CN1653405A - A liquid cooling device for a notebook computer - Google Patents

A liquid cooling device for a notebook computer Download PDF

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Publication number
CN1653405A
CN1653405A CN 03810929 CN03810929A CN1653405A CN 1653405 A CN1653405 A CN 1653405A CN 03810929 CN03810929 CN 03810929 CN 03810929 A CN03810929 A CN 03810929A CN 1653405 A CN1653405 A CN 1653405A
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CN
China
Prior art keywords
pump
heat
cooling device
impeller
housing
Prior art date
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Granted
Application number
CN 03810929
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Chinese (zh)
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CN100347636C (en
Inventor
庭月野恭
广濑政志
楢木野滋
相园让光
笠原一志
古贺慎弥
酒井敏辅
久保田俊幸
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Filing date
Publication date
Priority claimed from JP2003007168A external-priority patent/JP3431024B1/en
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of CN1653405A publication Critical patent/CN1653405A/en
Application granted granted Critical
Publication of CN100347636C publication Critical patent/CN100347636C/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/203—Heat conductive hinge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention relates to a pump used for circulating coolant, which is characterized in that the casing of the pump is connected with the electronic components directly. The pump has the advantages of improved efficiency of the cooling device and compact and flexible design.

Description

The Control device of liquid cooling that is used for notebook computer
Technical field
The electronic equipment that the present invention relates to a kind of cooling device and comprise it, this cooling device are suitable for circulating coolant and are used for cooling off heat-generating electronic elements such as the central processing unit that is arranged on housing (below be referred to as CPU).
Background technology
The acceleration of computing machine has in recent years obtained obvious improvement, and CPU also has than much bigger in the past clock frequency simultaneously.As a result, the heating of CPU has increased a lot, and is not enough thereby the conventional air cooling means of the heat radiator that places one's entire reliance upon has become.For this reason, a kind of high-power efficiently cooling device of absolute demand.This cooling device discloses in uncensored patent disclosure No.264139/1993 of Japan and No.32263/1996, and wherein cooling medium is used to cool off the substrate with heat-generating electronic elements mounted thereto in the substrate cocycle.
Traditional cooling device that utilizes the circulate coolant cooling electronic apparatus will be described below.Should be pointed out that term " electronic equipment " is meant the equipment that is suitable for according to being loaded in the program execution processing in CPU or the analog in this article in fact, or more specifically be meant Portable, compact equipment such as notebook computer.Yet described term comprises that also other is equipped with the equipment of the heat-generating electronic elements of heating when energising.The first traditional cold radiator cooler is schematically illustrated in Figure 10.Referring to Figure 10, reference number 100 expression housings; Label 101 expression heat-generating electronic elements; Label 102 expressions have the substrate of heater element mounted thereto 101; Label 103 is illustrated in heater element 101 and is used for carrying out the refrigeratory of heat interchange with cooling heating element 101 between the cooling medium of cooling heating element 101.Reference number 104 expression is used for heating radiator that heat is removed from cooling medium; Label 105 expressions are used to make the pump of circulate coolant; Label 106 expressions are used to make the pipeline of these element interconnections; Label 107 expressions are used for the fan with air cooling radiator 104.
Now, will the operation of the first traditional cold radiator cooler be described.After discharging from pump 105, the cooling medium pipeline 106 of flowing through arrives refrigeratory 103, and here temperature raises cooling medium owing to absorb the heat of heat-generating electronic elements 101.Then, to heating radiator 104, because air cools off by fan 107, here coolant temperature reduces with coolant feed.Like this, the cooling medium of cooling returns pump 105.The motion of cooling medium repeats with circulation.Described cooling device is designed to cool off heat-generating electronic elements 101 by circulating coolant in this way.
Then, be the second traditional cold radiator cooler that the example explanation is used for electronic equipment with the cooling device that in the uncensored patent disclosure No.142886/1995 of Japan, discloses.Figure 11 is the total figure that has the equipment of described cooling device.
Second cooling device is designed to by heat is delivered to the wall that serves as heating radiator metal shell partly effectively from heater element, and cooling is installed in the heater element in the narrow housing.Referring to Figure 11, the terminal block of reference number 108 expression electronic equipments; Label 109 expression keyboards; Label 110 expression semiconductor heater members; Label 111 indicating panel unit; Label 112 expression display units; The heat dump collector (header) that label 113 expressions and semiconductor heater members 110 carry out heat interchange; Label 114 expressions are used for the heating radiator collector of thermal transpiration; Label 115 expression flexible pipes; The metal shell of label 116 expression electronic equipments.
Second cooling device is suitable for utilizing heat-transfer arrangement with flexible structure to carry out hot tie-in between as the semiconductor heater members 110 of heater element and metal shell 116.Described heat-transfer arrangement comprises the smooth heat dump collector 113 that links to each other with semiconductor heater members 110 and have the fluid passage; The heating radiator collector 114 that has the fluid passage and be set to contact with the wall of metal shell 116; And the flexible pipe 115 that makes the collector interconnection.Described heat-transfer arrangement is designed to utilize the fluid drives mechanism that is contained in the heating radiator collector 114 to drive between heat dump collector 113 and heating radiator collector 114 or circulates and is sealed in fluid in the device.Between semiconductor heater members 110 and metal shell 116, provide like this, easily and irrelevant being connected of arrangements of elements.In addition, realize that by drive fluid heat is transmitted efficiently.Because heating radiator collector 114 and metal shell 116 hot tie-ins, be diffused into to a great extent on the metal shell 116 with high-termal conductivity from the heat of heating radiator collector.
On the other hand, there be a kind of known having to be used for the pump of the hot-swap feature of internal heat exchange, disclosed in the open No.147900/1990 of Japanese unexamined utility model.Referring to Figure 12, reference number 120 expression motor; Label 121 expression heat exchangers; Label 122 expression cooling-water ducts; Label 122a represents outlet; Label 122b represents inlet; Label 123 expression centrifugal pumps; Label 124 expression housings; Label 125 expression impellers.
Centrifugal pump 123 is provided with ingress port 124b at volute housing 124 middle bodies, is being provided with outlet port 124a with the tangent position of housing.Be provided with impeller 125 in housing 124, the axle of impeller is connected with motor 120.The cooling-water duct 122 of heat exchanger 121 is contained in the housing, is arranged on according to Z-shaped mode on the whole periphery of impeller 125.
Now, the operation to the pump with hot-swap feature of routine is described.When making impeller 125 rotations by motor 120, import housing 124 from the hot coolant A that installs via ingress port 124b, rotation in housing 124, the outlet port 124a from the outside discharges then.In this course, because high pressure forms turbulent flow in the perimeter of housing 124 inside, thereby cooling medium A is contacted with cooling-water duct 122 fiercely, make cooling medium A be flow through the chilled water B cooling of chilled water fluid passage 122.By this way, device sends cooling medium A to equipment under pressure, simultaneously cooling cooling medium A in centrifugal pump 123.
But above-mentioned first kind of traditional cooling device needs: refrigeratory 103 is used for by the cooling of the heat interchange between hot producing component 101 and cooling medium heating electron device 101; Heating radiator 104 is used for removing heat from cooling medium; Pump 105 is used for circulating coolant; To be used for replenishing cooling medium and unshowned coolant container.Because cooling device comprises these combination of elements, this device has bigger volume and complicated structure, can not realize miniaturization, causes cost to increase simultaneously.In other words, first kind of traditional cold radiator cooler is applicable to cooling large-sized electronic equipment basically, but be not suitable for current high-performance portable notebook computer, notebook computer is characterised in that compact, in light weight, small and exquisite design and has various carrying and the use pattern.
Although aforementioned second kind of traditional cold radiator cooler can be used for notebook computer, but, the shape of the heating radiator collector 114 that is connected to the smooth heat absorber 113 of semiconductor heater members 110 and contacts with the wall of betal can 116 has suitable thickness all as box.Just, collector is an obstacle for the small and exquisite design of notebook computer.Particularly, second kind of traditional radiating element is set to make heating radiator collector 114 wherein to comprise the ebullator of conduct fluid driver littler than other pump on transverse width.Unfortunately, the thickness of ebullator defines the thickness of big heating radiator collector 114 generally, thereby can not design thin little light notebook computer.
In addition, thin little light notebook computer does not allow the heat absorber collector 113 of the ebullator that is used to hold second cooling device.Just, the thickness of pump increases the thickness to semiconductor heater members 110, causes the thickness of notebook computer to increase.The thin little lightweight design of this and notebook computer runs in the opposite direction.In addition, the vibrations that produce of ebullator and noise effect the semiconductor heater members 110 of installation pump it on.In some cases, noise can damage ear, and based on these considerations, second kind of cooling device is difficult to thin little lightweight design is made contributions.
The cooling power of second kind of traditional cooling device is limited, and reason is the heating radiator collector that contacts with the wall of metal shell 116 114, and rate of heat exchange is low because area of dissipation is little.Can consider that increasing area of dissipation strengthens cooling power.Yet, further increase area of dissipation and cause following contradiction.Just, the area of dissipation of increase means length and the round-robin amount that increases the fluid passage, needs to increase the output of integrated ebullator thus, and this will cause the increase of heating radiator collector 114 thickness.If ebullator is contained in the metal shell 116 independently, just need in the notebook computer main body of clearance spaces being reduced to the limit, save another space that is used for pump.In addition, the installment work of cooling device is complicated.Thereby second kind of traditional cooling device reduces restricted to the dimensional thickness of notebook computer.The defective of second kind of traditional cooling device is to satisfy the requirement in conjunction with the cooling power of the nearest development of CPU.
On the other hand, big, the complex structure of traditional pump volume with hot-swap feature, this complicated structure need be provided with cooling-water duct therein, because cooling medium is by water quench independently.Pump also needs to be used for second pump and second heat exchanger that is used to absorb from the heat of chilled water of recirculated cooling water.Therefore, this pump is a kind of system of complexity, and size is difficult to reduce, and has a large amount of parts, and installation effectiveness is low.Therefore, can not expect to obtain the good thermal efficiency or low cost from this pump.
Consider above-mentionedly, the object of the present invention is to provide and a kind ofly can improve the cooling device that cooling effectiveness, size and thickness reduce and have simple structure.
Another object of the present invention is to provide a kind of compact conformation, the little electronic equipment light and simple in structure of design of thin.
Summary of the invention
Cooling device according to the present invention is used to realize above-mentioned purpose.According to the present invention, a kind of cooling device that is used for electronic component is provided, the heating radiator of heat that comprises cooling circuit, is used for the pump by the cooling circuit circulating coolant and is used to disperse the cooling medium in loop, it is characterized in that, pump directly is connected with electronic component, in order to set up thermo-contact between the housing of pump and electronic component.
In this structure, cooling circuit and heating radiator between pump and electronic component, have not improved cooling effectiveness, have dwindled device size and thickness.Thereby make cooling device have simple structure.
Electronic equipment according to the present invention has: be used to hold first housing of circuit, described first housing comprises CPU (central processing unit) and memory storage, and is provided with keyboard at its end face; And second housing, comprising display unit, described second housing is rotatably mounted to first housing; This equipment also comprises above-mentioned cooling device, is used to cool off the electronic heating element that comprises central processing unit.
Therefore, device size and thickness have obtained reducing, thereby make electronic devices structure simple and low-cost.
Description of drawings
Fig. 1 illustrates the summary structural drawing that is equipped with according to the electronic equipment of the cooling device of first embodiment of the invention;
Fig. 2 is the sectional view according to the contact heat exchanger-type pump of first embodiment of the invention;
Fig. 3 is the decomposition diagram according to the contact heat exchanger-type pump of first embodiment of the invention;
Fig. 4 is the sectional view that illustrates according to the major part of the flow of coolant in the contact heat exchanger-type pump of first embodiment of the invention;
Fig. 5 A is the table of explanation according to the radial thrust on the annular impeller of first embodiment of the invention;
Fig. 5 B is the synoptic diagram that is used to explain according to the radial thrust on the annular impeller of first embodiment of the invention;
Fig. 6 is the sectional view that illustrates according to the major part of the flow of coolant in the contact heat exchanger-type pump that is provided with fan of first embodiment of the invention;
Fig. 7 is the summary structural drawing that is equipped with according to the electronic equipment of the cooling device of second embodiment of the invention;
Fig. 8 is the sectional view according to the pivot member of second embodiment of the invention;
Fig. 9 is the sectional view according to the pivot member of second embodiment of the invention that dismountable snap-on-connector is housed;
Figure 10 is the structural drawing that is used for the first traditional cold radiator cooler of electronic equipment;
Figure 11 is the structural drawing that is used for the second traditional cold radiator cooler of electronic equipment;
Figure 12 is the partial cross section skeleton view of the traditional pump with heat exchanger function;
Figure 13 is according to the contact heat exchanger-type pump of the embodiment of the invention and the mounting structure figure of heat-generating electronic elements;
Figure 14 is according to the contact heat exchanger-type pump of the embodiment of the invention and the mounting structure figure of heat-generating electronic elements;
Figure 15 is according to the contact heat exchanger-type pump of the embodiment of the invention and the mounting structure figure of heat-generating electronic elements;
Figure 16 is according to the contact heat exchanger-type pump of the embodiment of the invention and the mounting structure figure of heat-generating electronic elements;
Figure 17 is according to the contact heat exchanger-type pump of the embodiment of the invention and the mounting structure figure of heat-generating electronic elements;
Figure 18 is according to the contact heat exchanger-type pump of the embodiment of the invention and the mounting structure figure of heat-generating electronic elements;
Figure 19 is according to the contact heat exchanger-type pump of the embodiment of the invention and the mounting structure figure of heat-generating electronic elements;
Figure 20 is according to the contact heat exchanger-type pump of the embodiment of the invention and the mounting structure figure of heat-generating electronic elements;
Figure 21 is according to the contact heat exchanger-type pump of the embodiment of the invention and the mounting structure figure of heat-generating electronic elements;
Figure 22 is according to the contact heat exchanger-type pump of the embodiment of the invention and the mounting structure figure of heat-generating electronic elements;
Figure 23 is according to the contact heat exchanger-type pump of the embodiment of the invention and the mounting structure figure of heat-generating electronic elements;
Figure 24 is according to the contact heat exchanger-type pump of the embodiment of the invention and the mounting structure figure of heat-generating electronic elements;
Figure 25 is according to the contact heat exchanger-type pump of the embodiment of the invention and the mounting structure figure of heat-generating electronic elements;
Figure 26 is according to the contact heat exchanger-type pump of the embodiment of the invention and the mounting structure figure of heat-generating electronic elements;
Figure 27 is according to the contact heat exchanger-type pump of the embodiment of the invention and the mounting structure figure of heat-generating electronic elements;
Figure 28 is according to the contact heat exchanger-type pump of the embodiment of the invention and the mounting structure figure of heat-generating electronic elements;
Figure 29 is according to the contact heat exchanger-type pump of the embodiment of the invention and the mounting structure figure of heat-generating electronic elements;
Figure 30 is according to the contact heat exchanger-type pump of the embodiment of the invention and the mounting structure figure of heat-generating electronic elements;
Figure 31 is according to the contact heat exchanger-type pump of the embodiment of the invention and the mounting structure figure of heat-generating electronic elements;
Figure 32 is according to the contact heat exchanger-type pump of the embodiment of the invention and the mounting structure figure of heat-generating electronic elements;
Figure 33 is according to the contact heat exchanger-type pump of the embodiment of the invention and the mounting structure figure of heat-generating electronic elements;
Figure 34 is according to the contact heat exchanger-type pump of the embodiment of the invention and the mounting structure figure of heat-generating electronic elements;
Figure 35 is according to the contact heat exchanger-type pump of the embodiment of the invention and the mounting structure figure of heat-generating electronic elements;
Figure 36 is according to the contact heat exchanger-type pump of the embodiment of the invention and the mounting structure figure of heat-generating electronic elements;
Figure 37 is according to the contact heat exchanger-type pump of the embodiment of the invention and the mounting structure figure of heat-generating electronic elements;
Figure 38 is the synoptic diagram according to the exemplary heat exchange type centrifugal pump of the cooling device of third embodiment of the invention;
Figure 39 is the front view according to the blade of the centrifugal pump of third embodiment of the invention;
Figure 40 shows the exemplary fluid bearing that can use in the centrifugal pump of a third embodiment in accordance with the invention;
Figure 41 is the skeleton view according to the inside surface of the centrifugal pump pump chamber of third embodiment of the invention;
Figure 42 A shows the brush that is connected to according to the impeller of the centrifugal pump of third embodiment of the invention;
Figure 42 B shows the blade that is connected to according to the impeller of the centrifugal pump of third embodiment of the invention;
Figure 43 is the side view of the centrifugal pump that 43-43 along the line cuts open among Figure 38;
Figure 44 is the synoptic diagram according to the exemplary heat exchange type centrifugal pump of the cooling device of fourth embodiment of the invention;
Figure 45 is the front view according to the impeller of the centrifugal pump of fourth embodiment of the invention;
Figure 46 A shows the centrifugal pump according to the impeller with short turning axle of fourth embodiment of the invention;
Figure 46 B shows the another kind of centrifugal pump according to the impeller with short turning axle of fourth embodiment of the invention;
Figure 47 is the front view according to the inwall of the centrifugal pump pump chamber of fourth embodiment of the invention;
Figure 48 is the synoptic diagram according to the housing of the centrifugal pump of fourth embodiment of the invention.
Figure 49 is the synoptic diagram according to the exemplary heat exchange type centrifugal pump of the cooling device of fifth embodiment of the invention.
Embodiment
Below with reference to the accompanying drawings, describe the preferred embodiments of the present invention in detail.In following description, each part of the same numeral representative in the accompanying drawing makes up basically in an identical manner, so omitted the repeat specification to same pieces.
First embodiment
The cooling device of first embodiment and the electronic equipment that comprises this cooling device are designed to will contact the heat exchanger-type pump and heating radiator interconnects by the flexible pipe that allows second housing to rotate with respect to first housing.This electronic equipment is the foldable device such as notebook computer.Fig. 1 illustrates the summary structural drawing that is equipped with according to the electronic equipment of the cooling device of first embodiment of the invention.Fig. 2 is the sectional view according to the contact heat exchanger-type pump of first embodiment of the invention.Fig. 3 is the decomposition diagram according to the contact heat exchanger-type pump of first embodiment of the invention.Fig. 4 is the sectional view that illustrates according to the major part of the flow of coolant in the contact heat exchanger-type pump of first embodiment of the invention.
Referring to Fig. 1, first housing of reference number 1 representative such as notebook computer; The keyboard that label 2 is represented on the end face that is arranged on first housing 1; Label 3 representatives are such as the heat-generating electronic elements that is contained in the CPU in first housing 1; Label 4 is represented the substrate that heat-generating electronic elements 3 is installed on it; Label 5 is represented second housing of the effect of the lid that plays first housing 1; The display unit that label 6 is represented on the inside surface that is arranged on second housing 5 is used to the operating result that shows that CPU provides; Label 7 representatives are set to and the heater element 3 tight contact heat exchanger formula pumps that contact, and be used for carrying out heat interchange between heater element 3 and cooling medium X, thereby cooling heating element 3 also play the effect of circulating coolant X; Label 8 expressions are arranged on the heating radiator that is used for removing from cooling medium X heat on display unit 6 back sides; Label 8a represents the coolant channel with the zigzag setting; Label 8b represents to replenish the storage container of cooling medium X; Label 9 expression be used to the to interconnect pipeline of these elements.The aqueous solution of propylene glycol that can be used as food additives or analog safely is suitable for use as cooling medium X.As under the following situation with the case material described, cooling medium preferably adds anticorrosive additive, is used to improve the anticorrosion properties of cooling medium with respect to these materials at aluminium or copper.
Because need from the less width on display unit 6 back sides than removing heat in the cooling medium the large space, heating radiator 8 comprises the sheet shaped piece of being made by the material such as copper, aluminium or analog of high-termal conductivity and Gao Re release performance.As shown in Figure 1, comprise coolant channel 8a and storage container 8b in the heating radiator.In order to increase cooling effect, heating radiator 8 can also be provided with fan, by dry powerful cooling cooling medium towards heating radiator 8.Pipeline 9 comprises the rubber tube of being made by rubber flexibility, lower gas permeability property, and described rubber has guaranteed the degree of freedom of layout of beam line such as butyl rubber.The purpose of the rubber of lower gas permeability property is to prevent the entering of air bubble in the pipe.
The structure of contact heat exchanger formula pump 7 then, has been described.Contact heat exchanger formula pump 7 according to first embodiment is vortex pump (also being referred to as Wesco pump, regenerative pump or Wesco pump).Referring to Fig. 2 and 3, reference number 11 is represented the ring-type impeller of vortex pump; Label 12 representatives are formed on the blade of a plurality of troughs of belt on ring-type impeller 11 peripheries; Label 13 representatives are arranged on the rotor magnet in week in the ring-type impeller 11.Reference number 14 representatives are arranged on the motor stator in week in the rotor magnet 13; Label 15 representative is used to hold the pump case of ring-type impeller 11, and pump case also is used for the outlet of directed flow direction of flow, allows to impose on by impeller 11 recovery of pressure of the kinetic energy of fluid; Label 15a representative contacts, is used for the heat-absorbent surface from its heat absorption with electronic component 3; Label 15b represents pump chamber, is used for directed flow direction of flow outlet, allows to impose on by blade 12 recovery of pressure of the kinetic energy of fluid; Label 16 is represented case lid, and this case lid constitutes the part of pump case 15, and holds ring-type impeller 11 by sealing pump chamber 15b; Label 17 representatives are arranged on the stylolitic part that in the pump case 15, rotatably supports ring-type impeller 11.The pump 7 of first embodiment is with respect to the thickness that has 5-10mm on the turning axle direction; The feature radical length is 40-50mm; Rotational speed is 1200rpm; Flow is 0.08-0.12L/min.; The lift level is 0.35-0.45m.Therefore, comprise that the data of pump in accordance with the present invention of the value of first embodiment are restricted to, thickness is 3-15mm; The feature radical length is 10-70mm; Flow is 0.01-0.5L/min.; Lift is 0.1-2m.Just, this pump is specific speed (unit: m, the m with 24-28 3/ min., the pump of compact type rpm) is little more a lot of than the pump of routine.
Traditionally, the thermal heat transfer capability that its contacts side surfaces heater element is used to carry out the pump of heat interchange is considered to lower, thereby its hot-swap feature never was studied.Because it is relatively more difficult to form the flat side of pump, the application with the slimline pump that approaches peaceful heat-absorbent surface is considered to infeasible.Yet inventor's notice is vortex pump and finds and can realize purpose of the present invention by pump is improved.That is to say, make heat stand turbulent heat interchange, can realize sufficient hot-swap feature from heat-generating electronic elements 3 by the turbulent flow of the periphery that is formed on vortex pump.The whole plate-like structure that forms forms one by a part and impeller, so that can have been realized flat heat-absorbent surface with drive part.Consider that heat-absorbent surface with respect to the area of flow with respect to the heat of pass traffic, compares with the pump of normal size, this compactness, small and exquisite pump can be realized enough cooling poweies.
Particularly, the fluid in the pump chamber 15 of contact heat exchanger-type pump 7 is stirred by blade 12, forms helical flow, and described pump 7 is common vortex pumps.See on the macroscopic view that fluid flows along ring-type pump chamber 15b.Absorb from the fluid stream (the microscopic view shown in Fig. 4, fluid flows partly against the direction of heat transfer adverse current) of the outside heat that transmits of thermal source by ring-type impeller 11 peripheries.As a result, pump can play the effect of heat exchanger, and another cooling device need not be provided.But pump also can comprise auxiliary cooling device, to strengthen cooling power.Rotor magnet 13 and ring-type impeller 11 are integral, to form the ring bodies by column part 17 rotatable supports.Correspondingly, the inertial mass of ring-type impeller 11 is reduced, thereby has reduced the heat that drive part produces, and simultaneously, size, thickness and the weight of contact heat exchanger-type pump 7 are reduced.In order to quicken heat transmission, must select to make pump case 15 and case lid 16 such as the high conductivity material of copper, aluminium etc.In principle, be suitable for adopting the metal material of the high heat-exchange capacity that comprises copper, aluminium etc.In addition, as to the insensitive material of the variation of pyroconductivity, also can use resin or analog with high thermoconductivity.Select in order to reduce weight aluminium as the situation of material that is used to form pump case 15 under, can preferably that thermal conductivity ratio aluminium is higher copper sheet be connected to the lower surface of pump case 15.In addition, heat pipe can be connected to the lower surface (on heat-absorbent surface side 15a) of pump case 15, maybe can be embedded in its part, thereby the heat that is absorbed more effectively can be delivered to the outer peripheral edges of the annular impeller 11 in the pump case 15.Copper sheet and heat pipe are equivalent to auxiliary conducting-heat elements of the present invention.Except the sheet component that links to each other, auxiliary conducting-heat elements can and cut away unwanted part by the frictional engagement copper bar and form.Pump case 15 and case lid 16 also preferably are formed with flap-like projection and depression on its outer surface, to carry out heat interchange effectively with extraneous air.
In addition, contact heat exchanger formula pump 7 can be designed to have fully the heat-absorbent surface 15a of the pump case 15 that is limited by the plane.Particularly, the side of pump case 15 forms corresponding to the side of pump chamber 15b and motor stator 14, and motor stator 14 is contained in the cavity in the stylolitic part 17 simultaneously, makes the heat-absorbent surface 15a of pump 7 form flat thus.Like this, heat-absorbent surface 15a is closely contacted with heat-generating electronic elements 3 (its end face forms flat usually).Form under the uneven situation at the top of heat-generating electronic elements 3, pump case thickness can so change so that consistent with the top structure of heater element, and foundation closely contacts with the top of heater element thus.Similar with above-mentioned copper sheet, can preferably binder resin or the rubber with high thermoconductivity be placed between the top structure of heat-absorbent surface 15a and heat-generating electronic elements 3 so that pump case can be fastening in place and possibility minimum that heat conductivity reduces.Should be pointed out that the top structure one that makes heat-absorbent surface 15a and heat-generating electronic elements 3 causes the heat-absorbent surface 15a that has complementary structure to have the three-dimensional structure of heater element 3 end faces.That is, the curvature of the curvature of heat-absorbent surface coupling heater element 3, thus pump case self can be installed on the element.And, so consistent meaning, although usually different with structure with the size of heat-absorbent surface 15a (the heat exchanger-type pump 70 minutes of contacting according to the present invention is little such as the size of the heat-generating electronic elements 3 of CPU and structure, and heater element 3 has bigger size usually, and pump in accordance with the present invention 7 can adopt various forms, and heater element is generally square), the curvature of these elements still matches each other at their fixed part (contact portion) at least.In order to carry out heat transmission effectively, be necessary to eliminate the formation air layer between heat-absorbent surface 15a and the heat-generating electronic elements 3.Therefore, consistent thought can comprise for example less situation that forms in any of heat-absorbent surface and heater element that is recessed in, although never recommend this method.
In first embodiment, motor stator 14 is received in the central cavity that the stylolitic part 17 by pump case 15 limits and is transmitted, and a side of motor stator is transmitted heat, and its opposite side makes heat dissipate when being exposed to extraneous air simultaneously.Like this, running part produces little heat basically, and these heats are dissipated in the atmosphere.Therefore, contact heat exchanger-type pump 7 can be used for cooling off heat-generating electronic elements 3.Yet, consider effective cooling of heat-generating electronic elements 3, do not recommend and will be provided with near the motor stator 14 that equally yet produces heat such as the heater element 3 of CPU.Though change the size that depends on heater element 3 and heat-absorbent surface 15a, heet transfer rate depends on the position of heater element 3.Because the heat that motor produces, so present higher heat absorption rate corresponding to the zone of the heat-absorbent surface 15a of the horizontal side of housing and near the zones ingress port 19 and the outlet port 20, the horizontal side of wherein said housing is clipped in the middle the wall of pump chamber 15b.Especially, by the center with heater element 3 be arranged on by ingress port 19, outlet port 20 and pump chamber 15b around the location of heat-absorbent surface 15a, can obtain maximum radiating effect.
The cavity that receives motor stator 14 can by the silicones with high thermoconductivity or urethane resin is molded forms, so that the heat that is produced by motor stator 14 can be delivered to pump chamber 15b via described molding part.And, described molding part spontaneous heating in the future element 3 and pass to cooling medium X among the pump chamber 15b effectively by the heat that heat-absorbent surface 15a absorbs.This causes the coefficient of overall heat transmission further to improve.Form by moulding material is molded if comprise the motor stator 14 of winding, then molded stator is not only accelerated the dissipation from the heat of heater element 3, and fully with conductive winding part and watertight Fengkai.Like this, can prevent admirably that escape of liquid from appearring in motor stator 14.
Contact heat exchanger-type pump 7 according to first embodiment is suitable for the noncontact rotation, reduces the axial and radial thrust that is produced by hydrodynamic force in order to keep long-time quiet run simultaneously.Referring to Fig. 2 and 3, reference number 18 expression thrust plates; Label 19 expression inlets; Label 20 expression outlets.Reference number 22 expression is formed on the opposite flank of ring-type impeller 11 and thrust dynamic pressure that have spiral groove patterns produces groove, and that form and radial dynamic pressure that have herringbone pattern produces groove on the inner periphery of ring-type impeller 11 and label 23 is illustrated in.
In vortex pump, because near the pressure of the location the outlet port 20 is greater than near the pressure of the location the ingress port 19, so lost thrust-balancing.Therefore, form thrust dynamic pressure and produce the spiral groove patterns of groove 22, thereby on the opposite side of impeller 11, be formed for the fluid film of dynamic support axial thrust so that be provided for suction action to the inner periphery propelling fluid of groove with the rotation of ring-type impeller 11.On the other hand, form radial dynamic pressure and produce man type chute's pattern of groove 23, thereby on ring-type impeller 11, be formed for the fluid film of dynamic support radial thrust so that provide suction action to the axle center of groove propelling fluid with the rotation of impeller 11.Thrust dynamic pressure produces groove 22 and can be formed on the thrust plate or case lid of pump case 15, rather than is formed on the ring-type impeller 11.On the other hand, radial dynamic pressure generation groove 23 can be formed on the stylolitic part 17 of pump case 15.
Fig. 5 A is the table of listing according to the radial thrust on the ring-type impeller 11 of first embodiment of the invention, and Fig. 5 B is the key diagram according to the radial thrust on the ring-type impeller of first embodiment of the invention.In Fig. 5 B, arrow F represents to act on the direction of the power on the ring-type impeller 11.Shown in Fig. 5 B, vortex pump is big near the pressure in the zone at ingress port 19 places in the pressure ratio near the location that exports port 20, thereby radial thrust acts on θ direction or the direction away from outlet port 20.Therefore, if the degree of depth of sentencing the dynamic pressure that increase is provided by in the a-quadrant (part of the stylolitic part 17 of the pump case of representing with the thick line among the figure 15) forms radial dynamic pressure and produces groove 23 fluid thrust is strengthened, can prevent that then radial thrust from making ring-type impeller 11 contact with stylolitic part.In this case, radial dynamic pressure generation groove 23 can only be formed near on the a-quadrant of the stylolitic part 17 that exports port 20 or on the whole circumference.In this way, can guarantee the stable operation of pump.According to the data of listing among Fig. 5 A clearly, the direction of the power on the ring-type impeller 11 changes according to the pressure differential between outlet port 20 and the ingress port 19.Therefore, can be according to the scope of employed area limiting a-quadrant.
Contact heat exchanger-type pump 7 has the following advantages.The first, the running part of vortex pump comprises rotor magnet 13 and motor stator 14 separately.Rotor magnet 13 becomes one with ring-type impeller 11, thereby the all-in-one-piece main body can combine with motor stator 14 to form the flat general structure of pump.This allows to form flat and wide heat-absorbent surface 15a on the side of pump.Second, because the heat transferred heat-absorbent surface 15a of the electronic component of spontaneous heating in the future 3, so contact heat exchanger-type pump 7 can be enough to serve as cooling device, wherein at described heat-absorbent surface 15a place by the helical flow (comprising the local adverse current opposite) of fluid with direction of heat transfer, heat stands turbulent heat interchange at the outer peripheral edges place of pump.The 3rd, by stylolitic part 7 is provided, ring-type impeller 11 is sealed in the fluid fully, and keeps floating with non-contacting form in pump case 15, makes the load minimum on it thus.The heat that minimum load causes drive part to produce reduces, and increases cooling power.The 4th, contact heat exchanger-type pump 7 also serves as cooling device, thereby does not need traditional cooling device or be used for the installment work of cooling device.In addition, pump 7 is installed to installment work or the ad hoc structure that does not need extra trouble on the heater element 3.Only need pump 7 is arranged on the heater element securely, its heat-absorbent surface contacts described element simultaneously.With regard to the installment work and expense of cooling device, this is very favorable.
Next will and comprise that the operation of the electronic equipment of this cooling device is described to the operation of the cooling device of first embodiment.When from the external power source supply capability, by the electric current of the semiconductor switch circuit control in the contact heat exchanger-type pump 7 coil of motor stator 14 of flowing through, so that produce rotating magnetic field.Rotating magnetic field acts on the rotor magnet 13, to produce physical force therein.Because rotor magnet 13 is an one with stylolitic part 17 rotatable ring-type impellers 11 that support by pump case 15, so ring-type impeller 11 bears torque, this makes wheel rotation.Combine with the rotation of impeller 11, the blade 12 on impeller 11 outer peripheral edges gives kinetic energy from the fluid of ingress port 19 importings.Kinetic energy increases the hydrodynamic pressure in the pump case 15 gradually, so that fluid is discharged from outlet port 20.
In this process, because the rotation of impeller 11, the suction action that thrust dynamic pressure produces groove 22 produces the inner periphery propelling fluid of groove 22 towards thrust dynamic pressure, thereby produces thrust dynamic pressure between the opposite side of impeller 11 and thrust plate 18.This allows impeller 11 smooth rotation to prevent its contact thrust plate 18 by fluid film simultaneously.On the other hand, because the rotation of impeller 11, the suction action that radial dynamic pressure produces groove 23 produces the axial centre propelling fluid of groove 23 towards radial dynamic pressure, thereby produces radial dynamic pressure between the inner periphery of impeller 11 and stylolitic part 17.Therefore, ring-type impeller 11 smooth rotation keep floating simultaneously and do not contact with stylolitic part 17.Ring-type impeller 11 presents little moment of inertia and extraordinary response.In addition, the pump own wt significantly alleviates.
Under this state, contact heat exchanger-type pump 7 sucks cooling medium X reposefully.As shown in Figure 4, the cooling medium X that is sucked stirs by the impeller in the space that is surrounded by pump case 15 and case lid 16 11, forms the peculiar fluid stream of vortex pump thus in pump chamber 15b, increases gradually along with pressure then and discharges.In this process, cooling medium X and pump case 15 and case lid 16 are carried out violent turbulent heat interchange, and temperature raises by the heat that transmits from heat-generating electronic elements 3 for wherein said pump case 15 and case lid 16.By utilizing shot blast, shot peening etc. to improve the surfaceness of the inwall of pump chamber 15, can promote turbulent heat interchange.This is owing to increased heat exchange area by improving surfaceness, and owing to has promoted turbulent flow by more violent heat interchange.Since identical, as shown in Figure 6, can improve heat exchange amount to the fin 15c that impeller 11 protrudes by providing from the inwall of pump chamber 15b.Fin 15c helps the fluid smooth flow among the pump chamber 15b, and the zone that helps to increase the heat interchange from pump chamber 15 to cooling medium X.Fig. 6 is used for illustrating the sectional view of cooling medium in the major part that flows of contact heat exchanger-type pump, and described contact heat exchanger-type pump is provided with the fin according to the first embodiment of the present invention.
Like this, along with cooling medium X absorbs during turbulent heat interchange from the heat of heater element 3 and temperature raises, cooling medium X is delivered to heating radiator 8 via pipeline 9, and by heating radiator 8 coolings.After temperature reduced, cooling medium X returned pump 7 via pipeline 9, repeated these motions in circulation.
Discharge from second housing 5 from the heat that heating radiator 8 discharges, and the internal temperature of first housing 1 remains on constant level.Therefore, thus do not worry since the user the surface temperature of first housing 1 of frequent contact raise and make the user uncomfortable.In this way, by absorb the heat from heater element 3 by means of the circulation of cooling medium X, contact heat exchanger-type pump 7 can remain on the temperature of heat-generating electronic elements 3 in the allowed band.
Because the dual purpose that contact heat exchanger-type pump 7 serves as pump and cooling device, the cooling device of first embodiment does not need to provide pump and cooling device respectively with the electronic equipment that comprises this cooling device or is used to make pump and the pipeline of cooling device interconnection, thereby realizes the size of cooling device and the minimizing of cost.Also saved the installment work of cooling device.And, need be and carry out the installment work or the ad hoc structure of trouble in addition for pump 7 being installed on the heater element 3.Can be only by pump 7 is placed on the element 3 with the form that contacts with element 3 and pump 7 is in place rightly.Aspect the installation and cost of cooling device, this is very favourable.
Contact heat exchanger-type pump 7 is configured to extra-thin vortex pump, and wherein blade 12, rotor magnet 13 and rotating shaft form one, to form the ring-type impeller 11 that wherein receives motor stator 14.Pump 7 is suitable for making cooling medium to stand violent turbulent heat interchange therein, thereby improves the cooling effectiveness of cooling device, and helps further to reduce the thickness and the cost of cooling device.
Pipeline 9 comprises the pipeline of being made by the rubber of low-permeable, keeps the freedom of layout of beam line thus, and prevents the cooling medium X evaporation in the cooling device for a long time, and wherein cooling medium X evaporation will cause a large amount of gases to invade cooling device.In addition, by contact heat exchanger-type pump 7 being set in first housing 1 and in second housing 5, heating radiator 8 being set, the size such as the main body of notebook computer is reduced.
Second embodiment
Cooling device according to second embodiment of the invention contacts heat exchanger-type pump and heating radiator interconnection with the electronic device design that comprises this cooling device for making by pipeline and the pivot member that allows second housing to rotate with respect to first housing.Electronic equipment is a foldable device such as notebook computer for example.Contact heat exchanger-type pump is constructed in the same manner as in the first embodiment.Fig. 7 illustrates the summary structure that is equipped with according to the electronic equipment of the cooling device of second embodiment of the invention.Fig. 8 illustrates the sectional view of pivot member according to a second embodiment of the present invention.Fig. 9 illustrates the sectional view of the pivot member of the second embodiment of the present invention that removable snap-on-connector is housed.
Referring to Fig. 7, reference number 1 expression first housing; Label 2 expression keyboards; Label 3 expression heater elements; Label 4 expression substrates; Label 5 expressions second housing; Label 6 expression display units; Label 7 expression contact heat exchanger-type pumps; Label 8 expression heating radiators; Label 8a represents coolant channel; Label 8b represents storage container; Label 9a represents the pipeline from contact heat exchanger-type pump; Label 9b represents the pipeline from heating radiator 8.Reference number 30 expression is arranged on the pivot member in the coupling part between first housing 1 and second housing 5, and is suitable for being pivoted with the rotation of second housing 5.Pivot member 30 is connected with pipeline 9b from heating radiator 8 respectively with from the pipeline 9a of the pump of contact heat exchanger-type pump 7.
Next pivot member 30 will be described.Referring to Fig. 8, the outer cylindrical body of reference number 31 expression hollows, the one end is connected with pipeline, and the other end is connected with the inner cylinder of describing later 32; Label 31a represents to prevent the recess of landing; Label 32 expressions are inserted in the inner cylinder that is used for connected hollow in the outer cylindrical body 31; Label 32b represents to be inserted in the projection that is used to prevent landing among the recess 31a.Hollow space defines the passage that is used for cooling medium X.Reference number 32a is illustrated in the groove that forms in the outer peripheral edges of inner cylinder 32, and label 33 expression is inserted between outer cylindrical body 31 and the inner cylinder 32 and be contained in O ring elastic parts among the groove 32a.O ring elastic parts 33 supports outer cylindrical body 31 and inner cylinder 32 in pivotally supported mode, and provides sealing between the passage of outer cylindrical body 31 and inner cylinder 32 and exterior section, prevents from thus to leak by the cooling medium X of passage.O ring elastic parts 33 is arranged to two rows, thereby prevents the cooling medium X evaporation in the cooling device for a long time, and described cooling medium X evaporation will cause a large amount of gases to invade cooling device.In order to prevent that outer cylindrical body 31 from inner cylinder 32 landings, protruding 32b is arranged on the inner cylinder 32, and recess 31a is formed on outer cylindrical body 31 places.
Referring to Fig. 9, reference number 31b represents to be arranged on the valve in the outer cylindrical body 31 of pivot member 30; Label 31c represents to be used for the spring of bias valve 31b; Label 32c represents to be arranged on the valve in the inner cylinder 32; Label 32d represents to be used for the spring of bias valve 32c.Under the state that outer cylindrical body 31 and inner cylinder 32 are separated from each other, each inner passage of valve 31b, 32b sealing cylinder.When outer cylindrical body 31 and inner cylinder 32 were connected with each other, its each inner passage communicated with each other.
Because the structure of contact heat exchanger-type 7 is identical with first embodiment with operation, so save description to it.
Next, will be to according to the cooling device of second embodiment with comprise that the electronic equipment of this cooling device is described.The cooling medium X that is sucked by contact heat exchanger-type pump 7 stirs by the annular impeller in the pump 7 11, and standing violent turbulent heat interchange with pump case 15 and case lid 16, described pump case 15 and case lid 16 are because the heat of transmitting from heat-generating electronic elements 3 and temperature raises.As a result, coolant temperature raises.The cooling medium X of heating is delivered to heating radiator 8 via pipeline 9, and by heating radiator 8 coolings.After temperature reduced, cooling medium X returned pump 7 via pipeline 9 and the passage by pivot member 30, repeats these motions in circulation.In this way, the cooling heating element 3 by making cooling medium X circulation keeps the temperature of heat-generating electronic elements 3 in allowed limits.
When the user opened and closed second housing 5 such as electronic equipments such as notebook computers, second housing 5 was around the hinge through of first housing 1, as shown in Figure 7.Described rotation makes the outer cylindrical body 31 of pivot member 30 and inner cylinder 32 be pivoted each other, thus the second housing smooth rotation.In addition, be connected by pivot member 30 with pipeline 9b from the pipeline 9a of the pump 7 in first housing 1, thereby pipeline is not yielding from the heating radiator 8 in second housing 5.Therefore, prevent that pipeline obstruction from passing through cooling medium stream herein.
Under pivot member and connector all-in-one-piece situation shown in Figure 9, but separate groups armored pump sidepiece and heating radiator sidepiece.These parts can be packed into separately in first housing 1 and second housing 5, to be formed for the sub-component of first housing 1 and second housing 5.Subsequently, first and second housings 51, can be connected to each other.This reduces manufacturing cost.
According to above-mentioned second embodiment, the pivot member that is arranged on the pipeline place between first and second housings 1,5 provides the smooth rotation of second housing 5, also prevents pipe deforming, otherwise pipe deforming will hinder the cooling medium pipeline of flowing through.The detachable card button-type connector that is arranged on the pipeline place of interconnection contact heat exchanger-type pump and heating radiator allows pump side portion and heating radiator sidepiece to install separately, makes manufacturing cost reduce.In addition, pivot member and connector are integral and help further to reduce for example size and the cost of main body such as notebook computer.
According to the cooling device of the foregoing description, contact heat exchanger-type pump also serves as cooling device, thereby does not need to provide separately pump and the cold device that goes, and does not also need to make the pipeline of pump and cooling device interconnection.This makes cooling device size and cost reduce, and makes installment work easier.
Because contact heat exchanger-type pump is a vortex pump, so impeller thickness is less.On the other hand, the side surface that extends along pump discharge defines heat-absorbent surface, can flow through by the fluid that is positioned at the impeller outer periphery and be subjected to turbulent heat interchange so that be delivered to outside heat from heater element, therefore, cooling element effectively.Like this, cooling device can be realized the raising of cooling effectiveness and the minimizing of size and cost.
Contact heat exchanger-type pump is the vortex pump that comprises the ring-type impeller, and rotor magnet is arranged in the inner periphery of impeller, and pump case comprises the stylolitic part between motor stator and rotor magnet, and described stylolitic part supports impeller rotationally.Therefore, pump motor does not partly have the projection towards heat-absorbent surface, thereby can make pump form ultrathin type.And, utilize the cooling medium that is positioned at the impeller outer peripheral region, make the heat of transmission stand violent turbulent heat interchange.Therefore, cooling device can be realized the raising of cooling effectiveness and the further minimizing of its thickness and cost.
Because heat-absorbent surface is limited by the whole side of pump case, so heat-absorbent surface can advantageously occupy the largest usable region of pump case.Flat heat-absorbent surface allows pump is installed on the substrate with flat top surface.Motor stator can form by pattern-making material is molded, thereby promotes the heat transmission and make motor stator waterproof.
Electronic equipment is configured to make second housing to link to each other rotationally with first housing, and is provided with the cooling device that is used to cool off the heat-generating electronic elements that comprises CPU.Like this, make the electronic equipment that comprises first housing and have second housing of display unit be suitable for cooling, thereby the size of main body of electronic equipment is further diminished with keyboard.
Contact heat exchanger-type pump is installed on the end face of CPU (central processing unit), and its heat-absorbent surface contacts end face simultaneously, and heating radiator is arranged on the back side of the display unit in second housing.Like this, wherein comprise by first housing and comprise further reducing of size of main body that being provided with of heating radiator realize electronic equipment in contact heat exchanger-type pump and second housing.
Next, will heat-generating electronic elements 3 and the mounting structure that contacts heat exchanger-type pump 7 be described referring to Figure 13 to Figure 37.In Figure 13 to Figure 36, arrow K represents the position of keyboard 2, and arrow B is represented the position of first housing, 1 bottom.
Be arranged under the situation on keyboard 2 sides of circuit board 200 as shown in figure 13 circuit board 200, heat-generating electronic elements 3 and contact heat exchanger-type pump 7 and be stacked on the top of each other with specified order from first housing, 1 bottom towards keyboard 2 at heater element 3.The embodiment of Figure 13 illustrates the example that heater element 3 and pump 7 have physical size about equally.Therefore, heater element 3 can not protrude from pump 7, and vice versa.Such setting has guaranteed that heater element 3 will be delivered to contact heat exchanger-type pump 7 fully by the heat that heater element 3 produces.Incidentally, pump 7 and heater element 3 are by stationary fixture or normally used bonding agent is secured to one another is in the same place.
The embodiment different with Figure 13 is shown in Figure 14, wherein will be coated between heater element 3 and the pump 7 such as the adhesive 201 that silicone grease etc. has flowability and a good thermal conductivity, thereby further improves radiating effect.If pump 7 is placed directly on the heater element shown in Figure 13 3, then between them, form less air layer, this for example hinders heat to be delivered to the problem of pump 7 from heater element 3 with regard to producing.Yet as shown in figure 14, the setting of adhesive 201 for example prevents to form that air layer etc. has the part of low heat conductivity between heater element 3 and pump 7
Another embodiment different with Figure 13 is shown in Figure 15, and the heat-conducting piece 202 that wherein has high-termal conductivity is between heater element 3 and pump 7, and the heat that is used for being produced by heater element 3 is delivered to the whole zone of the heat-absorbent surface of pump 7 reposefully.This makes cooling power improve.At heater element 3 is under the situation of for example semiconductor device such as IC, and especially, semiconductor device heart place temperature especially therein raises.The big calorimetric that heat-conducting piece 202 accelerates to produce at the semiconductor device center is delivered to the whole zone of the heat-absorbent surface of pump 7.The instantiation of heat-conducting piece 202 for example comprises the plate made by copper or aldary and sheet shaped piece and the film of being made by copper or aldary, and described film is formed on the heat-absorbent surface of pump 7 by sputter, vapor deposition, plating etc.The example of making the material of heat-conducting piece comprises that copper, aldary and other have the material of good thermal conductivity.Alternatively, can be with heat pipe or analog etc. as heat-conducting piece 202.
And heat-conducting piece 202 is in order to be delivered to heat at least corresponding near the position in the zone of pump 7 or its, pump chamber 15b of ANALYSIS OF COOLANT FLOW etc. for example, thus significantly improve cooling effectiveness.
An embodiment different with the embodiment shown in Figure 13 is shown in Figure 16 again, and wherein adhesive 203 (material is identical with the material of adhesive 201), heat-conducting piece 202 and adhesive 201 are arranged between heater element 3 and the contact heat exchanger-type pump 7 with the specified order from heat generating member 3.Because heat-conducting piece 202 sends the heat of spontaneous heating element 3 effectively, such setting simultaneously heat-conducting piece 202 and heater element 3 and each prevented the formation of low thermal conduction portions such as air layer for example to the adhesive between heat-conducting piece 203 and the pump 7 203,201, so can obtain very high cooling effectiveness at each.Should be pointed out that if omit in the adhesive 201,203 any, also can obtain high cooling effectiveness.
Figure 17 to Figure 20 illustrates the modification of Figure 13 to Figure 16 respectively.The difference of the embodiment of Figure 17 to Figure 20 and the embodiment of Figure 13 to Figure 16 is that contact heat exchanger-type pump 7 protrudes from the outward flange of heater element 3.According to the embodiment of Figure 17 to Figure 20, if pump moves from the installation site more or less, then pump 7 can cover the roughly entire contact surface of heater element 3 definitely.This does not need for pump 7 is provided with high installation accuracy, thereby the set-up time reduces, and throughput rate improves.
Figure 21 to Figure 24 illustrates the modification of the embodiment of Figure 13 to Figure 16 respectively.The difference of the embodiment of Figure 21 to Figure 24 and the embodiment of Figure 13 to Figure 16 is that electronic component 3 protrudes from the outward flange of pump 7.These embodiment allow pump 7 optionally to be installed to the generation ad-hoc location of the heater element 3 of many heats especially.Another advantage of these embodiment is if pump moves from the installation site more or less, and then pump 7 can make its roughly whole heat-absorbent surface contact with heater element 3 definitely.This does not need for pump 7 is provided with high installation accuracy, thereby the set-up time reduces, and throughput rate improves.
Figure 25 to Figure 36 illustrates the modification of the embodiment of Figure 13 to Figure 24 respectively, and difference is, heater element 3 and pump 7 are arranged on the side with keyboard 2 opposed circuit boards 200 at least.Because except the installation surface of circuit board 200, the embodiment of Figure 25 to 36 has identical structure and effect with the embodiment of Figure 13 to Figure 24, therefore omit description to it.
Figure 37 illustrates another embodiment.Though the embodiment of Figure 13 to Figure 36 has the structure that pump 7 wherein is suitable for only cooling off an electronic component, also pump can be designed to cool off a plurality of electronic components shown in Figure 37.In this example, keyboard 2 can be arranged on the either side.
As shown in Figure 1, coolant channel with pump 7 and heater element 3 between different zone, space in extend, thereby the space of broad need be provided between pump 7 and heater element 3.This allows the very thin design of equipment.In the place that coolant channel extends between pump 7 and heater element 3, the flow resistance minimizing shows between pump 7 and heater element 3 needs the space of broad, thereby realizes that very thin design is infeasible.
The 3rd embodiment
Now the internal structure of the centrifugal pump 300 of the 3rd one exemplary embodiment will be described referring to Figure 38 to Figure 42 B.The open type impeller 301 of centrifugal pump has through hole 301a and the unlimited blade 302 that is formed on wherein.Magnet rotor 303 is along the outer peripheral edges setting of impeller 301.Stator 304 is arranged in the magnet rotor 303.The housing 305 of pump holds impeller 301, and recovers to be given by impeller 301 pressure of the kinetic energy of fluid, thereby the guiding fluid is to the outlet port that links to each other with exit passageway 310.Housing 305 has coupled heat-generating electronic elements 400, for example IC, LSI or MPU etc.
Pump chamber 305a recovers the pressure of the kinetic energy that given by blade 302, thereby fluid is directed to the outlet port.Heating face 305b is arranged on the side of housing 305 along pump chamber 305a.Heat-absorbent surface makes heat-generating electronic elements 400 lose heat by direct or indirect contact.Pump chamber 305a has inside surface 305c.Housing 305 holds impeller 301, and case lid 306 sealing pump chamber 305a.The stationary shaft 307 that is arranged on the housing 305 supports impeller 301 rotationally.Bearing 308 is arranged on the center of the impeller 301 that is installed on the stationary shaft 307.Bearing 308 has dynamic pressure and produces groove 308a (referring to Figure 40) when being embodied as fluid bearing.Pump 300 comprises: water inlet 309a, and wherein cooling medium is put into pump chamber 305a by described water inlet; With access road 309, be used for cooling medium is imported ingress port.A plurality of grooves 311 are formed on the inside surface 305c of pump chamber.312 scrapings of elasticity strip brush are positioned at the frontier district of the laminar flow on the pump chamber inside surface 305c.Similarly, 313 scrapings of elasticity strip brush are positioned at the frontier district of the laminar flow on the pump chamber inside surface 305c.
Case lid 306 and housing 305 form the pump case of centrifugal pump 300.Housing 305 is made by the material with high-termal conductivity and thermal diffusivity, i.e. making one of at least in copper, aldary, aluminium, the aluminium alloy.Case lid 306 can be made by identical materials.Alternatively, housing 305 can have mixed structure, and wherein its core is made by copper or aldary, and other parts are made by other material such as aluminum or aluminum alloy.The thickness of the centrifugal pump of the 3rd embodiment on rotor shaft direction is 8 to 12mm, and the feature radical length is 25 to 60mm, and rotating speed is 2,000 to 3, and 500rpm, flow are 0.1 to 0.5L/min, and lift is 0.2 to 0.8m.Described pump is defined as 5 to 20mm thickness, 10 to 70mm feature radical length, 0.05 to 1L/min flow, 0.1 to 2m lift.Therefore, described pump has 40 to 100 (m, m 3/ min, specific speed rpm), and more much smaller than traditional pump.
In centrifugal pump 300, impeller 301 and blade 302 are towards heat-generating electronic elements 400.The shape of heat-absorbent surface 305b is corresponding to the shape of heat-generating electronic elements 400 end faces.This structure allows pump chamber 305a directly to receive heat via heat-absorbent surface 305b.Stator 304 is installed on the case lid 306 by press fit.The inside surface of magnet rotor is towards the outer peripheral edge portion of stator 304.
Case lid 306 is arranged between stator 304 and the magnet rotor 303 as the separator that is used to separate stator and rotor.Like this, stator 304 is separated fully with the cooling medium stream of pump chamber 305a.According to the 3rd embodiment, impeller 301 and magnet rotor 303 are integrally formed by the stylolitic part of the impeller of magnetization formation magnet rotor 303.Yet, impeller and magnet rotor are separated.The rotating magnetic field that is produced by stator 304 is rotated magnet rotor 303, thereby impeller 301 is rotated.The rotation of impeller 301 produces negative pressure near impeller 301 centers.Negative pressure makes cooling medium suck the access road 309 that is communicated with impeller.Impeller 301 gives cooling medium with momentum, so that it is discharged into the outside.Cooling medium is discharged into the cooling circuit that is arranged on pump 300 outsides by the outlet port (not shown) in the outer peripheral edge portion that is arranged on impeller 301 by exit passageway 310.
The bearing of being made by low friction, wear resistant pottery 308 is press fit into the center of impeller 301.In bearing 308, stationary shaft 307 1 ends of being made by pottery are fixed to housing 305, and the other end is fixed to case lid 306.As shown in Figure 38, the part of the peripheral surface of cutting bearing 308 is to provide the gap of the bearing of press fit impeller 301 between axle and hole.The through hole 301a from axle center displacement is served as in the gap, and impeller 301 1 sides that blade 302 will be set are connected to the opposite side of the relative impeller of side therewith.The rear side that through hole 301a makes the part of the cooling medium that stands the centrifugal force that given by impeller 301 enter impeller 301.Cooling medium in the impeller rear side flows into inlet 309a by through hole 301a under negative pressure.In other words, the part of cooling medium is circulated in centrifugal pump 300.Coolant circulating is mixed and exchange mutually at inlet 309a place.
The centrifugal force that is produced by impeller 301 provides negative pressure near the center of impeller 301, thereby cavitation may take place in the place that produces bubble.Yet the centrifugal pump 300 of the 3rd embodiment has and is about 40 to 100 (m, m 3/ min, specific speed rpm), thus produce bubble hardly.Even produced bubble, also mix by circulation, thereby bubble is discharged owing to cooling medium.Owing to just exchange at the opposite side of impeller 301 with between the side of the 309a that enters the mouth, so bubble can not stay near impeller 301 centers in coolant circulating.Even when air mixes in cooling device and suck in the centrifugal pump 300, just prevent also that in coolant circulating air is positioned near impeller 301 centers, and discharge bubble gradually.As a result, in the pump of the 3rd embodiment, cavitation produces noise hardly, and does not form air layer.In addition, because turbulent flow forms a large amount of heats of cooling medium transmission.
Should be pointed out that the fluid bearing that can use as shown in Figure 40 replaces bearing 308.The dynamic pressure that fluid bearing can have spiralization thereon produces groove 308a, and described groove has improved the performance of discharging bubble.Dynamic pressure produces groove 308a can be herringbone or other shape.Impeller can have the groove that forms on its back side, be used to adjust internal circulating load and backside pressure.These grooves impeller 301 axially on produce thrust.
In addition, as shown in figure 41, a plurality of grooves 311 are formed at least a portion of the pump chamber inwall 305c on the heat-absorbent surface 305b back side that impeller 301 slides there.Groove separates the boundary layer of cooling medium stream, and in described boundary layer, the cooling medium mobile by the rotation of impeller 301 forms along pump chamber inwall 305c, thereby makes cooling medium that turbulent flow take place.This turbulent flow has increased the heat that is delivered to cooling medium from the surperficial 305b that absorbs heat.Similarly, it is coarse that pump chamber inwall 305c can form its surface by shot peening, blasting treatment, or can improve heat absorption efficiency according to other method of the principle of similitude.And as shown in figure 42, brush 302 or lamellar blade 313 not only are connected to blade 302, and are connected to the impeller with pump chamber inwall 305c sliding contact, the boundary layer that utilizes the revolving force of impeller 301 to break cooling medium stream, thus improve heat absorption efficiency.Though do not illustrate, the helicla flute that forms on pump chamber inwall 305c makes cooling medium form turbulent flow, and has increased the heat that transmits.
Compare fully greatly with the heat that is produced at the heat transfer factor from the housing to the cooling medium, and can transmit big calorimetric the time, heat needn't spread along pump chamber 305a.In this case, the thickness of the heat-absorbent surface 305b of housing 305 can be reduced,, thereby the pump attenuation can be made with the raising heat absorption efficiency.For this reason, access road 309 preferably has the plurality of stepped serrations of being similar to, and has minor axis on the thickness of shell direction, as shown in figure 43.In order to increase heat transfer area, and do not hinder impeller 301 and rotate, be provided with such as the little column that protrudes and the projection of rib at least a portion of the wall 305c that pump chamber inwall 305c can slide there in impeller 301 sides.Projection has increased heat transfer area, and allows cooling medium to form more turbulent flow, thereby improves caloric receptivity.Near the projection that forms heat-generating electronic elements 400 centers has improved heat absorption efficiency.If the center of heat-generating electronic elements be arranged on impeller 301 the axle center the projection can be arranged on impeller 301 the axle center near.
According to the 3rd embodiment, the cooling medium that the temperature of cooling off in the cooling circuit of pump 300 outsides is low is relatively roughly supplied with the middle body of centrifugal pump 300 by access road 309.This set provides large-area heat-absorbent surface 305b for pump chamber.And, because cooling medium is supplied with aforesaid pump chamber 305a, so the heat transferred that absorbs by large-area heat-absorbent surface 305b arrives cooling medium.Therefore, resulting cooling effectiveness is very high.
And access road 309 roughly is communicated with the middle body of centrifugal pump 300.The cooling medium of cooling is supplied with the middle body of centrifugal pump 300 at first substantially.Therefore, when centrifugal pump 300 was installed on the heat-generating electronic elements 400, the middle body that receives middle body and the temperature of centrifugal pump 300 of the cooling medium heat-generating electronic elements 400 higher than other parts was roughly relative.This set has improved the efficient of cooling heat-generating electronic elements 400.
As mentioned above, according to the 3rd embodiment, access road 309 is arranged between pump chamber 305a and the heat-absorbent surface 305b.Even when cooling medium is flowed through access road 309, this structure also allows cooling medium to absorb the heat that is received by heat-absorbent surface 305, thereby has further improved cooling effectiveness.
As mentioned above, the centrifugal pump 300 of the cooling device of the 3rd embodiment comprises the housing of being made by the material with high-termal conductivity 305 and is formed with the open type impeller 301 that opens wide blade 302 on it.The shape of the end face of heat-absorbent surface 305b and heat-generating electronic elements 400 is respectively a three-dimensional complementary each other.Access road 309 with elliptic cross-section (minor axis is on the thickness direction) is arranged between heat-absorbent surface 305b and the pump chamber inwall 305c (the thick portion of housing 305).This structure has reduced near the thickness of shell the passage, thereby has reduced near the temperature at the heat-absorbent surface 305b place the access road 309.Access road 309 does not protrude to heat-generating electronic elements 400, thereby the shape of heat-absorbent surface 305b is not subjected to the influence of the shape of centrifugal pump 300.Close contact between heat-absorbent surface 305b and the heat-generating electronic elements 400 makes heat-absorbent surface 305b can absorb heat effectively.
The 4th embodiment
Centrifugal pump according to the 4th one exemplary embodiment is characterised in that its water inlet is arranged on the back side of impeller.The element similar to the element among the 3rd embodiment is denoted by like references, and saves the detailed description to these elements.
Referring to Figure 44, the water inlet 309b that is communicated with access road 309 is arranged near the center of impeller 301, so that the back side of pump chamber 305a and side are communicated with.As shown in figure 45, water inlet 309b comprises three through holes that are arranged on the same radius place at impeller center with equal intervals.Access road 309 is arranged on the center of the stator 304 in the case lid 306, and is communicated with water inlet 309b.Stationary shaft 307 is provided with in the mode identical with the 3rd embodiment with bearing 308.
The water inlet 309b of present embodiment comprises three through holes with circular cross section with the fixed intervals setting.Yet the quantity in hole is not limited to three, and each all can have circle or square sectional in the hole, maybe can be configured as the groove with arc section.Consider the production of impeller, the quantity of through hole is preferably 30 or still less.Too many through hole or too big groove have weakened impeller self.For this reason, the quantity of through hole is preferably 30 or littler.Hole with flute profile equally preferably is arranged on around the axle with 180 degree or littler angle.
Because access road 309 is placed on the side relative with heat-absorbent surface 305b, so can reduce to be positioned at the thickness of pump case 305 of the side of heat-absorbent surface 305b.Like this, the heat transfer factor from housing 305 to cooling medium is compared fully big with the heat that is produced.If can transmit big calorimetric, then heat needn't transmit along pump chamber 305a, thereby can improve heat absorption efficiency.In addition, being arranged near the water inlet 309b in impeller 301 centers allows cooling medium to suck from the back side of impeller 301.
As shown in Figure 46 A and 46B, described pump can comprise the on-fixed axle, and sucks cooling medium from impeller 301 back sides.In Figure 46 A, stylolitic part 306b is arranged on case lid 306a center, and access road 309 is arranged in this part.Short rotating shaft 307a is arranged on impeller 301 centers.Bearing 308b is arranged among the stylolitic part 306b.Short rotating shaft 307b inserts bearing, to support described axle.Inlet 309c is included in the through hole that forms around the axle center of impeller 301.For example projection such as column or rib 314 be arranged on the pump chamber inwall 305c relative with the 309c that enters the mouth in (referring to Figure 47) in the heart.
According to the 4th embodiment, projection 314 is configured as column.Yet the shape of projection is not limited to column, also can be prism-shaped, taper, pyramid, truncated cone or truncated pyramid, hemisphere and semiellipse.In Figure 46 B, protruding 301c is arranged on the entrance side of blade 302 or between the blade 302.
As mentioned above, provide connection between the inlet access road 309 gone up overleaf of 309c and the pump chamber 305a.This set allows cooling medium to suck from the back side of impeller 301.Except cooling medium from the side relative with heat-generating electronic elements 400 sucks, directly provide heat absorption efficiently to the jet effect on the pump chamber inwall 305c with refrigerant injection.
In addition, the projection 314 that is arranged on the pump chamber inwall 305c has increased endotherm area, thereby has improved caloric receptivity significantly.Projection 314 can produce turbulent flow at pump chamber inwall 305c place, thereby has further improved heat absorption efficiency.Because blade 302 is not present in the middle body of impeller 301, so projection 314 can be easily positioned in this part.Consider balance, the center of heat-generating electronic elements 400 usually is arranged on impeller 301 centers.For this reason, heat absorption efficiency has been improved in projection 314 parts that are arranged in this part.In other words, the portion temperature that is positioned near the heat-generating electronic elements 400 impeller 301 centers that are used to suck cooling medium is the highest, and the temperature difference maximum between element and the cooling medium; Thereby, can improve heat transfer capacity.In addition, the projection 314 that is arranged in this part has increased heat transfer area, has reduced thermal resistance, thereby transmits heat.And the jet effect of cooling medium has improved heat absorption efficiency.Projection 314 allows cooling medium to produce turbulent flow, thereby has further improved heat absorption efficiency.The groove that forms in same section replaces projection 314 that similar effect is provided.
And as shown in Figure 46 B, projection 314 preferably is arranged on the entrance side of the blade 302 among the pump chamber 305a, and protruding 301c can preferably be arranged on the position that allows projection 314 and 301c radial engagement on the impeller 301.It is desirable to spiral protruding 301c is set.For fear of the actual contact between projection 314 and the 301c, projection 314 must move radially from protruding 301c, thereby they are relative, but whether is placed on the identical concentric circles.On the entrance side of blade 302, produce the turbulent flow of cooling medium by the stirring action of protruding 301c on the impeller 301 and projection 314 generations.And the dissipation of heat area that is increased by projection 314 has improved heat absorption efficiency significantly.According to experiment, with 3, the heat transfer coefficient that the rotating speed of 000rpm obtains is about 6,000W/m 2K, this moment, the heat of maximum can be dissipated to cooling medium from heat-absorbent surface 305b.
If heat-generating electronic elements 400 contacts the area that the area of pump chamber rotates less than blade 302 there, and the heat that is received must spread all over the side along pump chamber 305a, then compare with thin housing, the pump chamber inwall 305c with core of rising shown in Figure 48 helps to improve heat absorption efficiency.In Figure 48, for pump chamber inwall 305d, the thickness of housing 305 radially reduces from the axle center of impeller 301.Hot-fluid may flow in having the part of less thermal resistance.For example, such part has and is used to make big area of section that type of thermal communication crosses or bigger thermal conductivity.Therefore, on the pump chamber inwall 305d that thickness radially reduces, heat can propagate into the side along pump chamber 305a.
In each pump shown in Figure 46 A and the 46B, the groove with herringbone or other shape that forms on the outer peripheral surface of magnet the rotor 303 and surface of impeller 301 allows hydrodynamic to keep impeller 301.And impeller 301 is supported on the bearing 308b of the stylolitic part 306b among the case lid 306a rotationally and is arranged between the short rotating shaft 307a of center of impeller 301.Therefore, so simple structure can be guaranteed the steady and stable rotation of impeller 301, and promotes heat transmission.
The 5th embodiment
The centrifugal pump of the 5th one exemplary embodiment comprises plate-like impeller 301, and impeller 301 is magnetized.Particularly, referring to Figure 49, make the magnetization of impeller 301 back sides so that magnet 301b to be provided.Magnet 301b can be independent of impeller 301, and forms by disc-shaped magnet is linked to each other with impeller.And similar to third and fourth embodiment, in order to improve heat absorption efficiency, groove and column form at pump chamber wall 305c place.In addition, brush and blade can be arranged on the impeller 301, maybe can increase the thickness of housing middle body.
As mentioned above, the centrifugal pump 300 of the 5th embodiment is thinner in the axial direction.Therefore, centrifugal pump can be installed in the portable set that for example notebook computer etc. is little, so that allow to cool off effectively heat-generating electronic elements 400.
According to the 3rd to the 5th embodiment, preferably use centrifugal pump 300.Yet, can use the axial flow type impeller.As long as can obtain above-mentioned effect, also can use the impeller of other shape.
As Figure 13 to installation shown in Figure 37 according to the pump of the 3rd to the 5th embodiment.In other words, the pump shown in Figure 13 to Figure 37 can be replaced by the pump shown in the 3rd to the 5th embodiment.
According to the 3rd to the 5th embodiment, the area of bearing portions, for example, and the bearing portions 500 of Figure 38, promptly the area of the center of rotation of impeller 301 preferably only is 100mm 2If the area of bearing portions 500 surpasses 100mm 2, then pump chamber 305a is not placed in the middle position of centrifugal pump 300, it is optimal absorbing heat here.This has reduced cooling effectiveness.And more preferably, pump does not need to comprise bearing portions 500.Yet if pump needs bearing portions 500, the area of bearing portions 500 is because its intensity is preferably 0.5mm at least 2In this case, pump chamber 305c is present in around the bearing portions 500.
Commercial Application
Be used to make the pump of circulate coolant to have and the direct hot linked housing of electronic component.This has improved the cooling effectiveness of cooling device, and has realized the compact very thin design of device.

Claims (39)

1, a kind of cooling device that is used for electronic component comprises:
Cooling circuit;
Be used for pump by described circuit cycle cooling medium;
Heating radiator, this heating radiator are used for disperseing the heat of the cooling medium in described loop;
Wherein said pump directly is connected with described electronic component, is used for setting up thermo-contact between the housing of described pump and described electronic component.
2, cooling device according to claim 1, wherein said pump is a centrifugal pump, this centrifugal pump has the surfaces of revolution of the heat-absorbent surface that is parallel to described housing, from the heat-absorbent surface of the described housing of heat transferred of described electronic component.
3, cooling device according to claim 2, wherein said heat-absorbent surface is provided with auxiliary heat-conducting piece.
4, cooling device according to claim 3, wherein said auxiliary heat-conducting piece is a flat part, and a surface of this flat part becomes matching relationship with described heat-absorbent surface, and its another face becomes matching relationship with the surface of contact of described electronic component.
5, cooling device according to claim 3, wherein said pump comprise pump chamber in it, and wherein said auxiliary heat-conducting piece is arranged on the copper sheet on the described housing side that described pump chamber extends.
6, cooling device according to claim 1, wherein, silicone grease is coated on the surface of contact between described housing and the described electronic component.
7, cooling device according to claim 3, wherein, silicone grease is coated on the described auxiliary heat-conducting piece.
8, cooling device according to claim 2, wherein said pump is a vortex pump.
9, cooling device according to claim 8,
Wherein said pump comprises the ring-type impeller, and this ring-type impeller is formed with a plurality of trough of belt blades in its neighboring and week is provided with rotor magnet within it; Be arranged on the motor rotor in interior week of described rotor magnet; And place stylolitic part between described motor rotor and the described stator magnet,
Wherein said housing holds described impeller within it, have ingress port and outlet port, and wherein said stylolitic part rotatably supports described ring-type impeller.
10, cooling device according to claim 1, wherein said housing directly is connected with described electronic component on its whole surface relative with described electronic component.
11, cooling device according to claim 10, wherein, the whole surface of the described housing relative with described electronic component is formed in the plane.
12, cooling device according to claim 9, wherein, the described motor stator that is arranged in the described stylolitic part forms by the pattern-making material with high-termal conductivity is molded.
13, cooling device according to claim 5, the surfaceness of wherein said pump chamber increases.
14, cooling device according to claim 9, wherein said stylolitic part is provided with the radial dynamic pressure generation device in its lip-deep position of the auxiliary phase offside that acts on the radial thrust direction on the described ring-type impeller.
15, a kind of electronic equipment comprises: be used to hold first housing of electronic circuit, this electronic circuit comprises that CPU (central processing unit) and memory storage and its end face are provided with keyboard; And second housing, this second housing comprises the display unit of the result that is used to show that described CPU (central processing unit) provides, described second housing is rotatably mounted to described first housing, described equipment also comprises cooling device as claimed in claim 1, is used to cool off the electronic component that comprises described central processing unit.
16, electronic equipment according to claim 15, wherein said pump lean against on the end face of described CPU (central processing unit), and its heat-absorbent surface contacts the end face of described CPU (central processing unit), and wherein said heating radiator is arranged on the back side of the display unit in described second housing.
17, a kind of cooling device that is used for electronic equipment comprises:
Pump is used for by the cooling circuit circulating coolant; And
Heating radiator is used for disperseing the heat of the cooling medium of described cooling circuit,
Wherein said pump contacts with described electronic component, is used for setting up thermo-contact between the housing of described pump and described electronic component, and wherein said cooling circuit is arranged in the zone that is different from the space between described pump and the described electronic component.
18, a kind of cooling device that is used for electronic component, comprise: be suitable for being connected the pump that is used for by cooling circuit suction heat eliminating medium with heating radiator, described pump comprises the pump case that is used to hold described pump, described pump case comprise have high-termal conductivity, be suitable for and the direct hot linked heat-conducting part of heater element.
19, cooling device according to claim 18, one of them makes wherein said heat-conducting part by aluminium, copper and stainless steel.
20, cooling device according to claim 18, described pump comprise the ring-type impeller that is arranged in described pump case, and the part of wherein said cooling circuit is around the outer peripheral portion of described ring-type impeller.
21, cooling device according to claim 20, wherein, with heat eliminating medium on the direction of heat transfer of described heat-conducting part opposite direction the adverse current of described ring-type impeller construction for the described part of the feasible described cooling circuit of flowing through.
22, cooling device according to claim 1, wherein said pump comprises pump chamber, this pump chamber is used for partly receiving described cooling medium by the substantial middle of described pump.
23, cooling device according to claim 22 also comprises:
Be used for described cooling medium is imported the access road of described pump chamber,
Wherein said housing has the heat-absorbent surface that contacts with described electronic component, and
Wherein said access road is arranged between described heat-absorbent surface and the described pump chamber.
24, cooling device according to claim 24, the cross section of wherein said access road define a longitudinal axis, and the described longitudinal axis in described cross section is parallel to described heat-absorbent surface and extends.
25, cooling device according to claim 22 also comprises:
Be used for described cooling medium is imported the access road of described pump chamber,
Wherein said housing has the heat-absorbent surface that contacts with described electronic component, and
Wherein said access road is arranged on crosses a described pump chamber side relative with described heat exchange surface.
26, cooling device according to claim 25, wherein said pump also comprise the rotatable impeller that is arranged in the described pump chamber and has the through hole that is formed on wherein.
27, cooling device according to claim 1,
Wherein said pump also comprises having the pump chamber that is formed on the groove in its inwall,
Wherein said housing has the heat-absorbent surface that contacts with described electronic component, and
Wherein said groove is arranged on the described inwall in the part relative with described heat-absorbent surface.
28, cooling device according to claim 1,
Wherein said housing has the heat-absorbent surface that contacts with described electronic component, and
Wherein said pump comprises:
Pump chamber, and
Impeller, this impeller are arranged in the described pump chamber and on its surface relative with described heat-absorbent surface has first projection.
29, cooling device according to claim 28, wherein said pump also comprise second projection that is arranged on the described pump chamber inwall relative with described heat-absorbent surface.
30, cooling device according to claim 29, wherein, when the rotation of described impeller, described first does not contact each other with described second projection.
31, cooling device according to claim 1,
Wherein said housing has the heat-absorbent surface that contacts with described electronic component,
Wherein said pump comprises:
Pump chamber, and
Be arranged on first projection on the inwall of the described pump chamber relative with described heat-absorbent surface.
32, cooling device according to claim 31,
Wherein said pump also comprises the rotatable impeller that is arranged in the described pump chamber, and
Wherein said first projection centers on the turning axle setting of the described impeller on the described pump chamber inwall.
33, cooling device according to claim 31 wherein, is provided with groove in the inwall of described pump chamber.
34, cooling device according to claim 33, wherein said first projection are arranged in the middle body of inwall of described pump chamber, and
Wherein said groove is arranged on the inwall of described pump chamber around described first projection.
35, cooling device according to claim 1,
Wherein said pump comprises the rotatable impeller in it, and
Wherein said cooling medium flows near the rotation center of described impeller or its.
36, cooling device according to claim 1,
Wherein said housing has the heat-absorbent surface that contacts with described electronic component, and
Wherein said pump comprises:
Pump chamber,
Be arranged in the described pump chamber and have the rotatable impeller of turning axle, and
Bearing portions, this bearing portions are arranged on the turning axle that is positioned at described heat-absorbent surface one side in the described pump chamber and supports described impeller.
37, cooling device according to claim 36, the area of wherein said bearing portions is not more than 100mm 2
38, cooling device according to claim 1,
Wherein said housing has the heat-absorbent surface that contacts with described electronic component,
Wherein said pump comprises:
The pump chamber that holds cooling medium, and
Be arranged on the rotatable impeller in the described pump chamber, and
Thickness between wherein said heat-absorbent surface and the described pump chamber increases in the direction from thoughtful its rotation center of described impeller outer.
39, cooling device according to claim 1,
Wherein said housing has the heat-absorbent surface that contacts with described electronic component,
Wherein said pump comprises:
The pump chamber that holds described cooling medium, and
Be arranged on the rotatable impeller in the described pump chamber, and
Be arranged on the blade that is positioned at described heat-absorbent surface one side on the described impeller.
CNB038109298A 2002-05-15 2003-05-12 A liquid cooling device for a notebook computer Expired - Lifetime CN100347636C (en)

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JP2002139598 2002-05-15
JP2003007168A JP3431024B1 (en) 2003-01-15 2003-01-15 Cooling system
JP007168/2003 2003-01-15

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