CN203102139U - Radiator and notebook computer - Google Patents
Radiator and notebook computer Download PDFInfo
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- CN203102139U CN203102139U CN 201320005152 CN201320005152U CN203102139U CN 203102139 U CN203102139 U CN 203102139U CN 201320005152 CN201320005152 CN 201320005152 CN 201320005152 U CN201320005152 U CN 201320005152U CN 203102139 U CN203102139 U CN 203102139U
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- heat
- heating radiator
- thermal hole
- hole
- radiator
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Abstract
The utility model discloses a radiator. Heat conduction holes are formed in the radiator and are blind holes. The radiator further comprises an end close over arranged on openings of the heat conduction holes, heat conduction media arranged in the heat conduction holes, and a capillary net attached to inner walls of the heat conduction holes. The end close over is used for forming a vacuum chamber with the heat conduction holes in an enclosing manner. The heat conduction media are used for adsorbing heat diffused by a heat conduction media and vaporizing the heat, and the heat on the inner walls of the heat conduction holes is released and is condensed to liquid again. The capillary net is used for guiding the liquid on the inner walls to flow into the bottom of the vacuum chamber. In the radiator, a structure similar to a heat pipe is formed in the heat conduction holes, a heat conductivity coefficient is large, heat dissipation efficiency is high, and heat dissipation requirements of a high-power heat source can be met. The utility model further discloses a notebook computer, wherein the radiator is applied to the notebook computer, and a heat source on the notebook computer can dissipate heat well.
Description
Technical field
The utility model relates to the heat dissipation equipment field, more particularly, relates to a kind of heating radiator, also relates to a kind of notebook computer.
Background technology
Be used for the CPU(central processing unit in the computer) heating radiator be the radial heating radiator of fin (claiming heronsbill structure heating radiator again), it adopts the extrusion process manufacturing, the entire heat dissipation sheet is one-body molded, comprises the skeleton at middle part and is fixed on fin on the above-mentioned skeleton.
In the prior art, the radial heating radiator of fin is by the aluminium manufacturing, and skeleton 105 mostly is solid construction.In order to improve radiating efficiency, can on skeleton 105 end faces, offer thermal hole, this thermal hole is a through hole, and is filled with the copper heating column in it.During application, the heat of CPU conducts to the copper heating column at skeleton 105 and skeleton 105 middle parts by the heat conducting base that is welded on skeleton 105 ends, wherein, conducts to heat on the skeleton 105 and directly arrives the fin places along skeleton 105 and dispel the heat; The heat that conducts to copper heating column place spreads all over whole copper heating column rapidly, and on the skeleton 105 that is in contact with it by reaching everywhere of copper heating column, arrives the fin place by skeleton 105 places again and dispel the heat.
Because the coefficient of heat conductivity of copper heating column is greater than the coefficient of heat conductivity of aluminium skeleton 105, when using the radial heating radiator of above-mentioned fin, most of heat can by the copper heating column apace excessively to skeleton 105 everywhere, and dispel the heat by the fin place that conducts to everywhere of skeleton 105, radiating efficiency is higher.But copper heating column coefficient of heat conductivity at normal temperatures only is about 400W/mK, though be the good metal heating column, when being applied to the bigger CPU of power, still has the not enough problem of heat radiation.
In addition, the density of copper heating column is bigger, and the heatsink mass of using the copper heating column is bigger, and the weight that causes using the notebook of this heating radiator increases, and causes the portability of notebook computer poor.Simultaneously, the price of copper product is higher, causes the production cost of the heating radiator of using the copper heating column and notebook computer that should heating radiator all higher.
In sum, how to provide a kind of middle part thermal hole place coefficient of heat conductivity big heating radiator,, satisfy the radiating requirements of high-power CPU to improve its radiating efficiency, and how a kind of notebook of using above-mentioned heating radiator is provided, be those skilled in the art's problem demanding prompt solutions.
The utility model content
In view of this, the utility model provides a kind of heating radiator, and the coefficient of heat conductivity at its thermal hole place, middle part is big, and the radiating efficiency height can satisfy the heat radiation requirement of powerful thermal source.The utility model also provides a kind of notebook computer of using above-mentioned heating radiator, and its endogenous pyrogen heat radiation is good.
For achieving the above object, the utility model provides following technical scheme:
A kind of heating radiator which is provided with thermal hole, and described thermal hole is a blind hole, also comprises:
Be arranged on the opening part of described thermal hole, be used for surrounding the end capping of vacuum chamber with described thermal hole;
Be arranged in the described thermal hole, be used to absorb the heat-conducting medium that heat is also vaporized, heat release also condenses into liquid again on the inwall of described thermal hole that thermal source distributes; With
Paste on described inwall, be used for the capillary network of the liquid drainage on the described inwall to the bottom of described vacuum chamber.
Preferably, in the above-mentioned heating radiator, also comprise the seal that is arranged between described end capping and the described thermal hole.
Preferably, in the above-mentioned heating radiator, described seal is an O-ring seal.
Preferably, in the above-mentioned heating radiator, described end capping is the barrel-like structure of end sealing, and its sidewall is provided with external thread; The porch of described thermal hole is provided with the internal thread that cooperates with described external thread.
Preferably, in the above-mentioned heating radiator, the openend of described end capping is provided with the convex edge that pastes in described thermal hole periphery.
Preferably, in the above-mentioned heating radiator, described end capping is provided with described thermal hole and is connected, and has the stifled aspirating hole of plug.
Preferably, in the above-mentioned heating radiator, described heat-conducting medium is water or ethanol.
Preferably, in the above-mentioned heating radiator, described capillary network is tinsel capillary network or copper powder sintering capillary network.
A kind of notebook computer comprises heating radiator, and described heating radiator is any described heating radiator in the technique scheme.
The heating radiator that the utility model provides comprises skeleton 105, heat-conducting medium, capillary network and end capping, and wherein, the end face of skeleton 105 is provided with thermal hole, and this thermal hole is a blind hole; The end capping is arranged on the opening part of thermal hole, is used for surrounding vacuum chamber with above-mentioned thermal hole; Heat-conducting medium is arranged in the above-mentioned thermal hole, is used to absorb the heat of thermal source and vaporization, heat release and condense into liquid again on the inwall of thermal hole; Capillary network pastes on the inwall of thermal hole, is used for the bottom of the liquid drainage on the above-mentioned inwall to vacuum chamber.
During assembling, capillary network is pasted on the inwall of thermal hole, filling heat-conductive medium in thermal hole, and will hold capping to be assemblied in the opening part of thermal hole so that itself and above-mentioned thermal hole surround vacuum chamber.During application, heat-conducting medium is positioned at the vacuum chamber of holding capping and thermal hole to surround, and its boiling point is very low, can absorb the heat of thermal source in the bottom of above-mentioned vacuum chamber and seethe with excitement rapidly to vaporize; Afterwards, the heat-conducting medium falling heat-transfer hole of gaseous state, and condense in the inwall place heat release of thermal hole; Then, capillary network is with the liquid heat-conducting medium drainage at the thermal hole inwall place bottom to vacuum chamber; The heat-conducting medium that is back to the vacuum chamber bottom continues to absorb heat and repeat above-mentioned steps, form and inhale the heat release circulation, the lasting heat that also promptly will conduct to the vacuum chamber bottom conducts to skeleton 105 everywhere, makes heat by dispelling the heat than promptly conducting to the fin place behind thin skeleton 105 walls.
To sum up, in the heating radiator that the utility model provides, the thermal hole place forms the structure that is similar to heat pipe, the value of its coefficient of heat conductivity can reach several thousand even up to ten thousand, the heating radiator of copper heating column is set in the prior art, and its heat transfer efficiency significantly improves, and can satisfy the heat radiation requirement of high-power thermal source.
In addition, in the heating radiator that the utility model provides, capillary network and heat-conducting medium only are housed in the thermal hole, the heating radiator of heat conduction copper post is housed in the prior art, it is in light weight, and produces that the cost of material is low.Simultaneously, the heat spreader structures that the utility model provides is simple, is convenient to production and processing.
The utility model also provides a kind of notebook computer of using above-mentioned heating radiator, and the high-power CPU thermal source heat radiation on it is good.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
The structural representation of the square heronsbill structure heating radiator of the employing tinsel capillary network that Fig. 1 provides for the utility model embodiment;
The cut-open view of the square heronsbill structure heating radiator of the employing tinsel capillary network that Fig. 2 provides for the utility model embodiment;
The structural representation of the circular heronsbill structure heating radiator of the employing tinsel capillary network that Fig. 3 provides for the utility model embodiment;
The cut-open view of the circular heronsbill structure heating radiator of the employing tinsel capillary network that Fig. 4 provides for the utility model embodiment;
Wherein, among Fig. 1-Fig. 4:
Embodiment
The utility model embodiment discloses a kind of heating radiator, and its coefficient of heat conductivity is big, and the radiating efficiency height can satisfy the heat radiation requirement of powerful thermal source.The utility model also provides a kind of notebook computer of using above-mentioned heating radiator, and CPU heat radiation is good in it.
Below in conjunction with the accompanying drawing among the utility model embodiment, the technical scheme among the utility model embodiment is clearly and completely described, obviously, described embodiment only is the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the utility model protection.
The heating radiator that the utility model embodiment provides comprises skeleton 105, heat-conducting medium, capillary network and end capping 101, and wherein, the end face of skeleton 105 is provided with thermal hole, and this thermal hole is a blind hole; End capping 101 is arranged on the opening part of thermal hole, is used for surrounding vacuum chamber with above-mentioned thermal hole; Heat-conducting medium is arranged in the above-mentioned thermal hole, is used to absorb the heat of thermal source and vaporization, heat release and condense into liquid again on the inwall of thermal hole; Capillary network pastes on the inwall of thermal hole, is used for the bottom of the liquid drainage on the above-mentioned inwall to vacuum chamber.
During assembling, capillary network is pasted on the inwall of thermal hole, filling heat-conductive medium in thermal hole is assemblied in the opening part of thermal hole with end capping 101 and makes end capping 101 surround vacuum chamber with above-mentioned thermal hole.In this heating radiator, heat-conducting medium is positioned at the vacuum chamber of holding capping 101 and thermal hole to surround, and its boiling point is very low, can absorb the heat of thermal source in the bottom of above-mentioned vacuum chamber and the vaporization of seething with excitement rapidly; The heat-conducting medium falling heat-transfer hole of gaseous state, and condense in the inwall place heat release of thermal hole, afterwards, capillary network is with the liquid heat-conducting medium drainage at the thermal hole inwall place bottom to vacuum chamber; The heat-conducting medium that is back to the vacuum chamber bottom continues to absorb heat and repeat above-mentioned steps, form and inhale the heat release circulation, the heat that can continue and promptly the thermal source place be conducted to vacuum chamber bottom conducts to skeleton 105 everywhere, and promptly conducting to fin 106 places after making heat by thin skeleton 105 walls dispels the heat.
To sum up, in the heating radiator that present embodiment provides, the thermal hole place forms the structure that is similar to heat pipe, the value of its coefficient of heat conductivity can reach several thousand even up to ten thousand, the heating radiator of copper heating column is set in the prior art, and its heat transfer efficiency significantly improves, and can satisfy the heat radiation requirement of high-power thermal source.
In addition, the radiating efficiency of the heating radiator that present embodiment provides significantly improves, and it requires lowly to the number of fin 106, and promptly this heating radiator can satisfy the heat radiation requirement of thermal source equally on the basis of suitably reducing fin 106, can reach the effect of saving material.
Moreover, in the heating radiator that present embodiment provides, the heat-conducting medium of gaseous state condenses in an end heat release of thermal hole stow away from heat, and promptly most of heat is discharged by an end of stow away from heat on the heating radiator, it can avoid the local temperature at thermal source place too high, avoids influencing thermal source other element radiating on every side.
Simultaneously, in the heating radiator that present embodiment provides, capillary network and heat-conducting medium only are housed in the thermal hole, the heating radiator of heat conduction copper post is housed in the prior art, it is in light weight, and produces that the cost of material is low.Characteristics simple in structure, that be convenient to production and processing that the heating radiator that the utility model provides also has.
Enter in the thermal hole for fear of ambient atmosphere, in the heating radiator that the foregoing description provides, also be provided with seal between end capping 101 and the thermal hole, as O-ring seal, sealing gasket etc.In this heating radiator, seal can guarantee the sealing of the openend of thermal hole, guarantees that heat-conducting medium can operate as normal.
Concrete, above-mentioned end capping 101 can be set to solid plug stifled 102, but in order to save material and to reduce the weight of holding capping 101, in the heating radiator that the foregoing description provides, end capping 101 is set to the tubular structure of end sealing, be provided with external thread with sidewall, accordingly, the porch of thermal hole is provided with the internal thread that cooperates with above-mentioned external thread, during assembling, the openend of end capping 101 is screwed in the thermal hole, the bottom of end capping 101 is screwed in the thermal hole.
Preferably, in the heating radiator that the foregoing description provides, the openend of end capping 101 is provided with the convex edge that is used to paste in the thermal hole periphery, and it can play position-limiting action, avoid holding capping 101 to screw in the depths of thermal hole, be convenient to staff or instrument it is carried out clamping to finish the dismounting operation; Accordingly, the bottom of end capping 101 is screwed in the thermal hole.
Concrete, in the heating radiator that the foregoing description provides, seal can be set to the sealing gasket between above-mentioned convex edge and skeleton 105, or is wrapped in the band in end capping 101 outsides, preferably, be set at the O-ring seal of holding between capping 101 and the thermal hole inwall 103.
The assembling the foregoing description provide heating radiator the time can in vacuum environment, carry out, to guarantee that thermal hole and end capping 101 surround vacuum chamber, but this mode cost is higher, and assembling speed is slow, efficient is low, so in order further to optimize technique scheme, in the heating radiator that present embodiment provides, end capping 101 is provided with the aspirating hole that is connected with thermal hole inside, and this aspirating hole place is provided with plug stifled 102; During assembling, earlier heat-conducting medium, capillary network are separately positioned in the thermal hole, will hold capping 101 to be arranged on the thermal hole opening part again, take out plug and block up 102, and will be evacuated in the thermal hole, get final product with the stifled 102 shutoff pilot holes of plug at last.
In the heating radiator that the foregoing description provides, heat-conducting medium can be set to water, ethanol or acetone etc., present embodiment is not done qualification to the material of heat-conducting medium, but it need possess in the environment of normal temperature and vacuum the heat and the vaporization of can fast Absorption CPU distributing, and in the place's heat release of thermal hole inwall and condense into the function of liquid.
In the heating radiator that the foregoing description provides, capillary network can be set to tinsel capillary network 104 or copper powder sintering capillary network.
Concrete, the heating radiator that the foregoing description provides can be set to square heronsbill heating radiator, as shown in Figure 1, can also be set to circular heronsbill heating radiator, as shown in Figure 3.
The utility model embodiment also provides a kind of notebook computer, and it comprises heating radiator, wherein, the heating radiator that heating radiator provides for the foregoing description, the CPU heat radiation of this notebook computer is good.
The laptop computer applications that present embodiment provides the heating radiator that provides of the foregoing description, it also has the effect that the foregoing description provides, and does not repeat them here.
Each embodiment adopts the mode of going forward one by one to describe in this instructions, and what each embodiment stressed all is and the difference of other embodiment that identical similar part is mutually referring to getting final product between each embodiment.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the utility model.Multiple modification to these embodiment will be conspicuous concerning those skilled in the art, and defined herein General Principle can realize under the situation that does not break away from spirit or scope of the present utility model in other embodiments.Therefore, the utility model will can not be restricted to these embodiment shown in this article, but will meet and principle disclosed herein and features of novelty the wideest corresponding to scope.
Claims (9)
1. one kind heating radiator which is provided with thermal hole, it is characterized in that, described thermal hole is a blind hole, also comprises:
Be arranged on the opening part of described thermal hole, be used for surrounding the end capping of vacuum chamber with described thermal hole;
Be arranged in the described thermal hole, be used to absorb the heat-conducting medium that heat is also vaporized, heat release also condenses into liquid again on the inwall of described thermal hole that thermal source distributes; With
Paste on described inwall, be used for the capillary network of the liquid drainage on the described inwall to the bottom of described vacuum chamber.
2. heating radiator according to claim 1 is characterized in that, also comprises the seal that is arranged between described end capping and the described thermal hole.
3. heating radiator according to claim 2 is characterized in that, described seal is an O-ring seal.
4. heating radiator according to claim 1 is characterized in that, described end capping is the barrel-like structure of end sealing, and its sidewall is provided with external thread; The porch of described thermal hole is provided with the internal thread that cooperates with described external thread.
5. heating radiator according to claim 4 is characterized in that the openend of described end capping is provided with the convex edge that pastes in described thermal hole periphery.
6. heating radiator according to claim 1 is characterized in that, described end capping is provided with described thermal hole and is connected, and has the stifled aspirating hole of plug.
7. heating radiator according to claim 1 is characterized in that, described heat-conducting medium is water or ethanol.
8. heating radiator according to claim 1 is characterized in that, described capillary network is tinsel capillary network or copper powder sintering capillary network.
9. a notebook computer comprises heating radiator, it is characterized in that, described heating radiator is any described heating radiator of claim 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320005152 CN203102139U (en) | 2013-01-06 | 2013-01-06 | Radiator and notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320005152 CN203102139U (en) | 2013-01-06 | 2013-01-06 | Radiator and notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203102139U true CN203102139U (en) | 2013-07-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320005152 Expired - Fee Related CN203102139U (en) | 2013-01-06 | 2013-01-06 | Radiator and notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203102139U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114442775A (en) * | 2022-01-28 | 2022-05-06 | 苏州浪潮智能科技有限公司 | Heat radiator |
-
2013
- 2013-01-06 CN CN 201320005152 patent/CN203102139U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114442775A (en) * | 2022-01-28 | 2022-05-06 | 苏州浪潮智能科技有限公司 | Heat radiator |
| CN114442775B (en) * | 2022-01-28 | 2023-07-14 | 苏州浪潮智能科技有限公司 | Radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130731 Termination date: 20210106 |
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| CF01 | Termination of patent right due to non-payment of annual fee |