CN102332889B - 振动片、振子以及振荡器 - Google Patents

振动片、振子以及振荡器 Download PDF

Info

Publication number
CN102332889B
CN102332889B CN201110192101.XA CN201110192101A CN102332889B CN 102332889 B CN102332889 B CN 102332889B CN 201110192101 A CN201110192101 A CN 201110192101A CN 102332889 B CN102332889 B CN 102332889B
Authority
CN
China
Prior art keywords
vibrating
vibrating piece
arm
base
crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201110192101.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN102332889A (zh
Inventor
山田明法
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of CN102332889A publication Critical patent/CN102332889A/zh
Application granted granted Critical
Publication of CN102332889B publication Critical patent/CN102332889B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02086—Means for compensation or elimination of undesirable effects
    • H03H9/02102—Means for compensation or elimination of undesirable effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0504—Holders or supports for bulk acoustic wave devices
    • H03H9/0514—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps
    • H03H9/0519—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps for cantilever
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/21—Crystal tuning forks

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
CN201110192101.XA 2010-07-09 2011-07-04 振动片、振子以及振荡器 Expired - Fee Related CN102332889B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010156577A JP5617392B2 (ja) 2010-07-09 2010-07-09 振動片、振動子及び発振器
JP2010-156577 2010-07-09

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201410008939.2A Division CN103731115A (zh) 2010-07-09 2011-07-04 振动片、振子以及振荡器

Publications (2)

Publication Number Publication Date
CN102332889A CN102332889A (zh) 2012-01-25
CN102332889B true CN102332889B (zh) 2014-05-07

Family

ID=45438182

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201110192101.XA Expired - Fee Related CN102332889B (zh) 2010-07-09 2011-07-04 振动片、振子以及振荡器
CN201410008939.2A Pending CN103731115A (zh) 2010-07-09 2011-07-04 振动片、振子以及振荡器

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201410008939.2A Pending CN103731115A (zh) 2010-07-09 2011-07-04 振动片、振子以及振荡器

Country Status (3)

Country Link
US (2) US8760235B2 (enExample)
JP (1) JP5617392B2 (enExample)
CN (2) CN102332889B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201032470A (en) * 2008-10-24 2010-09-01 Seiko Epson Corp Bending vibration piece, bending vibrator, and piezoelectric device
JP5912557B2 (ja) * 2011-03-29 2016-04-27 日本電波工業株式会社 音叉型圧電振動片及び圧電デバイス
JP6287208B2 (ja) * 2013-12-27 2018-03-07 セイコーエプソン株式会社 振動子、発振器、電子機器、物理量センサーおよび移動体
KR102052759B1 (ko) * 2014-07-07 2019-12-09 삼성전기주식회사 진동편 및 이를 구비한 전자기기
JP6432190B2 (ja) * 2014-07-25 2018-12-05 セイコーエプソン株式会社 振動素子、振動素子の製造方法、振動子、電子機器および移動体
JP6450551B2 (ja) * 2014-09-30 2019-01-09 エスアイアイ・クリスタルテクノロジー株式会社 圧電振動片及び圧電振動子
KR20160076711A (ko) * 2014-12-23 2016-07-01 삼성전기주식회사 튜닝 포크형 진동자
JP6582501B2 (ja) * 2015-04-02 2019-10-02 セイコーエプソン株式会社 振動素子、振動子、電子機器および移動体
CN107852146B (zh) * 2015-07-09 2021-04-09 株式会社村田制作所 水晶振动片以及水晶振子
JP2017200015A (ja) * 2016-04-26 2017-11-02 セイコーエプソン株式会社 振動子、発振器、電子機器および移動体
JP6644383B2 (ja) * 2017-07-18 2020-02-12 真理子 村岡 変形絞り付きカメラレンズキャップ
US11337920B2 (en) 2017-12-18 2022-05-24 Tris Pharma, Inc. Pharmaceutical composition comprising GHB gastro-retentive raft forming systems having trigger pulse drug release
CA3085941A1 (en) 2017-12-18 2019-06-27 Tris Pharma, Inc. Ghb pharmaceutical compositions comprising a floating interpenetrating polymer network forming system
JP6675468B2 (ja) * 2018-12-07 2020-04-01 エスアイアイ・クリスタルテクノロジー株式会社 圧電振動片及び圧電振動子
CN116094486B (zh) * 2022-11-21 2023-11-21 成都泰美克晶体技术有限公司 一种音叉晶体振荡片及其制造方法和压电器件
KR20250148613A (ko) 2023-02-03 2025-10-14 트리스 파마 인코포레이티드 저 나트륨 옥시베이트 밤마다 1회 투여 조성물
CN117767909A (zh) * 2023-12-27 2024-03-26 天津大学 一种音叉型压电振动片及振荡器

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050104480A1 (en) * 2003-09-29 2005-05-19 Hideo Tanaya Piezoelectric device, cellular phone system using the piezoelectric device, and electronic equipment using the piezoelectric device
JP2007158486A (ja) * 2005-12-01 2007-06-21 Epson Toyocom Corp 水晶振動素子、水晶振動子、及び水晶発振器
CN101383600A (zh) * 2007-07-19 2009-03-11 伊塔瑞士钟表制造股份有限公司 具有优化的运动电容的压电生成器

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0232229U (enExample) 1988-08-23 1990-02-28
JP4852195B2 (ja) * 1999-01-20 2012-01-11 セイコーエプソン株式会社 音叉型水晶振動子
JP4026074B2 (ja) 2003-06-30 2007-12-26 有限会社ピエデック技術研究所 水晶振動子と水晶ユニットと水晶発振器
JP4609196B2 (ja) * 2005-06-20 2011-01-12 セイコーエプソン株式会社 圧電振動片および圧電デバイスならびに電子機器および携帯電話装置
JP4694953B2 (ja) 2005-11-30 2011-06-08 セイコーインスツル株式会社 圧電振動片の製造方法、圧電振動片、圧電振動子、発振器、電子機器及び電波時計
KR20090089903A (ko) 2006-12-12 2009-08-24 이 아이 듀폰 디 네모아 앤드 캄파니 3-하이드록시글루타로니트릴의 합성 방법
US8446079B2 (en) * 2008-05-23 2013-05-21 Statek Corporation Piezoelectric resonator with vibration isolation
JP4838873B2 (ja) * 2008-07-22 2011-12-14 日本電波工業株式会社 圧電振動片および圧電デバイス
JP5454134B2 (ja) 2008-12-27 2014-03-26 セイコーエプソン株式会社 振動片、振動子、センサー及び電子部品
US8067880B2 (en) 2008-12-27 2011-11-29 Seiko Epson Corporation Flexural vibration element and electronic component
JP2010157933A (ja) 2008-12-27 2010-07-15 Epson Toyocom Corp 屈曲振動片及び電子部品
JP5445114B2 (ja) 2009-03-02 2014-03-19 セイコーエプソン株式会社 振動片および発振器
JP2010226608A (ja) 2009-03-25 2010-10-07 Seiko Epson Corp 屈曲振動片およびそれを用いた発振器
JP2010252302A (ja) 2009-03-25 2010-11-04 Seiko Epson Corp 屈曲振動片およびそれを用いた発振器
JP2010226610A (ja) 2009-03-25 2010-10-07 Seiko Epson Corp 屈曲振動片およびそれを用いた発振器
JP5385037B2 (ja) * 2009-07-21 2014-01-08 エスアイアイ・クリスタルテクノロジー株式会社 圧電振動片、圧電振動子、発振器、電子機器及び電波時計並びに圧電振動片の製造方法
JP5565163B2 (ja) * 2009-10-08 2014-08-06 セイコーエプソン株式会社 振動片、振動子、発振器、および電子機器
JP5659585B2 (ja) 2010-07-09 2015-01-28 セイコーエプソン株式会社 振動片、振動子、発振器及び電子機器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050104480A1 (en) * 2003-09-29 2005-05-19 Hideo Tanaya Piezoelectric device, cellular phone system using the piezoelectric device, and electronic equipment using the piezoelectric device
JP2007158486A (ja) * 2005-12-01 2007-06-21 Epson Toyocom Corp 水晶振動素子、水晶振動子、及び水晶発振器
CN101383600A (zh) * 2007-07-19 2009-03-11 伊塔瑞士钟表制造股份有限公司 具有优化的运动电容的压电生成器

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2007-158486A 2007.06.21

Also Published As

Publication number Publication date
US9325278B2 (en) 2016-04-26
CN103731115A (zh) 2014-04-16
CN102332889A (zh) 2012-01-25
US20120007685A1 (en) 2012-01-12
US8760235B2 (en) 2014-06-24
US20140253254A1 (en) 2014-09-11
JP5617392B2 (ja) 2014-11-05
JP2012019441A (ja) 2012-01-26

Similar Documents

Publication Publication Date Title
CN102332889B (zh) 振动片、振子以及振荡器
US8482358B2 (en) Flexural resonator element, resonator, oscillator, and electronic device
CN101847978B (zh) 弯曲振动片及利用该弯曲振动片的振荡器
JP5593979B2 (ja) 振動片、振動子、発振器、センサー及び電子機器
US8232707B2 (en) Flexural vibration piece and oscillator using the same
JP2010226608A (ja) 屈曲振動片およびそれを用いた発振器
CN102629860B (zh) 振动片、振子、振荡器以及电子设备
JP2011082945A (ja) 屈曲振動片、屈曲振動子、および電子デバイス
JP2011228980A (ja) 振動片、振動子、発振器、および電子機器
JP5533213B2 (ja) 振動片、振動子及び発振器
JP5822186B2 (ja) 振動子、発振器、および電子機器
JP2012028899A (ja) 振動片、振動子及び発振器
JP5621285B2 (ja) 振動片、振動子および発振器
JP2011254351A (ja) 圧電振動片、圧電振動子および圧電発振器
JP2015027093A (ja) 振動片、振動子及び発振器
JP2012182610A (ja) 振動片、振動子、発振器及び電子機器
JP2011239256A (ja) 振動片、振動子、発振器、および電子機器
JP2015015770A (ja) 屈曲振動片、振動子、発振器及び電子機器

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140507

Termination date: 20200704

CF01 Termination of patent right due to non-payment of annual fee