CN204117038U - CPU, video card and hard disk waste heat recovery device - Google Patents
CPU, video card and hard disk waste heat recovery device Download PDFInfo
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- CN204117038U CN204117038U CN201420574350.4U CN201420574350U CN204117038U CN 204117038 U CN204117038 U CN 204117038U CN 201420574350 U CN201420574350 U CN 201420574350U CN 204117038 U CN204117038 U CN 204117038U
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Abstract
The utility model discloses a kind of CPU, video card and hard disk waste heat recovery device, comprise heat collecting apparatus, heat delivery device and heat quantity transfer device; Described heat collecting apparatus near each heat generating components of computer install each heat generating components is produced transfer of heat to described heat collecting apparatus; Described heat delivery device comprises the heat delivery passage be connected with described heat collecting apparatus, described heat delivery passage is provided with blower fan in order to heat is transported to heat quantity transfer device along described heat delivery passage from heat collecting apparatus.The beneficial effects of the utility model are: heat recovery, energy-conserving and environment-protective; Simplicity of design, structure are reliable; Automatic startup, closedown; Heating position adjusts flexibly, not by position limitation.
Description
Technical field
The utility model relates to a kind of and the matching used device of computer, is specifically related to a kind of CPU, video card and hard disk waste heat recovery device.
Background technology
Computer be applied in more and more people routine work, life in.People's operating computer will use keyboard and mouse usually, and during cold weather, due to physiological phenomenon, the hand of people can not be obedient, so operating computer difficulty becomes large, affects the daily work of people, life.
Utility model content
Then the purpose of this utility model is to provide a kind ofly transfers to keyboard, mouse etc. around by the waste heat recovery produced in CPU, video card and hard disk operational process, the normal work that temperature is too low to overcome, cold weather affects people, life.
The purpose of this utility model is achieved through the following technical solutions:
A kind of CPU, video card and hard disk waste heat recovery device, comprise heat collecting apparatus, heat delivery device and heat quantity transfer device; Described heat collecting apparatus is installed near each heat generating components of computer the heat that each heat generating components is produced and is collected into described heat collecting apparatus; Described heat delivery device comprises the heat delivery passage be connected with described heat collecting apparatus, described heat delivery passage is provided with blower fan in order to heat is transported to heat quantity transfer device along described heat delivery passage from heat collecting apparatus.Described thermal component comprises CPU, video card and hard disk.
Preferably, described heat collecting apparatus comprises funnelform heat collection cover, and described heat collection cover comprises one and CPU radiator fan or VGA COOLER are located at interior opening end and a necking down end be connected with heat delivery passage.
Further, described heat collecting apparatus comprises heat collection blower fan, and described heat collection assembling is at the interface of described heat collection cover and heat delivery passage.
Further, described heat delivery passage comprises heat delivery pipeline and is coated on the heat-insulation layer outside heat delivery pipeline, is provided with heat delivery blower fan in described heat delivery pipeline.
Preferably, described heat collecting apparatus is one be coated on described hard disk except the heat absorption capsule of the outside surface being provided with connection-peg side, and the inside of described heat absorption capsule has the first heat catalysis and fills chamber, and described first heat catalysis is filled in chamber and is filled with heat catalysis.
Further, described heat delivery device comprises a heat abstractor and two heat delivery pipes, two described heat delivery pipes are respectively the first heat catalysis delivery pipe and the second heat catalysis delivery pipe, spacing is kept between two heat delivery pipes, and be coated with heat-insulation layer in the outside of heat delivery pipe, described heat abstractor comprises the second inner heat catalysis container cavity and outside heat radiator, heat catalysis is filled with in described second heat catalysis container cavity, two described heat delivery pipes are communicated with the first heat catalysis and fill chamber and the second heat catalysis container cavity to form heat catalysis loop, described heat catalysis loop is provided with heat catalysis ebullator.
Further, described heat absorption capsule comprises conducting strip and heat absorption softgel shell body, the outside surface of described conducting strip and hard disk is fitted, the coated described conducting strip of described heat absorption softgel shell body is capsule container cavity and formation is absorbed heat, the material that described conducting strip is greater than 200w/ (m*k) by thermal conductivity is made, and described heat absorption softgel shell body is made up of insulation material.The material that thermal conductivity is greater than 200w/ (m*k) comprises adamas, silicon, silver, copper or aluminium etc., wherein adamantine thermal conductivity is 1300 ~ 2400w/ (m*k), next thermal conductivity being silicon is the material of 611w/ (m*k), the thermal conductivity of silver is 429w/ (m*k), the thermal conductivity of copper is 401w/ (m*k), the thermal conductivity of gold is 317w/ (m*k), and the thermal conductivity of aluminium is 240w/ (m*k).Consider processibility and cost, the sidewall that the outside surface of described heat absorption capsule and hard disk is fitted is selected copper material or aluminium to make to have more practicality.
Further, described heat quantity transfer device comprises some air outlets, and described air outlet is provided with transfer of heat blower fan heat being blown to air outlet outside from heat delivery passage through air outlet; Described heat quantity transfer device also comprises the two groups of oscillating vanes being arranged on described air outlet, and one group in described two groups of oscillating vanes vertically arranges and driven by teeter motor, and other one group is horizontally disposed with and is driven by longitudinal oscillation motor.Described one group of oscillating vane is vertically arranged and along vertical rotation axis reciprocally swinging, and another group oscillating vane described is horizontally disposed with and along horizontal rotating shaft reciprocally swinging.
Further, the outside surface of CPU, video card and hard disk is all provided with temperature sensor, described temperature sensor is electrically connected with controller, described controller is also electrically connected with environment temperature sensor, described controller is electrically connected heat collection blower fan, heat delivery blower fan, heat catalysis ebullator, transfer of heat blower fan, teeter motor and longitudinal oscillation motor, between described teeter motor and the oscillating vane vertically arranged, is provided with chain drive and limit switch between described longitudinal oscillation motor and horizontally disposed oscillating vane.Heat collection blower fan is set with in described controller, heat delivery blower fan, heat catalysis ebullator, transfer of heat blower fan, the start-up parameter of teeter motor and longitudinal oscillation motor, as when environment temperature lower than 15 DEG C and as described in video card, when the temperature of internal memory or harddisk surface is higher than 50 DEG C, described controller starts heat collection blower fan, heat delivery blower fan, heat catalysis ebullator, transfer of heat blower fan, teeter motor and longitudinal oscillation motor, CPU, video card or the neighbouring hot-air crossed through waste-heat of hard disk are through heat collecting apparatus, heat delivery device and heat quantity transfer device arrive mouse, near keyboard or other need position.
Further, described heat delivery passage is fixedly connected with mouse lines, keyboard chord, the air outlet of described heat quantity transfer device be arranged on mouse except on the outside surface of bottom surface or keyboard except on the outside surface of bottom surface or below keyboard.Warm braw blows out from the gap between keyboard.Described air outlet can be embedded on the shell of mouse or all sides of keyboard, also heat quantity transfer device can be made independently device, independently heat quantity transfer device and heat delivery channel connection, the transfer of heat blower fan and the controller that are positioned at independently heat quantity transfer device are electrically connected.
The beneficial effects of the utility model are:
1) heat recovery, energy-conserving and environment-protective
The waste heat that CPU, video card or hard disk send by heat collecting apparatus is collected with the form of hot-air, is transported to heat quantity transfer device with heat delivery passage, and hot-air is dispersed into the position of needs by heat quantity transfer device, does not rely on warming installation, energy-conserving and environment-protective;
2) simplicity of design, structure are reliable
The coated aerogel heat-proof cover in outside of described heat delivery passage, places the loss in heat delivery process, the excellent thermal insulation performance of aerogel; The material that the sidewall that the outside surface of described heat absorption capsule and hard disk is fitted is greater than 200w/ (m*k) by thermal conductivity is made, and ensures the heat absorption efficiency of heat absorption capsule;
3) automatically start, close
By environment temperature sensor determination environment temperature, by being arranged on the temperature of the temperature sensor determination heat generating components of CPU, video card and hard disk outside surface, the temperature signal of said temperature sensor is sent to controller, by the automatic open close of the setup control heat collection blower fan of controller, heat delivery blower fan, heat catalysis ebullator, transfer of heat blower fan, teeter motor and longitudinal oscillation motor;
4) heating position adjusts, flexibly not by position limitation
Described heat quantity transfer device can be arranged to absolute construction, and independently heat quantity transfer device can be placed into different positions according to actual needs, not by the restriction of installation site.
Accompanying drawing explanation
Fig. 1 is circuit connection diagram of the present utility model;
Fig. 2 is the structural representation of the utility model embodiment one;
Fig. 3 is the A-A cut-open view of Fig. 2;
Fig. 4 is the structural representation of the utility model embodiment two;
Fig. 5 is the B-B cut-open view of Fig. 4;
Fig. 6 is the cut-open view of the C-C of Fig. 4.
In figure, 1, heat collection cover; 2, heat delivery passage; 3, heat collection blower fan; 4, heat delivery blower fan; 5, heat quantity transfer device; 6, transfer of heat blower fan; 7, heat delivery pipeline; 8, heat-insulation layer; 9, absorb heat capsule; 10, heat catalysis ebullator; 11, the first heat catalysis delivery pipe; 12, the second heat catalysis delivery pipe; 13, heat catalysis; 14, conducting strip; 15, absorb heat softgel shell body.
Embodiment
Embodiment one
As shown in Figure 1-Figure 3, a kind of CPU, video card and hard disk waste heat recovery device, comprise heat collecting apparatus, heat delivery device and heat quantity transfer device 5; Described heat collecting apparatus near each heat generating components of computer install each heat generating components is produced transfer of heat to described heat collecting apparatus; Described heat delivery device comprises the heat delivery passage 2 be connected with described heat collecting apparatus, described heat delivery passage 2 is provided with blower fan in order to heat is transported to heat quantity transfer device 5 along described heat delivery passage 2 from heat collecting apparatus.
Can send a large amount of heats in CPU, video card and hard disk operational process, and these heats are disadvantageous for the normal operation of computing machine.CPU or video card itself are provided with heating radiator under normal circumstances, and its heating radiator adopts physics heat radiator to add radiator fan design usually, adopts the CPU of the technical program or video card can not use physics heat radiator, only uses radiator fan.
Described heat collecting apparatus comprises funnelform heat collection cover 1, and described heat collection cover 1 comprises one and CPU radiator fan or VGA COOLER are located at interior opening end and a necking down end be connected with heat delivery passage 2.Tip upside down on CPU radiator fan or VGA COOLER by funnelform heat collection cover 1, the thrust hot-air by cpu fan or graphics card fan enters heat delivery passage 2.
Described heat collecting apparatus comprises heat collection blower fan 3, and described heat collection blower fan 3 is arranged on the interface of described heat collection cover 1 and heat delivery passage 2.Heat collection blower fan 3 increases the suction force of hot-air near heat collecting apparatus, coordinates the propelling movement power of radiator fan, increases the flow that hot-air enters heat delivery passage 2, improves the heat absorption capacity of described heat collecting apparatus.
The heat-insulation layer 8 that described heat delivery passage 2 comprises heat delivery pipeline 7 and is coated on outside heat delivery pipeline 7, is provided with heat delivery blower fan 4 in described heat delivery pipeline 7.Described heat-insulation layer 8 is aerogel heat-proof cover, aerogel heat-proof cover comprises a housing, be filled with aerogel in described housing, the Specific surface area that silica aerogel is very thin effectively limit the propagation of local thermal excitation, its solid state heat conductance 2-3 orders of magnitude lower than corresponding vitreous material.Nanometer micropore hole inhibits gas molecule to heat conducting contribution.The refractive index of silica aerogel is close to l, and more than 100 are reached to the ratio burying in oblivion coefficient that is infrared and visible ray, effectively through sunshine, and the infrared emanation of environment temperature can be stoped, become a kind of desirable transparent insulate material, be applied in Solar use and building energy-saving.By the means of doping, the radiation thermal conduction of silica aerogel can be reduced further, under normal temperature and pressure, the thermal conductivity of carbon dope aerogel lowly can reach 0.013w/ (m*k), is the solid-state material that current thermal conductivity is minimum, and being expected alternative polyurethane foam becomes new refrigerator heat-barrier material.Mixing people's titania can make silica aerogel become new type high temperature heat-barrier material, and thermal conductivity during 800K is only 0.03w/ (m*k).
Described heat quantity transfer device 5 comprises some air outlets, and described air outlet is provided with the transfer of heat blower fan 6 heat being blown to air outlet outside from heat delivery passage 2 through air outlet; Described heat quantity transfer device 5 also comprises the two groups of oscillating vanes being arranged on described air outlet, and one group in described two groups of oscillating vanes vertically arranges and driven by teeter motor, and other one group is horizontally disposed with and is driven by longitudinal oscillation motor.Described heat delivery passage 2 is fixedly connected with mouse lines, keyboard chord, the air outlet of described heat quantity transfer device 5 be arranged on mouse except on the outside surface of bottom surface or keyboard except on the outside surface of bottom surface or below keyboard.
Under on the shell that air outlet can be arranged on described mouse according to actual needs or all sides of described keyboard or described keyboard; Also can make absolute construction, conveniently be placed on assigned address, use flexibly.Described two groups of oscillating vanes are identical with the regulating tuyere controlled with air-conditioning with the structure of the motor corresponding to it, therefore repeat no more.
The outside surface of CPU and video card is all provided with temperature sensor, described temperature sensor is electrically connected with controller, described controller is also electrically connected with environment temperature sensor, described controller is electrically connected heat collection blower fan 3, heat delivery blower fan 4, transfer of heat blower fan 6, teeter motor and longitudinal oscillation motor, between described teeter motor and the oscillating vane vertically arranged, is provided with chain drive and limit switch between described longitudinal oscillation motor and horizontally disposed oscillating vane.By the temperature of temperature sensor perception CPU and video card, controller is a gauge tap, condition of work can be set by gauge tap, as: when environment temperature is lower than 15 DEG C, when the temperature of CPU or video card is higher than 50 DEG C, controller works, connect circuit, described heat collection blower fan 3, heat delivery blower fan 4, heat catalysis ebullator 10, transfer of heat blower fan 6, teeter motor and longitudinal oscillation motor are started working, the hot-air that CPU or video card work produce is through heat collecting apparatus, heat delivery device and heat quantity transfer device 5 transfer to keyboard, near mouse or independently air outlet place.
When using the present embodiment, the hot-air crossed through waste-heat around CPU, video card is pressed to heat collection cover 1 by CPU radiator fan, VGA COOLER, hot-air in heat collection cover 1 is pumped to heat delivery passage 2 by heat collection blower fan 3 simultaneously, finally by heat quantity transfer device 5, hot-air is dispersed into the position of needs, as mouse, keyboard or heat quantity transfer device 5 is made absolute construction, the heat quantity transfer device 5 of absolute construction can arbitrarily movement according to actual needs.
Embodiment two
As shown in Fig. 1 and Fig. 4-Fig. 6, the present embodiment structure is substantially identical with embodiment one, and its difference is:
Described heat collecting apparatus is one be coated on described hard disk except the heat absorption capsule 9 of the outside surface being provided with connection-peg side, and the inside of described heat absorption capsule 9 has the first heat catalysis and fills chamber, and described first heat catalysis is filled in chamber and is filled with heat catalysis.
Described heat delivery device comprises a heat abstractor and two heat delivery pipes, two described heat delivery pipes are respectively the first heat catalysis delivery pipe 11 and the second heat catalysis delivery pipe 12, spacing is kept between two heat delivery pipes, and be coated with heat-insulation layer 8 in the outside of heat delivery pipe, described heat abstractor comprises the second inner heat catalysis container cavity and outside heat radiator, heat catalysis is filled with in described second heat catalysis container cavity, two described heat delivery pipes are communicated with the first heat catalysis and fill chamber and the second heat catalysis container cavity to form heat catalysis loop, described heat catalysis loop is provided with heat catalysis ebullator 10.
Described heat absorption capsule 9 comprises conducting strip 14 and heat absorption softgel shell body 15, described conducting strip 14 is fitted with the outside surface of hard disk, the coated described conducting strip 14 of described heat absorption softgel shell body 15 is capsule container cavity and formation is absorbed heat, the material that described conducting strip 14 is greater than 200w/ (m*k) by thermal conductivity is made, and described heat absorption softgel shell body 15 is made up of insulation material.The material that thermal conductivity is greater than 200w/ (m*k) comprises adamas, silicon, silver, copper or aluminium etc., wherein adamantine thermal conductivity is 1300 ~ 2400w/ (m*k), next thermal conductivity being silicon is the material of 611w/ (m*k), the thermal conductivity of silver is 429w/ (m*k), the thermal conductivity of copper is 401w/ (m*k), the thermal conductivity of gold is 317w/ (m*k), and the thermal conductivity of aluminium is 240w/ (m*k).Insulation material is aerogel heat-proof layer or vacuum interlayer.
When using the present embodiment, heat catalysis ebullator 10 described in the present embodiment is electrically connected with host supplying power circuit, and between heat catalysis ebullator 10 and host supplying power circuit, be provided with switch, on the shell of the computer that described switch is embedded, when cold weather, Push switch, connect heat catalysis ebullator 10, heat catalysis starts at heat catalysis loop internal circulation flow, heat absorption capsule 9 absorbs heat from harddisk surface, the heat catalysis being arranged in heat absorption capsule 9 is heated, power is provided to be back in heat absorption capsule 9 along heat catalysis loop through heat abstractor by the heat catalysis after heating through heat catalysis ebullator 10, complete a heat absorption, heat radiation circulation, start next circulation again.
The utility model is not limited to above-mentioned preferred forms; anyone can draw other various forms of products under enlightenment of the present utility model; no matter but any change is done in its shape or structure; every have identical with the application or akin technical scheme, all drops within protection domain of the present utility model.
Claims (10)
1. CPU, video card and a hard disk waste heat recovery device, is characterized in that:
Comprise heat collecting apparatus, heat delivery device and heat quantity transfer device;
Described heat collecting apparatus near each heat generating components of computer install each heat generating components is produced transfer of heat to described heat collecting apparatus;
Described heat delivery device comprises the heat delivery passage be connected with described heat collecting apparatus, described heat delivery passage is provided with blower fan in order to heat is transported to heat quantity transfer device along described heat delivery passage from heat collecting apparatus.
2. CPU according to claim 1, video card and hard disk waste heat recovery device, it is characterized in that: described heat collecting apparatus comprises funnelform heat collection cover, described heat collection cover comprises one and CPU radiator fan or VGA COOLER is located at interior opening end and a necking down end be connected with heat delivery passage.
3. CPU according to claim 2, video card and hard disk waste heat recovery device, is characterized in that: described heat collecting apparatus comprises heat collection blower fan, and described heat collection assembling is at the interface of described heat collection cover and heat delivery passage.
4. CPU according to claim 3, video card and hard disk waste heat recovery device, it is characterized in that: described heat delivery passage comprises heat delivery pipeline and is coated on the heat-insulation layer outside heat delivery pipeline, is provided with heat delivery blower fan in described heat delivery pipeline.
5. CPU according to claim 1, video card and hard disk waste heat recovery device, it is characterized in that: described heat collecting apparatus is one be coated on described hard disk except the heat absorption capsule of the outside surface being provided with connection-peg side, the inside of described heat absorption capsule has the first heat catalysis and fills chamber, and described first heat catalysis is filled in chamber and is filled with heat catalysis.
6. CPU according to claim 5, video card and hard disk waste heat recovery device, it is characterized in that: described heat delivery device comprises a heat abstractor and two heat delivery pipes, two described heat delivery pipes are respectively the first heat catalysis delivery pipe and the second heat catalysis delivery pipe, spacing is kept between two heat delivery pipes, and be coated with heat-insulation layer in the outside of heat delivery pipe, described heat abstractor comprises the second inner heat catalysis container cavity and outside heat radiator, heat catalysis is filled with in described second heat catalysis container cavity, two described heat delivery pipes are communicated with the first heat catalysis and fill chamber and the second heat catalysis container cavity to form heat catalysis loop, described heat catalysis loop is provided with heat catalysis ebullator.
7. CPU according to claim 5, video card and hard disk waste heat recovery device, it is characterized in that: described heat absorption capsule comprises conducting strip and heat absorption softgel shell body, the outside surface of described conducting strip and hard disk is fitted, the coated described conducting strip of described heat absorption softgel shell body is capsule container cavity and formation is absorbed heat, the material that described conducting strip is greater than 200w/ (m*k) by thermal conductivity is made, and described heat absorption softgel shell body is made up of insulation material.
8. the CPU according to any one of claim 1-7, video card and hard disk waste heat recovery device, it is characterized in that: described heat quantity transfer device comprises some air outlets, described air outlet is provided with transfer of heat blower fan heat being blown to air outlet outside from heat delivery passage through air outlet; Described heat quantity transfer device also comprises the two groups of oscillating vanes being arranged on described air outlet, and one group in described two groups of oscillating vanes vertically arranges and driven by teeter motor, and other one group is horizontally disposed with and is driven by longitudinal oscillation motor.
9. CPU according to claim 8, video card and hard disk waste heat recovery device, it is characterized in that: CPU, the outside surface of video card and hard disk is all provided with temperature sensor, described temperature sensor is electrically connected with controller, described controller is also electrically connected with environment temperature sensor, described controller is electrically connected heat collection blower fan, heat delivery blower fan, heat catalysis ebullator, transfer of heat blower fan, teeter motor and longitudinal oscillation motor, between described teeter motor and the oscillating vane vertically arranged, chain drive and limit switch is provided with between described longitudinal oscillation motor and horizontally disposed oscillating vane.
10. CPU according to claim 8, video card and hard disk waste heat recovery device, it is characterized in that: described heat delivery passage is fixedly connected with mouse lines, keyboard chord, the air outlet of described heat quantity transfer device be arranged on mouse except on the outside surface of bottom surface or keyboard except on the outside surface of bottom surface or below keyboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420574350.4U CN204117038U (en) | 2014-09-30 | 2014-09-30 | CPU, video card and hard disk waste heat recovery device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420574350.4U CN204117038U (en) | 2014-09-30 | 2014-09-30 | CPU, video card and hard disk waste heat recovery device |
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| CN204117038U true CN204117038U (en) | 2015-01-21 |
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| CN201420574350.4U Active CN204117038U (en) | 2014-09-30 | 2014-09-30 | CPU, video card and hard disk waste heat recovery device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107887959A (en) * | 2017-12-26 | 2018-04-06 | 孔祥贵 | A kind of charger construction of produced heat when can utilize charger operation automatically |
-
2014
- 2014-09-30 CN CN201420574350.4U patent/CN204117038U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107887959A (en) * | 2017-12-26 | 2018-04-06 | 孔祥贵 | A kind of charger construction of produced heat when can utilize charger operation automatically |
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Address after: Venus 201507 Cao Jing Town Jinshan District Shanghai City No. 1070 Patentee after: Limited by Share Ltd supply chain Address before: Venus 201507 Cao Jing Town Jinshan District Shanghai City No. 1070 Patentee before: SHANGHAI MAICHUANG ELECTRONICS CO., LTD. |
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Address after: Room 308, Tangchen financial building, 710 Dongfang Road, Pudong New Area, Shanghai, 201507 Patentee after: Maichuang Enterprise Management Service Co., Ltd Address before: 201507, No. 1070, Jinxing Town, Cao Jing Town, Shanghai, Jinshan District Patentee before: Limited by Share Ltd. supply chain |
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