of a plurality of fan modules and steering assemblies of the present invention Illustration.

[FIG. 2B] It is a use state diagram of one embodiment of a plurality of fan modules and steering assemblies of the present invention.

[Fig. 3A] It is a use state diagram of one embodiment of a plurality of fan modules and steering assemblies of the present invention.

[FIG. 3B] It is a use state diagram of one embodiment of a plurality of fan modules and steering assemblies of the present invention.

[FIG. 3C] It is a usage state diagram of one embodiment of a plurality of fan modules and steering assemblies of the present invention.

[Fig. 4] A schematic structural diagram of an embodiment of a heat dissipation device with a reversible fan according to the present invention.

[Fig. 5A] It is a schematic diagram of the use state of one embodiment of the heat dissipation device with a reversible fan according to the present invention.

[FIG. 5B] It is a schematic diagram of the use state of one embodiment of the heat dissipation device with a reversible fan according to the present invention.

[FIG. 5C] It is a schematic diagram of the use state of one embodiment of the heat dissipation device with a reversible fan according to the present invention.

[FIG. 6] A schematic diagram of an embodiment of a motherboard of the present invention.

FIG. 7 is a schematic diagram of an embodiment of a heat sink installation type of a motherboard of the present invention.

Please refer to FIG. 1A to FIG. 1C, which are schematic diagrams of an embodiment of a heat dissipation device with a reversible fan according to an embodiment of the present invention. The heat dissipating device 100 is used to dissipate a plurality of electronic parts 4. The electronic parts 4 are arranged around the central processing unit 7. The heat dissipating device 100 includes a heat dissipating device. The heater 1, the fan group frame 20, the steering assembly 5 (see FIGS. 2A to 2B), and the control circuit 3. The heat sink 1 can conduct heat to the electronic component 4. The upper surface of the heat dissipation area is divided into a plurality of heat dissipation areas 10. Each heat dissipation area 10 can be used to conduct heat to the corresponding electronic component 4, such as an electronic component adjacent to or located below the heat dissipation area 10. 4. In one embodiment, the electronic component 4 refers to a component of a power source, such as a capacitor. The heat sink 1 is made of metal. In one embodiment, the heat sink 1 has a fin structure. The type of installing the heat sink 1 is not limited, and may vary with the arrangement of the circuit board 6, the central processing unit 7, and the electronic parts 4. As shown in FIG. 1A, in this embodiment, the heat sink 1 is substantially L-shaped. In FIG. 1B and FIG. 1C, the heat sink 1 is a horizontal type or a vertical type.

Please refer to FIG. 2A to FIG. 2B, which are schematic structural diagrams of an embodiment of a plurality of fan modules and steering assemblies according to the present invention, respectively.

The fan group frame 20 includes a plurality of fan modules 2. The fan group frame 20 is disposed on the radiator 1, and each fan area 2 is correspondingly provided with a fan module 2. The fan module 2 includes a frame 21 and a fan 22. The fan 22 is disposed in the frame 21. The steering assembly 5 is connected to the fan assembly frame 20, and the steering assembly 5 is used to drive each fan module 2 to turn around a pivot axis Z parallel to the upper surface of the radiator 1, that is, to turn around the axis extending from the pivot axis Z as a symmetrical axis.

More specifically, in this embodiment, the steering assembly 5 includes a base 51, a connecting line 52, and a steering motor 53, the base 51 is disposed on the circuit board 6, the steering motor 53 and the fan module 2 of the fan assembly 20 Connected, the steering motor 53 is connected to the base 51 via the connection line 52. In this way, the steering motor 53 can receive the signal transmitted by the control circuit 3 to start operation, and drive each fan module 2 with the extension axis of the pivot axis Z as a symmetrical axis. Flip.

Please refer to FIG. 3A to FIG. 3C, which are diagrams of the use states of one embodiment of the multiple fan module and the steering assembly of the present invention, respectively.

As shown in FIG. 3A, in this embodiment, there is more than one steering assembly 5. The steering assembly 5 is disposed at each end of the "L" -shaped radiator 1. The steering assembly 5 is connected to the fan module 2 of the fan assembly frame 20. A steering module 5 can drive the fan module 2 of the heat dissipation areas a to d to flip in the first axis X, and a steering module 5 can drive the fan module 2 of the heat dissipation zones e to f to flip in the second axis Y. It achieves the effect of manufacturing air current and partitioning heat by partition. In some embodiments, a fan module 2 can be selected to be driven by one of the two steering assemblies 5 and can be flipped according to different axial directions. For example, the fan module 2 of the above-mentioned heat dissipation area d can be driven according to the first axial direction X. Or the second axial Y flip. The invention is not limited to this.

As shown in FIG. 3B to FIG. 3C, each fan module 2 can be connected to the steering assembly 5, so that the direction and degree of each fan module 2's flip are not necessarily the same. In this embodiment, the fan module of the heat dissipation zone d Group 2 can choose to flip according to the first axial X or the second axial Y, depending on its combination with the steering assembly 5. The present invention is not limited thereto, and should be installed according to the needs of users and manufacturers.

In one embodiment, the heat dissipation device 100 further includes a liquid-cooled structure (not shown). The liquid-cooled structure includes a liquid storage tank, a water pump, and a transmission tube. The transmission tube communicates with the liquid storage tank, the water pump, and the radiator 1, respectively. The tank stores water-cooled liquid. The water-cooled liquid can flow in the transmission tube. The water pump can drive the water-cooled liquid to guide the water-cooled liquid into and out of the radiator 1. In this way, when the water-cooled liquid flows through the radiator 1, it can absorb the heat of the radiator 1. Bring the heat out of the radiator 1 and return to the reservoir. This cyclic process has the effect of helping the heat sink 1 dissipate heat. The water cooling liquid may be composed of propylene glycol (or some other alcohols) plus distilled water and additives (colorants, rust inhibitors). In some embodiments, the water cooling liquid is pure water or distilled water.

Please refer to FIG. 4, which is an embodiment of a heat dissipation device with a reversible fan according to the present invention. Schematic diagram. The control circuit 3 is connected to the central processing unit 7, the electronic component 4, the steering assembly 5, and the fan module 2. The control circuit 3 can detect the operating status of the electronic component 4 and the central processing unit 7.

To further illustrate, the control circuit 3 includes a control unit 31 and a detection unit 32. The detection unit 32 is connected to the control unit 31. The detection unit 32 can detect at least one of the temperature and the clock of the electronic component 4 and the central processing unit 7, and send a detection signal to the control unit 31 according to the detection result. The unit 31 determines which fan module 2 in the heat dissipation area 10 needs to be started to operate according to each detection signal, so as to reduce the temperature of the corresponding electronic component 4 or the central processing unit 7, and correspondingly transmits an activation signal to the heat dissipation area 10 Fan module 2 to make it run. The control unit 31 also correspondingly transmits a flip signal to the steering assembly 5 to drive the fan module 2 on the heat dissipation area 10 corresponding to the electronic component 4 or the central processing unit 7 according to the above-mentioned axial direction (first axial X or second axial Y) is the symmetry axis flip.

In other words, the user can preset a temperature limit value or a clock limit value in the control unit 31, for example, set the temperature limit value or the clock limit value in a Basic Input / Output System (BIOS). When the detection unit 32 sends a detection signal to the control unit 31, the control unit 31 determines whether the temperature or clock at which the electronic component 4 or the CPU 7 operates exceeds the temperature limit or the clock limit based on the detection signal. When the control unit 31 determines that the operating temperature or clock of the electronic component 4 or the central processing unit 7 has exceeded a set value (ie, overheating or overclocking), the control unit 31 controls the heat dissipation area corresponding to the electronic component 4 or the central processing unit 7 accordingly. The fan module 2 of 10 runs or turns over, generating air flow to discharge heat, so that the electronic parts 4 or the central processing unit 7 do not overheat and maintain stability. There may be one or more fan modules 2 driven and turned, which depends on the detection result of the user's setting and detection unit 32 and the installation of the fan module 2 and the steering assembly 5.

In the above, the activation signal includes setting at least one of a rotation speed, a forward rotation and a reverse rotation of the fan module 2. For example, set the fan module 2's speed per minute (rpm) to rotate in a clockwise or counterclockwise manner, and the time for the fan 22 to rotate. The startup signal received by each fan module 2 is not It must be the same. The turning signal includes setting a turning direction and a turning angle of the steering module 5 driving the fan module 2. For example, setting the steering assembly 5 to drive the fan module 2 to turn clockwise or counterclockwise according to the pivot axis Z, and the angle of the flip (degree of flip), the user can preset in the basic input and output system or application. . The fan module 2 has different rotation speeds, forward and reverse rotations, and reversed directions and angles. The airflow is different, and the heat dissipation effect is different. Therefore, the user can set the operation mode of each fan module 2 to achieve the best heat dissipation. effect.

In one embodiment, the control circuit 3 is further connected to the above-mentioned water pump signal, and the control circuit 3 further transmits a signal to start the water pump for liquid (water) cooling and heat dissipation.

Please refer to FIG. 5A to FIG. 5C, which are schematic diagrams of the use state of one embodiment of the heat dissipation device with a reversible fan according to the present invention. Electronic parts 4 such as power supply parts are distributed below the heat dissipation areas a to f. Therefore, the power supply parts have different states of division of labor. Therefore, when the CPU 7 is operating, there are different power requirements. When the temperature of the power supply parts below the heat dissipation areas a to d is different, When the temperature rises, there is a need for district cooling, and the fan module 2 must run during the heat dissipation process, that is, the fan 22 rotates to generate air flow. The following describes the turning method of the fan module 2 in more detail.

As shown in FIG. 5A, in this embodiment, the control circuit 3 can control the steering assembly 5 to drive the heat dissipation area a for high-temperature or overclocked electronic parts 4 or / and the central processing unit 7 adjacent to or under the heat dissipation areas a to d. The fan module 2 of ~ d is inverted, and the fan modules 2 of other heat dissipation areas e and f are not inverted. As shown in the embodiment shown in FIG. 3B, the control circuit can control the steering assembly 5 to drive the heat dissipation area. The fan module 2 of a is flipped separately, and the fan modules 2 of other heat dissipation areas b ~ f are not flipped, which depends on the setting and detection result of the control circuit 3.

As shown in FIG. 5B, in this embodiment, the control circuit 3 controls the steering assembly 5 to drive the heat dissipation area e, for the high-temperature or overclocked electronic parts 4 or / and the central processing unit 7 adjacent to or under the heat dissipation area e, f. The fan module 2 of f is flipped together, and the fan modules 2 of other heat dissipation areas a to d are not flipped.

As shown in FIG. 5C, in this embodiment, for the high temperature or overclocked electronic parts 4 or / and the central processing unit 7 and / or the CPU 7 which are adjacent to or under the heat dissipation areas b, f. 7. The fan modules 2 in the heat dissipation areas b and f can be turned at the same time or at different times to achieve the effect of heat dissipation.

Therefore, from the above-mentioned embodiments, it can be known that there are various ways to realize the inversion of the fan module 2. When the fan modules 2 of multiple heat dissipation zones 10 (such as the heat dissipation zones a to d) are driven by the same steering assembly 5, heat dissipation The directions and angles of the fan modules 2 in the areas a to d are the same (both clockwise or counterclockwise). In contrast, if the plurality of steering components 5 are respectively connected to the fan modules 2 of each of the heat dissipation areas a to f, the fan modules 2 of the driven heat dissipation areas a to d can be inverted and operated separately, and each fan module 2 is inverted. The direction or flip angle may be different. As described above, the configuration of the steering assembly 5 and the fan assembly 20 (fan module 2) should be determined according to the needs of the user or the operator. The present invention is not limited.

According to the characteristics of the electronic component 4 and the central processing unit 7, the user sets the driving conditions (speed, fan rotation direction and rotation time) and the turning conditions (turning angle, turning direction) of the driven fan module 2 to the control circuit 3 respectively. In this way, the fan module 2 achieves the best heat dissipation effect during operation (the fan module 2 is running and turned over). In this way, the temperature of the power supply parts is high You can use different settings to make the fan module 2 run in different areas and areas where the temperature of the power supply parts is relatively low to correspond to heat dissipation. In addition to the advantages of energy saving, it can also maintain the stability and high efficiency of the host.

In one embodiment, the heat dissipating device 100 with a reversible fan is used in combination with the central processing unit 7 having a heat dissipating plate (not shown). A fan (not shown) is provided on the heat dissipating plate. It flows from the heat dissipation plate to the direction of the circuit board 6. The heat dissipation device 100 with a reversible fan can be turned by the fan module 2. Therefore, the generated wind current can be effectively avoided from being offset with the wind current generated by the fan of the heat dissipation plate. Can achieve the best cooling effect.

In another embodiment, the air current generated by the fan on the heat dissipation plate of the central processing unit 7 flows in a direction parallel to the circuit board 6. Therefore, for the electronic component 4, the heat generated by the fan cannot be taken away effectively. In addition to dissipating the heat generated by the electronic components 4, the heat dissipating device 100 capable of turning the fan can also assist the CPU 7 to dissipate heat.

Please refer to FIG. 6 to FIG. 7. FIG. 6 is a schematic structural diagram of an embodiment of a motherboard of the present invention. FIG. 7 is a schematic diagram of an embodiment of a heat sink installation type of a motherboard of the present invention. The main board 200 includes a circuit board 6, a central processing unit 7, a plurality of electronic parts 4, a heat sink 1, a plurality of fan modules 2, and a control circuit 3. Regarding the circuit board 6, the central processing unit 7, a plurality of electronic parts 4, a radiator 1, a plurality of fan modules 2, and a control circuit 3, please refer to FIGS. 1A to 1C and related descriptions again.

For the arrangement and structure of the fan group frame 20, the plurality of fan modules 2, and the steering assembly 5, please refer to FIGS. 2A to 3C and related descriptions again; regarding the control circuit 3 to control the operation and control of the fan module 2 on the heat dissipation area 10 The steering unit 5 drives the fan module 2 to turn over, please refer to FIG. 4 and related descriptions again. For the startup signal and flipping signal transmitted by the control circuit 3, please refer to the above descriptions. For the use status of the heat sink 100 with a reversible fan, please refer to FIG. See Figures 5A to 5C And related descriptions, which are not repeated here.

An embodiment of the present invention illustrates that a central processor and electronic components generate a large amount of thermal energy during operation. The temperature of the central processor and electronic components is detected by a control circuit, and the fan module is controlled to control the operation of the fan module to change the motherboard, electronic components, and central processing. Device temperature to maintain the performance and stability of the motherboard. The electronic components are distributed on the circuit board, adjacent to or under the heat sink. In one embodiment, the control circuit further controls the steering assembly so that the fan module can be flipped in an axial direction. The different fan module flip angles result in different wind currents, which can correspond to the thermal energy generated by electronic components or the central processor in a timely manner. For cooling.

In addition, the fan module can also be reversed and operated in partitions. When the temperature of the electronic component at a particular location changes greatly, the control circuit controls the fan module at the corresponding position on the one hand, and controls the steering module to drive the fan module to turn over. Changing the temperature of electronic parts at specific locations so that they do not overheat, it can be seen that the heat dissipation device with a reversible fan has the advantage of energy saving. The control circuit controls the operation of the fan module, including setting the fan speed, forward or reverse operation, and fan rotation time, as well as setting the fan module's turning direction, turning angle, and maintaining time after turning, etc. , To achieve the effect of controlling air volume, air intake or exhaust and effectively achieve the purpose of maintaining the performance and stability of the motherboard (electronic parts, central processing unit).

Claims (10)

A heat dissipating device with a reversible fan is used for dissipating a plurality of electronic parts. The electronic parts are arranged around a central processing unit. The heat dissipating device includes a heat sink having a plurality of heat dissipating areas, and each of the heat dissipating parts. A zone is used to conduct heat to at least one of the electronic components; a fan unit frame includes a plurality of fan modules, the fan unit frame is arranged on the radiator, and at least one fan module is correspondingly arranged on each of the heat dissipation areas; a turning The component includes a steering motor, which is connected to the fan assembly frame to drive each fan module in an axial direction parallel to the upper surface of the heat sink; and a control circuit which signals to connect the electronic components , The central processing unit, the fan modules and the steering assembly, and the control circuit detects an operating state of the electronic components and one of the central processing units, and controls the steering assembly to the heat dissipation areas in response to the operating state. The at least one fan module is turned over. The heat dissipation device with a reversible fan according to claim 1, wherein the control circuit includes: a control unit; and a detection unit connected to the control unit, the detection unit detects the electronic components and the central processing unit. At least one of the temperature and the clock of the device transmits at least one detection signal to the control unit according to the detection result, and the control unit correspondingly transmits an activation signal to the heat dissipation areas according to the detection signals. At least one fan module is made to actuate, and the control unit correspondingly transmits a turning signal to the steering assembly to drive the at least one fan module to turn in the axial direction. The heat dissipation device with a reversible fan according to claim 2, wherein the activation signal includes setting at least one of a rotation speed, a forward rotation and a reverse rotation of the fan module. The heat dissipating device with a reversible fan as described in claim 2, wherein the reversing signal includes setting a turning direction and a reversing angle of the steering component driving the fan module. The heat dissipating device with a reversible fan according to claim 1, wherein the steering assembly further includes a base and a connection line, the base is disposed on a circuit board, the steering motor is connected to the fan assembly frame and passes through This connection line is connected to the base. A motherboard includes: a circuit board; a plurality of electronic parts disposed on the circuit board; a central processing unit disposed on the circuit board; a heat sink disposed on the electronic parts without contacting the central processing unit A fan unit frame including a plurality of fan modules, the fan unit frame is disposed on the radiator, and at least one fan module is correspondingly disposed on each of the heat dissipation areas; The steering assembly includes a steering motor, which is connected to the fan assembly frame to drive each of the fan modules in an axial direction parallel to the upper surface of the radiator; and a control circuit that signals to connect the electronics Parts, the central processing unit, the fan modules, and the steering assembly, the control circuit detects an operating state of the electronic parts and one of the central processing units, and controls the steering assembly to the heat dissipation areas in response to the operating state The at least one fan module is turned over. The motherboard according to claim 6, wherein the control circuit includes: a control unit; and a detection unit connected to the control unit, the detection unit detects the temperature and time of the electronic components and the central processing unit. At least one of the pulses transmits at least one detection signal to the control unit according to the detection result, and the control unit correspondingly transmits an activation signal to the at least one fan module in the heat dissipation areas according to the detection signals. In order to make it actuate, the control unit also correspondingly transmits a turning signal to the steering assembly, so that it drives the at least one fan module to turn in the axial direction. The motherboard according to claim 7, wherein the activation signal includes setting at least one of a rotation speed, a forward rotation and a reverse rotation of the fan module. The motherboard according to claim 7, wherein the turning signal includes setting a turning direction and a turning angle of the steering module driving the fan module. The motherboard according to claim 6, wherein the steering assembly includes a base and a connection line, the base is disposed on the circuit board, and the steering motor is connected to the base via the connection line.