CN106888565B - Radiating module - Google Patents
Radiating module Download PDFInfo
- Publication number
- CN106888565B CN106888565B CN201510930040.0A CN201510930040A CN106888565B CN 106888565 B CN106888565 B CN 106888565B CN 201510930040 A CN201510930040 A CN 201510930040A CN 106888565 B CN106888565 B CN 106888565B
- Authority
- CN
- China
- Prior art keywords
- fan
- runner
- radiating module
- fins group
- pump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 claims abstract description 34
- 239000012809 cooling fluid Substances 0.000 claims abstract description 21
- 235000019628 coolness Nutrition 0.000 claims 1
- 239000012530 fluid Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 230000005611 electricity Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A kind of radiating module is suitable for configuration on a heat source, and radiating module includes a cooling component, a pipeline assembly, one first fins group, one first fan and one second fan.Cooling component includes a heat conducting element, a runner and a pump, and wherein heat conducting element is suitable for configuration on heat source and is thermally coupled in runner, and at least part position of pump is in runner and including a motor shaft.Pipeline assembly is connected to runner, wherein a cooling fluid is suitable for flowing in pipeline assembly and runner.Pipeline assembly passes through the first fins group.First fan arrangement is by the first fins group, to cool down to the first fins group.Second fan arrangement is above cooling component, and wherein motor shaft is linked in one second fan shaft of the second fan, and drives the second fan by pump.
Description
Technical field
The present invention relates to a kind of radiating modules, and in particular to a kind of radiating module of double fan.
Background technique
Electronic component, e.g. central processing unit (CPU), image process unit (GPU), microprocessor (MCU) or
The element of metal oxide semiconductcor field effect transistor (MOSFET) etc. can generate a large amount of heat at work.With science and technology into
Step, the power of these electronic components is higher, and when running can generate more heats, it is necessary to using heat dissipation element by electronic component
Heat production take away, so that electronic component is maintained operating temperature appropriate, occur to avoid the situation burnt when machine or element.One
As for, electronic component can be radiated using fan with radiating fin.When electricity can not be effectively reduced in the radiating mode using fan
When the temperature of subcomponent, then cooling fluid (e.g. water, refrigerant or liquid nitrogen etc.) can be used instead to radiate, cooling fluid can mention
For heat dissipation effect more preferably than fan.
However, cooling fluid radiates primarily directed to particular electronic component, such as the interior cooling component for having cooling fluid
It is mounted on above central processing unit, this cooling component just only can be to central processing unit radiator, to the electricity around cooling component
The cooling effect of subcomponent is fairly limited.But on general motherboard, power supply would generally be placed by central processing unit
Module supplies electricity to central processing unit, when the cooling component that has cooling fluid in use for central processing unit cool down without
In view of power supply module heat dissipation when, power supply module may be excessively high because of temperature, causes to burn when machine or element
The case where ruining, and make power supply module that can not supply electricity to central processing unit, in turn resulting in motherboard can not operate.
In addition, the power supply interface limited amount on motherboard, if cooling component, which needs plug-in also, to be needed to consider distribution problem.
Summary of the invention
The purpose of the present invention is to provide a kind of radiating module, has and be configured on main heat source and interior have cooling fluid
Cooling component, can also be to other cooling heat sources with the second fan configured above cooling component, and the second fan is not required to
In addition plug-in.
A kind of radiating module of the invention is suitable for configuration on a heat source, and radiating module includes a cooling component, a pipeline
Component, one first fins group, one first fan and one second fan.Cooling component includes a heat conducting element, a runner and a pump,
Wherein heat conducting element is suitable for configuration on heat source and is thermally coupled in runner, and at least part position of pump is in runner and including a horse
Up to shaft.Pipeline assembly is connected to runner, wherein a cooling fluid is suitable for flowing in pipeline assembly and runner.Pipeline assembly is worn
Cross the first fins group.First fan arrangement is by the first fins group, to cool down to the first fins group.Second fan arrangement is in cooling
Above component, wherein motor shaft is linked in one second fan shaft of the second fan, and drives the second fan by pump.
In one embodiment of this invention, above-mentioned motor shaft is connected to the second fan shaft.
In one embodiment of this invention, above-mentioned radiating module further includes a gear set, position pump and the second fan it
Between, pump interlocks the second fan by gear set.
In one embodiment of this invention, above-mentioned runner is formed on heat conducting element.
In one embodiment of this invention, above-mentioned radiating module further includes one second fins group, is arranged in the second fan
Top, pipeline assembly pass through the second fins group.
In one embodiment of this invention, the second above-mentioned fan is a cross flow fan.
In one embodiment of this invention, the second above-mentioned fan includes an outline border, and outline border is multiple with being arranged obliquely
Guide vane.
Passed through based on above-mentioned, of the invention radiating module and configures what the absorption heat source of the heat conducting element on heat source was issued
Heat, runner are thermally coupled in heat conducting element, are pumped after flowing through the cooling fluid absorption heat of runner toward pipeline assembly.Pipeline assembly
Across the first fins group, and the heat for absorbing cooling fluid is transferred to the first fins group.First fan arrangement is in the first fin
Group is other, to cool down to the first fins group.Also, in radiating module of the invention, motor shaft is linked in the second fan and turns
Axis, and make the second fan driven by pump the second fan above cooling component is configured without volume external power supply can be under side
Side is blown away, and is cooled down to other heat sources by heat source.
Below in conjunction with the drawings and specific embodiments, the present invention will be described in detail, but not as a limitation of the invention.
Detailed description of the invention
Fig. 1 is to configure the schematic diagram on motherboard according to a kind of radiating module of one embodiment of the invention；
Fig. 2 is the top view of the cooling component of the radiating module of Fig. 1；
Fig. 3 is to configure the schematic diagram on motherboard according to a kind of radiating module of another embodiment of the present invention；
Fig. 4 is to configure the schematic diagram on motherboard according to a kind of radiating module of another embodiment of the present invention.
Wherein, appended drawing reference
10: motherboard
12: main heat source
14: secondary heat source
100,100a, 100b: radiating module
110: cooling component
112: heat conducting element
114: runner
116: pump
118: motor shaft
120: pipeline assembly
130: the first fans
140: the first fins groups
150: the second fans
152: the second fan shafts
154: outline border
156: guide vane
160: the second fins groups
170: gear set
Specific embodiment
Structural principle and working principle of the invention are described in detail with reference to the accompanying drawing:
Fig. 1 is to configure the schematic diagram on motherboard according to a kind of radiating module of one embodiment of the invention.Fig. 2 is figure
The top view of the cooling component of 1 radiating module.Fig. 1 and Fig. 2 are please referred to, the radiating module 100 of the present embodiment is suitable for configuration and exists
On motherboard 10.In Fig. 1, motherboard 10 includes a main heat source 12 and multiple secondary heat sources 14 adjacent to main heat source 12.It is main
Heat source 12 is, for example, central processing unit, and secondary heat source 14 is, for example, the power supply module for being used to supply electricity to central processing unit.
Certainly, the type of main heat source 12 and secondary heat source 14, allocation position, quantity is not with the above-mentioned system that is limited.
In the present embodiment, radiating module 100 includes a cooling component 110, a pipeline assembly 120, one first fan
130, one first fins group 140, one second fan 150.As shown in Fig. 2, cooling component 110 includes a heat conducting element 112, one stream
Road 114 and a pump 116.The configuration of heat conducting element 112 is on main heat source 12 and is thermally coupled in runner 114.In the present embodiment, thermally conductive
The material of element 112 is copper, and runner 114 is formed on heat conducting element 112.Certainly, in other embodiments, runner 114
Position be can be on another heat carrier, this heat carrier thermal contact conductance element 112, to absorb the heat of heat conducting element 112.Pump 116
At least part position in runner 114.More particularly, runner 114 can be protruded into the running by pumping 116 blade, so that position
Cooling fluid (e.g. water) flowing in runner 114.Pump 116 includes a motor shaft 118.
Pipeline assembly 120 is connected to runner 114, cooling fluid can in pipeline assembly 120 and runner 114 flow circuit.
Pipeline assembly 120 passes through the first fins group 140 at the position for being away from cooling component 110.First fan 130 is configured in the first fin
By piece group 140, to cool down to the first fins group 140.In the present embodiment, pipeline assembly 120 can be extended close in computer
Casing (not being painted) at, the first fins group 140 and the first fan 130 can together position on casing.Certainly, pipeline assembly
120, the position of the first fins group 140 and the first fan 130 is not limited thereto system.
The radiating module 100 of the present embodiment passes through the heat conducting element 112 configured on main heat source 12 and absorbs 12 institute of main heat source
The heat of sending, runner 114 are thermally coupled in heat conducting element 112, are taken out after flowing through the cooling fluid absorption heat of runner 114 by pump 116
Toward pipeline assembly 120.Pipeline assembly 120 passes through the first fins group 140, and the heat for absorbing cooling fluid is transferred to the first fin
Piece group 140, the first fan 130 blows to the first fins group 140, and cools down to the first fins group 140.Therefore, cooling fluid is passing through
Crossing pipeline assembly 120 can be cooled down after the position for passing through the first fins group 140, and the cooling fluid of cooling flows to runner once again
114.The radiating module 100 of the present embodiment cools down to main heat source 12 by above-mentioned circulation.
In addition, the radiating module 100 of the present embodiment is also by configuring 150 court of the second fan above cooling component 110
It blows away to side-lower, and cools down to the secondary heat source 14 on 12 side of main heat source.In detail, the configuration of the second fan 150 is in cooling component
110 tops, in the present embodiment, the second fan 150 are a cross flow fan.In more detail, the second fan 150 includes an outline border
154, outline border 154 has the multiple guide vanes 156 being arranged obliquely, and above, air outlet is in outline border for the air intake vent of the second fan 150
At 154 (side on drawing), wind can be flowed out along the guide vane 156 that these are arranged obliquely, and make the wind of the second fan 150
It can blow toward obliquely downward, and cool down to these secondary heat sources 14 on motherboard 10.
It is noted that in general, power supply interface limited amount on motherboard 10, if the second fan 150 of installation
It is also contemplated that distribution problem.The radiating module 100 of the present embodiment is linked in the second fan 150 by the motor shaft 118 of pump 116
One second fan shaft 152, and drive the second fan 150 by pump 116.In more detail, in the present embodiment, motor turns
Axis 118 is connected to the second fan shaft 152, and therefore, when motor shaft 118 rotates, the second fan shaft 152 is directly driven
And rotate the second fan 150.In this way, which there is no need to additionally connect power supply again for the second fan 150.That is, the second wind
Fan 150 and pump 116 share the same motor, and the rotation of this motor pumps 116 blade to drive water flow, while also rotating the second fan
150 blade drives air-flow.
The radiating module 100 of the present embodiment possesses water cooling and air-cooled advantage simultaneously, not only has water cooling to main heat source 12
Radiating efficiency, and also have air-cooled air-flow that can help to reduce temperature the secondary heat source 14 on 12 side of main heat source.In this way, secondary heat source
14 can maintain normal operation and provide main heat source 12 stable power supply, and main heat source 12 can also maintain appropriate operating temperature,
It avoids when machine or burns, can more prolong its service life.
It is noted that the radiating module 100 of the present embodiment can also be detected via temperature inductor (not being painted)
The temperature of secondary heat source and the revolving speed that the second fan 150 is accordingly controlled with controller (not being painted), allow the revolving speed of the second fan 150
It is reduced when the temperature of secondary heat source 14 is low, excessive fan noise is avoided to generate, allow the revolving speed of the second fan 150 in secondary heat source 14
The high Shi Shenggao of temperature, have the temperature for relatively reducing secondary heat source 14.
Fig. 3 is to configure the schematic diagram on motherboard according to a kind of radiating module of another embodiment of the present invention.It needs
Bright, in Fig. 3, the element same or like with previous embodiment is indicated with identical symbol, is just no longer introduced herein
These elements, and the only main difference of the embodiment of the embodiment and Fig. 1 of explanatory diagram 3.
Referring to Fig. 3, in the present embodiment, in order to provide the second fan 150 better heat dissipation effect, radiating module 100a
Further include one second fins group 160.Second fins group 160 is arranged above the second fan 150 (namely the second fan 150
Air intake vent group 160 tops in the second fan 150, and pipeline assembly 120 passes through the second fins group 160.Therefore, pipeline assembly
Cooling fluid in 120 can cool down to the second fins group 160.Air-flow can lead to before the air intake vent for entering the second fan 150
The second fins group 160 is crossed, and becomes the air-flow of more low temperature, it, more can be to this when being blown out later from the side of the second fan 150
A little pair heat sources 14 have better cooling effect.More particularly, in the present embodiment, the function of the first fins group 140 is will to manage
Cooling fluid cooling in road component 120.The function of second fins group 160 is by the air at the air intake vent of the second fan 150
Cooling, so that the second fan 150 can blow out the wind of low temperature.
Fig. 4 is to configure the schematic diagram on motherboard according to a kind of radiating module of another embodiment of the present invention.It needs
Bright, in Fig. 4, the element same or like with preceding embodiment is indicated with identical symbol, is just no longer introduced herein
These elements, and the only main difference of the embodiment of the embodiment and Fig. 3 of explanatory diagram 4.
Referring to Fig. 4, in the present embodiment, radiating module 100b further includes a gear set 170, and position is in pump 116 and second
Between fan 150, pump 116 interlocks the second fan 150 by gear set 170, so that the second fan 150 can utilize gear set
170 obtain bigger revolving speed, and provide bigger air quantity.For example, in Fig. 3, gear set 170 includes small one and large one
Two gears, gear ratio in this way 1 to 10, but gear ratio is not limited thereto system.If the revolving speed of pump 116 is with per minute 100
Switch to example, by gear set 170, the revolving speed of the second fan 150 can come 1000 turns per minute.In this way, pump 116 revolving speed
Water flow just can be effectively driven without very high, and the second fan 150 also can effectively drive air-flow.Certainly, Fig. 3 is only drawn
The form of one of gear set 170 is shown, the quantity of 170 middle gear of gear set, size relationship, allocation position not with
Above-mentioned is limitation.
In conclusion radiating module of the invention, which passes through, configures what the absorption heat source of the heat conducting element on heat source was issued
Heat, runner are thermally coupled in heat conducting element, are pumped after flowing through the cooling fluid absorption heat of runner toward pipeline assembly.Pipeline assembly
Across the first fins group, and the heat for absorbing cooling fluid is transferred to the first fins group.First fan arrangement is in the first fin
Group is other, to cool down to the first fins group.Also, in radiating module of the invention, motor shaft is linked in the second fan and turns
Axis, and make the second fan driven by pump the second fan above cooling component is configured without volume external power supply can be under side
Side is blown away, and is cooled down to other heat sources by heat source.
Certainly, the present invention can also have other various embodiments, without deviating from the spirit and substance of the present invention, ripe
It knows those skilled in the art and makes various corresponding changes and modifications, but these corresponding changes and change in accordance with the present invention
Shape all should fall within the scope of protection of the appended claims of the present invention.
Claims (5)
1. a kind of radiating module, it is suitable for configuration on a heat source, which is characterized in that the radiating module includes:
One cooling component, including a heat conducting element, a runner and one pump, wherein the heat conducting element be suitable for configuration on the heat source and
It is thermally coupled in the runner, including a motor shaft；
One pipeline assembly is connected to the runner, wherein a cooling fluid is suitable for flowing in the pipeline assembly and the runner,
In, in the runner, the blade of pump can protrude into runner in the running at least part position of the pump, so that position is cold in runner
But fluid flows；
One first fins group, the pipeline assembly pass through first fins group；
One first fan configures by first fins group, to cool down to first fins group；And
One second fan configures above the cooling component, which is a cross flow fan, and wherein the motor shaft is linked in
One second fan shaft of second fan, and drive second fan by the pump, which includes an outline border, this is outer
Frame has the multiple guide vanes being arranged obliquely, to multiple secondary heat source coolings on motherboard.
2. radiating module according to claim 1, which is characterized in that the motor shaft is connected to second fan shaft.
3. radiating module according to claim 1, which is characterized in that further include:
One gear set, between the pump and second fan, which interlocks second fan by the gear set for position.
4. radiating module according to claim 1, which is characterized in that the runner is formed on the heat conducting element.
5. radiating module according to claim 1, further includes:
One second fins group is arranged above second fan, which passes through second fins group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510930040.0A CN106888565B (en) | 2015-12-15 | 2015-12-15 | Radiating module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510930040.0A CN106888565B (en) | 2015-12-15 | 2015-12-15 | Radiating module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106888565A CN106888565A (en) | 2017-06-23 |
| CN106888565B true CN106888565B (en) | 2019-06-11 |
Family
ID=59174083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510930040.0A Expired - Fee Related CN106888565B (en) | 2015-12-15 | 2015-12-15 | Radiating module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106888565B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108491046A (en) * | 2018-05-22 | 2018-09-04 | 郑州天点科技有限公司 | A kind of heat radiation type computer cabinet |
| CN111813206A (en) * | 2020-08-12 | 2020-10-23 | 东莞市冰点智能科技有限公司 | Novel water pump separation type water-cooling radiator with built-in fan |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101166409A (en) * | 2006-10-16 | 2008-04-23 | 英业达股份有限公司 | Liquid-cooling heat radiator |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102856275A (en) * | 2011-06-29 | 2013-01-02 | 鸿富锦精密工业（深圳）有限公司 | Cooling system |
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2015
- 2015-12-15 CN CN201510930040.0A patent/CN106888565B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101166409A (en) * | 2006-10-16 | 2008-04-23 | 英业达股份有限公司 | Liquid-cooling heat radiator |
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| Publication number | Publication date |
|---|---|
| CN106888565A (en) | 2017-06-23 |
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Address after: Taiwan Xindian District, New Taipei City Chinese Po Road No. 6 Applicant after: GIGA-BYTE TECHNOLOGY Co.,Ltd. Address before: Chinese Taiwan Taipei City store Bao Jiang Road No. 6 Applicant before: GIGA-BYTE TECHNOLOGY Co.,Ltd. |
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