CN102376660A - Radiating device - Google Patents
Radiating device Download PDFInfo
- Publication number
- CN102376660A CN102376660A CN2010102573616A CN201010257361A CN102376660A CN 102376660 A CN102376660 A CN 102376660A CN 2010102573616 A CN2010102573616 A CN 2010102573616A CN 201010257361 A CN201010257361 A CN 201010257361A CN 102376660 A CN102376660 A CN 102376660A
- Authority
- CN
- China
- Prior art keywords
- heat
- liquid
- loop
- heat abstractor
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention relates to a radiating device which comprises a loop component and a power component; the loop component forms a closed loop filled with a liquid substance, and the closed loop is mutually contacted with a high-temperature object; the power component supplies power to the radiating device, so that the liquid in the closed loop flows; and heat conduction is carried out between the liquid in the closed loop and the high-temperature object, and when the power component enables the liquid in the closed loop to flow, the liquid in the closed loop radiates the heat of the high-temperature object. The radiating device can quickly radiate the heat of the high-temperature object and has a good effect.
Description
Technical field
The present invention relates to a kind of device, particularly a kind of heat abstractor.
Background technology
Be accompanied by the develop rapidly of science and technology, existing nowadays product intelligent, high speed emerges in an endless stream, and simultaneously, these products are also had higher requirement to the temperature capacity of process chip or some devices.
In order to let process chip or device be in a reasonable operating state, can select to take some cooling treatment measures usually, to control its temperature a suitable scope.Existing general what adopt is that a fan directly is set near chip or device at present, accelerating distributing of its heat that is produced, thereby reaches the purpose of cooling.Yet this traditional cooling method is difficult in time prove effective in the bigger occasion of some caloric values, so radiating effect is not clearly.
Summary of the invention
In view of this, be necessary to provide a kind of heat abstractor, to address the above problem.
The present invention provides a kind of heat abstractor, can carry out radiating treatment to high temp objects.
This heat abstractor comprises a loop assembly and a Power Component, and this loop assembly is formed a closed-loop path that is filled with liquid substance, and this loop and high temp objects are in contact with one another; This Power Component is that heat abstractor provides power, makes liquid flow in the closed-loop path; Wherein, carry out heat conduction between liquid in the loop and the high temp objects, during liquid flow in Power Component makes the loop, the liquid in the loop dispels the heat to high temp objects.
Heat abstractor of the present invention through Power Component is set, makes that the liquid in the loop that the loop assembly formed can circulate, thereby the object that contacts with the loop is carried out radiating treatment fast, and respond well.
Description of drawings
Fig. 1 is the sketch map of heat abstractor in an embodiment of the present invention.
Fig. 2 is the exploded view of heat abstractor among Fig. 1.
Fig. 3 is the exploded view of driven member, connector and the connecting tube of heat abstractor among Fig. 2.
The main element symbol description
| |
1 |
| The |
10 |
| |
20 |
| The |
101 |
| |
102 |
| |
103 |
| Following |
104 |
| Connecting |
105 |
| Rotating |
201 |
| |
202 |
| Connector | 203 |
| Last |
1031、1032 |
| |
1033 |
| Following |
1041、1042 |
| The connecting tube two- |
1051、1052 |
| Serrated portion | 2031 |
Embodiment
See also Fig. 1, be the sketch map of heat abstractor in an embodiment of the present invention 1.This heat abstractor 1 can be used for being high temp objects, carries out radiating treatment like computer main board, CPU etc.This heat abstractor 1 comprises a loop assembly 10 and a Power Component 20, and this loop assembly 10 comprises a heat conduction case 101 and a return 102, and this heat conduction case 101 fully contacts with the high temp objects that needs heat radiation.This return 102 and this heat conduction case 101 are formed the loop of a closure, in this loop, are filled with the liquid substance (not shown), be used for and with high temp objects that heat conduction case 101 contacts between carry out heat conduction.In this execution mode, this return 102 is arranged to helical form, thereby in the volume that reduces heat abstractor 1, has increased area of dissipation, and this return 102 can be arranged to other shapes in other embodiments.This Power Component 20 is used to heat abstractor 1 power is provided, and makes the liquid flow that is in the loop.Under the effect of this Power Component 20, this liquid substance that constantly absorbs the high temp objects heat circulates in the loop, and the heat that drives Liquid Absorption distributes, thereby high temp objects is dispelled the heat.In this execution mode; The liquid substance of filling in this loop is a water; The contact surface that this heat conduction case 101 contacts with high temp objects is provided with greatly as far as possible and contacts with the maximum surface of high temp objects, with the heat transfer area between liquid and the high temp objects in the expansion heat conduction case 101.For example, high temp objects is a strip object, and then the surface, place, long limit with this high temp objects contacts with the contact surface of heat conduction case 101, makes that heat transfer area is maximum.
Please consult Fig. 2 and Fig. 3 in the lump.This heat conduction case 101 is provided with port one 011 and port one 012; Liquid substance can flow into from a port of heat conduction case 101; Flow out from another port; For example liquid substance self-loop pipeline 102 flows into heat conduction case 101 through port one 011, thereby and from port one 012 outflow heat conduction case 101 inflow returns 102.Inside at this heat conduction case 101 can also be provided with the conduction trough (not shown); So that liquid substance flows according to the flow direction of conduction trough; Thereby the liquid substance after the heat conduction of transference high temp objects can flow out heat conduction case 101 as soon as possible; Improve heat transfer efficiency, in this execution mode, this thermal trough is " it " type structure.
This return 102 comprises pipeline 103 on, once a pipeline 104 and a connecting tube 105, and should go up pipeline 103, pipeline 104 and connecting tube 105 comprise two ports respectively down, for liquid inflow and outflow respectively.The port of this heat conduction case 101, time pipeline 104, connecting tube 105 and last pipeline 103 joins end to end successively, constitutes an enclosed construction, and liquid does not circulate in this enclosed construction intermittently.
As shown in Figure 2, in this execution mode, pipeline 103 port one 031 links to each other with the port one 011 of heat conduction case 101 through a downward interface conduit 1033 on this, and another port 1032 directly links to each other with a port one 052 of connecting tube 105.A port one 042 of this time pipeline 104 links to each other with the another port 1012 of heat conduction case 101, and another port 1041 links to each other with the another port 1051 of connecting tube 105.Should go up pipeline 103, following pipeline 104, connecting tube 105 and heat conduction case 101 and form the loop of a closure together, this liquid substance can flow in this loop.
This Power Component 20 comprises a rotating part 201, a driven member 202 and a connection piece 203; This driven member 202 links to each other with this connector 203; This connector 203 is provided with serrated portion 2031; And serrated portion 2031 is built in the loop, is used for when connector 203 rotates the liquid flow that serrated portion 2031 on it can drive the loop.In this execution mode, the serrated portion 2031 on this connector 203 is built in the connecting tube 105.
This rotating part 201 rotates under the situation of energising; Air is flowed and the generation air-flow towards driven member 202, and this air-flow drives driven member 202 and rotates, and rotates thereby drive the connector 203 that is connected with driven member 202; Make and rotate in the liquid of serrated portion 2031 in being in the closed-loop path on the connector 203; And then the liquid in the drive loop is constantly mobile, makes the liquid in the heat conduction case 101 that contacts with high temp objects be in the state that constantly flows, when flow of liquid is crossed heat conduction case 101; The heat of this high temp objects that contacts with heat conduction case 101 is taken away; When liquid flows in this return 102, the cooling of dispelling the heat, thus through uninterruptedly circulating of liquid high temp objects is lowered the temperature.In this execution mode, pipeline 103 and following pipeline 104 are arranged to circularly on this, are in the top of rotating part 201, driven member 202 is surrounded, and be in order to increase the area of heat radiation, the raising radiating efficiency on the one hand; On the other hand, in pipeline and liquid self-radiating wherein, the air-flow that rotation produced of rotating part 201 and driven member 202 also will dispel the heat to pipeline and liquid wherein.
In this execution mode; This rotating part 201 is a fan; This driven member 202 comprises two electric fans that are in connector 203 both sides respectively, is used to increase the rotatory force of the connector 203 that is connected with driven member 202, makes serrated portion 2031 in liquid, can rotate well.In another embodiment, this driven member 202 includes only an electric fan.In other embodiments, this rotating part 201 is a rotation motor, is connected with connector 203, and connector 203 is provided with serrated portion 2031, and the serrated portion 2031 that the rotation through rotation motor directly drives in the closed-loop path is rotated.
Claims (10)
1. a heat abstractor is used for high temp objects is dispelled the heat, and it is characterized in that, this heat abstractor comprises:
One loop assembly, this loop assembly is formed a closed-loop path that is filled with liquid substance;
One Power Component is used to heat abstractor power is provided, and makes liquid flow in the closed-loop path;
Wherein, When heat abstractor dispels the heat to high temp objects; The loop assembly contacts with high temp objects, carries out heat conduction between liquid in the loop and the high temp objects, when the liquid in the Power Component driving loop constantly flows; This working fluid is constantly taken away the heat of high temp objects, thereby dispels the heat.
2. heat abstractor as claimed in claim 1 is characterized in that, this loop assembly comprises a return and a heat conduction case, and this return and heat conduction case are formed the closed-loop path, and this heat conduction case is used for contacting with high temp objects.
3. heat abstractor as claimed in claim 2; It is characterized in that; This return comprises pipeline on pipeline, the connecting tube and, this time pipeline, connecting tube, goes up pipeline and the heat conduction case includes two ports, and this heat conduction case, pipeline, connecting tube and the port of going up pipeline join end to end successively down; Constitute an enclosed construction, liquid does not circulate in this enclosed construction intermittently.
4. heat abstractor as claimed in claim 1 is characterized in that this Power Component comprises a rotating part, a driven member and a connection piece; This driven member links to each other with this connector; The part of this connector is built in the closed-loop path, contacts with liquid substance, and this rotating part makes driven member rotate under the situation of energising; Drive connector and place the part of loop liquid to rotate, drive liquid substance and flow.
5. heat abstractor as claimed in claim 2 is characterized in that this return is arranged to helical form.
6. heat abstractor as claimed in claim 2 is characterized in that, when high temp objects was dispelled the heat, this heat conduction case contacted with the maximum contact surface of high temp objects.
7. heat abstractor as claimed in claim 4 is characterized in that, the part that this connector is built in the closed-loop path is a serrated portion.
8. heat abstractor as claimed in claim 4 is characterized in that, this rotating part is a fan, and this driven member is an electric fan or two electric fans.
9. heat abstractor as claimed in claim 1; It is characterized in that; This Power Component comprises a rotation motor and a connection piece, and this rotation motor links to each other with this connector, and the part of this connector is built in the closed-loop path; This rotation motor directly drives connector and rotates after energising, the part drive liquid that is built in the liquid of this connector flows.
10. heat abstractor as claimed in claim 9 is characterized in that, the part that this connector is built in the liquid is a serrated portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010257361 CN102376660B (en) | 2010-08-19 | 2010-08-19 | Radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010257361 CN102376660B (en) | 2010-08-19 | 2010-08-19 | Radiating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102376660A true CN102376660A (en) | 2012-03-14 |
| CN102376660B CN102376660B (en) | 2013-08-28 |
Family
ID=45795041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010257361 Expired - Fee Related CN102376660B (en) | 2010-08-19 | 2010-08-19 | Radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102376660B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1455953A (en) * | 2001-11-12 | 2003-11-12 | 株式会社日立制作所 | Electronic device |
| CN2650335Y (en) * | 2003-07-04 | 2004-10-20 | 鸿富锦精密工业（深圳）有限公司 | Water-cooled radiating device |
| CN1653405A (en) * | 2002-05-15 | 2005-08-10 | 松下电器产业株式会社 | A liquid cooling device for a notebook computer |
| CN1828875A (en) * | 2005-02-28 | 2006-09-06 | 台达电子工业股份有限公司 | Liquid cooling type heat radiation module |
| CN1835216A (en) * | 2005-03-18 | 2006-09-20 | 台达电子工业股份有限公司 | Liquid cooling radiation module |
| CN101598318A (en) * | 2009-06-24 | 2009-12-09 | 蔡州 | Heat abstractor |
-
2010
- 2010-08-19 CN CN 201010257361 patent/CN102376660B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1455953A (en) * | 2001-11-12 | 2003-11-12 | 株式会社日立制作所 | Electronic device |
| CN1653405A (en) * | 2002-05-15 | 2005-08-10 | 松下电器产业株式会社 | A liquid cooling device for a notebook computer |
| CN2650335Y (en) * | 2003-07-04 | 2004-10-20 | 鸿富锦精密工业（深圳）有限公司 | Water-cooled radiating device |
| CN1828875A (en) * | 2005-02-28 | 2006-09-06 | 台达电子工业股份有限公司 | Liquid cooling type heat radiation module |
| CN1835216A (en) * | 2005-03-18 | 2006-09-20 | 台达电子工业股份有限公司 | Liquid cooling radiation module |
| CN101598318A (en) * | 2009-06-24 | 2009-12-09 | 蔡州 | Heat abstractor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102376660B (en) | 2013-08-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202168321U (en) | Integrated liquid cooling radiator | |
| CN203276154U (en) | Efficient heat dissipation device of computer CPU | |
| CN106465562A (en) | Heat pipe cooling system and power equipment | |
| CN102790020A (en) | Liquid cooling type heat dissipation device | |
| CN100435609C (en) | Pulse heat pipe radiator for electronic cooling | |
| CN100446228C (en) | Liquid-cooled radiating system | |
| CN106852092B (en) | A kind of novel mechanical pump liquid cooling heat radiation system | |
| CN208848114U (en) | A kind of intelligent computer information processing equipment of excellent in heat dissipation effect | |
| CN200968795Y (en) | Heat pipe radiator | |
| CN207719189U (en) | A kind of CPU high fevers radiator | |
| CN104851855A (en) | Semiconductor liquid-cooling radiator | |
| CN102376660B (en) | Radiating device | |
| CN204705976U (en) | A kind of heat abstractor | |
| CN204761938U (en) | Electronic equipment constant temperature system | |
| CN203520294U (en) | Efficient computer radiator | |
| CN207546393U (en) | Heating refrigeration mixing all-in-one machine | |
| CN204014396U (en) | Composite heat dissipation device | |
| CN2924792Y (en) | LED miniature liquid cooling system | |
| CN208013880U (en) | It is a kind of can intelligent temperature control laptop CPU water cooling micro-channel radiators | |
| CN206507832U (en) | Food processor and heat sink for food processor | |
| CN201196763Y (en) | Heat radiating device used for removing heat generated by computer device | |
| CN206458521U (en) | A kind of oil radiator structure | |
| CN212777589U (en) | Portable graphite alkene heating electric heater | |
| CN204117038U (en) | CPU, video card and hard disk waste heat recovery device | |
| CN220340668U (en) | Dual-cycle liquid cooling device and dual-cycle liquid cooling system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: HONGFUJIN PRECISE INDUSTRY CO., LTD. Effective date: 20141201 Owner name: BEIJING ZHONGCAI WYSE EDUCATION TECHNOLOGY CO., LT Free format text: FORMER OWNER: FUTAIHUA INDUSTRIAL (SHENZHEN) CO., LTD. Effective date: 20141201 Owner name: NANTONG SHUNSHENG CONSTRUCTION ENGINEERING CO., LT Free format text: FORMER OWNER: BEIJING ZHONGCAI WYSE EDUCATION TECHNOLOGY CO., LTD. Effective date: 20141201 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 100083 HAIDIAN, BEIJING TO: 226311 NANTONG, JIANGSU PROVINCE Free format text: CORRECT: ADDRESS; FROM: 518109 SHENZHEN, GUANGDONG PROVINCE TO: 100083 HAIDIAN, BEIJING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20141201 Address after: 226311, Jiangsu Province, Tongzhou District, Nantong Zhang Zhen Town, Tong Kai Bridge Village forty-three groups Patentee after: Nantong Shun Saint Construction Engineering Co.,Ltd. Address before: 100083 Beijing Haidian District Zhongguancun Road No. 18 smartfortune International Building B706 Patentee before: Beijing Zhongcai Wyse Education Technology Co.,Ltd. Effective date of registration: 20141201 Address after: 100083 Beijing Haidian District Zhongguancun Road No. 18 smartfortune International Building B706 Patentee after: Beijing Zhongcai Wyse Education Technology Co.,Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Guanlan Street third community Guanlan Foxconn Technology Park B District, building 4, building 6, building 7, building 13, (I) Patentee before: FuTaiHua Industry (Shenzhen) Co.,Ltd. Patentee before: HON HAI PRECISION INDUSTRY Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130828 Termination date: 20190819 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |