CN102361128A - High-power load sheet (150W) using aluminum nitride ceramic substrate - Google Patents
High-power load sheet (150W) using aluminum nitride ceramic substrate Download PDFInfo
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- CN102361128A CN102361128A CN2011102648922A CN201110264892A CN102361128A CN 102361128 A CN102361128 A CN 102361128A CN 2011102648922 A CN2011102648922 A CN 2011102648922A CN 201110264892 A CN201110264892 A CN 201110264892A CN 102361128 A CN102361128 A CN 102361128A
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Abstract
The invention discloses a high-power load sheet (150W) using an aluminum nitride ceramic substrate. The high-power load sheet comprises the aluminum nitride substrate with the size of 9.55*6.35*1.0mm, wherein, a rear conductor layer is printed on the rear face of the aluminum nitride substrate; and resistors and leads are printed on the front face of the aluminum nitride substrate and are connected together to form a load circuit, a grounding terminal of the load circuit is electrically connected with the rear conductor layer, and glass protective films are printed on the resistors. By adopting the structure, the high-power load sheet (150W) using the aluminum nitride ceramic substrate has the advantages of good VSWR (Voltage Standing Wave Ratio) performance, high power up to 150W on the aluminum nitride ceramic substrate with the size of 9.55*6.35*1.0mm and good characteristics with high frequency band of 3G, thus the use range of the aluminum nitride ceramic substrate with the size is broadened and the high-power load sheet can be better matched with equipment.
Description
Technical field
The present invention relates to a kind of aluminium nitride ceramics substrate carrier sheet, particularly a kind of high power aluminium nitride ceramics substrate 150 tile load sheets.
Background technology
Aluminium nitride ceramics substrate carrier sheet is mainly used in the power that in communication base station, absorbs reverse input in the communication component, if can not bear the power of requirement, load will burn out, and possibly cause entire equipment to burn out.Domestic aluminium nitride ceramics substrate carrier sheet all is the commercial communication field that is applied at present, and the commercial communication frequency requirement is in 3G and the 3G.For carrier sheet; Can reach the requirement of application, the one, need to satisfy the requirement of power, the one, characteristics of product just VSWR (standing-wave ratio) is more little good more; The existing market basis needs to satisfy in 1.25: 1. and along with increasing of frequency range, the VSWR of product also will be high more.If VSWR is more little, with equipment mate just easy more, so when reaching the power of regulation, littler VSWR is the trend and the demand in market.
Simultaneously because the diversity requirement of design, with a kind of power product needed plurality of specifications is arranged, could satisfy client's various designing requirements like this.
Summary of the invention
To the deficiency of above-mentioned prior art, the technical problem that the present invention will solve provides a kind of power that can bear 150W, and standing wave needs to satisfy present 3G application requirements, reaches in 1.10: 1 with interior in the 2G frequency range simultaneously.
For solving the problems of the technologies described above, the present invention adopts following technical scheme:
A kind of high power aluminium nitride ceramics substrate 150 tile load sheets; It comprises the aluminium nitride substrate of a 9.55*6.35*1.0mm; The back up of said aluminium nitride substrate has back of the body conducting shell, and the front of said aluminium nitride substrate is printed with resistance and lead, and said lead connects said resistance and forms load circuit; The earth terminal of said load circuit is electrically connected with said back of the body conducting shell, is printed with glass protection film on the said resistance.
Preferably, the upper surface of said lead and glass protection film also is printed with one deck black protective film.
Preferably, said back of the body conducting shell and lead are formed by the conductive silver paste printing, and said resistance is formed by the resistance slurry printing.
Technique scheme has following beneficial effect: the high power aluminium nitride ceramics substrate 150 tile load sheets of this structure have good VSWR performance; Power on the aluminium nitride ceramics substrate of 9.55*6.35*1.0mm reaches 150W; Make its characteristic standing wave can satisfy present 3G application requirements simultaneously; Reach in 1.10: 1 with interior in the 2G frequency range simultaneously, make the aluminium nitride ceramics substrate scope of application of this size wider, also can carry out good coupling with equipment more.
Adopt vertical design, structurally form complementation, satisfied the different design requirement of client with transverse design.
Above-mentioned explanation only is the general introduction of technical scheme of the present invention, understands technological means of the present invention in order can more to know, and can implement according to the content of specification, below with preferred embodiment of the present invention and conjunction with figs. specify as after.Embodiment of the present invention is provided by following examples and accompanying drawing thereof in detail.
Description of drawings
Fig. 1 is the structural representation of the embodiment of the invention.
Embodiment
Below in conjunction with accompanying drawing the preferred embodiments of the present invention are described in detail.
As shown in Figure 1; These high power aluminium nitride ceramics substrate 150 tile load sheets comprise the aluminium nitride substrate 1 of a 9.55*6.35*1.0mm; The back up of aluminium nitride substrate 1 has back of the body conducting shell, and the front of aluminium nitride substrate 1 is printed with resistance 3 and lead 2, and lead 2 connects resistance 3 and forms load circuit; The earth terminal of load circuit is electrically connected through the silver slurry with back of the body conducting shell, thereby makes the load circuit earth-continuity.Back of the body conducting shell and lead 2 are formed by the conductive silver paste printing, and resistance 3 is formed by the resistance slurry printing.Be printed with glass protection film 4 on the resistance 3.The upper surface of lead 2 and glass protection film 4 also is printed with one deck black protective film 5.
The high power aluminium nitride ceramics substrate 150 tile load sheets of this this structure have good VSWR performance; Power on the aluminium nitride ceramics substrate of 9.55*6.35*1.0mm reaches 150W; Make its characteristic standing wave can satisfy present 3G application requirements simultaneously; Reach in 1.10: 1 with interior in the 2G frequency range simultaneously, make the aluminium nitride ceramics substrate scope of application of this size wider, also can carry out good coupling with equipment more.Power according to this aluminium nitride ceramics substrate carrier sheet of detection can be born is highly stable, can reach the requirement that communication period absorbs required power fully,
Adopt vertical design, structurally form complementation, satisfied the different design requirement of client with transverse design.
More than a kind of high power aluminium nitride ceramics substrate 150 tile load sheets that the embodiment of the invention provided have been carried out detailed introduction; For one of ordinary skill in the art; According to the thought of the embodiment of the invention, the part that on embodiment and range of application, all can change, in sum; This description should not be construed as limitation of the present invention, and all any changes of making according to design philosophy of the present invention are all within protection scope of the present invention.
Claims (3)
1. high power aluminium nitride ceramics substrate 150 tile load sheets; It is characterized in that: it comprises the aluminium nitride substrate of a 9.55*6.35*1.0mm; The back up of said aluminium nitride substrate has back of the body conducting shell, and the front of said aluminium nitride substrate is printed with resistance and lead, and said lead connects said resistance and forms load circuit; The earth terminal of said load circuit is electrically connected with said back of the body conducting shell, is printed with glass protection film on the said resistance.
2. high power aluminium nitride ceramics substrate 150 tile load sheets according to claim 1, it is characterized in that: the upper surface of said lead and glass protection film also is printed with one deck black protective film.
3. high power aluminium nitride ceramics substrate 150 tile load sheets according to claim 1, it is characterized in that: said back of the body conducting shell and lead are formed by the conductive silver paste printing, and said resistance is formed by the resistance slurry printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102648922A CN102361128A (en) | 2011-09-08 | 2011-09-08 | High-power load sheet (150W) using aluminum nitride ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102648922A CN102361128A (en) | 2011-09-08 | 2011-09-08 | High-power load sheet (150W) using aluminum nitride ceramic substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102361128A true CN102361128A (en) | 2012-02-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102648922A Pending CN102361128A (en) | 2011-09-08 | 2011-09-08 | High-power load sheet (150W) using aluminum nitride ceramic substrate |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5332981A (en) * | 1992-07-31 | 1994-07-26 | Emc Technology, Inc. | Temperature variable attenuator |
| CN101075490A (en) * | 2007-05-01 | 2007-11-21 | 北海银河开关设备有限公司 | 12kV fixed-sealed resistant voltage divider |
| CN101859620A (en) * | 2009-04-08 | 2010-10-13 | 深圳市信特科技有限公司 | Manufacturing method of high-frequency high-power resistor |
| CN101923928A (en) * | 2010-03-25 | 2010-12-22 | 四平市吉华高新技术有限公司 | High-frequency patch resistor and manufacturing method thereof |
| CN202259627U (en) * | 2011-09-08 | 2012-05-30 | 苏州市新诚氏电子有限公司 | High power aluminium nitride ceramic substrate 150W load sheet |
-
2011
- 2011-09-08 CN CN2011102648922A patent/CN102361128A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5332981A (en) * | 1992-07-31 | 1994-07-26 | Emc Technology, Inc. | Temperature variable attenuator |
| CN101075490A (en) * | 2007-05-01 | 2007-11-21 | 北海银河开关设备有限公司 | 12kV fixed-sealed resistant voltage divider |
| CN101859620A (en) * | 2009-04-08 | 2010-10-13 | 深圳市信特科技有限公司 | Manufacturing method of high-frequency high-power resistor |
| CN101923928A (en) * | 2010-03-25 | 2010-12-22 | 四平市吉华高新技术有限公司 | High-frequency patch resistor and manufacturing method thereof |
| CN202259627U (en) * | 2011-09-08 | 2012-05-30 | 苏州市新诚氏电子有限公司 | High power aluminium nitride ceramic substrate 150W load sheet |
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Application publication date: 20120222 |