CN105449073A - Multi-grain substrate-free LED device - Google Patents
Multi-grain substrate-free LED device Download PDFInfo
- Publication number
- CN105449073A CN105449073A CN201410474632.1A CN201410474632A CN105449073A CN 105449073 A CN105449073 A CN 105449073A CN 201410474632 A CN201410474632 A CN 201410474632A CN 105449073 A CN105449073 A CN 105449073A
- Authority
- CN
- China
- Prior art keywords
- substrate
- led matrix
- aforementioned
- multiple grain
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Led Device Packages (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Abstract
A multi-grain substrate-free LED device comprises a piece of light-transmitting substrate, a layer of fluorescent glue, at least one light emitting diode grain and an enable circuit, wherein the light-transmitting substrate comprises an upper surface, a lower surface and side surfaces connected with the upper and lower surfaces, and at least one groove is formed in the lower surface; the fluorescent glue fills in the groove, and forms an installation surface corresponding to the lower surface; the at least one light emitting diode grain comprises a light emitting surface and a guide connection surface which is opposite to the light emitting surface, and at least two enable terminals are formed on the guide connection surface; the light emitting surface of the light emitting diode grain faces toward the upper surface, and at least parts of the guide connection surface, the lower surface and the installation surface are accommodated in the fluorescent glue in a corresponding method; and the enable circuit is arranged on the lower surface and the enable terminals, and further comprises a pair of welding terminals.
Description
Technical field
A kind of multiple grain for lighting field is without substrate LED matrix.
Background technology
Current light-emitting diode Light-EmittingDiode (calling LED in the following text) is quite universal, not only volume is little for LED matrix, the reaction time is fast, long service life, brightness not easily decay and vibration resistance, LED matrix is gradually replaced comprise the display of the information of display backlight light source, lighting source, traffic sign, vehicle to see version and lighting etc. thereof, allow the use category of LED matrix expand gradually.
Aforementioned LED matrix is when using as illumination, the visual demand of human eye need be coordinated and design, seen by human eye, white light is jointly provided by redgreenblue cone cell, for cost-saving, current white light LEDs then uses the Blue LED Die of single wavelength usually, discharges gold-tinted via the yellow fluorescent material absorption portion blue light being arranged on wafer front, with residue blue light colour mixture, allow three kinds of cone cells in mankind's eye can be subject to suitable stimulation, and produce visually cognitive white light.In the encapsulation of existing LED, printed circuit board (PCB) or the ceramic substrate of an insulation must be set, and on substrate, cook up wire and weld pad, install for LED grain and wiring power supply.
But, all obstruction light can be covered as the printed circuit board (PCB) of substrate or ceramic substrate, the light emission direction of LED matrix is suppressed naturally, to realize wide-angle illumination, then and must as so-called corn lamp etc., additionally at each three-dimensional viewpoin, LED grain is set respectively, this measure makes the structure of LED matrix more complicated, and due to the intensive setting of LED grain of each angle, part electric energy is converted to heat energy release, thus ambient temperature rises, and all therefore luminous efficiency and the useful life of LED decline.
Because above-mentioned problem, the present inventor attempts to provide a kind of multiple grain without substrate LED matrix, effectively can solve passing heat radiation problem not easily, promotes the luminous efficiency of LED matrix; Simplify the production process of LED matrix simultaneously, reduce cost of manufacture, promote overall fine ratio of product; And guarantee that the fluorescent glue inserted can be substantially flush and form tabular surface with the lower surface of LED grain, and pass through modes such as such as printing, the electrode of LED grain is allowed directly to adhere to one deck conducting resinl with wire and activation luminescence and due to the designs simplification of substrate, make LED matrix can printing opacity and have and better use elasticity completely, these can be all the focuses that the present invention will pay attention to.
Summary of the invention
One of the present invention object is to provide a kind of multiple grain of complete printing opacity without substrate LED matrix.
Another object of the present invention is to provide a kind of multiple grain simplifying production process without substrate LED matrix, reduces cost of manufacture, promotes overall fine ratio of product.
Another object of the present invention is to provide a kind of multiple grain without substrate LED matrix, guarantees that the fluorescent glue inserted can form tabular surface, and prints conducting resinl and make LED matrix activation luminous, simplifies the structure of substrate, obtains and better use elasticity.
The present invention again another object be to provide a kind of can with the multiple grain of the angle luminescence of 360 degree without substrate LED matrix.
Still a further object of the present invention is to provide one that LED crystal particle operating temperature can be made effectively to decline, and the multiple grain of improving extraction efficiency is without substrate LED matrix.
For reaching above-mentioned purpose, the invention provides a kind of multiple grain without substrate LED matrix, comprising: a slice transmitting substrate, have a upper surface, a lower surface and connect the side of aforementioned upper and lower surface, wherein this lower surface is formed with at least one groove; One deck is filled in the fluorescent glue in aforementioned grooves, and this fluorescent glue is formed with the installed surface of an aforementioned lower surface of correspondence; At least one LED crystal particle, have a light-emitting area and one and connect face in contrast to this light-emitting area, this connects on face and is formed with at least two activation terminals; Aforementioned LED crystal particle is with this light-emitting area towards aforementioned upper surface, and this connects the face mode corresponding with aforementioned lower surface and aforementioned installed surface, is placed in above-mentioned fluorescent glue at least partly; And layout is at the enable circuit of this lower surface and aforementioned activation terminal, this enable circuit more comprises a pair solder terminal.
Disclosed a kind of multiple grain is without substrate LED matrix, passing board structure is removed, a slice is only provided to form the transmitting substrate of groove, insert fluorescent glue in a groove and place LED crystal particle, the installed surface of fluorescent glue can be flushed with the lower surface of transmitting substrate, allowing multiple grain possess without substrate LED matrix can for conducting resinl in the mode of printing, form enable circuit and be in the layout of on lower surface, with this activation LED crystal particle, simplify the production process of LED matrix by this, reduce cost of manufacture, overall fine ratio of product obtains and promotes; On the other hand, due to the designs simplification of substrate, make the complete printing opacity of LED matrix further, for realizing full angle luminescence and guaranteeing the even of bright dipping color, what in the mode of a glue, the fluorescent glue of mixing yellow fluorescent powder is attached to LED crystal particle connects on face, obtains and better uses elasticity; Effectively reduce the operating temperature of LED matrix, the known LED matrix of structural improvement accordingly simultaneously, take precautions against the light extraction efficiency of temperatures involved LED crystal particle.
Accompanying drawing explanation
Fig. 1 be the multiple grain of the present invention first preferred embodiment without substrate LED matrix stereogram, be the architectural feature that transmitting substrate is described;
Fig. 2 is the side sectional view of LED crystal particle in Fig. 1, is to illustrate that lower surface is exposed slightly in the face that connects of LED crystal particle;
Fig. 3 is the side sectional view of mask plate, is the mode of conducting resinl by screen painting is described, smears printing on lower surface;
Fig. 4 is the stereogram of the mask plate be arranged on lower surface, is the pattern of conducting resinl according to mask plate is described, forms layout enable circuit on the lower surface;
Fig. 5 is that in Fig. 4, multiple grain, without the side sectional view of substrate LED matrix, is illustrate additionally to squeeze into one deck fluorescent glue on the groove of lower surface, and smears layer protective layer on the lower surface;
Fig. 6 be the multiple grain of the present invention second preferred embodiment without substrate LED matrix side sectional view, be illustrate in groove insert yellow fluorescence powder in advance and form enable circuit by the mode of sputter;
Fig. 7 is the stereogram of multiple grain without substrate LED matrix of the present invention second preferred embodiment, is to illustrate that the silver particles be shelled out is according to the pattern of light shield, forms layout enable circuit on the lower surface;
Fig. 8 is that the multiple grain of Fig. 6 is separated from one another by sacrificing section without substrate LED matrix, and completes the end view of a plurality of multiple grain without substrate LED matrix.
Symbol description
1,1 ' ... multiple grain is without substrate LED matrix 2,2 ' ... transmitting substrate
21 ... upper surface 22,22 ' ... lower surface
221,221 ' ... groove 23 ... side
24 ' ... sacrifice section 3,3 ' ... fluorescent glue
31 ... installed surface 4,4 ' ... LED crystal particle
41 ... light-emitting area 42 ... connect face
421 ... activation terminal 5,5 ' ... enable circuit
51 ... solder terminal 6 ... mask plate
6 ' ... light shield 7 ... protective layer
Embodiment
Aforementioned and other technology contents, feature and effect for the present invention, in the detailed description of the preferred embodiment of following cooperation Figure of description, can know and present; In addition, in embodiments, identical element represents with similar label.
Multiple grain of the present invention is without the first preferred embodiment of substrate LED matrix, as shown in Figure 1, example is interpreted as the multiple grain of LED light source without substrate LED matrix 1, comprise the transmitting substrate 2 that a slice example is interpreted as optical glass, and for ease of illustrate for the purpose of, in the side 23 that this definition transmitting substrate 2 has a upper surface 21, lower surface 22 and connects upper surface 21 and lower surface 22 respectively, wherein lower surface 22 is formed with the groove 221 of plural number.In the fabrication process, for making groove 221 upwards expose, for being filled with the fluorescent glue 3 that example is interpreted as the transparent epoxy resin of Homogeneous phase mixing fluorescent material, be therefore that the mode turned upside down is placed.Thus the fluorescent glue 3 of sticky shape is subject to the shape restriction of groove 221, and for ease of understanding, the side corresponding to lower surface 22 at this definition fluorescent glue 3 is installed surface 31.
Then please also refer to shown in Fig. 2, many LED crystal particle 4 corresponding respectively to aforementioned grooves 221, are placed into respectively and have been filled with in the groove 221 of fluorescent glue 3.For making the main bright dipping of LED crystal particle 4 be towards above-mentioned upper surface 21, therefore when operating, be place in the mode of light-emitting area 41 towards fluorescent glue 3 and upper surface 21.And define the another side of LED crystal particle 4 in contrast to light-emitting area 41 for connecting face 42 at this.
In the process made, fluorescent glue 3 can not fill up whole groove 221 at first, and the storing region can reserved for press-in LED crystal particle 4, make fluorescent glue 3 can form difference in height slightly with lower surface 22, when LED crystal particle 4 is pressed into, the fluorescent glue 3 of surrounding can be forced to rise gradually and fill up groove 221, and now fluorescent glue 3 will form the installed surface 31 substantially flush with the lower surface 22 of transmitting substrate 2.Due to the face that connects 42 of LED crystal particle 4 being formed with activation terminal, therefore connecting face 42 can flush in lower surface 22, also can slightly protrude from outside lower surface 22, even if connect between face 42 and lower surface 22 and be formed with a little height fall, but not tabular surface extremely accurately, do not affect the enforcement of the technology of the present invention yet.
Certainly, being familiar with the art personage can understand easily, and the size of groove 221 must be greater than LED crystal particle 4.Once fit each other, not only will affect the storing of LED crystal particle 4, when also will affect Partial angle bright dipping, the ratio regular meeting of yellow fluorescence is on the low side.Another aspect, due to fluorescent glue 3 insert groove 221 and not yet completely solidification before, the fluorescent material mixed in resin can precipitate toward graphic below gradually because of gravity effect, thus away from LED crystal particle 4, this also makes in future operation process, more fluorescent material generates heat away from LED crystal particle 4, thus reduce the situation of fluorescent material by heat deterioration, extends the useful life of LED matrix.
After all LED crystal particle 4 have been placed, crystal grain with a line arrangement can by its activation terminal according to such as two row alignments, please refer to shown in Fig. 3 and Fig. 4, in this example, can a mask plate 6 be arranged at above the lower surface 22 of transmitting substrate 2, on mask plate 6 and with tulle be formed such as two row parallel to each other can penetrating pattern; Subsequently conducting resinl to be inserted in mask plate 6 and via the mode of such as screen painting, with scraper (non-label) by conducting resinl uniform application, can by penetrating pattern part, make conducting resinl according to aforementioned predetermined pattern, directly on the lower surface 22 of transmitting substrate 2 and the activation terminal of each LED grain, form the circuit layout of each activation terminal of series connection; Then heat and allow conducting resinl solidify, forming the enable circuit 5 that has complete electric loop.Certainly, being familiar with the art personage can know by inference easily, although the enable circuit in this example is for series circuit, change into parallel circuits or comprehensive both, all do not affect the enforcement of the technology of the present invention.
On the other hand, in the lump with reference to shown in figure 5, two activation terminals 421 on face 42 are connected because aforementioned enable circuit 5 can connect each LED crystal particle 4, and by a pair solder terminal 51 of the most terminal of enable circuit 5 as the interface outwards obtaining electric energy, and each LED crystal particle 4 of activation; Make the present invention there is not seen tellite or ceramic substrate in the past, but directly by the lower glass surface place of circuit-forming in printing opacity, significantly can simplify overall structure by this.In addition in this example, upper surface 21 is a matsurface, make multiple grain without in substrate LED matrix 1, the blue light that each independent LED grain exhales and the gold-tinted that fluorescent material discharges can through out-of-dately being reflected, being reflected and diffuse reflection, therefore, when multiple grain is watched without substrate LED matrix 1 front, will not easily find indivedual point-source of light, and light sources can be diffused as area source, allow the multiple grain of this example can not produce obvious luminous point without the illumination of substrate LED matrix 1, allow Integral luminous evenly.Certainly, being familiar with the art personage can know by inference easily, although the enable circuit in this example is the mode by screen painting, other printings or the mode such as sputter, plating also can be adopted to be shaped, all do not affect enforcement of the present invention.
Thereafter, the face that connects 42 of LED crystal particle 4 additionally arranges one deck fluorescent glue 3, the LED crystal particle 4 in this example is made all to be overlayed in fluorescent glue 3 by complete packet, therefore, LED crystal particle 4 is outside main rising angle, a small amount of blue light sending with wide-angle and return from 21 reflections of above-mentioned upper surface or diffuse reflection, also can by lower surface 22 side bright dipping, wherein still have part to be absorbed in fluorescent glue in the wings, and be converted to yellow fluorescence and again outwards disperse, allow Integral luminous direction property more comprehensively; Finally, in the outside of lower surface 22 and rear side fluorescent adhesive layer, more arranging layer protective layer 7, is the silica gel material layer that example is interpreted as a kind of printing opacity in this example, uses the protected effect reaching and take precautions against LED crystal particle or conducting resinl and contact with ambient atmosphere and be oxidized.Certainly; be familiar with the art personage can know by inference easily; protective layer herein also can adopt as heat sink materials such as thermal plastic insulations; except the effect that protection is provided; the used heat that more LED crystal particle can be produced discharges the outside of LED matrix; avoid used heat to be deposited in multiple grain without in substrate LED matrix, affect luminous efficiency.
Disclosed a kind of multiple grain is without substrate LED matrix, passing printed circuit board (PCB) or ceramic substrate structure are removed, a slice is only provided to form the transmitting substrate of groove, insert fluorescent glue in a groove and place LED crystal particle, the installed surface of fluorescent glue can be flushed with the lower surface of transmitting substrate, allowing multiple grain possess without substrate LED matrix can for conducting resinl in the mode of printing, form enable circuit and be in the layout of on lower surface, with this activation LED crystal particle, simplify the production process of LED matrix by this, reduce cost of manufacture, overall fine ratio of product obtains and promotes, on the other hand, due to the designs simplification of substrate, make the complete printing opacity of LED matrix further, for realizing full angle luminescence and guaranteeing the even of bright dipping color, what in the mode of a glue, the fluorescent glue of mixing yellow fluorescent powder is attached to LED crystal particle connects on face, make the rising angle of LED crystal particle can reach 360 degree, obtain and better use elasticity also additionally to impress layer protective layer at lower surface, take precautions against LED crystal particle and conducting resinl contacts and the protected effect of burning with ambient atmosphere to reach, effectively reduce the operating temperature of LED matrix, the known LED matrix of structural improvement accordingly simultaneously, take precautions against the light extraction efficiency of temperatures involved LED crystal particle.
Multiple grain of the present invention is without the second preferred embodiment of substrate LED matrix 1 ', please refer to Fig. 6, shown in Fig. 7, be that in this example, transmitting substrate 2 ' example is interpreted as acrylic with the difference of previous embodiment, fluorescent glue 3 ' then example is interpreted as one deck yellow fluorescence powder (non-label) layer of transparent of the arranging in pairs or groups epoxy resin inserted in advance in groove 221 ', LED crystal particle 4 ' is still and is positioned in groove 221 ', enable circuit 5 ' then changes with the mode layout of sputter (Sputter) on lower surface 22 ', in the process of sputter, generally utilize inert gas (such as: argon gas) to be used as electricity slurry, by the effect of high voltage electric field, make argon gas ionize generation ar-ion beam and bombard silver-colored target cathode, the light shield 6 ' be accumulated in as having predetermined pattern in the first embodiment is precipitated by the silver atoms in the silver-colored target material that spills, after removing light shield 6 ', with plating mode, the circuit that silver atoms is shaped is thickened again, form complete enable circuit 5 '.
In addition, as shown in Figure 8, batch manufacture process in, transmitting substrate 2 ' in this example can be large stretch of rectangle material, and be formed with reserved sacrifice section 24 ' between the rows, with such as instrument cutting or radium-shine cutting, transmitting substrate 2 ' after order has manufactured is easy to be separated, simplify processing procedure, once make multiple grain in this example a large amount of without substrate LED matrix 1 ', each multiple grain separated has the structure aspect of previous embodiment equally without substrate LED matrix 1 ', reduces manufacturing cost further, and promotes output efficiency.
The foregoing is only preferred embodiment of the present invention, scope of the invention process can not be limited with this, every simple equivalence done according to the present patent application the scope of the claims and description of the invention content changes and modifies, and all should still remain within the scope of the patent.
Claims (8)
1. multiple grain is without a substrate LED matrix, comprising:
A slice transmitting substrate, have a upper surface, a lower surface and connect the side of aforementioned upper and lower surface, wherein this lower surface is formed with at least one groove;
One deck is filled in the fluorescent glue in aforementioned grooves, and this fluorescent glue is formed with the installed surface of an aforementioned lower surface of correspondence;
At least one LED crystal particle, have a light-emitting area and one and connect face in contrast to this light-emitting area, this connects on face and is formed with at least two activation terminals; Aforementioned LED crystal particle is with this light-emitting area towards aforementioned upper surface, and this to connect face be the mode corresponding with aforementioned lower surface and aforementioned installed surface, be placed in above-mentioned fluorescent glue at least partly; And
Layout is at the enable circuit of this lower surface and aforementioned activation terminal, and this enable circuit more comprises a pair solder terminal.
2. multiple grain as claimed in claim 1 is without substrate LED matrix, more comprises one deck and is arranged at protective layer on lower surface.
3. multiple grain as claimed in claim 1 is without substrate LED matrix, and wherein this installed surface flushes with this lower surface.
4. multiple grain as claimed in claim 1 is without substrate LED matrix, and wherein this groove has the size being greater than above-mentioned LED crystal particle.
5. multiple grain as claimed in claim 1 is without substrate LED matrix, and wherein this enable circuit is one deck conducting resinl.
6. multiple grain as claimed in claim 5 is without substrate LED matrix, and wherein this enable circuit is a printed circuit.
7. multiple grain as claimed in claim 1 is without substrate LED matrix, and wherein this upper surface is a matsurface.
8. multiple grain as claimed in claim 1 is without substrate LED matrix, and wherein this transmitting substrate is also formed with reserved sacrifice section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410474632.1A CN105449073A (en) | 2014-09-17 | 2014-09-17 | Multi-grain substrate-free LED device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410474632.1A CN105449073A (en) | 2014-09-17 | 2014-09-17 | Multi-grain substrate-free LED device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105449073A true CN105449073A (en) | 2016-03-30 |
Family
ID=55559047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410474632.1A Pending CN105449073A (en) | 2014-09-17 | 2014-09-17 | Multi-grain substrate-free LED device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105449073A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106601725A (en) * | 2016-11-30 | 2017-04-26 | 环视先进数字显示无锡有限公司 | Composite sapphire substrate epitaxial LED display module manufacturing method |
| CN106641774A (en) * | 2016-11-30 | 2017-05-10 | 张中伟 | High-luminous-flux three-dimensional LED lamp |
| CN106784175A (en) * | 2016-11-30 | 2017-05-31 | 环视先进数字显示无锡有限公司 | The manufacture method and substrate of the epitaxy composite sapphire substrate of LED display modules |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040000867A1 (en) * | 2002-06-27 | 2004-01-01 | Hsing Chen | Package structure of a composite LED |
| CN102297351A (en) * | 2011-06-20 | 2011-12-28 | 中山大学 | LED (light emitting diode) light source module and manufacturing method thereof |
| CN102779460A (en) * | 2011-05-12 | 2012-11-14 | 富士迈半导体精密工业（上海）有限公司 | LED (light-emitting diode) display device and manufacturing process thereof |
| CN203812902U (en) * | 2014-04-18 | 2014-09-03 | 中国科学院苏州纳米技术与纳米仿生研究所 | LED light emitting device |
-
2014
- 2014-09-17 CN CN201410474632.1A patent/CN105449073A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040000867A1 (en) * | 2002-06-27 | 2004-01-01 | Hsing Chen | Package structure of a composite LED |
| CN102779460A (en) * | 2011-05-12 | 2012-11-14 | 富士迈半导体精密工业（上海）有限公司 | LED (light-emitting diode) display device and manufacturing process thereof |
| CN102297351A (en) * | 2011-06-20 | 2011-12-28 | 中山大学 | LED (light emitting diode) light source module and manufacturing method thereof |
| CN203812902U (en) * | 2014-04-18 | 2014-09-03 | 中国科学院苏州纳米技术与纳米仿生研究所 | LED light emitting device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106601725A (en) * | 2016-11-30 | 2017-04-26 | 环视先进数字显示无锡有限公司 | Composite sapphire substrate epitaxial LED display module manufacturing method |
| CN106641774A (en) * | 2016-11-30 | 2017-05-10 | 张中伟 | High-luminous-flux three-dimensional LED lamp |
| CN106784175A (en) * | 2016-11-30 | 2017-05-31 | 环视先进数字显示无锡有限公司 | The manufacture method and substrate of the epitaxy composite sapphire substrate of LED display modules |
| CN106784175B (en) * | 2016-11-30 | 2018-12-21 | 环视先进数字显示无锡有限公司 | The manufacturing method and substrate of the epitaxy composite sapphire substrate of LED display module |
| CN106601725B (en) * | 2016-11-30 | 2019-04-05 | 环视先进数字显示无锡有限公司 | The manufacturing method of composite sapphire substrate epitaxy LED display module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108807356B (en) | Four-in-one mini-LED module, display screen and manufacturing method | |
| CN112071828B (en) | Slender line type LED luminous device | |
| CN100539134C (en) | Lighting device | |
| CN102893418B (en) | Light emitting unit and illuminating apparatus | |
| KR101017921B1 (en) | Light emitting element mounting board, light emitting module and lighting equipment | |
| EP1890341A1 (en) | Porcelain enameled substrate for light-emitting device mounting, light-emitting device module, illuminating device, display and traffic signal device | |
| EP3582262A1 (en) | Four-in-one mini-led module, display screen and manufacturing method | |
| CN102709278A (en) | Plane thin sheet type LED (Light-Emitting Diode) array light source of fluorescent thin film | |
| CN101769452A (en) | Light emitting diode module and back light assembly | |
| TWI723921B (en) | Surface light source led device | |
| CN102074642B (en) | Light emitting device package, lighting module and illuminator | |
| CN104976547A (en) | Light emitting diode assembly and light emitting diode bulb using same | |
| CN105449073A (en) | Multi-grain substrate-free LED device | |
| CN102723324A (en) | Double-face light emitting planar wafer type LED (Light-Emitting Diode) packaging structure | |
| CN202712175U (en) | Fluorescent film planar sheet type LED array light source | |
| CN102479911B (en) | Light emitting device package | |
| EP4016649A1 (en) | Light-emitting device and manufacturing method, and display screen and lighting equipment comprising said light-emitting device | |
| CN2713647Y (en) | Power type white light LED | |
| KR20080029351A (en) | The apparatus of led blu and that of manufacture method | |
| CN105845804B (en) | Light emitting diode device and light emitting device using same | |
| CN102157509B (en) | Light mixing type light-emitting diode encapsulation structure capable of improving color rendering | |
| CN208352292U (en) | A kind of LED charactrons | |
| CN107525048A (en) | A kind of LED lamp panel, its preparation method and a kind of LED bar graph lamp | |
| KR20110125067A (en) | Light-emitting element package | |
| KR100691124B1 (en) | Manufacturing method for light emitting diode package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160330 |
|
| WD01 | Invention patent application deemed withdrawn after publication |