CN102297351B - LED (light emitting diode) light source module and manufacturing method thereof - Google Patents
LED (light emitting diode) light source module and manufacturing method thereof Download PDFInfo
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- CN102297351B CN102297351B CN201110165797.7A CN201110165797A CN102297351B CN 102297351 B CN102297351 B CN 102297351B CN 201110165797 A CN201110165797 A CN 201110165797A CN 102297351 B CN102297351 B CN 102297351B
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Abstract
The invention discloses an LED (light emitting diode) light source module. The LED light source module comprises a baseplate with a groove and an LED chip packaged in the groove, wherein a circuit is arranged on the bottom of the groove and used for finishing the electrical connection of the LED chip; and the LED light source module also comprises a transparent material arranged on the surface of the baseplate, a sealed cavity is arranged between the groove and the transparent material, and the cavity is filled with a liquid insulation heat conduction material. The invention also discloses a manufacturing method of the LED light source module. The LED light source module provided by the invention has the advantages that the chip is fully immersed in the insulation heat conduction material, the heat dissipation area is greatly increased, and stereo heat dissipation is formed, so that the temperature of the LED light source module is dropped; the junction temperature can be maintained at a lower temperature when the LED chip is in work, thereby greatly improving the reliability; the thermal conductivity of the insulation heat conduction material is high, the temperature uniformity of each chip is greatly improved, and the photochromic uniformity is also greatly improved; and the heat conduction efficiency of the LED chip is improved, so that the stability of the whole light source module is improved and the service life is prolonged.
Description
Technical field
The present invention relates to LED light source module packaging field, in particular for the manufacture method of LED light source module and this LED light source module of flat-panel monitor backlight.
Background technology
In LED light source, normal requirement forms light source module use with a plurality of chips, and heat radiation has just become one of them major issue that will consider.For LED chip, if heat concentrates on chip internal, can not effectively be diffused in surrounding environment and go, can cause the temperature rise of chip joint, cause the non-uniform Distribution of thermal stress, thereby accelerate the decay of device light output, affect the reliability of device.And for LED light source module, if temperature is inconsistent between different chip, may cause the optical attenuation speed of different chips inconsistent, thereby cause the photochromic uniformity variation of final light source.
For the heat dissipation problem of LED light source module, the Chinese patent that application number is 200720075987.9 discloses a kind of LED-backlit source heat-dissipating device, and radiating fin can slide on heat-radiating substrate; Application number is the backlight heat abstractor that 200610126831.9 Chinese patent discloses a kind of flat-panel screens, and heat-radiating substrate absorbs heat energy by heat-conducting part, and heat-radiating substrate front is provided with several radiating fins; Application number is the radiating module that 200610091179.1 Chinese patent discloses a kind of backlight, reaches the object of heat radiation by form a plurality of radiating fins and heat radiation conduit on heat-radiating substrate.Above-mentioned patent has all been mentioned the method for dispelling the heat with heat dissipation metal fin after circuit board that is used in, this method can reach good radiating effect, but also can be with the problem of serving: first, therefore the weight of system can become large, and this is worthless for pursuing frivolous backlight; Secondly, because the making of radiating fin needs die sinking, also increased the cost of system.
Summary of the invention
The problem existing for above-mentioned prior art, one object of the present invention is, the LED light source that a kind of area of dissipation is large, heat transfer efficiency is high, structure is frivolous module is provided; Another object of the present invention is, a kind of manufacture method of LED light source module is provided.
To achieve these goals, technical scheme of the present invention is: a kind of LED light source module, comprise with the substrate of groove and be packaged in the LED chip in groove, bottom portion of groove cloth has been useful on the circuit of LED chip electrical connection, also comprise the transparent material of being located at substrate surface, between groove and transparent material, form the cavity of a sealing, in cavity, be full of liquid insulating heat-conduction material.LED chip is immersed in insulating heat-conduction material completely, the heat that LED chip sends can conduct by insulating heat-conduction material, increasing heat radiation area, realize three-dimensional heat radiation, make to dispel the heat evenly between each LED chip, improved the service life of LED chip, the photochromic uniformity between LED chip can be kept the long period.
Preferably, the plated surface of groove is useful on the reflector layer that improves light reflectance, and specifically this reflector layer can be aluminium or silver.
Preferably, described LED chip adopts flip-chip, also can adopt positive cartridge chip.
Further, described LED chip is coated with the first layer of silica gel, phosphor powder layer and the second layer of silica gel from the bottom to top successively from light-emitting area; The first layer of silica gel isolation LED chip and fluorescent material, utilizes far field excitation pattern principle to improve fluorescent material launching efficiency and service life, and the 3rd layer of silica gel avoids phosphor powder layer directly to contact with heat-conducting liquid.
Further, described the second layer of silica gel is made film-form, or convex lens shape, or microlens array shape.
Preferably, described liquid insulating heat-conduction material is silicone oil; Described transparent material is glass or acrylic board.
The present invention also provides a kind of manufacture method of LED light source module, specifically comprises the following steps:
(1) make a substrate with groove, LED chip die bond, in bottom portion of groove, and is completed to electrical connection in LED chip bottom;
(2) with after alcohol cleaning base plate and LED chip, at substrate top, add a transparent material groove is sealed;
(3) on substrate, offer respectively input port and delivery outlet, input port and delivery outlet communication groove;
(4) by input port, in groove, inject liquid insulating heat-conduction material;
(5) in vacuum environment, the bubble in cavity is discharged from delivery outlet, make liquid insulating heat-conduction material be full of the cavity of groove and transparent material formation;
(6) sealing input port and delivery outlet,
Or do not seal input port and delivery outlet, cavity forms a closed circuit by input port and delivery outlet and extraneous cooling system, guarantee to be full of liquid insulating heat-conduction material in cavity and without bubble.
As a kind of preferred version, in step (1), also the upper surface at LED chip is coated with the first layer of silica gel, phosphor powder layer and the second layer of silica gel from lower to upper successively; Described the second layer of silica gel is made film-form, or convex lens shape, or microlens array shape.
As a kind of preferred version, described the first layer of silica gel utilizes high temperature to be cured, and solidification temperature is 140 degree, and be 40min-60min hardening time; Described phosphor powder layer fluorescent material excitation wavelength used is consistent with the peak wavelength of LED chip, utilizes high temperature to be cured, and solidification temperature is 150 degree, and be 40min-60min hardening time; Described the second layer of silica gel is made film-form or convex lens shape or microlens array shape, also utilizes high temperature to be cured, and solidification temperature is 140 degree, and be 40min-60min hardening time.
Preferably, described liquid insulating heat-conduction material is silicone oil; Described transparent material is glass or acrylic board.
Compared with prior art, the present invention has the following advantages:
1, chip is immersed in insulating heat-conduction material completely, has increased greatly area of dissipation, form three-dimensional heat radiation, the temperature of LED light source module is declined, junction temperature during LED chip work can remain on a lower temperature, and reliability improves;
2, the thermal conductivity of insulating heat-conduction material is high, and the temperature homogeneity between each chip is greatly improved, and photochromic uniformity is also greatly improved;
3, the heat transfer efficiency of LED chip improves, and makes the stability of whole light source module be improved and extend service life.
Accompanying drawing explanation
Fig. 1 is the side view of LED light source module of the present invention;
Fig. 2 is the top view of LED light source module of the present invention;
Fig. 3 is the structural representation of LED light source module of the present invention;
Fig. 4 is the single LEDs chip structure schematic diagram in the present invention.
The specific embodiment
Below in conjunction with accompanying drawing, the present invention is described in further detail:
As Figure 1-4, the LED light source module that a kind of heat dispersion is good, comprise with the substrate 3 of inverted trapezoidal groove and be packaged in the LED chip 2 in groove, four sides of groove are coated with aluminium or silver, be used for improving light reflectance, bottom portion of groove cloth has been useful on the circuit 21 of LED chip 2 electrical connections, and LED chip 2 adopts flip-chip.LED light source module also comprises the transparent acrylic board 1 of being located at substrate 3 surfaces, and 3 cavitys that form a sealing of groove and acrylic board, are full of silicone oil in cavity.The light output surface coating trilaminate material of LED chip 2, wherein ground floor and the 3rd layer are layer of silica gel 22,24, and intermediate layer is phosphor powder layer 23; The second layer of silica gel 24 of LED chip 2 top coating is made film-form or convex lens shape or microlens array shape.
Above-mentioned LED light source module is made by following steps:
First, make a substrate 3 that has trapezoidal groove, the bottom portion of groove good electrode of cloth and circuit line etc. can complete the necessary technique of LED chip 2 electrical connection, the metal that side is silver-plated or aluminium isoreflectance is high of trapezoidal groove; On substrate 3, complete the processing steps such as LED chip 2 face-down bondings, LED chip 2 quantity used with and the spacing of LED chip 2 can set according to the concrete size of the backlight light bar of made;
Then, the effect that is coated with the first layer of silica gel 22, the first layer of silica gel 22 at the exiting surface of LED chip 2 is isolation LED chip 2 and fluorescent material, adopts far field excitation pattern to improve fluorescent material launching efficiency and service life; With baking box, the first layer of silica gel 22 is carried out to hot setting, solidification temperature is 140 degree, and be 40min-60min hardening time;
Coating phosphor powder layer 23 in the first layer of silica gel 22 after solidifying, fluorescent material excitation wavelength used is consistent with the peak wavelength of LED chip 2, with baking box, phosphor powder layer 23 is carried out to hot setting, and solidification temperature is 150 degree, and be 40min-60min hardening time; The effect that is coated with again the second layer of silica gel 24, the second layer of silica gel 24 on phosphor powder layer 23 is isolation phosphor powder layer 23 and extraneous contacting, and the second layer of silica gel 24 is cured, and solidification temperature is 140 degree, and be 40min-60min hardening time;
With alcohol, clean LED chip 2 and the substrate 3 after face-down bonding, at substrate top, add a cover a transparent glass sheet, with binding material, seal; At substrate, 3 groove mouth places, two ends respectively insert a trapezoidal acrylic board, with binding material, seal, and make respectively input and output mouth 31 on two acrylic boards, cavity of the interior formation of substrate 3, by input port, in cavity, slowly inject silicone oil, and in vacuum environment, air bubble is discharged by delivery outlet, after liquid is filled with, seal input and output mouth, complete the seal operation of LED light source module.
The difference of the present embodiment and embodiment 1 is, in making the final step of LED light source module, input and output mouth does not seal, but forms a closed circuit with extraneous cooling system, in closed circuit, cooling medium used is all silicone oil, guarantees to be full of silicone oil in cavity and without bubble.
Above embodiment only, for technical scheme of the present invention is described, is not intended to limit; Although the present invention is had been described in detail with reference to preferred embodiment; those of ordinary skill in the field are to be understood that; still can modify or part technical characterictic is equal to replacement the specific embodiment of the present invention; and not departing from the spirit of technical solution of the present invention, it all should be encompassed in the middle of the technical scheme scope that the present invention asks for protection.
Claims (10)
1. a LED light source module, comprise with the substrate of groove and be packaged in the LED chip in groove, bottom portion of groove cloth has been useful on the circuit of LED chip electrical connection, it is characterized in that, also comprise the transparent material of being located at substrate surface, between groove and transparent material, form a cavity, in cavity, be full of liquid insulating heat-conduction material; Described with offering respectively input port and delivery outlet on the substrate of groove, input port and delivery outlet communication groove; Described LED chip is welded in the electrical connection of groove substrate.
2. LED light source module according to claim 1, is characterized in that, the plated surface of groove is useful on the reflector layer that improves light reflectance.
3. LED light source module according to claim 1, is characterized in that, described LED chip adopts flip-chip.
4. LED light source module according to claim 3, is characterized in that, described LED chip is coated with the first layer of silica gel, phosphor powder layer and the second layer of silica gel from the bottom to top successively from light-emitting area; Described the second layer of silica gel is made film-form, or convex lens shape, or microlens array shape.
5. LED light source module according to claim 1, is characterized in that, described liquid insulating heat-conduction material is silicone oil; Described transparent material is glass or acrylic board.
6. a manufacture method for LED light source module, is characterized in that, specifically comprises the following steps:
(1) make a substrate with groove, LED chip die bond, in bottom portion of groove, and is completed to electrical connection in LED chip bottom;
(2) with after alcohol cleaning base plate and LED chip, at substrate top, add a transparent material groove is sealed;
(3) with offering respectively input port and delivery outlet on the substrate of groove, input port and delivery outlet communication groove;
(4) by input port, in groove, inject liquid insulating heat-conduction material;
(5) in vacuum environment, the bubble in cavity is discharged from delivery outlet, make liquid insulating heat-conduction material be full of the cavity of groove and transparent material formation;
(6) sealing input port and delivery outlet.
7. a manufacture method for LED light source module, is characterized in that, specifically comprises the following steps:
(1) make a substrate with groove, LED chip die bond, in bottom portion of groove, and is completed to electrical connection in LED chip bottom;
(2) with after alcohol cleaning base plate and LED chip, at substrate top, add a transparent material groove is sealed;
(3) with offering respectively input port and delivery outlet on the substrate of groove, input port and delivery outlet communication groove;
(4) by input port, in groove, inject liquid insulating heat-conduction material;
(5) in vacuum environment, the bubble in cavity is discharged from delivery outlet, make liquid insulating heat-conduction material be full of the cavity of groove and transparent material formation;
(6) do not seal input port and delivery outlet, cavity forms a closed circuit by input port and delivery outlet and extraneous cooling system, guarantees to be full of liquid insulating heat-conduction material in cavity and without bubble.
8. according to the manufacture method of the LED light source module described in claim 6 or 7, it is characterized in that, in step (1), also the upper surface at LED chip is coated with the first layer of silica gel, phosphor powder layer and the second layer of silica gel from lower to upper successively;
Described the second layer of silica gel is made film-form, or convex lens shape, or microlens array shape.
9. the manufacture method of LED light source module according to claim 8, is characterized in that, described the first layer of silica gel utilizes high temperature to be cured, and solidification temperature is 140 degree, and be 40min-60min hardening time;
Described phosphor powder layer fluorescent material excitation wavelength used is consistent with the peak wavelength of LED chip, utilizes high temperature to be cured, and solidification temperature is 150 degree, and be 40min-60min hardening time;
Described the second layer of silica gel is made film-form or convex lens shape or microlens array shape, also utilizes high temperature to be cured, and solidification temperature is 140 degree, and be 40min-60min hardening time.
10. according to the manufacture method of the LED light source module described in claim 6 or 7, it is characterized in that, described liquid insulating heat-conduction material is silicone oil; Described transparent material is glass or acrylic board.
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| CN103759164A (en) * | 2014-02-21 | 2014-04-30 | 广东昌胜照明科技有限公司 | Double-tube lamp and production method thereof |
| CN103953862B (en) * | 2014-04-10 | 2019-01-04 | 衢州蘑菇网络科技有限公司 | A kind of the LED light manufacturing method and its LED light of the oil type of cooling |
| CN105449073A (en) * | 2014-09-17 | 2016-03-30 | 阳升应用材料股份有限公司 | Multi-grain substrate-free LED device |
| CN105336831A (en) * | 2015-09-24 | 2016-02-17 | 李峰 | Liquid-filled LED lamp |
| CN105782854B (en) * | 2016-05-20 | 2019-02-01 | 陈文韬 | Car headlamp mould group of a kind of achievable light switching and brightness regulation and preparation method thereof, control method |
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| CN102072474A (en) * | 2010-10-11 | 2011-05-25 | 朱大龙 | Soaking heat radiating method for LED (Light Emitting Diode) integrated module |
| CN102130111A (en) * | 2010-12-24 | 2011-07-20 | 郑伟 | Liquid-packaged high-power LED (light-emitting diode) device and packaging method of LED device |
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