JP3452059B1 - Cooling device and electronic equipment equipped with it - Google Patents

Abstract

An object of the present invention is to reduce the size while improving the cooling efficiency.
It is an object of the present invention to provide a low-cost cooling device that can be reduced in thickness and has a simple structure, and an electronic device including the same. SOLUTION: In the cooling device of the present invention and the electronic equipment provided with the same, the contact heat exchange type pump 7 is brought into contact with the heat generating electronic component 3 to remove heat from the heat generating electronic component 3 by the heat exchange action of the internal refrigerant. A cooling device for radiating heat from the radiator 8, wherein a pump casing 15 of the contact heat exchange type pump 7 is formed of a material having a high thermal conductivity, and the pump casing 15 has a side surface along an internal pump chamber 15b. Heat receiving surface 15a
Is formed, and the heat receiving surface 15a is formed in a shape complementary to the three-dimensional shape of the upper surface of the heat generating electronic component 3 at the contact position.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for electronic equipment, which cools heat-generating electronic parts such as a central processing unit (hereinafter, CPU) arranged inside a casing by circulating a coolant.
The present invention relates to an electronic device equipped with it.

[0002]

2. Description of the Related Art The recent trend toward higher speeds in computers has been extremely rapid, and the clock frequency of CPUs has become significantly greater than before. As a result, the amount of heat generated by the CPU is increased, and the capacity is insufficient only by air-cooling with a heat sink as in the conventional case, and a cooling device with high efficiency and high output is essential. Therefore, as such a cooling device, a cooling device has been proposed which cools a substrate on which heat-generating electronic components are mounted by circulating a coolant (Patent Document 1,
See Patent Document 2).

A conventional cooling device for electronic equipment which circulates and cools such a refrigerant will be described below. In addition,
In the present specification, the electronic device mainly refers to a device that loads a program into a CPU or the like to perform processing, and in particular, a small portable device such as a laptop computer.
In addition, it includes a device equipped with heat-generating electronic components that generate heat when energized. This conventional first cooling device,
For example, the one shown in FIG. 10 is known. Figure 10
FIG. 3 is a configuration diagram of a first cooling device of a conventional electronic device. Figure 1
0, 100 is a housing, 101 is a heat-generating electronic component, 102 is a substrate on which the heat-generating electronic component 101 is mounted, 10
3 is a cooler that cools the heat-generating electronic component 101 by exchanging heat between the heat-generating electronic component 101 and the coolant, 104 is a radiator that removes heat from the coolant, 105 is a pump that circulates the coolant, and 106 is connecting them. Piping, 107 is a radiator 1
It is a fan that air-cools 04.

The operation of the conventional first cooling device will be described. The refrigerant discharged from the pump 105 is sent to the cooler 103 through the pipe 106. Heat generating electronic component 1
By taking away the heat of 01, its temperature rises and the radiator 104
Sent to. In the radiator 104, the temperature is lowered by being forcedly cooled by the fan 107, and the temperature returns to the pump 105 again to repeat this. Thus, the heat-generating electronic component 101 is cooled by circulating the refrigerant.

Next, as a conventional second cooling device for electronic equipment, the one shown in FIG. 11 has been proposed (see Patent Document 3).

This second cooling device cools the heat generating member by efficiently transporting the heat generated by the heat generating member to the wall of the metal casing, which is a heat radiating portion, when the heat generating member is mounted in a narrow casing. FIG. 11 is a configuration diagram of a second cooling device for a conventional electronic device. In FIG. 11, 108 is a wiring board of an electronic device, 109 is a keyboard, 110 is a semiconductor heating element, and 1 is a semiconductor heating element.
11 is a disk device, 112 is a display device, 113 is a heat receiving header for exchanging heat with the semiconductor heating element 110, 11
Reference numeral 4 is a heat dissipation header for heat dissipation, 115 is a flexible tube, and 116 is a metal housing of an electronic device.

In this second cooling device, the semiconductor heating element 110, which is a heating member, and the metal casing 116 are thermally connected by a heat transport device having a flexible structure.
This heat transport device includes a flat heat receiving header 113 having a liquid flow path attached to a semiconductor heating element 110, and a heat radiating header 11 having a liquid flow path and brought into contact with the wall of a metal casing 116.
4. Flexible tube 115 that connects both
The liquid sealed inside is driven or circulated between the heat receiving header 113 and the heat radiating header 114 by the liquid driving mechanism built in the heat radiating header 114. As a result, the semiconductor heating element 110 and the metal housing 116 can be easily connected without being influenced by the arrangement of parts, and heat is transported with high efficiency by driving the liquid. In the heat dissipation header 114, the heat dissipation header 114 and the metal housing 11
Since 6 and 6 are thermally connected, the heat is widely diffused to the metal housing 116 due to the high thermal conductivity of the metal housing 116.

Further, a pump with a heat exchange function capable of internally exchanging heat has also been proposed (see, for example, Patent Document 4).

FIG. 12 is a partially broken perspective view of a conventional pump having a heat exchange function. In FIG. 12, 120 is a motor, 121 is a heat exchanger, 122 is a cooling water channel, 122a is a discharge port, 122b is a suction port, 123 is a centrifugal pump, 12
4 is a casing and 125 is an impeller.

The centrifugal pump 123 is provided with a suction port 124b in the center of a volute type casing 124 and a discharge port 124a in the outer tangential direction. An impeller 125 is provided inside the casing 124.
Is connected to the motor 120. Impeller 12
The cooling water passages 122 of the heat exchanger 121 are accommodated in a zigzag shape on the entire outer periphery of the heat exchanger 5.

The operation of such a conventional pump having a heat exchange function will be described. When the impeller 125 is rotated by the motor 120, the refrigerant A heated on the device side is sucked into the suction port 12.
4b enters the inside of the casing 124, and the casing 12
4 is swirled inside and discharged from the outer discharge port 124a. At this time, since the inside and outside of the casing 124 are in a turbulent state at a high pressure, the refrigerant A violently contacts the cooling water passage 122 and is cooled by the cooling water B flowing in the cooling water passage 122. In this way, the refrigerant A is pressure-fed to the device side while being cooled by the centrifugal pump 123.

[0012]

[Patent Document 1] Japanese Unexamined Patent Publication No. 5-264139

[Patent Document 2] Japanese Unexamined Patent Publication No. 8-32263

[Patent Document 3] Japanese Unexamined Patent Publication No. 7-142886

[Patent Document 4] Japanese Utility Model Laid-Open No. 2-147900

[0013]

However, in the first conventional cooling device, the cooler 10 that cools the heat-generating electronic component 101 by exchanging heat between the heat-generating electronic component 101 and the refrigerant.
3. A radiator 104 for removing heat from the refrigerant, a pump 105 for circulating the refrigerant, and a tank for replenishing the refrigerant (not shown) are required to replenish the refrigerant, and a replenishment tank is required. Difficult to miniaturize,
There was a problem that the cost would be high. That is, the conventional first cooling device is originally suitable for cooling a large electronic device, is small, lightweight, and thin, and is a recent high-performance portable notebook computer that is carried and used in various postures. It was not possible to deal with such problems.

Further, the second conventional cooling device can be used for a notebook type personal computer and the like, but the flat heat receiving header 113 attached to the semiconductor heating element 110 is also brought into contact with the wall of the metal casing 116. All the heat dissipation headers 114 are inevitably box-shaped and thick, which hinders the thinning of notebook personal computers and the like. That is, in the second conventional cooling device, a reciprocating pump having a relatively smaller width than other pumps is provided in the heat dissipation header 114 as a liquid driving device. Unfortunately, this reciprocating pump is a heat dissipation header. The thickness of 114 is specified to make the whole thicker. This cannot reduce the thickness of the notebook computer.

However, it is difficult to accommodate the reciprocating pump of the second cooling device in the heat receiving header 113 with a thin notebook personal computer. That is, in addition to the thickness of the pump, the thickness of the semiconductor heating element 110 and the like is added to increase the height of the notebook type personal computer, which goes against the reduction in thickness. In addition, the vibration and noise of the reciprocating pump may affect the semiconductor heating element 110 on which it is mounted and may be offensive to the ears.

Further, in the second cooling device, the heat dissipation header 114 brought into contact with the wall of the metal housing 116 has a small heat dissipation area and poor heat transfer efficiency, and has a limit in cooling power. It is conceivable to increase the heat dissipation area in order to increase the cooling power, but if the area is further increased, the flow path becomes longer and the circulation amount increases, leading to an increase in the output of the built-in reciprocating pump, which causes the heat dissipation header 114. There was a contradiction of increasing the thickness of the. Therefore, if a means of separately storing the reciprocating pump in the metal casing 116 is taken, a new space must be allocated to the notebook computer main body in which the wasted space is reduced to the limit, and the assembling work is also required. It becomes troublesome. As described above, the second cooling device has a limit to downsizing and thinning of a notebook computer or the like. Then, when the CPU capacity has been improved and more and more cooling capacity is required recently, the conventional second cooling device having such a problem still has doubts about the future.

Further, in the conventional pump with heat exchange function, since the refrigerant is cooled by another cooling water, a cooling water passage is required in the pump, the size is increased, the pump structure is complicated, and the cooling water is circulated. The second that draws heat from the second pump and cooling water
Since the heat exchanger of No. 1 is required, the system is complicated and downsizing is difficult, and the number of parts and workability are poor. Therefore, there is a problem that good thermal efficiency cannot be expected and cost is high.

Therefore, an object of the present invention is to provide a cooling device which can be made compact and thin while improving cooling efficiency, has a simple structure and is low in cost.

Another object of the present invention is to provide an electronic device which can be made compact and thin, has a simple structure and is low in cost.

[0020]

In order to solve this problem, in the cooling device of the present invention, a contact heat exchange type pump is brought into contact with a heat-generating electronic component and heat is generated from the heat-generating electronic component by heat exchange action of a refrigerant inside. It is a cooling device that takes away heat from the radiator and radiates heat from the radiator, and the pump casing of the contact heat exchange type pump is formed of a material with high thermal conductivity, and the pump casing receives heat on the side surface along the internal pump chamber. The surface is formed,
It is characterized in that the heat receiving surface is formed in a shape complementary to the three-dimensional shape of the upper surface of the heat-generating electronic component at the contact position.

As a result, the cooling device can be made smaller and thinner while improving the cooling efficiency, and a cooling device having a simple structure and low cost can be realized.

Further, the electronic equipment of the present invention comprises a first housing in which an electronic circuit including a central processing unit and a storage device are housed and a keyboard is provided on the upper surface, and a second housing in which a display device is provided. , The second housing is rotatably attached to the first housing,
The cooling device described above is provided for cooling the heat-generating electronic components including the central processing unit.

As a result, it is possible to provide an electronic device which can be made compact and thin, has a simple structure, and is low in cost.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION The invention according to claim 1 of the present invention is provided with a pipe, which constitutes a closed circuit for circulating a refrigerant, a radiator, and a contact heat exchange type pump, which are connected to each other. The mold pump is brought into contact with the heat-generating electronic components to remove heat from the heat-generating electronic components by the heat exchange action of the internal refrigerant and to circulate the refrigerant.
A cooling device that circulates and radiates heat from the radiator,
A pump casing of the contact heat exchange type pump is formed of a material having high thermal conductivity, and a heat receiving surface is formed on a side surface of the pump casing along an internal pump chamber, and the heat receiving surface is located at a contact position. Since the cooling device is characterized by being formed in a shape complementary to the three-dimensional shape of the upper surface of the heat-generating electronic component, the contact heat exchange type pump can also function as a cooler. It enables downsizing and cost reduction.

The invention according to claim 2 of the present invention is characterized in that an auxiliary heat conducting member is provided on the heat receiving surface.
According to the cooling device of the first aspect, heat transfer can be promoted by way of the auxiliary heat conduction member made of a material having a higher heat conductivity than the pump casing.

According to a third aspect of the present invention, the auxiliary heat conducting member is a plate-like member in which the upper surface shape and the lower surface of the heat generating member match and the shape of the heat receiving surface matches the upper surface at the contact position. According to the cooling device of the second aspect, the heat transfer can be promoted through the auxiliary heat conducting member which is a plate-shaped body having a higher heat conductivity than the pump casing.

In the invention according to claim 4 of the present invention, the auxiliary heat conducting member is a heat pipe provided on a side surface of the pump casing along the pump chamber. Therefore, the heat transfer can be promoted by the heat pipe.

In the invention according to claim 5 of the present invention, the contact heat exchange type pump is a vortex flow pump. Therefore, the impeller has a thickness of A thin, heat-receiving surface is formed on the side surface that follows the pump flow, and the heat transferred to the outside centering on the heat-generating electronic components can be effectively cooled by turbulent heat exchange with the flow around the impeller, and cooling efficiency It is possible to reduce the size and cost of the cooling device while improving the above.

The invention according to claim 6 of the present invention is a contact heat exchange type pump, in which a large number of grooved blades are formed on the outer periphery,
A ring-shaped impeller having a rotor magnet provided on the inner circumference, a motor stator provided on the inner circumference side of the rotor magnet, and a cylindrical portion arranged between the motor stator and the rotor magnet are formed, and the blade is provided. The cooling device according to claim 5, further comprising: a pump casing having a suction port and a discharge port for accommodating the vehicle therein, wherein the cylindrical portion is a swirl pump rotatably supporting a ring-shaped impeller. Therefore, the motor part of the contact heat exchange type pump does not form a protruding part with respect to the heat receiving surface and it can be made as an ultra-thin pump, and the heat transferred is violently turbulent heat with the refrigerant on the outer circumference of the impeller. Since they are replaced, it is possible to further reduce the thickness and cost of the cooling device while improving the cooling efficiency.

The invention according to claim 7 of the present invention is the heat receiving surface.
Is a plane, The method according to claim 1, wherein
Since the cooling device is described in, the heat receiving surface has a flat upper surface.
It can be mounted on any substrate.

The invention according to claim 8 of the present invention is the cylindrical portion.
The motor stator installed inside the
7. Molded with a non-molding material.
To the cooling device according to any one of
By molding with a material, it also promotes heat transfer
In addition, the motor stator can be completely waterproof
It

The invention according to claim 9 of the present invention is a pump.
7. The surface roughness of the room is roughened.
Since it is the cooling device according to any one of to 8
By exchanging, heat transfer can be promoted.

The invention according to claim 10 of the present invention is a cylinder
The portion of the radial thrust acting on the ring-shaped impeller is
Radial dynamic pressure generating means on the surface opposite to the direction and axis
10. The method according to claim 6, further comprising:
Since it is the cooling device described in, the ring-shaped impeller can be smoothly
Can rotate.

The invention according to claim 11 of the present invention is the contact
The heat exchange type pump has a thickness of 3 to 15 mm, and is a radial representative
A dimension of 10 to 70 mm.
Since it is the cooling device according to any one of 10 to 10,
It is possible to reduce the size and thickness while improving the rate.

According to a twelfth aspect of the present invention, a first housing having an electronic circuit including a central processing unit and a storage device and having a keyboard provided on an upper surface, and a processing result by the central processing unit are displayed. A second housing having a display device capable of controlling the heat generation electronic component including a central processing unit, the second housing being rotatably attached to the first housing. For this reason, the electronic device is characterized by being provided with the cooling device according to any one of claims 1 to 11.
By cooling the electronic device having the first housing having the keyboard and the second housing having the display device, the size of the electronic device main body can be further reduced.

According to a thirteenth aspect of the present invention, the contact heat exchange type pump is installed with the heat receiving surface in contact with the upper surface of the central processing unit, and the radiator is disposed on the rear surface of the display device in the second housing. The electronic device according to claim 12, wherein the contact heat exchange type pump is disposed in the first housing,
By disposing the radiator in the second housing, the electronic device body can be further downsized.

FIG. 1 shows the embodiment of the present invention.
9 to 9 will be described. In addition, in these drawings, the same members are denoted by the same reference numerals, and duplicate description is omitted.

(Embodiment 1) In the cooling device and the electronic equipment equipped with the same in the embodiment 1, the contact heat exchange type pump and the radiator are flexible and allow the rotation of the second housing and the first housing. It is connected by piping. The electronic device is a foldable device such as a laptop computer. 1 is an overall configuration diagram of an electronic device incorporating a cooling device according to Embodiment 1 of the present invention, FIG. 2 is a sectional view of a contact heat exchange type pump according to Embodiment 1 of the present invention, and FIG. 3 is implementation of the present invention. FIG. 4 is an exploded perspective view of the contact heat exchange type pump according to the first embodiment, and FIG. 4 is a cross-sectional view of essential parts showing a flow of the refrigerant in the contact heat exchange type pump according to the first embodiment of the present invention.

In FIG. 1, reference numeral 1 is a first housing of a notebook computer or the like, 2 is a keyboard provided on the upper surface of the first housing 1, and 3 is heat generated by a CPU or the like housed in the first housing 1. An electronic component, 4 is a substrate on which the heat-generating electronic component 3 is mounted, 5 is a second casing that serves as a cover of the first casing 1, and 6 is a calculation processing result by a CPU provided on the inner surface side of the second casing 5. A display device for displaying, 7 is a contact heat exchange type pump that is in close contact with the heat-generating electronic component 3 and exchanges heat with the heat-generating electronic component 3 to cool the heat-generating electronic component 3 and circulates the coolant X, and 8 is a display device. A radiator disposed on the back surface of 6 for removing heat from the refrigerant X,
Reference numeral 8a is a refrigerant passage meandering repeatedly, 8b is a reserve tank for replenishing the refrigerant X, and 9 is a pipe connecting these. As the refrigerant X, a harmless propylene glycol aqueous solution used for food additives and the like is suitable, and when aluminum or copper is used as a casing material as described later, it improves anticorrosion performance against them. It is desirable to add an anticorrosion additive for the purpose.

Since the radiator 8 needs to remove heat from the refrigerant X in a narrow and wide space on the back surface of the display device 6, it has a high thermal conductivity and a good heat dissipation property, for example, a thin plate material such as copper or aluminum. As shown in FIG. 1, a refrigerant passage 8a and a reserve tank 8b are formed inside.
A fan may be provided to forcibly apply air to the radiator 8 to cool it and increase the cooling effect. The pipe 9 is made of a flexible rubber tube having a low gas permeability, for example, a rubber tube such as butyl rubber in order to ensure the flexibility of the layout of the pipe. This is to prevent air bubbles from entering the tube.

Next, the structure of the contact heat exchange type pump 7 will be described. The contact heat exchange type pump 7 of the first embodiment uses a vortex flow pump (also referred to as a Wesco type pump, a regeneration pump, or a friction pump). In FIGS. 2 and 3, 11
Is a ring-shaped impeller of the vortex pump, 12 is a groove-shaped blade of the ring-shaped impeller 11 formed on the outer circumference, and 13 is a rotor magnet provided on the inner circumference of the ring-shaped impeller 11. Reference numeral 14 is a motor stator provided on the inner peripheral side of the rotor magnet 13, and 15 is a pump that accommodates the ring-shaped impeller 11 and at the same time recovers the kinetic energy given to the fluid by the ring-shaped impeller 11 to the discharge port. A casing 15a is a heat receiving surface that contacts the heat-generating electronic component 3 to remove heat, 15b is a pump chamber for recovering pressure of the kinetic energy given by the blades 12 and guiding it to the discharge port, and 16 is one of the pump casing 15. A casing cover that seals the pump chamber 15b after forming the ring-shaped impeller 11 and housing the ring-shaped impeller 11 is provided on the pump casing 15 and is a cylindrical portion that rotatably supports the ring-shaped impeller 11. . The contact heat exchange type pump 7 according to the first embodiment has a thickness of 5 to 10 mm in the rotation axis direction, a representative dimension of 40 to 50 mm in the radial direction, a rotation speed of 1200 rpm, and a flow rate of 0.
08-0.12 L / min, head 0.35-0.45 m
It is a pump of a degree. The specifications of the pump of the present invention include the values of the first embodiment, and the thickness is 3 to 15 mm,
Radial representative dimension 10-70 mm, flow rate 0.01-
The head is about 0.5 L / min and the head is about 0.1 to 2 m.
In terms of specific speed, this is 24-28 (unit: m, m ³ /
Min., Rpm), which is a small and thin pump completely isolated from conventional pumps.

Conventionally, a pump for exchanging heat by bringing its side surfaces into contact with each other has a poor heat transfer efficiency, and its heat exchanging function has not been the subject of consideration. Further, since it is difficult to form a flat side surface with a pump, it has been considered impossible to put a thin pump having a flat heat receiving surface into practical use. However, the present inventors pay attention to the vortex flow pump, and by adding the improvements described in detail below, if the heat transferred from the heat-generating electronic component 3 is turbulently heat-exchanged around the vortex flow pump, the heat exchange function becomes sufficient. The fact that a flat heat receiving surface can be realized by arranging a part of the driving unit with the impeller and arranging the whole in a flat plate shape has been reached. Further, at this time, when considering the area of the heat receiving surface with respect to the flow rate and the amount of heat transfer with respect to the flow rate, this small and thin pump can have a sufficient value for cooling, unlike a pump of a normal size.

That is, the flow in the pump casing 15 of the contact heat exchange type pump 7 is a spiral flow peculiar to the vortex flow type due to the stirring of the blades 12, and macroscopically a ring-shaped pump chamber 15b. Flowing along. The heat transferred from the heat source to the outside by this flow is taken away at the outer peripheral portion of the ring-shaped impeller 11 (microscopically, while partially countercurrent to the heat transfer direction as shown in FIG. 4). It is possible to function as a heat exchanger without separately providing it. However, it is possible to install an auxiliary cooler to increase the cooling power. Further, the rotor magnet 13 has a ring-shaped impeller 1
Since it is integrated with 1 to form a ring shape and is axially supported by the cylindrical portion 17, the inertial mass of the ring-shaped impeller 11 can be reduced, thereby suppressing the heat generation amount of the drive portion and the contact heat exchange type pump. 7 can be made small, thin, and lightweight. Then, in order to promote heat transfer, the pump casing 15
For the casing cover 16, it is necessary to select a material having high thermal conductivity such as copper or aluminum. Then, basically, it is suitable to use a metal material having a high thermal conductivity such as copper or aluminum, but a resin having a high thermal conductivity may be used where the influence on the thermal conductivity is small. When aluminum is selected as the material of the pump casing 15 in order to reduce the weight, a copper plate having a higher thermal conductivity than aluminum is used for the pump casing 15.
It is better to attach it to the underside of. Further, if a heat pipe is further attached to the lower surface (heat receiving surface side 15a) of the pump casing 15 or embedded in a part thereof, the received heat can be more efficiently transferred to the outer peripheral portion of the ring-shaped impeller 11 of the pump casing 15. Can be transmitted. The copper plate and the heat pipe are the auxiliary heat conducting member of the present invention.
In addition to attaching the plate material, the auxiliary heat conducting member may be formed by melting the rod-shaped copper material by friction welding and cutting the unnecessary portion. Further, it is also preferable that the pump casing 15 and the casing cover 16 have fin-shaped irregularities on the outer surface to positively exchange heat with the outside air.

Further, in the contact heat exchange type pump 7, the heat receiving surface 15a of the pump casing 15 can be made completely flat. That is, the pump casing 1
The side surface of 5 is aligned between the side surface of the pump chamber 15b and the side surface of the motor stator 14, and the motor stator 14 is housed in the recess in the cylindrical portion 17 to planarize the heat receiving surface 15a of the contact heat exchange type pump 7. Heating electronic components 3
You can make a close contact (usually the top is flat). When the upper shape of the heat-generating electronic component 3 has irregularities, the thickness can be changed so that the shapes match and the contacts can be made without a gap. It is preferable to interpose an adhesive resin or rubber having high thermal conductivity between the heat receiving surface 15a and the upper shape of the heat-generating electronic component 3 as in the case of the above-mentioned copper plate, and fix the heat transfer efficiency as much as possible without lowering the heat transfer efficiency. In addition,
Matching the upper shape of the heat-generating electronic component 3 here means giving a shape complementary to the three-dimensional shape of the upper surface of the heat-generating electronic component 3 to the heat-receiving surface 15a, and the shape of the heat-generating electronic component 3 is set. That is, the curved surfaces are matched so that they can be placed. In many cases, there is a difference between the size and shape of the heat-generating electronic component 3 such as a CPU and the size and shape of the heat receiving surface 15a (the contact heat exchange type pump 7 of the present invention is very small,
Normally, the heat-generating electronic component 3 has a larger size, and the contact heat exchange pump 7 of the present invention can adopt various shapes, but the shape is usually a quadrangle. ), The curved surfaces match at least at the mounting position (contact position). Further, in order to effectively carry out heat transfer, it is necessary not to form an air layer between the heat receiving surface 15a and the heat-generating electronic component 3, and the following is not preferable, but, for example, one is small. This includes the case where a recess is formed.

In the case of the first embodiment of the present invention, the motor stator 14 is the cylindrical portion 1 of the pump casing 15.
The heat is transferred by being accommodated in the central hollow portion formed by 7, and the other side is opened to the atmosphere and radiated to the outside air. Therefore, since the heat generated from the drive unit is originally small and is also radiated to the outside air, the contact heat exchange type pump 7 can exclusively cool the heat-generating electronic component 3. But,
In order to cool the heat-generating electronic component 3, it is better to avoid placing the heat-generating electronic component 3 such as a CPU near the motor stator 14 that generates heat. That is, depending on the size of the heat generating electronic component 3 and the size of the heat receiving surface 15a, the heat transfer rate varies depending on where the heat generating electronic component 3 is arranged. Since the heat of the motor is generated, the heat receiving efficiency is higher in the heat receiving surface 15a, on the side surfaces sandwiching the wall of the pump chamber 15b, or in the vicinity thereof, or in the heat receiving surface 15a, the portions closer to the suction port 19 and the discharge port 20. . Particularly, it is most effective for heat dissipation to dispose the center of the heat-generating electronic component 3 in a region surrounded by the suction port 19, the discharge port 20, and the pump chamber 15b within the heat receiving surface 15a.

Further, if the recessed portion in which the motor stator 14 is housed is molded with silicon resin or urethane resin having high thermal conductivity, even if heat is generated in the motor stator 14, the pump chamber 15b passes through this molded portion.
Heat transfer occurs to. In addition, the heat of the heat-generating electronic component 3 received from the heat receiving surface 15a is transferred from the mold portion to the pump chamber 15
It can be transmitted to the refrigerant X in b. Thereby, the heat transfer rate can be further increased. When the motor stator 14 including windings is molded with a molding material as described above, not only the heat dissipation from the heat-generating electronic component 3 is promoted, but also the winding portion through which electricity passes is completely waterproofed.
It is possible to take thorough measures against water leakage of the motor stator 14.

Further, the contact heat exchange type pump 7 of the first embodiment suppresses the axial and radial thrusts which are hydrodynamically generated in order to continue smooth operation for a long time, and rotates without contact. be able to. 2 and 3, 1
Reference numeral 8 is a thrust plate, 19 is a suction port, and 20 is a discharge port.
22 is a thrust dynamic pressure generating groove having spiral groove patterns formed on both side surfaces of the ring-shaped impeller 11, and 23 is a herringbone groove pattern similarly formed on the inner peripheral surface of the ring-shaped impeller 11. It is a radial dynamic pressure generating groove that it has.

In the vortex flow pump, the pressure in the vicinity of the discharge port 20 is larger than the pressure in the vicinity of the suction port 19, and the radial thrust balance is lost. Therefore, the spiral groove pattern of the thrust dynamic pressure generating groove 22 has a shape that acts as a pump that pushes out the fluid toward the inner peripheral side of the ring-shaped impeller 11 as the ring-shaped impeller 11 rotates. A liquid film is formed and the axial thrust is supported by dynamic pressure. Further, the herringbone-shaped groove pattern of the radial dynamic pressure generating groove 23 has a shape that acts as a pump to push the fluid toward the axial center side of the groove as the ring-shaped impeller 11 rotates, thereby forming a liquid film. However, the radial thrust applied to the ring-shaped impeller 11 is supported by dynamic pressure. The thrust dynamic pressure generating groove 22 may be formed not on the ring-shaped impeller 11 side but on the thrust plate 18 side of the pump casing 15 or the casing cover 16, and the radial dynamic pressure generating groove 23 may be formed on the cylindrical portion 17 of the pump casing 15. It may be formed on the side.

FIG. 5 (a) is a radial thrust generation table for the ring-shaped impeller according to the first embodiment of the present invention, and FIG. 5 (b) is the ring-shaped impeller according to the first embodiment of the present invention. It is an explanatory view of a thrust in the radial direction. As shown in FIG. 5 (b), in the vortex pump, the pressure in the vicinity of the discharge port 20 is larger than the pressure in the vicinity of the suction port 19, so that the radial thrust acts in the θ direction opposite to the discharge port 20. To do. Therefore, even if the radial dynamic pressure generating groove 23 is formed only in the portion A of the cylindrical portion 17 near the discharge port 20 (the thick line portion of the cylindrical portion 17 of the pump casing 15), or even if it is formed in the entire circumference, the groove depth of the portion A. If the dynamic pressure is increased to a depth that increases the dynamic pressure,
The radial thrust causes the ring-shaped impeller 11 to move to the cylindrical portion 17
It is possible to prevent the pump from coming into contact with the pump, and the pump can be operated stably. As shown in the data of FIG. 5A, the portion A is used because the direction of the force acting on the ring-shaped impeller 11 changes depending on the pressure difference between the discharge port 20 and the suction port 19. The range of the part A can be determined by the area.

As described above, according to the contact heat exchange type pump 7, first, the drive part of the vortex pump is separated into the rotor magnet 13 and the motor stator 14, and the rotor magnet 13 is integrated with the ring-shaped impeller 11. The entire structure can be arranged in a flat plate shape together with the motor stator 14. As a result, the flat and large heat receiving surface 15a can be formed on the side surface of the pump. Secondly, the heat transferred from the heat-generating electronic component 3 travels along the heat receiving surface 15a and partially flows countercurrently to the heat transfer direction in the spiral flow while undergoing turbulent heat exchange on the outer circumference of the pump, so that a contact heat exchange type pump 7 works well as a cooler. Thirdly, the ring-shaped impeller 11 can be completely sealed with water by providing the cylindrical portion 17, and the load can be minimized by floating in the pump casing 15 in a non-contact manner. Can be suppressed to improve the cooling function. Fourthly, since the contact heat exchange type pump 7 also serves as a cooler, not only the conventional cooler becomes unnecessary, but also the work of assembling the cooler becomes unnecessary.
In addition, when mounting the contact heat exchange type pump 7 itself on the heat generating electronic component 3, it is not necessary to separately assemble and special structure, but it is sufficient to just contact and fix the heat receiving surface 15a. It is also extremely effective in terms of assembly and cost of the cooling device.

Next, the operation of the cooling device according to the first embodiment of the present invention and the electronic equipment including the same will be described.
When power is supplied from an external power source, a current controlled by a semiconductor switching circuit provided in the contact heat exchange type pump 7 flows through the coil of the motor stator 14 to generate a rotating magnetic field. This rotating magnetic field is the rotor magnet 1
When acting on 3, the physical force is generated in the rotor magnet 13. At this time, the rotor magnet 13 is integrated with the ring-shaped impeller 11, and the ring-shaped impeller 11 is rotatably supported by the cylindrical portion 17 of the pump casing 15. Acts,
This rotating torque causes the ring-shaped impeller 11 to start rotating. The blades 12 provided on the outer circumference of the ring-shaped impeller 11 give kinetic energy to the fluid flowing from the suction port 19 by the rotation of the ring-shaped impeller 11, and the kinetic energy gradually increases the pressure of the fluid in the pump casing 15. It is raised and discharged from the discharge port 20.

Here, the pumping action of the thrust dynamic pressure generating groove 22 in accordance with the rotation of the ring-shaped impeller 11 pushes the fluid toward the inner peripheral side of the thrust dynamic pressure generating groove 22 so that the fluid is pushed to both side surfaces of the ring-shaped impeller 11. Thrust dynamic pressure is generated between the thrust plate 18 and the thrust plate 18. Therefore, the ring-shaped impeller 11 smoothly rotates without coming into contact with the thrust plate 18 due to the liquid film.
In addition, the radial dynamic pressure generating groove 23 is pumped by the radial dynamic pressure generating groove 23 as the ring-shaped impeller 11 rotates.
The ring-shaped impeller 11 by pushing the fluid to the center side in the axial direction of the
Radial dynamic pressure is generated between the inner peripheral surface of the cylinder and the cylindrical portion 17. Therefore, the ring-shaped impeller 11 floats without contacting the cylindrical portion 17 and smoothly rotates. Ring-shaped impeller 1
In No. 1, the moment of inertia is small and the response is extremely good. This also makes the weight of the pump itself very light.

In this state, the contact heat exchange type pump 7 smoothly sucks the refrigerant X. The sucked refrigerant X is agitated by the ring-shaped impeller 11 in the space surrounded by the pump casing 15 and the casing cover 16 as shown in FIG.
The flow in the pump chamber 15b peculiar to the vortex pump is formed,
It is discharged while being pressurized. At this time, the refrigerant X has a high temperature due to the heat transfer from the heat-generating electronic component 3
5, turbulent heat exchange with the casing cover 16 and the casing cover 16 is performed.
This turbulent heat exchange can be promoted by roughening the surface roughness of the inner wall surface of the pump chamber 15b by shot blasting, shot peening, or the like. this is,
It is considered that the heat transfer area increased due to the roughened surface roughness, and the turbulent flow became intense and the heat transfer increased. Similarly, as shown in FIG. 6, when fins 15C projecting from the inner wall surface of the pump chamber 15b toward the ring-shaped impeller 11 are provided, the flow in the pump chamber 15b is made smooth and the refrigerant X from the pump casing 15 is discharged. The heat transfer amount can be increased due to the increase of the transfer area to the. FIG. 6 is a sectional view of essential parts showing a flow of the refrigerant in the contact heat exchange type pump provided with the fins according to the first embodiment of the present invention.

The refrigerant X, which has thus taken up the heat of the heat-generating electronic component 3 due to the turbulent heat exchange to rise in temperature, is sent to the radiator 8 through the pipe 9, cooled by the radiator 8 and lowered in temperature. After that, it returns to the contact heat exchange type pump 7 through the pipe 9 again, and this is repeated.

The heat radiated from the radiator 8 is discharged to the outside of the second housing 5, and the temperature inside the first housing 1 is kept constant, so that the user often touches the first housing. The surface temperature of No. 1 does not increase the user's discomfort. In this way, the contact heat exchange pump 7 can circulate the refrigerant X to remove heat from the heat-generating electronic component 3 and maintain the heat-generating electronic component 3 at its allowable temperature.

In the cooling device according to the first embodiment of the present invention and the electronic apparatus equipped with the cooling device, the contact heat exchange type pump 7 serves as both the pump and the cooler, so that it is not necessary to separately install the pump and the cooler. Also, the piping for connecting the pump and the cooler is not necessary, and the cooling device can be downsized and the cost can be reduced. Eliminating the work of assembling the cooler. In addition, when the contact heat exchange type pump 7 itself is attached to the heat generating electronic component 3, no additional cumbersome assembly or special structure is required, and it is sufficient to simply place and contact it. It is also extremely useful in terms of assembly and cost of the cooling device.

Further, the pump of the contact heat exchange type pump 7 is
By forming the ring-shaped impeller 11 by integrating the blades 12, the rotor magnet 13, and the rotary shaft, and by inserting the motor stator 14 into the ultra-thin vortex pump, the refrigerant inside the pump becomes violent. Since turbulent heat exchange is performed, it is possible to further reduce the thickness and cost of the cooling device while improving the cooling efficiency in the cooler.

Further, the pipe 9 is made of a rubber tube having a low gas permeability, so that the refrigerant X in the cooling device evaporates to the outside for a long period of time and a large amount of gas is cooled while securing the flexibility of the piping layout. It can be prevented from mixing in. Further, by disposing the contact heat exchange type pump 7 in the first casing 1 and disposing the radiator 8 in the second casing 5, it is possible to further reduce the size of the main body such as a laptop computer. .

(Second Embodiment) A cooling device and an electronic apparatus including the same according to the second embodiment of the present invention include a contact heat exchange type pump, a radiator, a pipe, a second housing and a first housing. Is connected by a rotating member that allows the. The electronic device is a foldable device such as a laptop computer. Further, there is no difference in the configuration of the contact heat exchange type pump as compared with the first embodiment. 7 is an overall configuration diagram of an electronic device incorporating a cooling device according to Embodiment 2 of the present invention, FIG. 8 is a sectional view of a rotating member according to Embodiment 2 of the present invention, and FIG. 9 is an embodiment of the present invention. It is sectional drawing at the time of integrating the rotating member in 2 with the one-touch removable connector.

In FIG. 7, 1 is a first housing, 2 is a keyboard, 3 is a heat-generating electronic component, 4 is a substrate, 5 is a second housing, and 6 is a board.
Is a display device, 7 is a contact heat exchange type pump, 8 is a radiator, 8
Reference numeral a is a refrigerant passage, 8b is a reserve tank, 9a is a pipe on the contact heat exchange pump 7 side, and 9b is a pipe on the radiator 8 side. Reference numeral 30 denotes a rotating member that is provided in the connecting portion between the first housing 1 and the second housing 5 and has a structure that can rotate as the second housing 5 rotates. The contact heat exchange type pump 7 side Is connected to the pipe 9a and the pipe 9b on the radiator 8 side.

Next, the rotating member 30 will be described. In FIG. 8, 31 is a hollow outer cylinder whose one end is connected to a pipe and the other end is connected to an inner cylinder 32 to be described later, 31a is a notch for preventing falling out, and 32 is inserted into the outer cylinder 31 and connected. Hollow inner cylinder, 32b is a notch 31 for preventing falling out
It is a protrusion inserted into a. The hollow portion serves as a passage for the refrigerant X. Reference numeral 32a is a groove provided on the outer circumference of the inner cylinder 32, and 33 is an O-ring elastic member provided between the outer cylinder 31 and the inner cylinder 32 and fitted into the groove 32a. O-ring elastic member 3
3 rotatably supports the outer cylinder 31 and the inner cylinder 32, and the outer cylinder 3
1 and each passage of the inner cylinder 32 and the outside are sealed to prevent the refrigerant X in the passage from leaking to the outside. Further, by arranging the O-ring-shaped elastic members 33 in two rows, the refrigerant X in the cooling device is prevented from evaporating to the outside and a large amount of gas is mixed into the cooling device for a long period of time. In addition, in order to prevent the outer cylinder 31 and the inner cylinder 32 from coming off, the protrusion 3 is provided on the inner cylinder 32 side.
2b, a cutout 31a is provided on the outer cylinder 31 side.

Further, in FIG. 9, 31b is a rotating member 3.
0 is a valve provided in the outer cylinder 31, 31c is a spring for urging the valve 31b, 32c is a valve provided in the inner cylinder 32, and 32d is a spring for urging the valve 32c. The valve 31b and the valve 32c seal respective internal passages from the outside in a state where the outer cylinder 31 and the inner cylinder 32 are separated and removed. When the outer cylinder 31 and the inner cylinder 32 are connected, The passage is connected.

Since the configuration and operation of the contact heat exchange type pump 7 are the same as those of the first embodiment of the present invention, the description thereof will be omitted here.

Next, the operation of the cooling device according to the second embodiment of the present invention and the electronic equipment provided with it will be described.
The refrigerant X sucked into the contact heat exchange type pump 7 is agitated by the ring-shaped impeller 11 in the contact heat exchange type pump 7, and the heat is transferred from the heat generating electronic component 3 to a high temperature, so that the pump casing 15 and the casing cover. 16, violently turbulent heat exchange is performed, and as a result, the temperature rises and the pipe 9 and the rotating member 3
0 is sent to the radiator 8 through the passage and is cooled by the radiator 8, and the temperature is lowered to pass through the passage in the pipe 9 and the rotating member 30 to return to the contact heat exchange type pump 7. repeat. In this way, the heat-generating electronic component 3 is cooled by circulating the refrigerant X to keep the heat-generating electronic component 3 at its allowable temperature.

When the user opens and closes the second housing 5 in an electronic device such as a laptop computer, the second housing 5 rotates around the hinge of the first housing 1, but the second housing 5 rotates with the rotation. Since the outer cylinder 31 and the inner cylinder 32 of the moving member 30 rotate with respect to each other, the second casing 5 can be smoothly rotated, and the contact heat exchange type pump 7 side in the first casing 1 is provided. Piping 9a
And the pipe 9b on the radiator 8 side in the second housing 5 is the rotating member 30.
Since they are connected with each other, they are not deformed, and it is possible to prevent the flow of the internal refrigerant from being hindered.

When the rotating member is integrated with the connector as shown in FIG. 9, it is possible to assemble the contact heat exchange type pump side and the radiator side separately, each of which is inside the first housing 1. Since the first housing 1 and the second housing 5 can be connected after being assembled in the second housing 5 and subassembling the first housing 1 and the second housing 5, the manufacturing cost can be reduced.

As described above, the second embodiment of the present invention
According to this, by providing the rotating member 30 in the pipe between the first casing 1 and the second casing, the second casing 5 can be smoothly rotated, and the pipe is deformed so that the internal refrigerant is deformed. Can be prevented from obstructing the flow of. Further, by providing a connector capable of one-touch connection in the pipe connecting the contact heat exchange type pump 7 and the radiator 8, it becomes possible to assemble the contact heat exchange type pump 7 side and the radiator 8 side separately. Cost can be reduced. Furthermore, by integrating the rotating member 30 and the connector, it is possible to further reduce the size and cost of the main body of the notebook computer or the like.

[0068]

As described above, according to the cooling device of the present invention, since the contact heat exchange type pump also serves as the cooler, it is not necessary to separately install the pump and the cooler, and the pump and the cooler can be installed separately. The piping for connection is not required, and the cooling device can be downsized and the cost can be reduced. Easy to assemble.

Further, since the contact heat exchange type pump is a vortex flow pump, the impeller has a small thickness and a heat receiving surface is formed on a side surface along the flow of the pump so that heat is transferred to the outside centering on the heat generating electronic parts. The generated heat can be effectively cooled by exchanging turbulent heat with the flow around the impeller, and it is possible to reduce the size and cost of the cooling device while improving the cooling efficiency.

The contact heat exchange type pump is provided with a ring-shaped impeller having a rotor magnet provided on the inner periphery thereof and a pump casing having a cylindrical portion arranged between the motor stator and the rotor magnet. Since this is an eddy current pump that rotatably supports a ring-shaped impeller, the motor part of the contact heat exchange type pump does not form a protruding part with respect to the heat receiving surface, and it can be an ultra-thin pump. Since the heat to be heated is violently turbulently exchanged with the refrigerant on the outer circumference of the impeller, it is possible to further reduce the thickness and cost of the cooling device while improving the cooling efficiency.

Since the heat receiving surface is composed of the entire side surface of the pump casing, the heat receiving surface can be made large by making the best use of the pump casing. Since the heat receiving surface is flat, the heat receiving surface can be mounted on the substrate having a flat upper surface. By molding with a molding material, heat transfer can be promoted and the motor stator can be completely waterproofed.

According to the electronic device of the present invention, the second housing is rotatably attached to the first housing, and the cooling device is provided to cool the heat-generating electronic components including the central processing unit. By cooling the electronic device having the mounted first housing and the second housing having the display device, the electronic device main body can be further downsized.

Since the contact heat exchange type pump is installed with the heat receiving surface in contact with the upper surface of the central processing unit, and the radiator is arranged on the back surface of the display device in the second housing, the contact heat exchange type pump is installed in the first housing. By disposing the heat dissipator and disposing the radiator in the second housing, the size of the electronic device main body can be further reduced.

[Brief description of drawings]

FIG. 1 is an overall configuration diagram of an electronic device incorporating a cooling device according to a first embodiment of the present invention.

FIG. 2 is a sectional view of the contact heat exchange type pump according to the first embodiment of the present invention.

FIG. 3 is an exploded perspective view of the contact heat exchange type pump according to the first embodiment of the present invention.

FIG. 4 is a sectional view of essential parts showing a flow of a refrigerant in the contact heat exchange type pump according to the first embodiment of the present invention.

FIG. 5A is a radial thrust generation table for the ring-shaped impeller according to the first embodiment of the present invention. FIG. 5B is a radial thrust table for the ring-shaped impeller according to the first embodiment of the present invention. Illustration of

FIG. 6 is a sectional view of essential parts showing the flow of the refrigerant in the contact heat exchange type pump provided with the fins according to the first embodiment of the present invention.

FIG. 7 is an overall configuration diagram of an electronic device incorporating a cooling device according to a second embodiment of the present invention.

FIG. 8 is a sectional view of a rotating member according to Embodiment 2 of the present invention.

FIG. 9 is a cross-sectional view of the rotating member according to Embodiment 2 of the present invention integrated with a one-touch attachable / detachable connector.

FIG. 10 is a configuration diagram of a first cooling device for a conventional electronic device.

FIG. 11 is a configuration diagram of a second cooling device for a conventional electronic device.

FIG. 12 is a partially broken perspective view of a conventional pump with a heat exchange function.

[Explanation of symbols]

1 first housing 2,109 keyboard 3,101 Heat-generating electronic components 4,102 substrate 5 Second case 6 Display device 7 Contact heat exchange type pump 8,104 radiator 8a Refrigerant passage 8b reserve tank 9, 9a, 9b, 106 Piping 11 ring-shaped impeller 12 feathers 13 rotor magnet 14 motor stator 15 Pump casing 15a Heat receiving surface 15b Pump room 16 casing cover 17 Cylindrical part 18 Thrust plate 19 Suction port 20 outlets 22 Thrust dynamic pressure generation groove 23 Radial dynamic pressure generating groove 30 Rotating member 31 outer cylinder 31a cutout 32 inner cylinder 32a groove 32b protrusion 33 O-ring elastic member 100 housing 103 cooler 105 pump 107 fans 108 wiring board 110 Semiconductor heating element 111 Disk device 112 display device 113 Heat receiving header 114 heat dissipation header 115 Flexible tube 116 metal housing 120 motor 121 heat exchanger 122 Cooling channel 122a discharge port 122b suction port 123 Centrifugal pump 124 casing 125 impeller

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁷ Identification code FI H02K 9/19 H01L 23/46 Z 21/22 G06F 1/00 360C 360A (72) Inventor Joukou Aizo Kadoma, Osaka Kadoma 1006 Matsushita Electric Industrial Co., Ltd. (72) Inventor Kazushi Kasahara, Kadoma City, Osaka 1006 Kadoma Matsushita Electric Industrial Co., Ltd. (56) Reference JP 2002-94276 (JP, A) JP 2002 -100713 (JP, A) JP 2001-320187 (JP, A) JP 2000-151638 (JP, A) JP 2000-286581 (JP, A) JP 10-22426 (JP, A) JP 2001-24372 (JP, A) Registered utility model 3038538 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H05K 7/20 H01L 23/473 G06F 1/20

Claims (13)

(57) [Claims] A pipe forming a closed circuit for circulating a refrigerant, a radiator and a contact heat exchange type pump are connected to each other, and the contact heat exchange type pump is brought into contact with a heat generating electronic component. Heat is taken from the heat-generating electronic component by the heat exchange action of the internal refrigerant, and
A cooling device that circulates a refrigerant and radiates heat from the radiator, wherein the pump casing of the contact heat exchange type pump is formed of a material having high thermal conductivity, and the pump casing has an internal pump chamber. A cooling device, wherein a heat receiving surface is formed on a side surface along the side surface, and the heat receiving surface is formed in a shape complementary to a three-dimensional shape of an upper surface of the heat-generating electronic component at a contact position. 2. The cooling device according to claim 1, wherein an auxiliary heat conducting member is provided on the heat receiving surface. 3. The auxiliary heat conducting member is a plate-like member whose upper surface shape and lower surface of the heat generating member match each other at a contact position, and whose heat receiving surface and upper surface match each other. 2. The cooling device according to 2. 4. The cooling device according to claim 2, wherein the auxiliary heat conducting member is a heat pipe provided on a side surface of the pump casing along the pump chamber. 5. The cooling device according to claim 1, wherein the contact heat exchange type pump is a vortex flow pump. 6. A ring-shaped impeller in which a large number of groove-shaped blades are formed on the outer circumference and a rotor magnet is provided on the inner circumference, and the contact heat exchange pump is provided on the inner circumference side of the rotor magnet. And a pump casing having a suction port and a discharge port for accommodating the impeller inside and having a cylindrical portion formed between the motor stator and the rotor magnet. The cooling device according to claim 5, wherein is a vortex pump in which the ring-shaped impeller is rotatably supported. 7. The cooling device according to claim 1, wherein the heat receiving surface is a flat surface. 8. A cooling device according to any one of claims 6-7, characterized in that the motor stator provided on the inner side of the cylindrical portion is molded at a high molding material thermal conductivity. 9. The cooling device according to any one of claims 6-8, characterized in that the surface roughness of the pump chamber is roughened. 10. The radial dynamic pressure generating means is provided on the surface of the cylindrical portion opposite to the direction of the radial thrust acting on the ring-shaped impeller and the axial center. The cooling device according to any one of 6 to 9 . 11. The contact heat exchange pump has a thickness of 3 to 3.
15mm, typical radial dimension is 10-70mm
Cooling according to any one of claims 1 to 10,
apparatus. 12. A first housing having an electronic circuit including a central processing unit, a storage device, and a keyboard provided on an upper surface of the housing.
An electronic device comprising: a second housing having a display device capable of displaying a processing result by the central processing unit, wherein the second housing is rotatably attached to the first housing, An electronic device comprising the cooling device according to any one of claims 1 to 11 for cooling a heat-generating electronic component including the central processing unit. 13. The contact heat exchange type pump is installed with the heat receiving surface in contact with the upper surface of the central processing unit, and the radiator is arranged on the back surface of the display device in the second casing. The electronic device according to claim 12.