CN105530802A - Cooling system and electronic equipment - Google Patents
Cooling system and electronic equipment Download PDFInfo
- Publication number
- CN105530802A CN105530802A CN201511001412.8A CN201511001412A CN105530802A CN 105530802 A CN105530802 A CN 105530802A CN 201511001412 A CN201511001412 A CN 201511001412A CN 105530802 A CN105530802 A CN 105530802A
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- heat
- cooling system
- shell
- eliminating medium
- heat eliminating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a cooling system, which is applied to electronic equipment and comprises a circular heat pipe and a cooling fan, wherein the circular heat pipe comprises a pipe shell, a cooling medium and a driving part; the pipe shell is circular; the cooling medium is arranged in the pipe shell; the driving part is arranged on the pipe shell, and is used for driving the cooling medium to flow in the pipe shell in cycle; the cooling fan is used for cooling a cooling segment of the pipe shell; anda heat absorption segment of the pipe shell is close to a heat-source electronic element of the electronic equipment. The pipe shell of the heat pipe in the cooling system is circular; and the cooling medium flows in the pipe shell in cycle through the driving part, and can quickly flow back to the heat absorption segment via the cooling segment of the pipe shell, so that the cooling efficiency is relatively high and the effect is relatively good. The invention further provides the electronic equipment. The cooling system is utilized by the electronic equipment, and the electronic equipment has the characteristic that the heat-source electronic element is good in cooling effect.
Description
Technical field
The present invention relates to Mechanical Industry Technology field, more particularly, relate to a kind of cooling system, also relate to a kind of electronic equipment applying above-mentioned cooling system.
Background technology
Along with the development of society, electronic equipment is applied to the productive life of people more and more.
In electronic equipment, kinds of electronic components is various, wherein as the electronic components such as CPU in use can distribute large calorimetric, cooling system need be adopted to dispel the heat to it.
At present, the cooling system of electronic equipment comprises heat pipe and fan; Heat pipe comprises shell, heat transferring medium and capillary structure, and wherein, capillary structure is arranged in shell, and heat transferring medium is sealed in the above-mentioned shell that vacuumizes.During application, the first end of heat pipe is near the heat-source electric sub-element such as above-mentioned CPU of electronic equipment, heat transferring medium becomes gas mutually after above-mentioned first end place absorbs the heat of heat-source electric sub-element, the heat transferring medium of gaseous state flow to the second end of heat pipe, the heat transferring medium of gaseous state is in the effect heat radiation of fan in above-mentioned second end and becomes liquid mutually afterwards, then liquid heat transferring medium, at the first end place of the flows by action return pipe shell of above-mentioned capillary structure, so circulates, is embodied as thermal source electronic element radiating.
But in above-mentioned cooling system, be back to the first end of heat pipe after heat transferring medium becomes liquid mutually by capillary structure, by the gravity effect of heat eliminating medium itself in reflux course, back-flow velocity is slow, and cause this cooling system rate of heat dispation limited, radiating effect is not good.
In sum, how providing a kind of cooling system, to improve its radiating efficiency, improve its radiating effect, and how to provide a kind of electronic equipment applying above-mentioned cooling system, is those skilled in the art's problem demanding prompt solutions.
Summary of the invention
In view of this, the invention provides a kind of cooling system, the shell of its heat pipe be annular and heat eliminating medium by actuator at shell internal circulation flow, endotherm section can be flowed back to fast by the radiating segment of shell, radiating efficiency is higher, better effects if.The present invention also provides a kind of electronic equipment, and the above-mentioned cooling system of this electronic apparatus application, has an effect that heat-source electric sub-element radiating effect is good.
For achieving the above object, the invention provides following technical scheme:
A kind of cooling system, for electronic equipment, comprise annular heat pipe and radiator fan, described annular heat pipe comprises:
Shell, described shell is annular,
Heat eliminating medium, described heat eliminating medium is arranged in described shell;
Actuator, described actuator is arranged at described shell, and described actuator is for driving described heat eliminating medium at described shell internal circulation flow;
Wherein, described radiator fan is used for dispelling the heat to the radiating segment of described shell, and the endotherm section of described shell is near the heat-source electric sub-element of described electronic equipment.
Preferably, in above-mentioned cooling system, described actuator is near the endotherm section of described shell.
Preferably, in above-mentioned cooling system, described heat eliminating medium is liquid heat eliminating medium.
Preferably, in above-mentioned cooling system, described heat eliminating medium can keep liquid in the first preset temperature range.
Preferably, in above-mentioned cooling system, described heat eliminating medium is heat dissipation metal medium.
Preferably, in above-mentioned cooling system, described actuator is electromagnetic pump.
Preferably, in above-mentioned cooling system, described shell is the shell that inwall and described heat eliminating medium infiltrate.
Preferably, in above-mentioned cooling system, the inwall of described shell is provided with soakage layer, and described soakage layer and described heat eliminating medium infiltrate.
Preferably, in above-mentioned cooling system, the radiating segment of described shell comprises first radiating segment corresponding with the outlet of described radiator fan and second radiating segment corresponding with the entrance of described radiator fan.
Preferably, in above-mentioned cooling system, described heat eliminating medium is along being flowed by the direction of described first radiating segment to described second radiating segment.
A kind of electronic equipment, comprise heat-source electric sub-element and cooling system, described cooling system is the cooling system in technique scheme described in any one.
The invention provides a kind of cooling system, it is for electronic equipment, comprises annular heat pipe and radiator fan, and annular heat pipe comprises shell, heat eliminating medium and actuator; Shell is annular, and heat eliminating medium is arranged in shell; Actuator is arranged at shell, and actuator is for driving heat eliminating medium at shell internal circulation flow; Wherein, radiator fan is used for dispelling the heat to the radiating segment of shell, and the endotherm section of shell is near the heat-source electric sub-element of electronic equipment.
In cooling system provided by the invention, the shell of heat pipe be annular and heat eliminating medium by actuator at shell internal circulation flow, constantly can absorb the heat with heat-source electric sub-element in stray electron equipment, compared to the cooling system that the heat eliminating medium becoming liquid state in prior art is mutually refluxed by capillary structure, its heat eliminating medium can flow back to the endotherm section of shell fast by the radiating segment of shell and again absorb heat under the effect of above-mentioned actuator, it flows back to the speed of endotherm section to avoid the gravity effect of heat eliminating medium self, and radiating efficiency is higher, better effects if.
The present invention also provides a kind of electronic equipment, and it applies above-mentioned cooling system, has the effect that heat-source electric sub-element radiating effect is good.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The assembling schematic diagram of the cooling system that Fig. 1 provides for the embodiment of the present invention and heat-source electric sub-element;
The schematic cross-section of the first shell that Fig. 2 provides for the embodiment of the present invention;
The schematic cross-section of the second shell that Fig. 3 provides for the embodiment of the present invention;
The schematic cross-section of the third shell that Fig. 4 provides for the embodiment of the present invention;
The schematic cross-section of the 4th kind of shell that Fig. 5 provides for the embodiment of the present invention
Wherein, in Fig. 1-Fig. 5:
Shell 101; Actuator 102; Radiator fan 103; Heat-source electric sub-element 201.
Embodiment
The embodiment of the invention discloses a kind of cooling system, the shell of its heat pipe be annular and heat eliminating medium by actuator at shell internal circulation flow, endotherm section can be flowed back to fast by the radiating segment of shell, its radiating efficiency is higher, better effects if.The embodiment of the invention also discloses a kind of electronic equipment, the above-mentioned cooling system of this electronic apparatus application, has the advantages that heat-source electric sub-element radiating effect is good.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 1-Fig. 5, the embodiment of the present invention provides a kind of cooling system, and it is for electronic equipment, comprises annular heat pipe and radiator fan 103; Annular heat pipe comprises shell 101, heat eliminating medium and actuator 102; Shell 101 is annular; Heat eliminating medium is arranged in shell 101; Actuator 102 is arranged at shell 101, and actuator 102 is for driving heat eliminating medium shell 101 internal circulation flow (namely actuator 102 drives heat eliminating medium along the annular flow channel flow of shell 101); Wherein, radiator fan 103 is for dispelling the heat to the radiating segment of shell 101, and the endotherm section of shell 101 is for being set to the heat-source electric sub-element 201 near electronic equipment.
In application process, heat eliminating medium absorbs the heat of heat-source electric sub-element 201 when being in the endotherm section of shell 101, afterwards heat eliminating medium at actuator 102 flows by action to the radiating segment of shell 101, and dispel the heat under the effect of radiator fan 103, heat eliminating medium again flow to above-mentioned endotherm section and absorbs heat under actuator 102 acts on subsequently, and so forth, realize dispelling the heat to heat-source electric sub-element 201.
Obviously, in the cooling system that the embodiment of the present invention provides, heat eliminating medium also constantly carries the heat with heat-source electric sub-element 201 in stray electron equipment by actuator 102 at shell 101 internal circulation flow, compared to the cooling system that the heat eliminating medium becoming liquid state in prior art is mutually refluxed by capillary structure, its heat eliminating medium can flow back to the endotherm section of shell fast by the radiating segment of shell and again absorb heat under the effect of above-mentioned actuator 102, it flows back to the speed of endotherm section to avoid the gravity effect of heat eliminating medium, and radiating efficiency is higher, better effects if.
Preferably, in the cooling system that above-described embodiment provides, actuator 102 is set to the endotherm section near shell 101.It will be understood by those skilled in the art that, in order to the heat making the endotherm section of shell 101 better absorb heat-source electric sub-element 201, apply in the electronic equipment of above-mentioned cooling system, the endotherm section of shell 101 need be set to and heat-source electric sub-element 201 arranged superposed, and in the present embodiment, actuator 102 is set near above-mentioned endotherm section, actuator 102 and above-mentioned heat-source electric sub-element 201 can be made to take same thickness space, avoiding electronic equipment to increase gauge because arranging above-mentioned actuator 102, being beneficial to electronic equipment and realizing lightening.
In above-mentioned cooling system, heat eliminating medium is liquid heat eliminating medium.In this embodiment, heat eliminating medium is liquid heat eliminating medium, it keeps liquid state not phase transformation in the process of whole heat absorption and heat radiation, compared in prior art by scheme that heat eliminating medium becomes gas to absorb heat mutually, can avoid occurs recepting the caloric in endothermic process reaches the problem of the upper limit, thus absorb heat more when the caloric value of heat-source electric sub-element 201 is large, thus improve the radiating efficiency of this cooling system, make it radiating effect better.
Concrete, above-mentioned heat eliminating medium is set in the first preset temperature range, to keep liquid.As everyone knows, the thermal Finite of heat-source electric sub-element 201 generation of electronic equipment, and in the present embodiment, make heat eliminating medium be set to keep in the first preset temperature range liquid, can meet and remain liquid to dispel the heat to heat-source electric sub-element 201 in electronic apparatus application process, also be convenient to the selection range expanding heat eliminating medium, facilitate user to choose suitable material according to cost, manufacture craft etc. and do heat eliminating medium.Above-mentioned first preset temperature range can be set to-20 °-100 °.
Concrete, in above-mentioned cooling system, heat eliminating medium is set to heat dissipation metal medium, accordingly, in the first preset temperature range, liquid state is remained in order to enable this heat dissipation metal medium, it is preferably set to gallium-indium alloy heat eliminating medium, and it also can be set to potassium sodium alloy certainly, and the present embodiment is not specifically limited.
For the ease of driving above-mentioned heat dissipation metal medium at shell 101 internal circulation flow, above-mentioned actuator 102 can be set to electromagnetic pump.Certainly, actuator 102 also can be set to the pump of other kind, and the kind of the present embodiment to actuator 102 does not limit, and it need realize driving heat eliminating medium constantly to circulate along shell 101.
Because heat eliminating medium can remain liquid state in the first preset temperature range, the process realizing dispelling the heat to heat-source electric sub-element 201 is without phase transformation, good heat dissipation effect, therefore can adopt the disadvantageous small size shell 101 of heat radiation in above-mentioned cooling system, so that electronic equipment realizes lightening.Above-mentioned small size shell 101 refers in two groups of shell 101 relative sidewalls (shell 101 is surrounded by these two groups relative sidewalls), distance between the internal face of the one group of sidewall be oppositely arranged along the thickness direction (i.e. shell 101 and heat-source electric sub-element 201 overlap direction) of electronic equipment is set to be not more than 2mm, namely be set to 2mm as L1 in Fig. 2-5 or be less than 2mm, distance between the internal face of other one group of sidewall is set to be not more than 25mm, is namely set to 25mm as L2 in Fig. 2-5 or is less than 25mm.
In above-mentioned cooling system, shell 101 seals.The internal fluid passageways of shell 101 is preferably set to be full of by heat eliminating medium, but in order to reduce manufacture difficulty, the internal fluid passageways of shell 101 also can be set to be full of by heat eliminating medium and air.
Further, in above-mentioned cooling system, shell 101 is set to the shell 101 that inwall infiltrates with liquid heat eliminating medium, to avoid heat eliminating medium to produce bubble in shell 101 (especially above-mentioned undersized shell 101) internal cause surface tension effects or form multiple discontinuous heat eliminating medium liquid bead, guarantee that heat eliminating medium can dispel the heat to be continuously heat-source electric sub-element 201 in shell 101 in continuous flow.
Above-mentioned shell 101 can directly adopt the material infiltrated with the heat eliminating medium of liquid state to prepare, but in order to cost-saving, it can arrange soakage layer at inwall, and this electric soakage layer need infiltrate with heat eliminating medium.
The electrodeposited coating (as nickel coating) that above-mentioned soakage layer can be set to rubber coating or infiltrate with liquid heat eliminating medium.For the cooling system of above-mentioned employing gallium-indium alloy as liquid heat eliminating medium, shell 101 can be set to inwall and be provided with the aluminum pipe that the copper pipe of nickel coating or inwall are provided with nickel coating.Certainly, according to the infiltration needs of heat eliminating medium, shell 101 also can be set to be made up of other materials or be set to other soakage layers, and the present embodiment is not specifically limited.
In cooling system, the size of radiator fan 103 is larger, and it has air inlet and air outlet, in order to make heat eliminating medium at the radiating segment quick heat radiating of shell 101, the radiating segment of above-mentioned shell 101 is set to comprise first radiating segment corresponding with the outlet of radiator fan 103 and second radiating segment corresponding with the entrance of radiator fan 103.During application, gas flow enters the entrance of radiator fan 103 after above-mentioned second radiating segment, the heat of heat eliminating medium is scattered and disappeared at above-mentioned second radiating segment place, air-flow flows through above-mentioned first radiating segment after being discharged by the exit of radiator fan 103 afterwards, the heat of heat eliminating medium is scattered and disappeared by above-mentioned first radiating segment, when obvious radiator fan 103 works, its air-flow formed everywhere all can be used for dispelling the heat to heat eliminating medium, is beneficial to the radiating efficiency improving this cooling system.
Concrete, in above-mentioned cooling system, heat eliminating medium is along being flowed by the direction of the first radiating segment to the second radiating segment.
The embodiment of the present invention also provides a kind of electronic equipment, and it comprises heat-source electric sub-element 201 and cooling system, wherein, and the cooling system that cooling system provides for above-described embodiment.The cooling system that this electronic apparatus application above-described embodiment provides, have the advantages that heat-source electric sub-element 201 radiating effect is good, and this electronic equipment also has other technique effect of the relevant cooling system that above-described embodiment provides, and does not repeat them here.
In this specification, each embodiment adopts the mode of going forward one by one to describe, and what each embodiment stressed is the difference with other embodiments, between each embodiment identical similar portion mutually see.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (11)
1. a cooling system, for electronic equipment, is characterized in that, comprises annular heat pipe and radiator fan, and described annular heat pipe comprises:
Shell, described shell is annular,
Heat eliminating medium, described heat eliminating medium is arranged in described shell;
Actuator, described actuator is arranged at described shell, and described actuator is for driving described heat eliminating medium at described shell internal circulation flow;
Wherein, described radiator fan is used for dispelling the heat to the radiating segment of described shell, and the endotherm section of described shell is near the heat-source electric sub-element of described electronic equipment.
2. cooling system according to claim 1, is characterized in that, described actuator is near the endotherm section of described shell.
3. cooling system according to claim 1, is characterized in that, described heat eliminating medium is liquid heat eliminating medium.
4. cooling system according to claim 3, is characterized in that, described heat eliminating medium can keep liquid in the first preset temperature range.
5. cooling system according to claim 4, is characterized in that, described heat eliminating medium is heat dissipation metal medium.
6. cooling system according to claim 5, is characterized in that, described actuator is electromagnetic pump.
7. the cooling system according to claim 3-6 any one, is characterized in that, described shell is the shell that inwall and described heat eliminating medium infiltrate.
8. cooling system according to claim 7, is characterized in that, the inwall of described shell is provided with soakage layer, and described soakage layer and described heat eliminating medium infiltrate.
9. cooling system according to claim 1, is characterized in that, the radiating segment of described shell comprises first radiating segment corresponding with the outlet of described radiator fan and second radiating segment corresponding with the entrance of described radiator fan.
10. cooling system according to claim 9, is characterized in that, described heat eliminating medium is along being flowed by the direction of described first radiating segment to described second radiating segment.
11. 1 kinds of electronic equipments, comprise heat-source electric sub-element and cooling system, it is characterized in that, described cooling system is the cooling system described in claim 1-10 any one.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511001412.8A CN105530802B (en) | 2015-12-28 | 2015-12-28 | Cooling system and electronic equipment |
| US15/392,053 US10031564B2 (en) | 2015-12-28 | 2016-12-28 | Heat dissipation apparatus and system for an electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511001412.8A CN105530802B (en) | 2015-12-28 | 2015-12-28 | Cooling system and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105530802A true CN105530802A (en) | 2016-04-27 |
| CN105530802B CN105530802B (en) | 2018-08-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511001412.8A Active CN105530802B (en) | 2015-12-28 | 2015-12-28 | Cooling system and electronic equipment |
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| Country | Link |
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| CN (1) | CN105530802B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105813440A (en) * | 2016-05-12 | 2016-07-27 | 常州市武进恒辉通信设备有限公司 | Temperature-reducing base for communication equipment |
| CN106376223A (en) * | 2016-11-24 | 2017-02-01 | 北京小米移动软件有限公司 | Liquid-cooling heat radiation system and electronic equipment |
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| CN1653405A (en) * | 2002-05-15 | 2005-08-10 | 松下电器产业株式会社 | A liquid cooling device for a notebook computer |
| CN1677655A (en) * | 2004-03-31 | 2005-10-05 | 新光电气工业株式会社 | Method of manufacturing radiating plate and semiconductor apparatus using the same |
| CN101864280A (en) * | 2010-05-20 | 2010-10-20 | 中国科学院苏州纳米技术与纳米仿生研究所 | Thermal interface material for packaging and radiating chip and preparation method thereof |
| CN102478930A (en) * | 2010-11-24 | 2012-05-30 | 中国科学院理化技术研究所 | Case back plate with liquid metal heat dissipation mechanism |
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2015
- 2015-12-28 CN CN201511001412.8A patent/CN105530802B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1653405A (en) * | 2002-05-15 | 2005-08-10 | 松下电器产业株式会社 | A liquid cooling device for a notebook computer |
| CN1677655A (en) * | 2004-03-31 | 2005-10-05 | 新光电气工业株式会社 | Method of manufacturing radiating plate and semiconductor apparatus using the same |
| CN101864280A (en) * | 2010-05-20 | 2010-10-20 | 中国科学院苏州纳米技术与纳米仿生研究所 | Thermal interface material for packaging and radiating chip and preparation method thereof |
| CN102478930A (en) * | 2010-11-24 | 2012-05-30 | 中国科学院理化技术研究所 | Case back plate with liquid metal heat dissipation mechanism |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105813440A (en) * | 2016-05-12 | 2016-07-27 | 常州市武进恒辉通信设备有限公司 | Temperature-reducing base for communication equipment |
| CN106376223A (en) * | 2016-11-24 | 2017-02-01 | 北京小米移动软件有限公司 | Liquid-cooling heat radiation system and electronic equipment |
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| Publication number | Publication date |
|---|---|
| CN105530802B (en) | 2018-08-10 |
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