TW200719804A - Structure of heat dissipation device - Google Patents

Structure of heat dissipation device

Info

Publication number
TW200719804A
TW200719804A TW094138922A TW94138922A TW200719804A TW 200719804 A TW200719804 A TW 200719804A TW 094138922 A TW094138922 A TW 094138922A TW 94138922 A TW94138922 A TW 94138922A TW 200719804 A TW200719804 A TW 200719804A
Authority
TW
Taiwan
Prior art keywords
heat dissipation
cooling liquid
efficient
thermal energy
dissipation device
Prior art date
Application number
TW094138922A
Other languages
Chinese (zh)
Inventor
Alex Horng
Masaharu Miyahara
Original Assignee
Sunonwealth Electr Mach Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sunonwealth Electr Mach Ind Co filed Critical Sunonwealth Electr Mach Ind Co
Priority to TW094138922A priority Critical patent/TW200719804A/en
Priority to JP2006005435A priority patent/JP2007134663A/en
Priority to DE200610002448 priority patent/DE102006002448B4/en
Publication of TW200719804A publication Critical patent/TW200719804A/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The present invention relates to a structure of heat dissipation device, comprising a central heat sink with a circumference from which a plurality of heat dissipation fins extend and a through hole penetrating both ends inside. The two ends of the through hole are covered tightly by a top lid and a bottom lid respectively to form a chamber to be filled up with a cooling liquid. The bottom lid can be conveniently replaced with one made of a material of high thermal conductivity so as to make absorption and conduction of thermal energy more efficient and better. If auxiliary heat dissipation fins are further provided, the heat exchange area with the cooling liquid can be increased and vortex mixture effect of the cooling liquid can also be enhanced so that the absorbed thermal energy can be uniformly diffused faster to thereby provide the most efficient and fastest result of heat dissipation.
TW094138922A 2005-11-07 2005-11-07 Structure of heat dissipation device TW200719804A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW094138922A TW200719804A (en) 2005-11-07 2005-11-07 Structure of heat dissipation device
JP2006005435A JP2007134663A (en) 2005-11-07 2006-01-12 Heat sink structure
DE200610002448 DE102006002448B4 (en) 2005-11-07 2006-01-18 Heat sink structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094138922A TW200719804A (en) 2005-11-07 2005-11-07 Structure of heat dissipation device

Publications (1)

Publication Number Publication Date
TW200719804A true TW200719804A (en) 2007-05-16

Family

ID=37982767

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094138922A TW200719804A (en) 2005-11-07 2005-11-07 Structure of heat dissipation device

Country Status (3)

Country Link
JP (1) JP2007134663A (en)
DE (1) DE102006002448B4 (en)
TW (1) TW200719804A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008028370A1 (en) * 2008-06-13 2009-12-17 Forschungszentrum Jülich GmbH heat exchangers
RU200277U1 (en) * 2020-07-09 2020-10-15 Российская Федерация, От Имени Которой Выступает Министерство Промышленности И Торговли Российской Федерации RADIO ELECTRONIC UNIT

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0273567A (en) * 1988-09-09 1990-03-13 Sony Corp Digital data reproducing circuit
DE4225676C2 (en) * 1992-08-04 1995-05-04 Abb Patent Gmbh Coolant-cooled converter module with a coolant flow generated by a coolant pump
JPH06252300A (en) * 1992-12-28 1994-09-09 Hitachi Ltd Integrated circuit chip provided with cooling device and manufacture thereof
JP3409434B2 (en) * 1994-05-27 2003-05-26 株式会社デンソー Inverter
JPH09307040A (en) * 1996-05-15 1997-11-28 Hitachi Ltd Semiconductor device, inverter, and manufacture of semiconductor device
US6019165A (en) * 1998-05-18 2000-02-01 Batchelder; John Samuel Heat exchange apparatus
US6327145B1 (en) * 2000-09-01 2001-12-04 Intel Corporation Heat sink with integrated fluid circulation pump
JP3431024B1 (en) * 2003-01-15 2003-07-28 松下電器産業株式会社 Cooling system
JP2005026571A (en) * 2003-07-04 2005-01-27 Nippon Densan Corp Electronic component cooling device
DE10332096B4 (en) * 2003-07-15 2005-12-08 Fujitsu Siemens Computers Gmbh Cooling arrangement for cooling a heat-generating component
TW200711557A (en) * 2005-09-02 2007-03-16 Sunonwealth Electr Mach Ind Co Heat dissipation device

Also Published As

Publication number Publication date
DE102006002448B4 (en) 2008-11-27
DE102006002448A1 (en) 2007-05-16
JP2007134663A (en) 2007-05-31

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