CN210272351U - White light LED light source module with high lumen density and high color rendering index - Google Patents
White light LED light source module with high lumen density and high color rendering index Download PDFInfo
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- CN210272351U CN210272351U CN201920869825.5U CN201920869825U CN210272351U CN 210272351 U CN210272351 U CN 210272351U CN 201920869825 U CN201920869825 U CN 201920869825U CN 210272351 U CN210272351 U CN 210272351U
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Abstract
The utility model provides a white light LED light source module with high lumen density and high color rendering index, which comprises a substrate, a blue light LED chip group, an independent radiating bracket, a solid-state fluorescent sheet, transparent silica gel and an insulating heat-conducting transparent cushion block; the blue light LED chip group and the insulating heat-conducting transparent cushion block are fixed on the substrate, the insulating heat-conducting transparent cushion block is distributed between gaps of the blue light LED chip group, the independent heat dissipation bracket is fixed on the substrate, and the step height of the independent heat dissipation bracket is consistent with the height of the insulating heat-conducting transparent cushion block; the solid-state fluorescent sheet is arranged on the independent heat dissipation support step and the insulating heat conduction transparent cushion block at the same time, and is bonded and fixed through the transparent silica gel mixed with the red fluorescent powder. The utility model discloses a red light phosphor powder improves the light-emitting quality with solid-state fluorescence piece composite packaging structure, and color rendering index Ra >90, and solid-state fluorescence piece effectively reduces the temperature of high-power LED light source through the independent heat dissipation of heat dissipation support, strengthens LED light source reliability, improves the LED light source life-span.
Description
Technical Field
The invention relates to a high-power white light LED light source module, in particular to a high-lumen-density high-color-rendering-index white light LED light source module.
Background
At present, a fluorescence conversion type LED light source is the most main technical route for obtaining a white light source, a blue light LED chip excites a fluorescent layer to be converted into yellow green light to be mixed to obtain white light, and a transparent solid fluorescent sheet draws attention in high-power and ultrahigh-power solid illumination due to good high-temperature quenching resistance and high heat conductivity. However, currently, fluorescent ceramics, fluorescent single crystals, fluorescent glasses, etc. are mainly doped with Ce3+、Lu3+、Eu2+The fluorescent spectrum of the single-phase fluorescent ions is between 500nm and 580nm, so that the red light part in the spectrum is seriously lost, the color rendering index is low, and the requirement of the market on a high-power high-color rendering index light source is difficult to meet.
The heat effect is one of the most main reasons for the failure of high-power and ultra-high-power LED light sources, and two heat sources exist in a fluorescence conversion type LED light source module: firstly, the blue light LED chip generates heat, less than 40% of energy of the blue light LED chip is converted into light energy, and more than 60% of electric energy is converted into heat energy; the other is that energy loss (photon energy loss of down-conversion) exists in the fluorescence conversion and energy loss caused by the waveguide effect of the fluorescence conversion layer, which causes the fluorescence conversion layer to generate heat, and especially in a high-power and high-power-density fluorescence conversion type LED light source, the heat dissipation problem of the fluorescence conversion layer even dominates. The heat of the fluorescent conversion layer in the current packaging mode can only be radiated and conducted through the substrate, the heat flow load is very high, the single heat radiation channel is difficult to meet the heat radiation of the light source with high power flow density, and the improvement of the lumen density of the high-power LED light source is seriously limited.
SUMMERY OF THE UTILITY MODEL
To the problem, an object of the utility model is to provide a white light LED light source module is pointed to high lumen density height that radiating effect is good, low cost, color rendering index is high, power density is big. The specific technical scheme is as follows:
a high lumen density high color rendering index white light LED light source module comprises a substrate, a blue light LED chip group, an independent heat dissipation support, a solid-state fluorescent sheet and transparent silica gel mixed with red fluorescent powder.
The blue light LED chip group is fixed on the substrate through die bonding welding and is electrically connected. The substrate is provided with a positive electrode and a negative electrode which can be connected with a power supply; the chips in the blue light LED chip group are connected in series through metal wires and then connected in parallel to the positive electrode and the negative electrode of the substrate. The blue light LED chip group 4 is composed of a plurality of blue light LED chips which are arranged in an array.
The independent radiating support is fixed on the substrate and forms a dam for the blue light LED chip group, and steps are arranged on the inner edge of the dam.
The solid-state fluorescent sheet is arranged on a step of a dam formed by the independent radiating support and is positioned right above the blue light LED chip group, and the solid-state fluorescent sheet is bonded and fixed through transparent silica gel mixed with red fluorescent powder; the solid-state fluorescent sheet also has good heat-conducting property and can generate yellow green light, heat on the solid-state fluorescent sheet is conducted to the independent heat dissipation support, and the light source heat is led out of the external heat dissipation heat sink through the independent heat dissipation support. The solid-state fluorescent sheet can bear high-power-density photo-thermal radiation, the transparent silica gel mixed with the red fluorescent powder is arranged below the solid-state fluorescent sheet to stably provide red light supply with the wavelength of 600-700nm for a light source, the color rendering index Ra is more than 90, and meanwhile, the refractive index of the transparent silica gel is close to that of a chip of a blue light chip set and the solid-state fluorescent sheet, so that the energy loss caused by the Fresnel effect is reduced, the bonding reliability of the solid-state fluorescent sheet is ensured, and the mechanical strength of a light source module is enhanced; secondly, solid-state fluorescence piece and blue light LED chipset are not direct contact, and solid-state fluorescence piece is connected with transparent cushion and independent heat dissipation support simultaneously, forms independent heat dissipation channel to the fluorescence conversion layer, in time takes away the fluorescent layer heat, effectively reduces the light source temperature, reduces high temperature thermal quenching risk, improves luminous quality and light efficiency.
The transparent silica gel is filled between the solid-state fluorescent sheet and the blue light LED chip group; the transparent silica gel layer mixed with the red fluorescent powder can provide stable red light complementary color. The transparent silica gel mixed with the red fluorescent powder is arranged below the solid-state fluorescent sheet, so that the solid-state fluorescent sheet can be effectively fixed, and the packaging reliability is ensured; transparent silica gel mixed with red fluorescent powder is arranged below a solid fluorescent sheet capable of generating yellow-green light, so that the mutual influence of different fluorescent ions can be avoided, and the light effect can be ensured while red light is effectively supplemented.
The color coordinate is adjusted by adjusting the concentration of red fluorescent powder in the transparent silica gel and the doping concentration and thickness of luminescent ions of the solid-state fluorescent sheet, so that a light source with high color rendering index, high light efficiency and high lumen density can be obtained.
The insulating heat-conducting transparent cushion block is fixed between the gaps of the blue LED chip groups through die bonding welding; the insulating heat-conducting transparent cushion block has good insulativity, heat conductivity and visible light transmittance; the transparent insulating and heat-conducting cushion block is higher than the blue light LED chip group, and the top of the transparent insulating and heat-conducting cushion block is effectively contacted with the bottom of the solid-state fluorescent sheet. That is to say, the solid-state fluorescent sheet is simultaneously contacted with the insulating heat-conducting transparent cushion block and the independent heat-radiating bracket. The heat dissipation channel of insulating heat conduction transparent cushion block can effectively switch on blue light LED chipset and solid-state fluorescence piece, switches on the heat that blue light LED chipset formed to solid-state fluorescence piece, conducts by solid-state fluorescence piece to independent heat dissipation support again on, derives the outside heat dissipation to the light source heat through independent heat dissipation support.
Furthermore, the solid-state fluorescent sheet can emit visible light of 380nm-780nm under the excitation of ultraviolet light or 400-500nm blue visible light, the fluorescence quantum yield of the solid-state fluorescent sheet is 50% -98%, and meanwhile, the solid-state fluorescent sheet has good permeability for 380nm-780nm visible light or infrared light; the solid-state fluorescent sheet also has good thermal conductivity, and the thermal conductivity is higher than 10W/m.K.
Further, the substrate of the solid-state fluorescent sheet is one of transparent ceramic, glass and single crystal.
Furthermore, the insulating heat-conducting transparent cushion block is of a strip-shaped structure, has good permeability to 380nm-780nm visible light or ultraviolet light, and is made of transparent ceramic or single crystal.
Further, the red fluorescent powder in the transparent silica gel can generate red light with the wavelength of 600-750nm under the excitation of blue light, the light transmittance of the transparent silica gel to visible light with the wavelength of 380-780 nm is more than 80%, and the refractive index is 1.4-1.6.
Furthermore, the height of a dam step formed by the independent radiating support for the blue light LED chip set is consistent with the height of the insulating heat conduction transparent cushion block.
Furthermore, two ends of the independent radiating bracket extend outwards and exceed the edge of the substrate to be connected with an external heat sink. The LED illumination packaging structure comprises a packaging body, a heat sink, a liquid nitrogen wall plate, a. After the independent heat dissipation support adopts the structure, the heat dissipation area is greatly increased, the connection with an external heat sink is flexibly realized, an independent heat dissipation channel is added, and the heat of the fluorescent layer is quickly taken away.
Furthermore, the independent radiating bracket is made of metal or ceramic, and the heat conductivity is higher than 100W/m.K.
Preferably, the independent heat dissipation bracket is made of one of copper alloy, aluminum alloy and magnesium alloy.
The packaging method of the white light LED light source module with high lumen density and high color rendering index comprises the following steps:
step a, fixing a blue light LED chip group and an insulating heat-conducting transparent cushion block on a substrate by adopting die bonding welding, wherein the insulating heat-conducting transparent cushion block is distributed between gaps of the blue light LED chip group; the substrate is provided with a positive electrode and a negative electrode which can be connected with a power supply; the chips in the blue light LED chip group are connected in series through metal wires and then connected in parallel to the positive electrode and the negative electrode of the substrate.
And b, placing the independent heat dissipation support on the substrate, forming a dam for the blue light LED chip group, and pouring a proper amount of transparent silica gel mixed with red fluorescent powder into the dam formed by the independent heat dissipation support.
And c, baking for 10-15min at the temperature of 60 ℃, accelerating the leveling of the transparent silica gel and discharging air bubbles.
D, after the transparent silica gel is leveled, pressing and fixing the solid-state fluorescent sheet in a vacuum environment, vacuumizing for 30s to prevent bubbles from being generated between the solid-state fluorescent sheet and the silica gel and ensure that the solid-state fluorescent sheet can be completely attached to the transparent silica gel mixed with the fluorescent powder.
And e, after the steps are finished, the complete light source module is placed at the temperature of 50 ℃ and is baked for 30min, or the temperature is 80 ℃, and the baking is carried out for 0.5H, so that the complete light source module is fully thermally cured.
The invention has the following advantages:
(1) by adopting the composite packaging technology of the red light fluorescent powder and the yellow-green light solid-state fluorescent sheet, the red light supply is stable and sufficient, the spectrum of the light source module has three wave crests, the color rendering index Ra is greater than 90, the requirement of a high-quality semiconductor light source is met, and meanwhile, the process is simple and mature, and the cost is low.
(2) The independent heat dissipation support is provided with the heat dissipation channel of the fluorescent layer of the light source module, so that heat of the chip and the fluorescent layer can be taken away quickly, heat flow accumulation is effectively reduced, light attenuation is reduced, the service life of a light source is prolonged, and the independent heat dissipation structure is convenient to process, low in cost and flexible in structure.
(3) The utility model discloses solid-state fluorescence piece be main fluorescence conversion layer, can tolerate high power density light and heat radiation, can realize the light-emitting of high-power little light emitting area, can prepare lumen density for 3000 give first place to the white light LED light source of 5000lm/cm2, satisfy the demand in special fields such as long-range search and rescue searchlight, projecting apparatus light source.
Drawings
FIG. 1 is a schematic plan view and a sectional view of a white light LED light source module with high lumen density and high color rendering index (the upper part of the figure is a sectional view, and the lower part is a schematic plan view)
Fig. 2 is a graph of a fluorescence spectrum of an LED light source of the white light LED light source module with high lumen density and high color rendering index of the present invention;
fig. 3 is a light source white light output spectrum curve diagram of the high lumen density high color rendering index white light LED light source module of the present invention;
shown in the figure: the LED light source comprises a 1-solid fluorescent sheet, a 2-independent radiating support, a 3-substrate, a 4-blue light LED chip group, a 5-insulating heat-conducting transparent cushion block and 6-transparent silica gel.
Detailed Description
The principles and features of the present invention will be described in further detail below with reference to the accompanying drawings, wherein the examples are provided for illustration of the invention and are not intended to limit the scope of the invention.
As shown in fig. 1 the utility model discloses a high apparent white light LED light source module that indicates of high lumen density, including base plate 3, blue light LED chipset 4, independent heat dissipation support 2, solid-state fluorescence piece 1 and sneak into red phosphor powder's transparent silica gel 6.
The blue LED chip group 4 is fixed on the substrate 3 through die bonding welding and realizes electrical connection. A positive electrode and a negative electrode which can be connected with a power supply are arranged on the substrate 3; the chips in the blue light LED chip group 4 are connected in series through metal wires and then connected to the positive electrode and the negative electrode of the substrate 3 in parallel to realize electrical connection. The blue light LED chip group 4 is composed of a plurality of blue light LED chips which are arranged in an array.
Independent heat dissipation support 2 passes through silica gel to be fixed on base plate 3 and forms the box dam to blue light LED chipset 4, is equipped with the step along in the box dam.
The solid-state fluorescent sheet 1 is arranged on a step of an enclosure formed by the independent radiating support 2 and is positioned right above the blue light LED chip group 4, and is bonded and fixed through transparent silica gel 6 mixed with red fluorescent powder; the solid-state fluorescent sheet 1 also has good heat-conducting property, heat on the solid-state fluorescent sheet 1 is conducted to the independent heat dissipation support, and the light source heat is led out of the external heat dissipation heat sink through the independent heat dissipation support 2. The solid-state fluorescent sheet 1 can bear high-power-density photo-thermal radiation, the transparent silica gel 6 mixed with red fluorescent powder is arranged below the solid-state fluorescent sheet 1 to stably provide red light supply with the wavelength of 600-700nm for a light source, the color rendering index Ra is greater than 90, and meanwhile, the refractive index of the transparent silica gel 6 is close to that of the chip of the blue light chip group 4 and the solid-state fluorescent sheet 1, so that the energy loss caused by the Fresnel effect is reduced, the bonding reliability of the solid-state fluorescent sheet 1 is ensured, and the mechanical strength of a light source module is enhanced; secondly, solid-state fluorescence piece 1 and blue light LED chipset 4 direct contact not, solid-state fluorescence piece 1 is connected with insulating heat conduction transparent cushion 5 and independent heat dissipation support 2 simultaneously, forms independent heat dissipation channel to the fluorescence conversion layer, in time takes away the fluorescent layer heat, effectively reduces the light source temperature, reduces high temperature thermal quenching risk, improves luminous quality and light efficiency.
The transparent silica gel 6 is filled between the solid-state fluorescent sheet 1 and the blue light LED chip group 4; the transparent silica gel layer 6 mixed with red fluorescent powder can provide stable red light complementary color. The transparent silica gel 6 mixed with the red fluorescent powder is arranged below the solid fluorescent sheet 1, so that the solid fluorescent sheet 1 can be effectively fixed, and the packaging reliability is ensured; transparent silica gel 6 mixed with red fluorescent powder is arranged below the solid-state fluorescent sheet 1 capable of generating yellow green light, so that the mutual influence of different fluorescent ions can be avoided, and the light effect can be ensured while red light is effectively supplemented.
The color coordinate is adjusted by adjusting the concentration of the red fluorescent powder in the transparent silica gel 6 and the doping concentration and thickness of the luminous ions of the solid fluorescent sheet 1, so that the light source with high color rendering index, high light efficiency and high lumen density can be obtained.
The LED module also comprises an insulating heat-conducting transparent cushion block 5 fixed between gaps of the blue LED chip groups 4 through die bonding welding; the insulating heat-conducting transparent cushion block 5 has good insulativity, heat conductivity and visible light transmittance; the insulating heat-conducting transparent cushion block 5 is higher than the blue light LED chip group 4, and the top of the insulating heat-conducting transparent cushion block is effectively contacted with the bottom of the solid-state fluorescent sheet 1. That is to say, the solid-state fluorescent sheet 1 is simultaneously contacted with the insulating heat-conducting transparent cushion block 5 and the independent heat-dissipating bracket 2. Insulating heat conduction transparent cushion 5 can effectively switch on blue light LED chipset 4 and solid-state fluorescence piece 1's heat dissipation channel, switches on the heat that blue light LED chipset 4 formed to solid-state fluorescence piece 1, conducts by solid-state fluorescence piece 1 again to independent heat dissipation support 2, derives the outside heat dissipation to the light source heat through independent heat dissipation support 2.
Further, the solid-state fluorescent sheet 1 can emit 380nm-780nm visible light under the excitation of ultraviolet light or 400-500nm blue visible light, the fluorescence quantum yield of the solid-state fluorescent sheet is 50% -98%, and the solid-state fluorescent sheet has good permeability for 380nm-780nm visible light or infrared light; the solid-state fluorescent sheet 1 also has good thermal conductivity, and the thermal conductivity is higher than 10W/m.K.
Further, the substrate of the solid-state fluorescent sheet 1 is one of transparent ceramic, glass, and single crystal.
Furthermore, the insulating heat-conducting transparent cushion block 5 is in a strip-shaped structure, has good permeability to 380nm-780nm visible light or ultraviolet light, and is made of transparent ceramic or single crystal.
Further, the red fluorescent powder in the transparent silica gel 6 can generate red light with the wavelength of 600-750nm under the excitation of blue light, the light transmittance of the transparent silica gel 6 to visible light with the wavelength of 380-780 nm is more than 80%, and the refractive index is 1.4-1.6.
Further, the height of a dam step formed by the independent heat dissipation support 2 for the blue light LED chip group 4 is consistent with the height of the insulating heat conduction transparent cushion block 5.
Furthermore, two ends of the independent radiating bracket 2 extend outwards and exceed the edge of the substrate 3 to be connected with an external heat sink. The LED illumination packaging structure comprises a packaging body, a heat sink, a liquid nitrogen wall plate, a. After the independent radiating support 2 adopts the structure, the radiating area is greatly increased, the connection with an external heat sink is flexibly realized, an independent radiating channel is added, and the heat of the fluorescent layer is quickly taken away.
Further, the independent heat dissipation bracket 2 is made of metal or ceramic, and the heat conductivity is higher than 100W/m.K.
Preferably, the independent heat dissipation bracket 2 is made of one of copper alloy, aluminum alloy and magnesium alloy.
The packaging method of the white light LED light source module with high lumen density and high color rendering index comprises the following steps:
step a, fixing a blue light LED chip group 4 and an insulating heat-conducting transparent cushion block 5 on a substrate 3 by adopting die bonding welding, wherein the insulating heat-conducting transparent cushion block 5 is distributed between gaps of the blue light LED chip group 4; a positive electrode and a negative electrode which can be connected with a power supply are arranged on the substrate 3; the chips in the blue LED chip group 4 are connected in series through metal wires and then connected in parallel to the positive electrode and the negative electrode of the substrate 3.
And b, placing the independent radiating support 2 on the substrate 3, forming an enclosure dam for the blue light LED chip group 4, and pouring a proper amount of transparent silica gel 5 mixed with red fluorescent powder into the enclosure dam formed by the independent radiating support 2.
And c, baking for 10-15min at the temperature of 60 ℃, accelerating the leveling of the transparent silica gel 6 and discharging air bubbles.
And d, after the transparent silica gel 6 is leveled, pressing the solid-state fluorescent sheet 1 in a vacuum environment and fixing, vacuumizing for 30s to prevent bubbles from being generated between the solid-state fluorescent sheet 1 and the silica gel, and ensuring that the solid-state fluorescent sheet 1 and the transparent silica gel 6 mixed with the fluorescent powder can be completely attached.
And e, after the steps are finished, the complete light source module is placed at the temperature of 50 ℃ and is baked for 30min, or the temperature is 80 ℃, and the baking is carried out for 0.5H, so that the complete light source module is fully thermally cured.
As shown in fig. 2 and 3, the utility model discloses a red light phosphor powder and the compound encapsulation technique of yellow green light solid-state fluorescence piece, ruddiness supply is stable sufficient, and light source module spectrum has three crest, and color rendering index Ra >90 satisfies the demand of high-quality semiconductor light source, and simple process is ripe simultaneously, low cost.
The above embodiments are merely illustrative of the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and to implement the same, and not to limit the protection scope of the present invention.
Claims (9)
1. A white light LED light source module with high lumen density and high color rendering index comprises a substrate, a blue light LED chip group, an independent radiating bracket, a solid-state fluorescent sheet and transparent silica gel mixed with red fluorescent powder, wherein the blue light LED chip group is fixed on the substrate through solid-crystal welding and is electrically connected; the independent radiating support is fixed on the substrate and forms a dam for the blue light LED chip group, and steps are arranged on the inner edge of the dam; the solid-state fluorescent sheet is arranged on a step of a dam formed by the independent radiating bracket and is positioned right above the blue light LED chip group; the transparent silica gel is filled between the solid-state fluorescent sheet and the blue light LED chip group; the color coordinate is adjusted by adjusting the concentration of red fluorescent powder in the transparent silica gel and the doping concentration and thickness of luminescent ions of the solid-state fluorescent sheet, so that a light source with high color rendering index, high light efficiency and high lumen density can be obtained; the method is characterized in that: the insulating heat-conducting transparent cushion block is fixed between the gaps of the blue LED chip groups through die bonding welding; the insulating heat-conducting transparent cushion block has good insulativity, heat conductivity and visible light transmittance; the transparent insulating and heat-conducting cushion block is higher than the blue light LED chip group, and the top of the transparent insulating and heat-conducting cushion block is effectively contacted with the bottom of the solid-state fluorescent sheet.
2. The white light LED light source module with high lumen density and high color rendering index of claim 1, wherein: the solid-state fluorescent sheet can emit visible light of 380nm-780nm under the excitation of ultraviolet light or 400-500nm blue visible light, the fluorescence quantum yield of the solid-state fluorescent sheet is 50% -98%, and the solid-state fluorescent sheet has good permeability for 380nm-780nm visible light or infrared light; the solid-state fluorescent sheet also has good thermal conductivity, and the thermal conductivity is higher than 10W/m.K.
3. The white light LED light source module with high lumen density and high color rendering index as claimed in claim 1 or 2, wherein: the substrate of the solid-state fluorescent sheet is one of transparent ceramic, glass and single crystal.
4. The white light LED light source module with high lumen density and high color rendering index of claim 1, wherein: the insulating heat-conducting transparent cushion block is of a strip-shaped structure, has good permeability to 380nm-780nm visible light or ultraviolet light, and is made of transparent ceramic or single crystal.
5. The white light LED light source module with high lumen density and high color rendering index of claim 1, wherein: the red fluorescent powder in the transparent silica gel can generate red light with the wavelength of 600-750nm under the excitation of blue light, the light transmittance of the transparent silica gel to visible light with the wavelength of 380-780 nm is more than 80%, and the refractive index is 1.4-1.6.
6. The white light LED light source module with high lumen density and high color rendering index of claim 1, wherein: the height of a dam step formed by the independent heat dissipation support for the blue light LED chip groups is consistent with that of the insulating heat conduction transparent cushion block.
7. The white light LED light source module with high lumen density and high color rendering index as claimed in claim 1 or 6, wherein: and two ends of the independent radiating bracket extend outwards and exceed the edge of the substrate to be connected with an external heat sink.
8. The white light LED light source module with high lumen density and high color rendering index of claim 7, wherein: the independent radiating support is made of metal or ceramic, and the heat conductivity is higher than 100W/m.K.
9. The white light LED light source module with high lumen density and high color rendering index of claim 8, wherein: the independent heat dissipation support is made of one of copper alloy, aluminum alloy and magnesium alloy.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110211949A (en) * | 2019-06-11 | 2019-09-06 | 贵州赛义光电科技有限公司 | A kind of high lumen density height is aobvious to refer to white LED light source mould group and packaging method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110211949A (en) * | 2019-06-11 | 2019-09-06 | 贵州赛义光电科技有限公司 | A kind of high lumen density height is aobvious to refer to white LED light source mould group and packaging method |
| CN110211949B (en) * | 2019-06-11 | 2024-06-28 | 贵州赛义光电科技有限公司 | High-lumen-density high-finger-display white light LED light source module and packaging method |
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