JP3431024B1 - Cooling system - Google Patents
Cooling systemInfo
- Publication number
- JP3431024B1 JP3431024B1 JP2003007168A JP2003007168A JP3431024B1 JP 3431024 B1 JP3431024 B1 JP 3431024B1 JP 2003007168 A JP2003007168 A JP 2003007168A JP 2003007168 A JP2003007168 A JP 2003007168A JP 3431024 B1 JP3431024 B1 JP 3431024B1
- Authority
- JP
- Japan
- Prior art keywords
- heat
- pump
- cooling device
- impeller
- pump chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【要約】
【課題】 本発明は、冷却効率を改善しながら小型化、
薄型化でき、構造が簡単な冷却装置を提供することを目
的とする。
【解決手段】 本発明の冷却装置は、冷媒を循環するた
めの閉循環路に放熱器と接触熱交換型の遠心ポンプが設
けられ、遠心ポンプが発熱電子部品１に接触されて内部
の冷媒の熱交換作用で該発熱電子部品から熱を奪い、放
熱器から放熱を行う冷却装置であって、遠心ポンプが、
高熱伝導率の材料で構成されたポンプケーシング１５と
開放型の羽根車１１とを備え、ポンプケーシング１５に
は、内部のポンプ室１５ａに沿った側面に受熱面１５ｂ
が形成され、且つ該受熱面１５ｂが接触位置において発
熱電子部品１の上部表面の３次元的な形状と相補的な形
状に形成されとともに、受熱面１５ｂとポンプ室１５ａ
の内壁面との間に吸込路１９が設けられたことを特徴と
する。An object of the present invention is to reduce the size while improving the cooling efficiency.
An object of the present invention is to provide a cooling device that can be reduced in thickness and has a simple structure. SOLUTION: The cooling device of the present invention is provided with a centrifugal pump of a contact heat exchange type with a radiator in a closed circuit for circulating the refrigerant, and the centrifugal pump is brought into contact with the heat-generating electronic component 1 to reduce the internal refrigerant. A cooling device that removes heat from the heat-generating electronic components by a heat exchange action and radiates heat from a radiator, wherein the centrifugal pump includes:
A pump casing 15 made of a material having high thermal conductivity and an open impeller 11 are provided. The pump casing 15 has a heat receiving surface 15b on a side surface along an internal pump chamber 15a.
Is formed, and at the contact position, the heat receiving surface 15b is formed in a shape complementary to the three-dimensional shape of the upper surface of the heat-generating electronic component 1, and the heat receiving surface 15b and the pump chamber 15a are formed.
A suction passage 19 is provided between the suction passage 19 and the inner wall surface.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、筐体内部に配設さ
れた中央処理装置（以下、ＣＰＵ）等の発熱電子部品
を、冷媒を循環させて冷却する電子機器の冷却装置に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for electronic equipment which cools heat-generating electronic parts such as a central processing unit (hereinafter, CPU) arranged inside a housing by circulating a refrigerant. .
【０００２】[0002]
【従来の技術】最近のコンピューターにおける高速化の
動きはきわめて急速であり、ＣＰＵのクロック周波数は
以前と比較して格段に大きなものになってきている。こ
の結果、ＣＰＵの発熱量が増し、従来のようにヒートシ
ンクで空冷するだけでは能力不足で、高効率で高出力の
冷却装置が不可欠になっている。そこでこのような冷却
装置として、発熱電子部品を搭載した基板を、冷媒を循
環させて冷却する冷却装置が提案された（特許文献１参
照）。2. Description of the Related Art The recent trend toward higher speeds in computers has been extremely rapid, and the clock frequency of CPUs has become significantly greater than before. As a result, the amount of heat generated by the CPU is increased, and the capacity is insufficient only by air-cooling with a heat sink as in the conventional case, and a cooling device with high efficiency and high output is essential. Therefore, as such a cooling device, a cooling device has been proposed that cools a substrate on which heat-generating electronic components are mounted by circulating a cooling medium (see Patent Document 1).
【０００３】以下、このような冷媒を循環させて冷却す
る従来の電子機器の冷却装置について説明する。なお、
本明細書において電子機器というのは、ＣＰＵ等にプロ
グラムをロードして処理を行う装置、中でもノート型パ
ソコンのような携行可能な小型の装置を中核とするが、
このほかに通電により発熱する発熱電子部品を搭載した
装置を含むものである。この従来の第１の冷却装置は、
例えば図１４に示すようなものが知られている。A conventional cooling device for electronic equipment which circulates and cools such a refrigerant will be described below. In addition,
In the present specification, the electronic device mainly refers to a device that loads a program into a CPU or the like to perform processing, and in particular, a small portable device such as a laptop computer.
In addition, it includes a device equipped with heat-generating electronic components that generate heat when energized. This conventional first cooling device,
For example, the one shown in FIG. 14 is known.
【０００４】図１４は従来の電子機器の第１冷却装置の
構成図である。図１４において、１００は筐体であり、
１０１は発熱電子部品、１０２は発熱電子部品１０１を
実装した基板、１０３は発熱電子部品１０１と冷媒との
間で熱交換を行ない発熱電子部品１０１を冷却する冷却
器、１０４は冷媒から熱を取り除く放熱器、１０５は冷
媒を循環させるポンプ、１０６はこれらを接続する配
管、１０７は放熱器１０４を空冷するファンである。FIG. 14 is a block diagram of a first cooling device for a conventional electronic device. In FIG. 14, 100 is a housing,
Reference numeral 101 is a heat-generating electronic component, 102 is a board on which the heat-generating electronic component 101 is mounted, 103 is a cooler that cools the heat-generating electronic component 101 by exchanging heat between the heat-generating electronic component 101 and a refrigerant, and 104 removes heat from the refrigerant. A radiator, 105 is a pump that circulates the refrigerant, 106 is a pipe connecting these, and 107 is a fan that cools the radiator 104 by air.
【０００５】この従来の第１冷却装置の動作を説明する
と、ポンプ１０５から吐出された冷媒は、配管１０６を
通って冷却器１０３に送られる。ここで発熱電子部品１
０１の熱を奪うことでその温度が上昇し、放熱器１０４
に送られる。この放熱器１０４でファン１０７によって
強制空冷されてその温度が降下し、再びポンプ１０５へ
戻ってこれを繰り返す。このように、冷媒を循環させて
発熱電子部品１０１を冷却するものであった。The operation of the conventional first cooling device will be described. The refrigerant discharged from the pump 105 is sent to the cooler 103 through the pipe 106. Heat generating electronic component 1
By taking away the heat of 01, its temperature rises and the radiator 104
Sent to. In the radiator 104, the temperature is lowered by being forcedly cooled by the fan 107, and the temperature returns to the pump 105 again to repeat this. Thus, the heat-generating electronic component 101 is cooled by circulating the refrigerant.
【０００６】次に、電子機器の従来の第２冷却装置とし
て、図１５に示すものが提案されている（特許文献１参
照）。Next, as a conventional second cooling device for electronic equipment, the one shown in FIG. 15 has been proposed (see Patent Document 1).
【０００７】この第２冷却装置は、発熱部材を狭い筐体
内に搭載したとき、発熱部材の発生熱を放熱部である金
属筐体壁まで効率良く輸送し発熱部材を冷却するもので
ある。This second cooling device cools the heat generating member by efficiently transporting the heat generated by the heat generating member to the wall of the metal casing, which is a heat radiating portion, when the heat generating member is mounted in a narrow casing.
【０００８】図１５は従来の電子機器の第２冷却装置の
構成図である。図１５において、１０８は電子機器の配
線基板、１０９はキーボード、１１０は半導体発熱素
子、１１１はディスク装置、１１２は表示装置、１１３
は半導体発熱素子１１０との間で熱交換する受熱ヘッ
ダ、１１４は放熱のための放熱ヘッダ、１１５はフレキ
シブルチューブ、１１６は電子機器の金属筐体である。FIG. 15 is a block diagram of a second cooling device for conventional electronic equipment. In FIG. 15, 108 is a wiring board of an electronic device, 109 is a keyboard, 110 is a semiconductor heating element, 111 is a disk device, 112 is a display device, and 113.
Is a heat receiving header for exchanging heat with the semiconductor heating element 110, 114 is a heat radiating header for heat radiation, 115 is a flexible tube, and 116 is a metal housing of an electronic device.
【０００９】この第２冷却装置は、発熱部材である半導
体発熱素子１１０と金属筐体１１６とをフレキシブル構
造の熱輸送デバイスにより熱的に接続するものである。
この熱輸送デバイスは、半導体発熱素子１１０に取り付
けた液流路を有する扁平状の受熱ヘッダ１１３、液流路
を有し金属筐体１１６の壁に接触させた放熱ヘッダ１１
４、さらに両者を接続するフレキシブルチューブ１１５
で構成され、内部に封入した液を放熱ヘッダ１１４に内
蔵した液駆動機構により受熱ヘッダ１１３と放熱ヘッダ
１１４との間で駆動あるいは循環させるものである。こ
れにより、半導体発熱素子１１０と金属筐体１１６とが
部品配列に左右されることなく容易に接続できるととも
に、液の駆動により高効率で熱が輸送される。放熱ヘッ
ダ１１４においては、放熱ヘッダ１１４と金属筐体１１
６とが熱的に接続されているので、金属筐体１１６の高
い熱伝導率のために熱が広く金属筐体１１６に拡散され
るものである。In this second cooling device, the semiconductor heating element 110, which is a heating member, and the metal casing 116 are thermally connected by a heat transport device having a flexible structure.
This heat transport device includes a flat heat receiving header 113 having a liquid flow path attached to a semiconductor heating element 110, and a heat radiating header 11 having a liquid flow path and brought into contact with the wall of a metal casing 116.
4. Flexible tube 115 that connects both
The liquid sealed inside is driven or circulated between the heat receiving header 113 and the heat radiating header 114 by the liquid driving mechanism built in the heat radiating header 114. As a result, the semiconductor heating element 110 and the metal housing 116 can be easily connected without being influenced by the arrangement of parts, and heat is transported with high efficiency by driving the liquid. In the heat dissipation header 114, the heat dissipation header 114 and the metal housing 11
Since 6 and 6 are thermally connected, the heat is widely diffused to the metal housing 116 due to the high thermal conductivity of the metal housing 116.
【００１０】また、本出願人も、冷却効率を改善しなが
ら小型化、薄型化でき、構造が簡単な渦流ポンプを使っ
た冷却装置を既に提案した（特願２００２−１３９５９
８）。Further, the present applicant has already proposed a cooling device using an eddy-current pump which can be made compact and thin while improving cooling efficiency and has a simple structure (Japanese Patent Application No. 2002-13959).
8).
【００１１】[0011]
【特許文献１】特開平７−１４２８８６号公報[Patent Document 1] Japanese Unexamined Patent Application Publication No. 7-142886
【００１２】[0012]
【発明が解決しようとする課題】しかしながら、従来の
第１冷却装置では、発熱電子部品１０１と冷媒とで熱交
換を行ない発熱電子部品１０１を冷却する冷却器１０
３、冷媒から熱を取り除くための放熱器１０４、冷媒を
循環させるポンプ１０５、図示はしないが冷媒を補充し
なければならず補充用タンクが必要であり、これらを組
み合わせるため装置が大型且つ複雑で小型化が難しく、
コストも高くなるという問題があった。すなわち従来の
第１冷却装置は、本来大型の電子機器の冷却に適したも
のであって、小型、軽量且つ薄型で、様々の姿勢で運ば
れ、使われる最近の高性能携行型のノート型パソコン等
には対応しきれないものであった。However, in the first conventional cooling device, the cooler 10 that cools the heat-generating electronic component 101 by exchanging heat between the heat-generating electronic component 101 and the refrigerant.
3. A radiator 104 for removing heat from the refrigerant, a pump 105 for circulating the refrigerant, and a tank for replenishing the refrigerant (not shown) are required to replenish the refrigerant, and a replenishment tank is required. Difficult to miniaturize,
There was a problem that the cost would be high. That is, the conventional first cooling device is originally suitable for cooling a large electronic device, is small, lightweight, and thin, and is a recent high-performance portable notebook computer that is carried and used in various postures. It was not possible to deal with such problems.
【００１３】また、従来の第２冷却装置はノート型パソ
コン等に使用することが可能であるが、半導体発熱素子
１１０に取り付けた扁平状の受熱ヘッダ１１３も、金属
筐体１１６の壁に接触させた放熱ヘッダ１１４もいずれ
もがボックス状で厚くならざるをえず、ノート型パソコ
ン等の薄型化を妨げるものであった。すなわち従来の第
２冷却装置では、放熱ヘッダ１１４の中に液体駆動装置
として他のポンプより横幅が比較的小さくなる往復動ポ
ンプが設けられており、残念なことに、この往復動ポン
プが放熱ヘッダ１１４の厚さを規定して全体を厚くして
いる。これではノート型パソコンの薄型化はできない。Although the second conventional cooling device can be used for a notebook type personal computer or the like, the flat heat receiving header 113 attached to the semiconductor heating element 110 is also brought into contact with the wall of the metal casing 116. All the heat dissipation headers 114 are inevitably box-shaped and thick, which hinders the thinning of notebook personal computers and the like. That is, in the second conventional cooling device, a reciprocating pump having a relatively smaller width than other pumps is provided in the heat dissipation header 114 as a liquid driving device. Unfortunately, this reciprocating pump is a heat dissipation header. The thickness of 114 is specified to make the whole thicker. This cannot reduce the thickness of the notebook computer.
【００１４】しかし、薄型のノート型パソコンで第２冷
却装置の往復動ポンプを受熱ヘッダ１１３の中に収容す
ることは困難である。すなわちポンプの厚さのほかに半
導体発熱素子１１０等の厚みも加わって、ノート型パソ
コンの高さを増加させ、薄型化に逆行することになるか
らである。その上、往復動ポンプの振動と騒音は、これ
を載置する半導体発熱素子１１０に影響を与えるし、耳
障りになる場合もあり、これらの面からも実現は困難で
ある。However, it is difficult to accommodate the reciprocating pump of the second cooling device in the heat receiving header 113 with a thin notebook personal computer. That is, in addition to the thickness of the pump, the thickness of the semiconductor heating element 110 and the like is added to increase the height of the notebook type personal computer, which goes against the reduction in thickness. In addition, the vibration and noise of the reciprocating pump may affect the semiconductor heating element 110 on which it is mounted and may be offensive to the ears.
【００１５】さらに、第２冷却装置において、金属筐体
１１６の壁に接触させた放熱ヘッダ１１４は、放熱面積
が小さくて伝熱効率が悪く、冷却力に限界が存在するも
のであった。冷却力を上げるために放熱面積を増すこと
も考えられるが、これ以上面積を増すのでは流路が長く
なって循環量が増し、内蔵した往復動ポンプの出力増加
を招き、これによって放熱ヘッダ１１４の厚みを増すと
いう矛盾があった。そこで、往復動ポンプを独立して金
属筐体１１６内に収納するという手段を講じると、限界
まで無駄なスペースを減少させたノート型パソコン本体
に新たなスペースを割かなければならないし、組み立て
作業も面倒になってしまう。このように、第２冷却装置
はノート型パソコン等の小型化、薄型化に対しては限界
を有するものであった。そして、最近のようにＣＰＵの
能力が向上して益々大きな冷却能力が要求されるとき
に、このような問題を抱えた従来の第２冷却装置では将
来性で疑問が残るものであった。Further, in the second cooling device, the heat dissipation header 114 brought into contact with the wall of the metal casing 116 has a small heat dissipation area and poor heat transfer efficiency, and has a limit in cooling power. It is conceivable to increase the heat dissipation area in order to increase the cooling power, but if the area is further increased, the flow path becomes longer and the circulation amount increases, leading to an increase in the output of the built-in reciprocating pump, which causes the heat dissipation header 114. There was a contradiction of increasing the thickness of the. Therefore, if a means of separately storing the reciprocating pump in the metal casing 116 is taken, a new space must be allocated to the notebook computer main body in which the wasted space is reduced to the limit, and the assembling work is also required. It becomes troublesome. As described above, the second cooling device has a limit to downsizing and thinning of a notebook computer or the like. Then, when the CPU capacity has been improved and more and more cooling capacity is required recently, the conventional second cooling device having such a problem still has doubts about the future.
【００１６】また、従来の熱交換機能付ポンプは、冷媒
を別の冷却水で冷やしているため、ポンプ内に冷却水路
が必要で大型化しポンプ構造が複雑になり、また、冷却
水を循環させる第２のポンプや冷却水から熱を奪う第２
の熱交換器が必要であるため、システムが複雑で小型化
が難しく、部品点数も作業性も悪く、従って熱効率も良
好なものは見込めず、コストも高いという課題があっ
た。Further, in the conventional pump having a heat exchange function, the refrigerant is cooled by another cooling water, so that a cooling water passage is required in the pump, the pump structure becomes large and the pump structure becomes complicated, and the cooling water is circulated. The second that draws heat from the second pump and cooling water
Since the heat exchanger of No. 1 is required, the system is complicated and downsizing is difficult, and the number of parts and workability are poor. Therefore, there is a problem that good thermal efficiency cannot be expected and cost is high.
【００１７】また、本出願人の提案した冷却装置は、従
来の第１冷却装置、第２冷却装置の課題を解決できる優
れた冷却装置であったが、渦流ポンプにおいては、ポン
プ室がステータの外周側に位置するため、ＣＰＵの位置
がポンプ中心に位置する場合には吸熱するポンプ室とＣ
ＰＵとの距離が大きくなり、受熱効率の改善の余地があ
った。しかし、この渦流ポンプを単純に他の形式のポン
プで置き換えることには困難があった。すなわち、他の
形式のポンプでは吸込路と吐出路、さらにはステータが
存在するため、ＣＰＵと接触する受熱面をポンプに構成
することが難しいからである。そして、敢えてこれを実
行しても小型化、薄型化することができなくなるもので
あった。Further, the cooling device proposed by the applicant was an excellent cooling device capable of solving the problems of the conventional first cooling device and second cooling device. However, in the vortex pump, the pump chamber is the stator. Since it is located on the outer peripheral side, when the CPU is located at the center of the pump, the pump chamber that absorbs heat and C
There was room for improving the heat receiving efficiency because the distance from the PU increased. However, it was difficult to simply replace this vortex pump with another type of pump. That is, in other types of pumps, since the suction passage, the discharge passage, and the stator are present, it is difficult to configure the heat receiving surface in contact with the CPU in the pump. And even if it dared to carry out this, it was impossible to make it smaller and thinner.
【００１８】そこで、本発明は、冷却効率を改善しなが
ら小型化、薄型化でき、構造が簡単な冷却装置を提供す
ることを目的とする。Therefore, an object of the present invention is to provide a cooling device which can be made compact and thin while improving the cooling efficiency and has a simple structure.
【００１９】[0019]
【課題を解決するための手段】本発明の冷却装置は上記
課題を解決するためになされたものであって、冷媒を循
環するための閉循環路に放熱器と接触熱交換型の遠心ポ
ンプが設けられ、遠心ポンプが発熱電子部品に接触され
て内部の冷媒の熱交換作用で該発熱電子部品から熱を奪
い、放熱器から放熱を行う冷却装置であって、遠心ポン
プが、高熱伝導率の材料で構成されたポンプケーシング
と開放型の羽根車とを備え、ポンプケーシングには、内
部のポンプ室に沿った側面に受熱面が形成され、且つ該
受熱面が接触位置において発熱電子部品の上部表面の３
次元的な形状と相補的な形状に形成されとともに、受熱
面とポンプ室の内壁面との間に吸込路が設けられたこと
を特徴とする。The cooling device of the present invention has been made in order to solve the above problems, and a radiator and a contact heat exchange type centrifugal pump are provided in a closed circuit for circulating a refrigerant. A cooling device provided with a centrifugal pump that draws heat from the heat-generating electronic component by contacting the heat-generating electronic component with the heat exchange action of the refrigerant inside and dissipates heat from the radiator, wherein the centrifugal pump has a high thermal conductivity. A pump casing made of a material and an open type impeller are provided, and a heat receiving surface is formed on a side surface of the pump casing along the internal pump chamber, and the heat receiving surface is an upper portion of the heat-generating electronic component at a contact position. Surface 3
It is characterized in that it is formed in a shape complementary to the dimensional shape and that a suction passage is provided between the heat receiving surface and the inner wall surface of the pump chamber.
【００２０】本発明によれば、冷却効率を改善しながら
小型化、薄型化でき、構造が簡単な冷却装置とすること
ができる。According to the present invention, it is possible to provide a cooling device having a simple structure which can be made smaller and thinner while improving cooling efficiency.
【００２１】[0021]
【発明の実施の形態】上記課題を解決するためになされ
た請求項１の発明は、冷媒を循環するための閉循環路に
放熱器と接触熱交換型の遠心ポンプが設けられ、遠心ポ
ンプが発熱電子部品に接触されて内部の冷媒の熱交換作
用で該発熱電子部品から熱を奪い、放熱器から放熱を行
う冷却装置であって、遠心ポンプが、高熱伝導率の材料
で構成されたポンプケーシングと開放型の羽根車とを備
え、ポンプケーシングには、内部のポンプ室に沿った側
面に受熱面が形成され、且つ該受熱面が接触位置におい
て発熱電子部品の上部表面の３次元的な形状と相補的な
形状に形成されとともに、受熱面とポンプ室の内壁面と
の間に吸込路が設けられたことを特徴とする冷却装置で
あり、開放型の羽根車の羽根がポンプ室内部に形成され
る層流境界層を剥ぎ取るため乱流化して伝熱量が増し、
吸込路が受熱面とポンプ室の内壁面との間に設けられて
いるので、これによって吸込路近傍の受熱面の温度を下
げることができ、吸込路が発熱電子部品の側に張り出し
ていないので、受熱面に遠心ポンプの内部構成による形
状の変化を形成する必要がなく、受熱面と発熱電子部品
の上部表面が密着しているので、熱を効果的に受熱する
ことができる。The invention according to claim 1 made in order to solve the above-mentioned problems is provided with a radiator and a contact heat exchange type centrifugal pump in a closed circuit for circulating a refrigerant, and the centrifugal pump is A cooling device in which a centrifugal pump is made of a material having a high thermal conductivity, which is in contact with a heat-generating electronic component and takes heat from the heat-generating electronic component by heat exchange action of an internal refrigerant to radiate heat from a radiator. The pump casing includes a casing and an open type impeller, and a heat receiving surface is formed on a side surface of the pump casing along the inner pump chamber, and the heat receiving surface has a three-dimensional shape of the upper surface of the heat-generating electronic component at a contact position. The cooling device is formed in a shape complementary to the shape, and has a suction passage provided between the heat receiving surface and the inner wall surface of the pump chamber. The laminar boundary layer formed on the Heat transfer amount is increased by turbulence to take,
Since the suction passage is provided between the heat receiving surface and the inner wall surface of the pump chamber, the temperature of the heat receiving surface in the vicinity of the suction passage can be lowered, and the suction passage does not project to the heat-generating electronic component side. Since it is not necessary to form a shape change on the heat receiving surface due to the internal configuration of the centrifugal pump and the heat receiving surface and the upper surface of the heat generating electronic component are in close contact with each other, heat can be effectively received.
【００２２】請求項２の発明は、吸込路が、ポンプケー
シングの肉厚方向に短軸をもつ楕円形状の断面を有して
いることを特徴とする請求項１記載の冷却装置であり、
ポンプ室と発熱部品との距離を縮めることができるため
に、その間の熱抵抗を下げることができる。A second aspect of the present invention is the cooling device according to the first aspect, wherein the suction passage has an elliptical cross section having a minor axis in the thickness direction of the pump casing.
Since the distance between the pump chamber and the heat generating component can be shortened, the thermal resistance between them can be reduced.
【００２３】請求項３の発明は、請求項１記載の冷却装
置において、受熱面とポンプ室の内壁面との間に吸込路
が設けられるのに代えて、羽根車の中心に吸水口が形成
され、該吸水口と連通する吸込路が受熱面と対向するポ
ンプケーシング側に設けられたことを特徴とする冷却装
置であり、ポンプ室の受熱面と反対側から吸い込むこと
を可能とし、結果に、ポンプ室と発熱部品との距離を縮
めることができるために、その間の熱抵抗を下げること
ができる。According to a third aspect of the present invention, in the cooling device according to the first aspect, instead of providing the suction passage between the heat receiving surface and the inner wall surface of the pump chamber, a water suction port is formed at the center of the impeller. The cooling device is characterized in that the suction passage communicating with the water suction port is provided on the pump casing side facing the heat receiving surface, and it is possible to suck from the side opposite to the heat receiving surface of the pump chamber. Since the distance between the pump chamber and the heat generating component can be shortened, the thermal resistance between them can be reduced.
【００２４】請求項４の発明は、吸水口が、羽根車の軸
中心と一致する軸中心を有していることを特徴とする請
求項３記載の冷却装置であり、羽根車内の流れの対称性
を保てるため流量を最も効率よく送ることができ、熱を
効果的に受熱することができる。The invention according to claim 4 is the cooling device according to claim 3, characterized in that the water intake has an axial center coinciding with the axial center of the impeller. Since it is possible to maintain the property, the flow rate can be sent most efficiently, and the heat can be effectively received.
【００２５】請求項５の発明は、羽根車には、該羽根車
の軸中心とずれた位置に貫通孔が形成されていることを
特徴とする請求項１〜４のいずれかに記載の冷却装置で
あり、ポンプ室の羽根車背面から貫通孔を通って還流さ
せることができ、羽根車中央に滞留し易い気泡やキャビ
ティを排出し、キャビテーションによる騒音をなくし伝
熱速度を向上できる。The invention according to claim 5 is characterized in that the impeller is formed with a through hole at a position deviated from the axial center of the impeller. It is a device, and can recirculate from the impeller rear surface of the pump chamber through the through hole, discharge bubbles and cavities that easily stay in the center of the impeller, eliminate noise due to cavitation, and improve the heat transfer rate.
【００２６】請求項６の発明は、ポンプ室内壁面には、
羽根の側面が回転する部分に動圧溝が設けられたことを
特徴とする請求項１〜５のいずれかに記載の冷却装置で
あり、動圧溝が羽根車に円滑な回転をさせ、摩擦で発生
する熱を抑え、受熱面の背面の表面積を増し、熱を効果
的に受熱することができる。According to a sixth aspect of the invention, the inner wall surface of the pump chamber is
The cooling device according to any one of claims 1 to 5, wherein a dynamic pressure groove is provided in a portion where the side surface of the blade rotates, wherein the dynamic pressure groove causes the impeller to rotate smoothly and to reduce friction. It is possible to suppress the heat generated in the above, increase the surface area of the back surface of the heat receiving surface, and effectively receive the heat.
【００２７】請求項７の発明は、ポンプ室内壁には、羽
根の側面がスライドする部分の少なくとも一部に層流境
界層を剥離させる凹部が多数設けられていることを特徴
とする請求項１〜６のいずれかに記載の冷却装置であ
り、伝熱量が小さい層流境界層を剥離させ、乱流境界層
として伝熱を促進させることができる。The invention of claim 7 is characterized in that the pump chamber inner wall is provided with a large number of recesses for separating the laminar boundary layer at least at a part where the side surface of the blade slides. The cooling device according to any one of 1 to 6, wherein the laminar boundary layer having a small amount of heat transfer can be separated to promote heat transfer as a turbulent boundary layer.
【００２８】請求項８の発明は、ポンプ室内壁には、羽
根の側面がスライドする部分の少なくとも一部に多数の
突起体が設けられたことを特徴とする請求項１〜７のい
ずれかに記載の冷却装置であり、ポンプ室内の冷媒の乱
流発生を促進し、伝熱を促進させることができる。The invention according to claim 8 is characterized in that a large number of projections are provided on at least a part of the portion where the side surface of the blade slides on the inner wall of the pump chamber. The described cooling device is capable of promoting the generation of turbulent flow of the refrigerant in the pump chamber and promoting heat transfer.
【００２９】請求項９の発明は、ポンプ室内壁には、吸
込路が対向するする部分の少なくとも一部に複数の突起
体もしくは溝を設けたことを特徴とする請求項３記載の
冷却装置であり、ポンプ室内の冷媒の乱流発生を促進
し、伝熱面積を増加させることができるために伝熱を促
進することができる。According to a ninth aspect of the invention, in the cooling device according to the third aspect, a plurality of protrusions or grooves are provided on at least a part of the portion where the suction passages face each other on the inner wall of the pump. Therefore, the turbulent flow of the refrigerant in the pump chamber can be promoted and the heat transfer area can be increased, so that the heat transfer can be promoted.
【００３０】請求項１０の発明は、羽根車には、羽根の
入口側もしくは羽根間に攪拌用羽根車突起体が形成され
ていることを特徴とする請求項１〜９のいずれかに記載
の冷却装置であり、攪拌用羽根車突起体が流路を攪拌す
るため、ポンプ室内の冷媒の乱流発生を促進する。The invention according to claim 10 is characterized in that the impeller is provided with a stirring impeller projection body on the inlet side of the impeller or between the impellers. This is a cooling device, and since the stirring impeller projection body stirs the flow path, it promotes the generation of turbulent flow of the refrigerant in the pump chamber.
【００３１】請求項１１の発明は、攪拌用羽根車突起体
が、ポンプ室内壁に形成された突起体と半径方向でずれ
た位置に対向して設けられることを特徴とする請求項１
０記載の冷却装置であり、攪拌用羽根車突起体が突起体
と接触せずに流路を効果的に攪拌し、ポンプ室内の冷媒
の乱流発生を促進し、伝熱面積も増加させ、伝熱効率を
更に向上させることができる。The eleventh aspect of the present invention is characterized in that the stirring impeller projection is provided so as to face the projection formed on the inner wall of the pump at a position displaced in the radial direction.
In the cooling device according to 0, the stirring impeller projection body effectively stirs the flow path without contacting the projection body, promotes turbulent flow of the refrigerant in the pump chamber, and increases the heat transfer area. The heat transfer efficiency can be further improved.
【００３２】請求項１２の発明は、羽根の側面には、ポ
ンプ室内壁の表面と接触する弾性線状体もしくは弾性板
状体が設けられたことを特徴とする請求項１〜１１のい
ずれかに記載の冷却装置であり、伝熱量が小さい層流境
界層を剥離させ、乱流境界層として伝熱を促進させるこ
とができる。The invention of claim 12 is characterized in that an elastic linear member or an elastic plate member contacting the surface of the inner wall of the pump is provided on the side surface of the blade. In the cooling device described in (3), the laminar boundary layer having a small heat transfer amount can be separated to promote heat transfer as a turbulent boundary layer.
【００３３】請求項１３の発明は、受熱面のポンプケー
シング厚さが羽根車の軸中心を中心として半径方向に減
少することを特徴とする請求項１〜１２のいずれかに記
載の冷却装置であり、電子部品からの熱をポンプ室全体
に拡散しやすくし、伝熱を促進させることができる。According to a thirteenth aspect of the present invention, in the cooling device according to any one of the first to twelfth aspects, the thickness of the pump casing on the heat receiving surface is reduced in the radial direction about the axial center of the impeller. Therefore, heat from the electronic components can be easily diffused throughout the pump chamber, and heat transfer can be promoted.
【００３４】請求項１４の発明は、冷媒の循環路と、前
記循環路内の冷媒を循環させるポンプと、前記循環路内
の冷媒の熱を放出する放熱器とを備えた電子部品の冷却
装置であって、前記ポンプは、前記ポンプのハウジング
と前記電子部品が熱的に接触するよう、前記電子部品に
直接連結され、前記ポンプのポンプ室の中央部に吸水口
が設けられたことを特徴とする電子部品の冷却装置であ
り、受熱面と発熱電子部品の上部表面が密着しており、
ポンプ室の中央部から冷媒を吸い込むことを可能とし、
温度の低い冷媒をポンプ室の中央部に供給することがで
き、羽根車内の流れの対称性を保てるため流量を最も効
率よく送ることができ、熱を効果的に受熱することがで
きる。According to a fourteenth aspect of the present invention, there is provided a cooling device for an electronic component, comprising a refrigerant circulation path, a pump for circulating the refrigerant in the circulation path, and a radiator radiating heat of the refrigerant in the circulation path. The pump is directly connected to the electronic component so that the housing of the pump and the electronic component are in thermal contact with each other, and a water intake port is provided in a central portion of a pump chamber of the pump. It is a cooling device for electronic parts, where the heat receiving surface and the upper surface of the heat generating electronic parts are in close contact,
It is possible to suck the refrigerant from the center of the pump chamber,
Coolant having a low temperature can be supplied to the central portion of the pump chamber, and since the flow symmetry in the impeller can be maintained, the flow rate can be sent most efficiently, and heat can be effectively received.
【００３５】請求項１５の発明は、前記ポンプは遠心ポ
ンプであることを特徴とする請求項１４記載の電子部品
の冷却装置であり、開放型の羽根車の羽根がポンプ室内
部に形成される層流境界層を剥ぎ取るため乱流化して伝
熱量が増し、熱を効果的に受熱することができる。According to a fifteenth aspect of the present invention, in the cooling device for electronic components according to the fourteenth aspect, wherein the pump is a centrifugal pump, the blades of an open type impeller are formed inside the pump chamber. Since the laminar boundary layer is stripped off, it becomes turbulent and the amount of heat transfer increases, so that heat can be effectively received.
【００３６】請求項１６の発明は、前記ポンプのポンプ
室内壁には、前記羽根車の側面がスライドする部分の少
なくとも一部に層流境界層を剥離させる剥離手段がけら
れていることを特徴とする請求項１４記載の電子部品の
冷却装置であり、伝熱量が小さい層流境界層を剥離さ
せ、乱流境界層として伝熱を促進させることができる。According to a sixteenth aspect of the present invention, the pump chamber inner wall of the pump is provided with a separating means for separating the laminar boundary layer in at least a part of a portion where the side surface of the impeller slides. The cooling device for an electronic component according to claim 14, wherein the laminar boundary layer having a small amount of heat transfer can be separated to promote heat transfer as a turbulent boundary layer.
【００３７】請求項１７の発明は、前記剥離手段が、少
なくともポンプ室内壁には凹部または突起体が設けられ
ていることを特徴とする請求項１４記載の電子部品の冷
却装置であり、伝熱量が小さい層流境界層を剥離させ、
乱流境界層として伝熱を促進させることができる。According to a seventeenth aspect of the present invention, in the cooling device for electronic parts according to the fourteenth aspect, the peeling means is provided with a recess or a projection at least on the inner wall of the pump chamber. The laminar boundary layer with a small
Heat transfer can be promoted as a turbulent boundary layer.
【００３８】請求項１８の発明は、前記剥離手段が、前
記羽根車の側面に前記ポンプ室内壁の表面と接触する弾
性線状体もしくは弾性板状体が設けられたことを特徴と
する請求項１４記載の電子部品の冷却装置であり、伝熱
量が小さい層流境界層を剥離させ、乱流境界層として伝
熱を促進させることができる。The invention according to claim 18 is characterized in that the peeling means is provided with an elastic linear body or elastic plate-like body which is in contact with the surface of the inner wall of the pump on the side surface of the impeller. The cooling device for an electronic component according to 14, wherein a laminar boundary layer having a small heat transfer amount can be separated to promote heat transfer as a turbulent boundary layer.
【００３９】以下、本発明の実施の形態について、図１
〜１３を用いて説明する。FIG. 1 shows the embodiment of the present invention.
This will be described with reference to Nos.
【００４０】（実施の形態１）図１は本発明の実施の形
態１における冷却装置の構成図、図２は本発明の実施の
形態１における冷却装置を構成する熱交換型の遠心ポン
プの構成図、図３は本発明の実施の形態１における遠心
ポンプの羽根車正面図、図４は本発明の実施の形態１に
おける遠心ポンプの流体軸受の展開図、図５は本発明の
実施の形態１における遠心ポンプのポンプ室内壁面の外
観図、図６（ａ）は本発明の実施の形態１における遠心
ポンプの羽根車に取り付けたブラシの説明図、図６
（ｂ）は本発明の実施の形態１における遠心ポンプの羽
根車に取り付けたブレードの説明図、図７は図２の遠心
ポンプのＸ−Ｘ断面図である。(Embodiment 1) FIG. 1 is a configuration diagram of a cooling device according to Embodiment 1 of the present invention, and FIG. 2 is a configuration of a heat exchange type centrifugal pump constituting the cooling device according to Embodiment 1 of the present invention. 3 is a front view of an impeller of a centrifugal pump according to Embodiment 1 of the present invention, FIG. 4 is a development view of a fluid bearing of the centrifugal pump according to Embodiment 1 of the present invention, and FIG. 5 is an embodiment of the present invention. 6 is an external view of the inner wall surface of the pump chamber of the centrifugal pump in FIG. 1, FIG. 6A is an explanatory view of a brush attached to the impeller of the centrifugal pump in the first embodiment of the present invention, FIG.
(B) is explanatory drawing of the blade attached to the impeller of the centrifugal pump in Embodiment 1 of this invention, FIG. 7 is XX sectional drawing of the centrifugal pump of FIG.
【００４１】図１において、１は冷却装置を構成する接
触熱交換型の遠心ポンプ、２はＣＰＵ等の発熱電子部品
であり、通常は表面がフラットなチップ部品である。な
お、実施の形態１の遠心ポンプ１と発熱電子部品２は、
きわめて小型で、ノート型パソコンのように携行可能な
小型の電子機器に搭載されるものである。３は発熱電子
部品２から受熱した冷媒を外部に放熱する放熱器、４は
遠心ポンプ１と放熱器３を接続して冷媒を循環するため
の循環路である。なお、この冷媒としては、食品添加物
などに用いられる無害なプロピレングリコール水溶液が
適当であり、さらに後述するようにケーシング材料とし
てアルミや銅等を使用する場合には、これらに対する防
食性能を向上させるための防食添加剤を添加するのが望
ましい。In FIG. 1, reference numeral 1 is a contact heat exchange type centrifugal pump which constitutes a cooling device, and 2 is a heat generating electronic component such as a CPU, which is usually a chip component having a flat surface. The centrifugal pump 1 and the heat-generating electronic component 2 according to the first embodiment are
It is extremely small and will be installed in a small electronic device that can be carried around like a notebook computer. 3 is a radiator for radiating the heat received from the heat-generating electronic component 2 to the outside, and 4 is a circulation path for connecting the centrifugal pump 1 and the radiator 3 to circulate the refrigerant. As this refrigerant, a harmless propylene glycol aqueous solution used for food additives is suitable, and when aluminum or copper is used as a casing material as described later, it improves the anticorrosion performance against them. It is desirable to add an anticorrosion additive for the purpose.
【００４２】放熱器３は、熱伝導率が高く放熱性のよい
材料、例えば銅、アルミニウム等の薄板材で構成され、
内部に冷媒通路とリザーブタンクが形成されている。ま
た、放熱器３に強制的に空気を当てて冷やし冷却効果を
増やすためファンを設けてもよい。循環路４は、配管レ
イアウトの自由度を確保するため、フレキシブルでガス
透過性の少ないゴム、例えばブチルゴムなどのゴムチュ
ーブで構成されている。これはチューブ内に気泡が混入
するのを防止するためである。The radiator 3 is made of a material having a high heat conductivity and a good heat dissipation property, for example, a thin plate material such as copper or aluminum.
A refrigerant passage and a reserve tank are formed inside. Further, a fan may be provided to forcibly apply air to the radiator 3 to cool it and increase the cooling effect. The circulation path 4 is made of a flexible rubber tube having a low gas permeability, for example, a rubber tube such as butyl rubber in order to ensure the flexibility of the piping layout. This is to prevent air bubbles from entering the tube.
【００４３】次に、遠心ポンプ１の内部構成について説
明する。図２〜図６（ａ），（ｂ）において、１１は遠
心ポンプの開放型の羽根車、１１ａは羽根車１１に設け
られた貫通孔、１２は羽根車１１の開放した羽根、１３
は羽根車１１の外周側方に設けられたマグネットロータ
である。１４はマグネットロータ１３の内周側に設けら
れたステータ、１５は羽根車１１を収容すると同時に羽
根車１１が流体に与えた運動エネルギーを圧力回復して
吐出口へと導くポンプケーシング、１５ａは羽根１２で
与えられた運動エネルギーを圧力回復して吐出口へと導
くためのポンプ室、１５ｂはポンプ室１５ａに沿ったポ
ンプケーシング１５の側面に形成され、発熱電子部品に
接触して熱を奪う受熱面、１５ｃはポンプ室１５ａの内
部のポンプ室内壁面、１６は羽根車１１を収納した後ポ
ンプ室１５ｂを密閉するためのケーシングカバー、１７
はポンプケーシング１５に設けられ、羽根車１１を回転
自在に軸支するための固定軸、１８は羽根車１１の中心
に設けられ固定軸１７に装着される軸受、１８ａは流体
軸受の場合の動圧発生溝（図４参照）である。１９は吸
込路、１９ａは吸水口、２０は吐出路である。２１はポ
ンプ室内壁面１５ｃに形成された層流境界層を多数の凹
部、２２は層流境界層を掻き取るブラシ（本発明の弾性
線状体）、２２は層流境界層を掻き取るブレード（本発
明の弾性板状体）である。Next, the internal structure of the centrifugal pump 1 will be described. 2 to 6 (a) and 6 (b), 11 is an open type impeller of a centrifugal pump, 11a is a through hole provided in the impeller 11, 12 is an open blade of the impeller 11, 13
Is a magnet rotor provided on the outer peripheral side of the impeller 11. Reference numeral 14 is a stator provided on the inner peripheral side of the magnet rotor 13, 15 is a pump casing that accommodates the impeller 11, and at the same time recovers the kinetic energy applied to the fluid by the impeller 11 to guide it to the discharge port. A pump chamber for recovering the pressure of the kinetic energy given by 12 and guiding it to the discharge port, 15b is formed on the side surface of the pump casing 15 along the pump chamber 15a, and receives heat by contacting the heat-generating electronic components to remove heat. 15 c is a wall surface of the pump chamber inside the pump chamber 15 a, 16 is a casing cover for sealing the pump chamber 15 b after housing the impeller 11, and 17
Is a fixed shaft provided in the pump casing 15 for rotatably supporting the impeller 11, 18 is a bearing provided in the center of the impeller 11 and mounted on the fixed shaft 17, and 18a is a dynamic bearing. It is a pressure generating groove (see FIG. 4). Reference numeral 19 is a suction passage, 19a is a water inlet, and 20 is a discharge passage. Reference numeral 21 is a large number of recesses in the laminar flow boundary layer formed on the wall surface 15c of the pump chamber, 22 is a brush for scraping the laminar flow boundary layer (the elastic linear member of the present invention), and 22 is a blade for scraping the laminar flow boundary layer ( The elastic plate-like body of the present invention).
【００４４】ケーシングカバー１６はポンプケーシング
１５と組み立てられて全体として遠心ポンプ１のポンプ
ケーシングを構成する。ポンプケーシング１５とケーシ
ングカバー１６のうち少なくともポンプケーシング１５
は、高熱伝導率で放熱性のよい材料、例えば銅、アルミ
ニウム等で構成する。なお、本実施の形態１の遠心ポン
プは回転軸方向の厚さが５〜１０ｍｍ、半径方向の代表
寸法が４０〜５０ｍｍ、回転数は１２００ｒｐｍ、流量
が０．０８〜０．１２Ｌ／分、ヘッドが０．３５〜０．
４５ｍ程度のポンプである。そして、本発明のポンプの
諸元は、本実施の形態１の値を含んで、厚さ３〜２０ｍ
ｍ、半径方向代表寸法１０〜７０ｍｍ、流量が０．０１
〜０．８Ｌ／分、ヘッド０．１〜２ｍ程度のものとな
る。これは比速度でいうと、２４〜２８（単位：ｍ、ｍ
3／分、ｒｐｍ）程度のポンプであって、従来のポンプ
とはまったく隔絶した大きさの小型薄型のポンプであ
る。The casing cover 16 is assembled with the pump casing 15 to form the pump casing of the centrifugal pump 1 as a whole. At least the pump casing 15 among the pump casing 15 and the casing cover 16
Is made of a material having high thermal conductivity and good heat dissipation, such as copper or aluminum. The centrifugal pump according to the first embodiment has a thickness of 5 to 10 mm in the rotation axis direction, a representative dimension of 40 to 50 mm in the radial direction, a rotation speed of 1200 rpm, a flow rate of 0.08 to 0.12 L / min, and a head. Is 0.35 to 0.
It is a pump of about 45 m. The specifications of the pump of the present invention include the values of the first embodiment, and the thickness is 3 to 20 m.
m, representative dimension in radial direction 10 to 70 mm, flow rate 0.01
The head is about 0.8 L / min and the head is about 0.1 to 2 m. In terms of specific speed, this is 24-28 (unit: m, m
It is a pump of about 3 / min, rpm) and is a small and thin pump that is completely isolated from the conventional pump.
【００４５】実施の形態１の遠心ポンプ１においては、
羽根車１１の羽根１２と発熱電子部品２とが対向するよ
うに設置され、発熱電子部品２の上部表面と相補的な形
状となる受熱面１５ｂが形成されており、受熱面１５ｂ
を介してポンプ室１５ａで直接受熱を行なう。ステータ
１４はケーシングカバー１６に圧入され、マグネットロ
ータ１３の内周面とステータ１４の外周部分が対向して
配置される。In the centrifugal pump 1 of the first embodiment,
The blade 12 of the impeller 11 and the heat generating electronic component 2 are installed so as to face each other, and a heat receiving surface 15b having a shape complementary to the upper surface of the heat generating electronic component 2 is formed.
Heat is directly received in the pump chamber 15a via the. The stator 14 is press-fitted into the casing cover 16, and the inner peripheral surface of the magnet rotor 13 and the outer peripheral portion of the stator 14 are arranged to face each other.
【００４６】ステータ１４とマグネットロータ１３の間
にはケーシングカバー１６が両者を仕切る分離板として
配置され、ステータ１４は完全にポンプ室１５ａ内を流
れる冷媒と隔離される。羽根車１１はマグネットロータ
１３と別体構成でもよいが、実施の形態１においては一
体で構成され、マグネットロータ１３となる円筒部に着
磁させた一体型の羽根車１１としている。マグネットロ
ータ１３がステータ１４の回転磁界の作用で回転するこ
とにより、羽根車１１が回転する。羽根車１１が回転す
ると、羽根車１１の中心付近に負圧が発生し、連通して
いる吸込路１９から冷媒が吸い込まれ、羽根車１１によ
って運動量を得て外側に吐き出される。羽根車１１の外
周部分には吐出口（図示しない）が設けられ、吐出路２
０を経て冷媒は循環路４に排出される。A casing cover 16 is arranged between the stator 14 and the magnet rotor 13 as a separating plate for partitioning the two, and the stator 14 is completely isolated from the refrigerant flowing in the pump chamber 15a. The impeller 11 may be configured separately from the magnet rotor 13, but in the first embodiment, the impeller 11 is integrally configured, and the impeller 11 is an integral type that is magnetized in a cylindrical portion that becomes the magnet rotor 13. The impeller 11 rotates as the magnet rotor 13 rotates by the action of the rotating magnetic field of the stator 14. When the impeller 11 rotates, negative pressure is generated in the vicinity of the center of the impeller 11, the refrigerant is sucked from the communicating suction passage 19, and the impeller 11 obtains momentum and is discharged to the outside. A discharge port (not shown) is provided in the outer peripheral portion of the impeller 11, and the discharge passage 2
After 0, the refrigerant is discharged to the circulation path 4.
【００４７】羽根車１１の中心には低摩擦で耐磨耗性の
セラミックからなる軸受１８が圧入され、さらにこれと
同様に、その内側にはセラミックからなる固定軸１７が
ポンプケーシング１５とケーシングカバー１６に両端を
固定されて配設される。図２に示すように、軸受１８の
外周面にはＤカットを施し、羽根車１１の軸受圧入孔
（図示しない）との間に隙間ができるように構成され、
羽根車１１の背面側とポンプ室１５ａ側を連通してい
る。この隙間が軸中心からずれた実施の形態１における
貫通孔１１ａである。この貫通孔１１ａにより、羽根車
１１で遠心力を受け押し出された冷媒の一部分は羽根車
１１の背面側に回り込み、貫通孔１１ａを通って負圧状
態の羽根車１１の吸水口１９ａに流出する。すなわち、
遠心ポンプ１の中で一部の冷媒が還流している。還流す
る冷媒は吸水口１９ａ内で混合され、再度還流する冷媒
は入れ替わったものとなる。A bearing 18 made of ceramic having low friction and wear resistance is press-fitted in the center of the impeller 11, and similarly, a fixed shaft 17 made of ceramic is provided inside the bearing 18 and the pump casing 15 and the casing cover. Both ends are fixed to 16 and arranged. As shown in FIG. 2, the outer peripheral surface of the bearing 18 is D-cut so that a gap is formed between the bearing 18 and a bearing press-fitting hole (not shown) of the impeller 11.
The back side of the impeller 11 and the pump chamber 15a side communicate with each other. This gap is the through hole 11a in the first embodiment that is deviated from the axial center. Through this through hole 11a, a part of the refrigerant that has been pushed out by the centrifugal force by the impeller 11 wraps around to the back side of the impeller 11 and flows out through the through hole 11a to the water suction port 19a of the impeller 11 in the negative pressure state. . That is,
Some of the refrigerant is circulating in the centrifugal pump 1. Refrigerant that recirculates is mixed in the water intake port 19a, and refrigerant that recirculates is replaced.
【００４８】羽根車１１による遠心力で羽根車１１の中
心付近は負圧となり、この付近はキャビテーションが発
生し易い環境にある。しかし、実施の形態１の遠心ポン
プ１は比速度で２４〜２８（単位：ｍ、ｍ3／分、ｒｐ
ｍ）程度であってキャビテーションは起こり難い上に、
仮に発生しても上述した還流によって混合して排出され
るものである。そして、発生したキャビティが羽根車１
１の中央付近に留まろうとしても、羽根車１１の背面と
吸水口１９ａ側で冷媒が入れ替わりながら循環するの
で、滞留することはない。また、冷却装置のどこかで空
気が混入し、これが遠心ポンプ１に吸い込まれたとして
も、還流によって羽根車１１の中央付近に滞留すること
がなく、気泡は徐々に排出される。従ってキャビテーシ
ョンに原因する騒音は少なく、気層が形成されないし、
流れが乱流化するため伝熱量も大きくなる。Due to the centrifugal force of the impeller 11, a negative pressure is generated in the vicinity of the center of the impeller 11, and in the vicinity of this, cavitation is likely to occur. However, the centrifugal pump 1 of the first embodiment has a specific speed of 24-28 (unit: m, m 3 / min, rp
m) and cavitation is unlikely to occur,
Even if it occurs, it is mixed and discharged by the above-mentioned reflux. And the generated cavity is the impeller 1
Even if it tries to stay near the center of 1, the refrigerant circulates while being exchanged between the back surface of the impeller 11 and the water suction port 19a side, and therefore does not stay. Further, even if air is mixed somewhere in the cooling device and is sucked into the centrifugal pump 1, it does not stay in the vicinity of the center of the impeller 11 due to the reflux, and the bubbles are gradually discharged. Therefore, the noise caused by cavitation is small, the air layer is not formed,
Since the flow becomes turbulent, the amount of heat transfer also increases.
【００４９】また、図４に示すように軸受１８の代わり
に流体軸受を用いてもよい。流体軸受の動圧発生溝１８
ａをスパイラル形状として、循環を促進するようにすれ
ば、気泡の排出性能を向上させることができる。動圧発
生溝１８ａの形状としてはヘリングボーン形状などでも
よい。羽根車１１の背面にも溝を形成し循環量と背圧を
調整することもできる。これによって羽根車１１に対す
るアキシャル方向のスラストを発生することもできる。A fluid bearing may be used instead of the bearing 18 as shown in FIG. Hydrodynamic bearing groove 18 for hydrodynamic bearing
If a is formed into a spiral shape to promote circulation, the bubble discharging performance can be improved. The dynamic pressure generating groove 18a may have a herringbone shape or the like. It is also possible to adjust the circulation amount and the back pressure by forming a groove on the back surface of the impeller 11. As a result, thrust in the axial direction with respect to the impeller 11 can also be generated.
【００５０】さらに図５に示すように、ポンプ室内壁面
１５ｃ（受熱面１５ｂの背面側）の羽根１２がスライド
する部分の少なくとも一部に凹部２１を多数形成するこ
とにより、羽根車１１の回転で流動する冷媒がポンプ室
内壁面１５ｃに沿って形成する層流境界層を剥離させ、
乱流化することができる。これによって受熱面１５ｂか
ら冷媒に伝達する熱量を大きくすることができる。同様
に、ポンプ室内壁面１５ｃをショットピーニング加工、
サンドブラスト加工などで凹凸を形成もしくは粗くする
ことにより、効果は多少低いが同様な原理で受熱効率を
上げることが可能となる。さらに、図６に示すように、
羽根１２だけでなく、ポンプ室内壁面１５ｃを軽く擦る
ようなブラシ２２や薄板状のブレード２３を羽根車に取
り付けることにより、羽根車１１の回転力により強制的
に層流境界層を崩し、受熱効率を向上させることができ
る。なお、図示はしないが、ポンプ室内壁面１５ｃにス
パイラル形状の溝を形成しても、乱流化することで伝熱
量を大きくすることができる。Further, as shown in FIG. 5, a large number of recesses 21 are formed in at least a part of the portion of the pump chamber inner wall surface 15c (on the rear side of the heat receiving surface 15b) where the blades 12 slide, so that the impeller 11 can rotate. The flowing refrigerant separates the laminar boundary layer formed along the inner wall surface 15c of the pump chamber,
Can be turbulent. As a result, the amount of heat transferred from the heat receiving surface 15b to the refrigerant can be increased. Similarly, the pump chamber wall surface 15c is shot peened,
By forming irregularities or roughening by sandblasting or the like, the effect is somewhat low, but it is possible to increase the heat receiving efficiency by the same principle. Furthermore, as shown in FIG.
By attaching not only the blade 12 but also the brush 22 and the thin blade 23 that lightly rub the inner wall surface 15c of the pump chamber to the impeller, the rotational force of the impeller 11 forcibly collapses the laminar boundary layer to improve the heat receiving efficiency. Can be improved. Although not shown, even if a spiral groove is formed on the inner wall surface 15c of the pump chamber, the heat transfer amount can be increased by making the flow turbulent.
【００５１】発熱量に比べケーシングから冷媒への伝達
係数が充分大きくとれ、大きな熱伝達量が得られる場合
は、熱をポンプ室１５ａに沿って広げる必要がなくなる
ため、ポンプケーシング１５の受熱面１５ｂ部分の肉厚
は薄い方が受熱効率がよくなり、ポンプを薄型にもでき
る。このために図７に示すように吸込路１９を肉厚方向
に短軸をもつ楕円形状の断面とするのが好適である。羽
根車１１の回転を障害しない範囲で伝熱面積を増やすた
めに、ポンプ室内壁面１５ｃの羽根１２の側面がスライ
ドする部分の少なくとも一部に小さな柱状体やリブ等の
突起体を突出させ、伝熱面積が増加させるとともに乱流
化を促進し、受熱量が増加させることができる。これら
の柱状体やリブ等は、発熱電子部品２の中心を置く位置
近傍に設けるのが受熱効率を増加する。そして発熱電子
部品２の中心を羽根車１１の軸中心に配置させるときに
は、羽根車１１の軸中心付近に立設すればよい。When the coefficient of transfer from the casing to the refrigerant is sufficiently large compared to the amount of heat generation and a large amount of heat transfer is obtained, there is no need to spread the heat along the pump chamber 15a, so the heat receiving surface 15b of the pump casing 15 is not necessary. The thinner the wall thickness, the better the heat receiving efficiency and the thinner the pump can be. Therefore, as shown in FIG. 7, it is preferable that the suction passage 19 has an elliptical cross section having a minor axis in the thickness direction. In order to increase the heat transfer area within the range where the rotation of the impeller 11 is not hindered, a projection such as a small columnar body or rib is projected on at least a part of the side surface of the blade 12 of the pump chamber inner wall surface 15c to slide, The heat area can be increased and turbulence can be promoted, and the amount of heat received can be increased. These columnar bodies, ribs and the like are provided near the position where the center of the heat-generating electronic component 2 is placed to increase the heat receiving efficiency. When the center of the heat-generating electronic component 2 is arranged at the axial center of the impeller 11, it may be installed upright near the axial center of the impeller 11.
【００５２】以上説明したように、実施の形態１の冷却
装置の遠心ポンプ１には、高熱伝導率の材料で構成され
たポンプケーシング１５と、羽根１２が形成された開放
型の羽根車１１が設けられており、また、受熱面１５ｂ
と発熱電子部品２の上部表面の形状が３次元的に相補的
形状とされ、且つ受熱面１５ｃとポンプ室内壁面１５ｃ
との間（ポンプケーシング１５の肉厚部分）に肉厚方向
に短軸をもつ楕円形状の吸込路１９が配設されているた
め、全体の肉厚も流路近傍の実質の肉厚も薄くすること
ができ、吸込路１９近傍の受熱面１５ｂの温度が下が
り、吸込路１９が発熱電子部品２の側に張り出していな
いので、受熱面１５ｂに遠心ポンプ１の内部事情で形状
変化を加える必要がなく、受熱面１５ｂと発熱電子部品
２の上部表面が密着できるため、効果的に受熱できる。As described above, the centrifugal pump 1 of the cooling device according to the first embodiment includes the pump casing 15 made of a material having high thermal conductivity and the open type impeller 11 having the vanes 12. It is provided and the heat receiving surface 15b
And the shape of the upper surface of the heat-generating electronic component 2 is three-dimensionally complementary, and the heat receiving surface 15c and the pump chamber inner wall surface 15c
Since the elliptical suction passage 19 having a short axis in the thickness direction is disposed between the and (the thick portion of the pump casing 15), the overall thickness and the substantial thickness near the flow passage are thin. Since the temperature of the heat receiving surface 15b in the vicinity of the suction passage 19 decreases and the suction passage 19 does not project to the heat-generating electronic component 2 side, it is necessary to change the shape of the heat receiving surface 15b depending on the internal circumstances of the centrifugal pump 1. Since the heat receiving surface 15b and the upper surface of the heat-generating electronic component 2 can be brought into close contact with each other, heat can be effectively received.
【００５３】（実施の形態２）実施の形態２の遠心ポン
プは、吸水口が羽根車の背面側に設置されたことを特徴
とするものである。図８は本発明の実施の形態２におけ
る冷却装置を構成する熱交換型の遠心ポンプの構成図、
図９は本発明の実施の形態２における遠心ポンプの羽根
車の正面図、図１０は本発明の実施の形態２における遠
心ポンプが回転短軸を備えた羽根車の構成図、図１１は
本発明の実施の形態２における遠心ポンプのポンプ室内
壁面の正面図、図１２は本発明の実施の形態２における
遠心ポンプのポンプケーシング厚さが半径方向に減少す
る構成図である。なお、実施の形態２の遠心ポンプは実
施の形態１の遠心ポンプと同一の構成部分を有している
ため、同一符号の説明は省略する。(Second Embodiment) The centrifugal pump according to the second embodiment is characterized in that the water inlet is installed on the back side of the impeller. FIG. 8 is a configuration diagram of a heat exchange type centrifugal pump that constitutes a cooling device according to Embodiment 2 of the present invention,
9 is a front view of an impeller of a centrifugal pump according to a second embodiment of the present invention, FIG. 10 is a configuration diagram of an impeller in which a centrifugal pump according to a second embodiment of the present invention includes a rotating short shaft, and FIG. 11 is a book. 12 is a front view of the inner wall surface of the pump chamber of the centrifugal pump according to the second embodiment of the invention, and FIG. 12 is a configuration diagram in which the pump casing thickness of the centrifugal pump according to the second embodiment of the present invention decreases in the radial direction. Since the centrifugal pump of the second embodiment has the same components as the centrifugal pump of the first embodiment, the description of the same reference numerals is omitted.
【００５４】図８において、１９ｂは吸込路１９とつな
がった吸水口であり、羽根車１１の中心近傍に設けら
れ、背面側とポンプ室１５ａ側とを貫通するものであ
る。この吸水口１９ｂは、図９に示すように半径方向の
同位置にずれて設けられた３個の貫通孔から構成され
る。吸込路１９はケーシングカバー１６のステータ１４
の中央に設けられており、吸水口１９ｂと連通する。固
定軸１７、軸受１８は実施の形態１と同様に配置され
る。In FIG. 8, 19b is a water inlet connected to the suction passage 19, which is provided near the center of the impeller 11 and penetrates the back side and the pump chamber 15a side. As shown in FIG. 9, the water suction port 19b is composed of three through holes provided at the same radial positions. The suction passage 19 is the stator 14 of the casing cover 16.
It is provided in the center of and communicates with the water suction port 19b. The fixed shaft 17 and the bearing 18 are arranged as in the first embodiment.
【００５５】このように、吸込路１９を受熱面１５ｂと
反対側に配置したことにより、ポンプケーシング１５の
受熱面１５ｂ側の肉厚を薄くすることができ、発熱量に
比べケーシングから冷媒への伝達係数が充分大きくと
れ、大きな熱伝達量が得られる場合は、熱をポンプ室１
５ａに沿って広げる必要がなく、受熱効率を増すことが
できる。また、羽根車１１の中心近くに吸水口１９ｂを
設けることにより、羽根車１１の背面から冷媒を吸い込
むことができる。By thus disposing the suction passage 19 on the side opposite to the heat receiving surface 15b, the wall thickness of the pump casing 15 on the heat receiving surface 15b side can be made thin, and the amount of heat generated from the casing to the refrigerant is smaller than that of the heat generation amount. When the transfer coefficient is sufficiently large and a large amount of heat transfer is obtained, heat is transferred to the pump chamber 1
The heat receiving efficiency can be increased without having to spread it along 5a. Further, by providing the water suction port 19b near the center of the impeller 11, the refrigerant can be sucked from the back surface of the impeller 11.
【００５６】なお、図１０（ａ），（ｂ）に示すよう
に、固定軸を取り除いて、羽根車１１の背面から冷媒を
吸い込む構成としてもよい。図１０（ａ）において、１
６ａはケーシングカバー、１６ｂはケーシングカバー１
６ａの中央に設けられ吸込路１９が内部に設けられる筒
部、１７ａは羽根車１１の中央に設けられた回転短軸、
１８ｂは筒部１６ｂに設けられ回転短軸１７ａが挿入さ
れて軸支する軸受、１９ｃは羽根車１１の軸中心に形成
された貫通孔からなる吸水口である。２４は吸水口１９
ｃと対向するポンプ室内壁面１５ｃ中央に設けられた柱
状体やリブ等の突起体である。なお、実施の形態２の場
合、突起体２４は円柱である。また図１０（ｂ）におい
て、１１ｃは羽根１２の入口側もしくは羽根１２間に設
けられた根車突起体である。As shown in FIGS. 10A and 10B, the fixed shaft may be removed and the refrigerant may be sucked from the back surface of the impeller 11. In FIG. 10A, 1
6a is a casing cover, 16b is a casing cover 1
6a is a cylindrical portion provided at the center of the impeller 11 and a suction passage 19 is provided therein. 17a is a rotating short shaft provided at the center of the impeller 11.
Reference numeral 18b is a bearing provided on the cylindrical portion 16b and axially supporting the rotating short shaft 17a inserted therein, and 19c is a water intake port formed of a through hole formed at the axial center of the impeller 11. 24 is a water intake 19
It is a protrusion such as a columnar member or a rib provided in the center of the wall surface 15c of the pump chamber that faces c. In addition, in the case of the second embodiment, the protrusion 24 is a column. Further, in FIG. 10B, 11 c is a root car projection provided on the inlet side of the blade 12 or between the blades 12.
【００５７】このように吸水口１９ｃによって、背面側
の吸込路１９とポンプ室１５ａを連通させ、羽根車１１
の背面側からの吸込みが可能となる。発熱電子部品２と
反対側からの吸い込みにより、受熱面１５ｂのポンプ室
壁面１５ｃに冷媒を直接噴射する噴流効果も加わって、
高効率の受熱が可能となる。As described above, the suction port 19 on the rear side is communicated with the pump chamber 15a by the water suction port 19c, and the impeller 11
It is possible to inhale from the back side of. By the suction from the side opposite to the heat-generating electronic component 2, a jet effect of directly injecting the refrigerant to the pump chamber wall surface 15c of the heat receiving surface 15b is also added,
Highly efficient heat reception is possible.
【００５８】また、ポンプ室内壁面１５ｃから突起体２
４が突出されることにより、受熱面積が増加し、受熱量
を大幅に向上させることができる。また突起体２４によ
り、ポンプ室内壁面１５ｃで乱流を発生させ、受熱効率
を向上させることができる。羽根車１１の中央部分には
羽根１２が存在しないため、この部分に突起体２４を設
けるのが容易であり、とくに発熱電子部品２の中心が設
置バランス上、羽根車１１の中央に位置することが多い
ので、この部分に突起体２４を設けることにより局所的
に受熱効率を向上させることができる。すなわち、羽根
車１１の中央で吸水するため、この位置に突起体２４を
設けることは、発熱電子部品２の熱が一番高く冷媒との
温度差を最も大きいため、伝熱量が大きくなる。また、
この部分で突起体２４を設けることにより伝熱面積を増
加させるため、熱抵抗を減少させることができ熱量の移
動を促進できる。さらに、噴流効果による受熱効率向上
が望めるものである。そして突起体２４で乱流が発生
し、これによる受熱効率向上もアップする。なお、突起
体２４に代えて溝を形成するのでも、同様の作用効果が
期待できる。Further, from the wall surface 15c of the pump chamber to the projection 2
By projecting 4 the heat receiving area is increased and the amount of heat received can be greatly improved. Further, due to the projection 24, turbulent flow can be generated on the inner wall surface 15c of the pump chamber, and the heat receiving efficiency can be improved. Since the blade 12 does not exist in the central portion of the impeller 11, it is easy to provide the protrusion 24 in this portion, and in particular, the center of the heat-generating electronic component 2 should be located at the center of the impeller 11 in terms of installation balance. Therefore, the heat receiving efficiency can be locally improved by providing the protrusion 24 in this portion. That is, since water is absorbed at the center of the impeller 11, providing the projection 24 at this position causes the heat of the heat-generating electronic component 2 to be the highest and the temperature difference with the refrigerant to be the largest, so that the amount of heat transfer becomes large. Also,
Since the heat transfer area is increased by providing the protrusion 24 at this portion, the thermal resistance can be reduced and the transfer of the amount of heat can be promoted. Furthermore, it is expected that the heat receiving efficiency will be improved by the jet effect. Then, a turbulent flow is generated in the projection 24, which improves heat receiving efficiency. Even if a groove is formed instead of the protrusion 24, the same effect can be expected.
【００５９】さらに、図１０（ｂ）に示すように、ポン
プ室１５ａの羽根１２の入口側に突起体２４を設け、こ
の突起体２４と半径方向にみていわば噛み合うような配
置で攪拌用羽根車突起体１１ｃを設けるのが好適であ
る。望ましくは攪拌用羽根車突起体１１ｃを螺旋状に配
置させるのがよい。接触を避けるため、突起体２４は攪
拌用羽根車突起体１１ｃと同心円上に位置しないよう
に、半径方向にずれた位置で対向して設ける必要があ
る。攪拌用羽根車突起体１１ｃと突起体２４の攪拌作用
によって羽根１２の入口側で乱流化が促進され、また突
起体２４の存在で放熱面積が増していることもあり、受
熱効率がきわめて向上する。実験によれば、３０００ｒ
ｐｍで、この構成による熱伝導率は６０００Ｗ／ｍ2Ｋ
近傍を示し、受熱面１５ｂから冷媒に最大の熱量を放熱
することができる。Further, as shown in FIG. 10 (b), a protrusion 24 is provided on the inlet side of the blade 12 of the pump chamber 15a, and the impeller for stirring is arranged so as to mesh with the protrusion 24 in the radial direction. It is preferable to provide the protrusion 11c. It is desirable to arrange the stirring impeller projections 11c in a spiral shape. In order to avoid contact, it is necessary that the protrusion 24 is provided so as to face the stirring impeller protrusion 11c at a position displaced in the radial direction so as not to be located on the concentric circle. The stirring action of the stirring impeller projection 11c and the projection 24 promotes turbulent flow at the inlet side of the blade 12, and the presence of the projection 24 increases the heat dissipation area. To do. According to the experiment, 3000r
pm, the thermal conductivity of this configuration is 6000 W / m 2 K
It shows the vicinity and can radiate the maximum amount of heat from the heat receiving surface 15b to the refrigerant.
【００６０】また、発熱電子部品２の接触面積が羽根１
２の回転面積より小さく、受熱した熱をポンプ室１５ａ
に沿った側面に広げる必要がある場合には、薄い肉厚の
ポンプケーシングより、図１２に示すように中心部が盛
り上がったポンプ室内壁面１５ｃが受熱効率の向上には
貢献する。図１２において、１５ｄはポンプケーシング
１５の肉厚が羽根車１１の軸中心を中心として半径方向
に減少するように構成したポンプ室内壁面である。熱流
束は通過する断面積が大きかったり、熱伝導率が大きい
などといった熱抵抗が小さい部分を流れ易く、肉厚が半
径方向に減少するポンプ室内壁面１５ｄとすることによ
り、熱をポンプ室１５ａに沿った側面にまで広げること
ができる。Further, the contact area of the heat-generating electronic component 2 is the blade 1
2 is smaller than the rotation area and the heat received is pump chamber 15a.
When it is necessary to spread it to the side surface along with, the pump chamber wall surface 15c having a raised central portion as shown in FIG. 12 contributes to the improvement of the heat receiving efficiency, rather than the thin pump casing. In FIG. 12, reference numeral 15d denotes a pump chamber inner wall surface configured so that the wall thickness of the pump casing 15 is reduced in the radial direction around the axis center of the impeller 11. The heat flux easily flows through a portion having a small thermal resistance such as a large cross-sectional area through which the heat flux passes or a large thermal conductivity, and the wall thickness of the pump chamber wall surface 15d in which the wall thickness is reduced in the radial direction allows heat to reach the pump chamber 15a. It can be spread to the side along.
【００６１】ところで、図１０で示した遠心ポンプの構
成においては、マグネットロータ１３の周方向内周面と
外周面、羽根車１１の表面にへリングボーン形状等の溝
を形成して羽根車１１を流体の動圧で保持するととも
に、ケーシングカバー１６ａの筒部１６ｂの軸受１８ｂ
と羽根車１１の中央に設けられた回転短軸１７ａとの間
で軸支するから、簡単な構成で羽根車１１の安定した円
滑な回転を確保し、伝熱を促進させることができる。By the way, in the configuration of the centrifugal pump shown in FIG. 10, the impeller 11 is formed by forming herringbone-shaped grooves on the inner and outer circumferential surfaces of the magnet rotor 13 and the surface of the impeller 11. Is held by the dynamic pressure of the fluid, and the bearing 18b of the tubular portion 16b of the casing cover 16a is held.
Since it is rotatably supported between the rotating short shaft 17a provided at the center of the impeller 11, stable and smooth rotation of the impeller 11 can be secured with a simple configuration, and heat transfer can be promoted.
【００６２】（実施の形態３）実施の形態３の遠心ポン
プは、羽根車１１を円盤状とし、羽根車１１に着磁した
ものである。図１３は本発明の実施の形態３における冷
却装置を構成する熱交換型の遠心ポンプの構成図であ
る。図１３において、１１ｂは羽根車１１の背面に着磁
されて設けられたマグネットである。マグネット１１ｂ
は、別体の平板状の磁石を羽根車に取り付けることで形
成するのでもよい。さらに実施の形態１，２と同様に、
受熱効率を向上させうるために、ポンプ室壁面１５ｃに
凹部や柱状体、羽根車１１にブラシ、ブレードを設けた
り、中心部の肉厚を増したりもできる。(Embodiment 3) In the centrifugal pump of Embodiment 3, the impeller 11 has a disk shape and is magnetized. FIG. 13 is a configuration diagram of a heat exchange type centrifugal pump that constitutes a cooling device according to the third embodiment of the present invention. In FIG. 13, 11b is a magnet that is magnetized and provided on the back surface of the impeller 11. Magnet 11b
May be formed by attaching a separate flat magnet to the impeller. Furthermore, as in the first and second embodiments,
In order to improve the heat receiving efficiency, it is possible to provide a recess or a columnar body on the pump chamber wall surface 15c, a brush or a blade on the impeller 11, or increase the thickness of the central portion.
【００６３】このように実施の形態３の遠心ポンプ１
は、軸方向の厚さを薄型にすることができ、ノート型パ
ソコンのように携行可能な小型の電子機器に搭載するこ
とにより、発熱電子機器２の冷却を効果的に行うことが
できる。Thus, the centrifugal pump 1 according to the third embodiment
Can be made thin in the axial direction, and can be effectively cooled by being mounted in a small portable electronic device such as a laptop computer.
【００６４】[0064]
【発明の効果】本発明の冷却装置によれば、開放型の羽
根車の羽根がポンプ室内部に形成される層流境界層を剥
ぎ取るため乱流化して伝熱量が増し、吸込路が受熱面と
ポンプ室の内壁面との間に設けられているので、これに
よって吸込路近傍の受熱面の温度を下げることができ、
吸込路が発熱電子部品の側に張り出していないので、受
熱面に遠心ポンプの内部構成による形状の変化を形成す
る必要がなく、受熱面と発熱電子部品の上部表面が密着
しているので、熱を効果的に受熱することができる。According to the cooling device of the present invention, the blades of the open type impeller strip the laminar boundary layer formed inside the pump chamber to make it turbulent and increase the amount of heat transfer, so that the suction passage receives heat. Since it is provided between the surface and the inner wall surface of the pump chamber, it is possible to lower the temperature of the heat receiving surface near the suction passage,
Since the suction passage does not project to the side of the heat-generating electronic component, it is not necessary to form a shape change on the heat-receiving surface due to the internal configuration of the centrifugal pump, and the heat-receiving surface and the upper surface of the heat-generating electronic component are in close contact with each other. Can effectively receive heat.
【００６５】肉厚方向に短軸をもつ楕円形状の断面を有
してため、ポンプ室と発熱部品との距離を縮めることが
できるために、その間の熱抵抗を下げることができる。Since it has an elliptical cross section having a minor axis in the thickness direction, the distance between the pump chamber and the heat generating component can be shortened, and therefore the thermal resistance between them can be reduced.
【００６６】吸水口と連通する吸込路が受熱面と対向す
るポンプケーシング側に設けられたため、ポンプ室の受
熱面と反対側から吸い込むことを可能とし、結果に、ポ
ンプ室と発熱部品との距離を縮めることができるため
に、その間の熱抵抗を下げることができる。Since the suction passage communicating with the water inlet is provided on the pump casing side facing the heat receiving surface, it is possible to suck from the side opposite to the heat receiving surface of the pump chamber, and as a result, the distance between the pump chamber and the heat generating component. Can be shortened, so that the thermal resistance between them can be reduced.
【００６７】吸水口が、羽根車の軸中心と一致する軸中
心を有してから、羽根車内の流れの対称性を保てるため
流量を最も効率よく送ることができ、熱を効果的に受熱
することができる。Since the water suction port has an axial center that coincides with the axial center of the impeller, the symmetry of the flow in the impeller can be maintained so that the flow rate can be sent most efficiently and the heat is effectively received. be able to.
【００６８】羽根車の軸中心とずれた位置に貫通孔が形
成されているから、ポンプ室の羽根車背面から貫通孔を
通って還流させることができ、羽根車中央に滞留し易い
気泡やキャビティを排出し、キャビテーションによる騒
音をなくし伝熱速度を向上できる。Since the through hole is formed at a position deviated from the axis center of the impeller, it is possible to circulate from the back surface of the impeller of the pump chamber through the through hole, and bubbles or cavities that easily stay in the center of the impeller. The heat transfer rate can be improved by eliminating the noise caused by cavitation.
【００６９】ポンプ室内壁面には、羽根の側面が回転す
る部分を含んで動圧溝が設けられているから、動圧溝が
羽根車に円滑な回転をさせ、摩擦で発生する熱を抑え、
受熱面の背面の表面積を増し、熱を効果的に受熱するこ
とができる。羽根の側面がスライドする部分の少なくと
も一部に層流境界層を剥離させる凹部が多数設けられて
いるから、伝熱量が小さい層流境界層を剥離させ、乱流
境界層として伝熱を促進させることができる。羽根の側
面がスライドする部分の少なくとも一部に多数の突起体
が設けられたため、ポンプ室内の冷媒の乱流発生を促進
し、伝熱を促進させることができる。羽根の側面がスラ
イドする部分の少なくとも一部に複数の突起体もしくは
溝を設けたから、ポンプ室内の冷媒の乱流発生を促進
し、伝熱面積を増加させることができるために伝熱を促
進することができる。Since the dynamic pressure groove is provided on the inner wall surface of the pump chamber including the portion where the side surface of the blade rotates, the dynamic pressure groove causes the impeller to rotate smoothly and suppresses heat generated by friction.
The surface area of the back surface of the heat receiving surface can be increased to effectively receive the heat. Since a large number of recesses for separating the laminar flow boundary layer are provided in at least a part of the portion where the side surface of the blade slides, the laminar flow boundary layer having a small heat transfer amount is separated to promote heat transfer as a turbulent boundary layer. be able to. Since many projections are provided on at least a part of the portion where the side surface of the blade slides, it is possible to promote the generation of a turbulent flow of the refrigerant in the pump chamber and promote the heat transfer. Since a plurality of protrusions or grooves are provided on at least a part of the portion where the side surface of the blade slides, turbulent flow of the refrigerant in the pump chamber is promoted and the heat transfer area can be increased, so heat transfer is promoted. be able to.
【００７０】羽根の入口側もしくは羽根間に攪拌用羽根
車突起体が形成され、攪拌用羽根車突起体が流路を攪拌
するため、ポンプ室内の冷媒の乱流発生を促進すること
ができる。また、攪拌用羽根車突起体が、ポンプ室内壁
に形成された突起体と半径方向でずれた位置に対向して
設けられるため、攪拌用羽根車突起体が突起体と接触せ
ずに流路を効果的に攪拌し、ポンプ室内の冷媒の乱流発
生を促進し、伝熱面積も増加させ、伝熱効率を更に向上
させることができる。Since the stirring impeller projections are formed on the inlet side of the blades or between the blades and the stirring impeller projections stir the flow path, the turbulent flow of the refrigerant in the pump chamber can be promoted. Further, since the stirring impeller projection is provided so as to face the projection formed on the inner wall of the pump at a position displaced in the radial direction, the stirring impeller projection does not come into contact with the projection and the flow path Can be effectively agitated, the turbulent flow of the refrigerant in the pump chamber can be promoted, the heat transfer area can be increased, and the heat transfer efficiency can be further improved.
【００７１】羽根の側面には、ポンプ室内壁の表面と接
触する弾性線状体もしくは弾性板状体が設けられたた
め、伝熱量が小さい層流境界層を剥離させ、乱流境界層
として伝熱を促進させることができる。ポンプケーシン
グ厚さが羽根車の軸中心を中心として半径方向に減少す
るため、電子部品からの熱をポンプ室全体に拡散しやす
くし、伝熱を促進させることができる。Since the elastic linear member or elastic plate member contacting the surface of the inner wall of the pump is provided on the side surface of the blade, the laminar flow boundary layer having a small heat transfer amount is separated and the heat transfer is performed as a turbulent flow boundary layer. Can be promoted. Since the thickness of the pump casing decreases in the radial direction around the axial center of the impeller, heat from the electronic components can be easily diffused throughout the pump chamber and heat transfer can be promoted.
【図１】本発明の実施の形態１における冷却装置の構成
図FIG. 1 is a configuration diagram of a cooling device according to a first embodiment of the present invention.
【図２】本発明の実施の形態１における冷却装置を構成
する熱交換型の遠心ポンプの構成図FIG. 2 is a configuration diagram of a heat exchange type centrifugal pump that constitutes the cooling device according to the first embodiment of the present invention.
【図３】本発明の実施の形態１における遠心ポンプの羽
根車正面図FIG. 3 is a front view of an impeller of the centrifugal pump according to the first embodiment of the present invention.
【図４】本発明の実施の形態１における遠心ポンプの流
体軸受の展開図FIG. 4 is a development view of a fluid bearing of the centrifugal pump according to the first embodiment of the present invention.
【図５】本発明の実施の形態１における遠心ポンプのポ
ンプ室内壁面の外観図FIG. 5 is an external view of a pump chamber inner wall surface of the centrifugal pump according to the first embodiment of the present invention.
【図６】（ａ）本発明の実施の形態１における遠心ポン
プの羽根車に取り付けたブラシの説明図
（ｂ）本発明の実施の形態１における遠心ポンプの羽根
車に取り付けたブレードの説明図6A is an explanatory view of a brush attached to an impeller of a centrifugal pump according to Embodiment 1 of the present invention; FIG. 6B is an explanatory view of a blade attached to an impeller of a centrifugal pump according to Embodiment 1 of the present invention.
【図７】図２の遠心ポンプのＸ−Ｘ断面図7 is a sectional view of the centrifugal pump of FIG. 2 taken along line XX.
【図８】本発明の実施の形態２における冷却装置を構成
する熱交換型の遠心ポンプの構成図FIG. 8 is a configuration diagram of a heat exchange type centrifugal pump that constitutes a cooling device according to a second embodiment of the present invention.
【図９】本発明の実施の形態２における遠心ポンプの羽
根車の正面図FIG. 9 is a front view of an impeller of a centrifugal pump according to a second embodiment of the present invention.
【図１０】本発明の実施の形態２における遠心ポンプが
回転短軸を備えた羽根車の構成図FIG. 10 is a configuration diagram of an impeller in which a centrifugal pump according to a second embodiment of the present invention includes a rotating short shaft.
【図１１】本発明の実施の形態２における遠心ポンプの
ポンプ室内壁面の正面図FIG. 11 is a front view of a pump chamber wall surface of the centrifugal pump according to the second embodiment of the present invention.
【図１２】本発明の実施の形態２における遠心ポンプの
ポンプケーシング厚さが半径方向に減少する構成図FIG. 12 is a configuration diagram in which the pump casing thickness of the centrifugal pump according to the second embodiment of the present invention is reduced in the radial direction.
【図１３】本発明の実施の形態３における冷却装置を構
成する熱交換型の遠心ポンプの構成図FIG. 13 is a configuration diagram of a heat exchange type centrifugal pump that constitutes a cooling device according to a third embodiment of the present invention.
【図１４】従来の電子機器の第１冷却装置の構成図FIG. 14 is a configuration diagram of a first cooling device of a conventional electronic device.
【図１５】従来の電子機器の第２冷却装置の構成図FIG. 15 is a configuration diagram of a second cooling device for a conventional electronic device.
【符号の説明】 １ 遠心ポンプ ２ 発熱電子部品 ３ 放熱器 ４ 循環路 １１ 羽根車 １１ａ 貫通孔 １１ｂ マグネット １１ｃ 攪拌用羽根車突起体 １２ 羽根 １３ マグネットロータ １４ ステータ １５ ポンプケーシング １５ａ ポンプ室 １５ｂ 受熱面 １５ｃ，１５ｄ ポンプ室内壁面 １６，１６ａ ケーシングカバー １６ｂ 筒部 １７ 固定軸 １７ａ 回転短軸 １８，１８ｂ 軸受 １８ａ 動圧発生溝 １９ 吸込路 １９ａ，１９ｂ，１９ｃ 吸水口 ２０ 吐出路 ２１ 凹部 ２２ ブラシ ２３ ブレード ２４ 突起体[Explanation of symbols] 1 centrifugal pump 2 heat generating electronic parts 3 radiator 4 circuit 11 impeller 11a through hole 11b magnet 11c Stirring impeller projection 12 feathers 13 Magnet rotor 14 Stator 15 Pump casing 15a Pump room 15b Heat receiving surface 15c, 15d Pump room wall surface 16, 16a Casing cover 16b tube 17 fixed axis 17a rotating short axis 18,18b bearing 18a Dynamic pressure generating groove 19 Suction path 19a, 19b, 19c Water intake 20 discharge paths 21 recess 22 brushes 23 blade 24 Protrusion
───────────────────────────────────────────────────── フロントページの続き (72)発明者 庭月野 恭 福岡市博多区美野島４丁目１番62号 パ ナソニック コミュニケーションズ株式 会社内 (72)発明者 久保田 俊幸 福岡市博多区美野島４丁目１番62号 パ ナソニック コミュニケーションズ株式 会社内 (56)参考文献 特開2002−151638（ＪＰ，Ａ) 特開2002−94277（ＪＰ，Ａ) 特開2002−374084（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) F25D 9/00 G06F 1/20 H05K 7/20 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kyo Tsukino 4-1-1, Minoshima, Hakata-ku, Fukuoka City Panasonic Communications Co., Ltd. (72) Toshiyuki Kubota 4-1-2, Minoshima, Hakata-ku, Fukuoka Panasonic Communications Co., Ltd. (56) Reference JP 2002-151638 (JP, A) JP 2002-94277 (JP, A) JP 2002-374084 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) F25D 9/00 G06F 1/20 H05K 7/20
Claims (18)
接触熱交換型の遠心ポンプが設けられ、前記遠心ポンプ
が発熱電子部品に接触されて内部の冷媒の熱交換作用で
該発熱電子部品から熱を奪い、前記放熱器から放熱を行
う冷却装置であって、 前記遠心ポンプが、高熱伝導率の材料で構成されたポン
プケーシングと開放型の羽根車とを備え、 前記ポンプケーシングには、内部のポンプ室に沿った側
面に受熱面が形成され、且つ該受熱面が接触位置におい
て前記発熱電子部品の上部表面の３次元的な形状と相補
的な形状に形成されとともに、前記受熱面と前記ポンプ
室の内壁面との間に吸込路が設けられたことを特徴とす
る冷却装置。1. A centrifugal pump of a contact heat exchange type with a radiator is provided in a closed circuit for circulating a refrigerant, and the centrifugal pump is brought into contact with a heat-generating electronic component to generate heat by a heat exchange action of an internal refrigerant. A cooling device that draws heat from an electronic component and radiates heat from the radiator, wherein the centrifugal pump includes a pump casing made of a material having high thermal conductivity and an open type impeller, and the pump casing includes: Has a heat receiving surface formed on a side surface along the inner pump chamber, the heat receiving surface having a shape complementary to the three-dimensional shape of the upper surface of the heat-generating electronic component at the contact position, and the heat receiving surface. A cooling device, wherein a suction passage is provided between a surface and an inner wall surface of the pump chamber.
厚方向に短軸をもつ楕円形状の断面を有していることを
特徴とする請求項１記載の冷却装置。2. The cooling device according to claim 1, wherein the suction passage has an elliptical cross section having a minor axis in the thickness direction of the pump casing.
とポンプ室の内壁面との間に吸込路が設けられるのに代
えて、前記羽根車の中心に吸水口が形成され、該吸水口
と連通する吸込路が前記受熱面と対向するポンプケーシ
ング側に設けられたことを特徴とする冷却装置。3. The cooling device according to claim 1, wherein instead of providing a suction passage between the heat receiving surface and the inner wall surface of the pump chamber, a water suction port is formed at the center of the impeller, and the water suction port is formed. A cooling device, wherein a suction passage communicating with the mouth is provided on the pump casing side facing the heat receiving surface.
する軸中心を有していることを特徴とする請求項３記載
の冷却装置。4. The cooling device according to claim 3, wherein the water suction port has an axial center coinciding with an axial center of the impeller.
た位置に貫通孔が形成されていることを特徴とする請求
項１〜４のいずれかに記載の冷却装置。5. The cooling device according to claim 1, wherein a through hole is formed in the impeller at a position deviated from the axial center of the impeller.
が回転する部分に動圧溝が設けられたことを特徴とする
請求項１〜５のいずれかに記載の冷却装置。6. The cooling device according to claim 1, wherein a dynamic pressure groove is provided in a portion of the pump chamber wall surface where the side surface of the blade rotates.
イドする部分の少なくとも一部に層流境界層を剥離させ
る凹部が多数設けられていることを特徴とする請求項１
〜６のいずれかに記載の冷却装置。7. The pump chamber inner wall is provided with a large number of recesses for separating a laminar boundary layer at least at a part where a side surface of the blade slides.
The cooling device according to any one of to 6.
イドする部分の少なくとも一部に多数の突起体が設けら
れたことを特徴とする請求項１〜７のいずれかに記載の
冷却装置。8. The cooling device according to claim 1, wherein a large number of projections are provided on at least a part of a portion where the side surface of the blade slides on the inner wall of the pump chamber. .
する部分の少なくとも一部に複数の突起体もしくは溝を
設けたことを特徴とする請求項３記載の冷却装置。9. The cooling device according to claim 3, wherein a plurality of protrusions or grooves are provided on at least a part of a portion of the pump chamber inner wall facing the suction passage.
くは前記羽根間に攪拌用羽根車突起体が形成されている
ことを特徴とする請求項１〜９のいずれかに記載の冷却
装置。10. The cooling device according to claim 1, wherein the impeller is provided with an agitating impeller projection body on the inlet side of the impeller or between the impellers. .
室内壁に形成された突起体と半径方向でずれた位置に対
向して設けられることを特徴とする請求項１０記載の冷
却装置。11. The cooling device according to claim 10, wherein the stirring impeller protrusion is provided so as to face a protrusion formed on the inner wall of the pump at a position displaced in the radial direction.
の表面と接触する弾性線状体もしくは弾性板状体が設け
られたことを特徴とする請求項１〜１１のいずれかに記
載の冷却装置。12. The elastic linear body or elastic plate-like body that is in contact with the surface of the inner wall of the pump chamber is provided on the side surface of the blade, according to any one of claims 1 to 11. Cooling system.
記羽根車の軸中心を中心として半径方向に減少すること
を特徴とする請求項１〜１２のいずれかに記載の冷却装
置。13. The cooling device according to claim 1, wherein the thickness of the pump casing on the heat receiving surface decreases in the radial direction around the axial center of the impeller.
子部品の冷却装置であって、 前記ポンプは、前記ポンプのハウジングと前記電子部品
が熱的に接触するよう、前記電子部品に直接連結され、
前記ポンプのポンプ室の中央部に吸水口が設けられたこ
とを特徴とする電子部品の冷却装置。14. A cooling device for an electronic component, comprising: a refrigerant circulation path; a pump for circulating the refrigerant in the circulation path; and a radiator for radiating heat of the refrigerant in the circulation path. A pump is directly connected to the electronic component such that the pump housing and the electronic component are in thermal contact;
A cooling device for electronic parts, wherein a water intake port is provided at a central portion of a pump chamber of the pump.
おいて、前記ポンプのポンプ室の中央部に吸水口が設け
られたことを特徴とする電子部品の冷却装置。15. The cooling device for an electronic component according to claim 14, wherein a water inlet is provided at a central portion of a pump chamber of the pump.
根車の側面がスライドする部分の少なくとも一部に層流
境界層を剥離させる剥離手段がけられていることを特徴
とする請求項１４記載の電子部品の冷却装置。16. A separation means for separating a laminar boundary layer is provided on at least a part of a portion where a side surface of the impeller slides, on a pump chamber inner wall of the pump. Electronic component cooling system.
壁には凹部または突起体が設けられていることを特徴と
する請求項１４記載の電子部品の冷却装置。17. The cooling device for an electronic component according to claim 14, wherein the peeling means is provided with a recess or a projection at least on the inner wall of the pump chamber.
記ポンプ室内壁の表面と接触する弾性線状体もしくは弾
性板状体が設けられたことを特徴とする請求項１４記載
の電子部品の冷却装置。18. The electronic component according to claim 14, wherein the peeling means is provided with an elastic linear body or elastic plate-like body that is in contact with the surface of the pump chamber inner wall on the side surface of the impeller. Cooling system.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003007168A JP3431024B1 (en) | 2003-01-15 | 2003-01-15 | Cooling system |
| AU2003230243A AU2003230243A1 (en) | 2002-05-15 | 2003-05-12 | A liquid cooling device for a notebook computer |
| PCT/JP2003/005873 WO2003098415A1 (en) | 2002-05-15 | 2003-05-12 | A liquid cooling device for a notebook computer |
| CNB038109298A CN100347636C (en) | 2002-05-15 | 2003-05-12 | A liquid cooling device for a notebook computer |
| TW92113104A TWI223584B (en) | 2002-05-15 | 2003-05-14 | A cooling device and an electronic apparatus including the same |
| US10/446,152 US6839234B2 (en) | 2002-05-15 | 2003-05-28 | Cooling device and an electronic apparatus including the same |
| US10/976,324 US7209355B2 (en) | 2002-05-15 | 2004-10-29 | Cooling device and an electronic apparatus including the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003007168A JP3431024B1 (en) | 2003-01-15 | 2003-01-15 | Cooling system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP3431024B1 true JP3431024B1 (en) | 2003-07-28 |
| JP2004218941A JP2004218941A (en) | 2004-08-05 |
Family
ID=27656076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003007168A Expired - Lifetime JP3431024B1 (en) | 2002-05-15 | 2003-01-15 | Cooling system |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3431024B1 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005273617A (en) * | 2004-03-26 | 2005-10-06 | Toshiba Corp | Fluid pump, electric apparatus, and cooling device |
| US7170750B2 (en) | 2003-11-28 | 2007-01-30 | Kabushiki Kaisha Toshiba | Electronic apparatus |
| US7203062B2 (en) | 2003-09-30 | 2007-04-10 | Kabushiki Kaisha Toshiba | Electronic apparatus with air cooling unit |
| US7215546B2 (en) | 2004-04-28 | 2007-05-08 | Kabushiki Kaisha Toshiba | Pump, electronic apparatus, and cooling system |
| US7273089B2 (en) | 2003-05-26 | 2007-09-25 | Kabushiki Kaisha Toshiba | Electronic apparatus having a heat-radiating unit for radiating heat of heat-generating components |
| US7301771B2 (en) | 2004-04-28 | 2007-11-27 | Kabushiki Kaisha Toshiba | Heat-receiving apparatus and electronic equipment |
| US7660120B2 (en) | 2004-08-26 | 2010-02-09 | Itt Manufacturing Enterprises, Inc. | Power supply unit for an electrical appliance and method for making electrical power available at components of an electrical appliance |
| CN109696008A (en) * | 2019-01-31 | 2019-04-30 | 深圳市研派科技有限公司 | A kind of fluid cooling device |
| CN110162156A (en) * | 2018-02-14 | 2019-08-23 | 日本电产三协株式会社 | Cooling device |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7209355B2 (en) | 2002-05-15 | 2007-04-24 | Matsushita Electric Industrial Co., Ltd. | Cooling device and an electronic apparatus including the same |
| JP4653444B2 (en) * | 2004-08-30 | 2011-03-16 | 株式会社東芝 | Cooling fluid pump, cooling device and electrical equipment |
| TW200719804A (en) * | 2005-11-07 | 2007-05-16 | Sunonwealth Electr Mach Ind Co | Structure of heat dissipation device |
| JP4645420B2 (en) * | 2005-11-17 | 2011-03-09 | パナソニック株式会社 | Heat receiver and cooling device provided with the same |
| JP4586087B2 (en) * | 2008-06-30 | 2010-11-24 | 株式会社日立製作所 | Power semiconductor module |
-
2003
- 2003-01-15 JP JP2003007168A patent/JP3431024B1/en not_active Expired - Lifetime
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7273089B2 (en) | 2003-05-26 | 2007-09-25 | Kabushiki Kaisha Toshiba | Electronic apparatus having a heat-radiating unit for radiating heat of heat-generating components |
| US7203062B2 (en) | 2003-09-30 | 2007-04-10 | Kabushiki Kaisha Toshiba | Electronic apparatus with air cooling unit |
| US7170750B2 (en) | 2003-11-28 | 2007-01-30 | Kabushiki Kaisha Toshiba | Electronic apparatus |
| JP2005273617A (en) * | 2004-03-26 | 2005-10-06 | Toshiba Corp | Fluid pump, electric apparatus, and cooling device |
| JP4592314B2 (en) * | 2004-03-26 | 2010-12-01 | 株式会社東芝 | Fluid pump, electrical equipment and cooling device |
| US7215546B2 (en) | 2004-04-28 | 2007-05-08 | Kabushiki Kaisha Toshiba | Pump, electronic apparatus, and cooling system |
| US7301771B2 (en) | 2004-04-28 | 2007-11-27 | Kabushiki Kaisha Toshiba | Heat-receiving apparatus and electronic equipment |
| US7660120B2 (en) | 2004-08-26 | 2010-02-09 | Itt Manufacturing Enterprises, Inc. | Power supply unit for an electrical appliance and method for making electrical power available at components of an electrical appliance |
| CN110162156A (en) * | 2018-02-14 | 2019-08-23 | 日本电产三协株式会社 | Cooling device |
| CN110162156B (en) * | 2018-02-14 | 2023-10-20 | 日本电产三协株式会社 | cooling device |
| CN109696008A (en) * | 2019-01-31 | 2019-04-30 | 深圳市研派科技有限公司 | A kind of fluid cooling device |
| CN109696008B (en) * | 2019-01-31 | 2023-09-26 | 深圳市研派科技有限公司 | Fluid cooling device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004218941A (en) | 2004-08-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4244703B2 (en) | Cooling system | |
| US6839234B2 (en) | Cooling device and an electronic apparatus including the same | |
| US7209355B2 (en) | Cooling device and an electronic apparatus including the same | |
| JP3431024B1 (en) | Cooling system | |
| US20030214786A1 (en) | Cooling device and an electronic apparatus including the same | |
| US20060018775A1 (en) | Liquid circulation system and liquid cooling system therewith | |
| TWI324503B (en) | Systems for integrated pump and reservoir | |
| US20060171801A1 (en) | Heatsink apparatus | |
| US7766629B2 (en) | Fluid pump, cooling apparatus and electrical appliance | |
| US20070193720A1 (en) | Composite heat-dissipating module | |
| JP3452059B1 (en) | Cooling device and electronic equipment equipped with it | |
| US7255154B2 (en) | Cooling device | |
| WO2003098415A1 (en) | A liquid cooling device for a notebook computer | |
| JP2005093604A (en) | Cooling device and electronic apparatus | |
| JP2006234255A (en) | Radiator and liquid cooling system comprising the same | |
| EP1571533A2 (en) | Liquid cooling system, and electronic apparatus having the same therein | |
| JP2005317796A (en) | Pump, cooling device, and electronic apparatus | |
| JP3741092B2 (en) | Ultra-thin pump and cooling system equipped with it | |
| JP2004278989A (en) | Cooling pump and heat receiving device | |
| JP2007103633A (en) | Cooling device and electronic apparatus including the same | |
| JP2006249966A (en) | Centrifugal pump and cooling device using the same | |
| JP4849114B2 (en) | Cooling system | |
| JP2006210885A (en) | Cooling device | |
| JP4134884B2 (en) | Cooling system | |
| JP2004285888A (en) | Contact type liquid-cooled heat receiving pump and cooling device for heating electronic component equipped with the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| TRDD | Decision of grant or rejection written | ||
| R151 | Written notification of patent or utility model registration |
Ref document number: 3431024 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080523 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090523 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100523 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110523 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110523 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120523 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120523 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130523 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130523 Year of fee payment: 10 |
|
| EXPY | Cancellation because of completion of term |