CN102292308A - 复合材料,制备复合材料的方法以及粘合剂和粘结材料 - Google Patents
复合材料,制备复合材料的方法以及粘合剂和粘结材料 Download PDFInfo
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Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008053736.5 | 2008-10-29 | ||
DE102008053736 | 2008-10-29 | ||
DE102009019221 | 2009-04-30 | ||
DE102009019221.2 | 2009-04-30 | ||
DE102009030118 | 2009-06-22 | ||
DE102009030118.6 | 2009-06-22 | ||
DE200910041574 DE102009041574A1 (de) | 2008-10-29 | 2009-09-15 | Verbundmaterial, Verfahren zum Herstellen eines Verbundmaterials sowie Kleber oder Bondmaterial |
DE102009041574.2 | 2009-09-15 | ||
PCT/IB2009/007174 WO2010049771A2 (de) | 2008-10-29 | 2009-10-20 | Verbundmaterial, verfahren zum herstellen eines verbundmaterials sowie kleber oder bondmaterial |
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Country Status (7)
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US (1) | US20110274888A1 (ja) |
EP (1) | EP2352709A2 (ja) |
JP (1) | JP5656088B2 (ja) |
KR (1) | KR101319755B1 (ja) |
CN (1) | CN102292308A (ja) |
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- 2009-10-20 JP JP2011533843A patent/JP5656088B2/ja not_active Expired - Fee Related
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CN102458043A (zh) * | 2010-10-27 | 2012-05-16 | 库拉米克电子学有限公司 | 金属陶瓷基片以及用于制造这种基片的方法 |
CN108431168A (zh) * | 2015-12-22 | 2018-08-21 | 安赛乐米塔尔公司 | 金属或非金属物品与传热流体之间传热的方法 |
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CN110718317A (zh) * | 2018-07-11 | 2020-01-21 | 台虹科技股份有限公司 | 复合材料 |
CN109659356A (zh) * | 2018-12-18 | 2019-04-19 | 河南师范大学 | 基于硒化铜单层的具有负微分电阻和开关作用的纳米器件 |
CN109659356B (zh) * | 2018-12-18 | 2021-08-27 | 河南师范大学 | 基于硒化铜单层的具有负微分电阻和开关作用的纳米器件 |
CN114956850A (zh) * | 2022-04-14 | 2022-08-30 | 天诺光电材料股份有限公司 | 一种利用金属线纳米薄膜制备覆铜氮化物陶瓷板的方法 |
CN114956850B (zh) * | 2022-04-14 | 2023-05-02 | 天诺光电材料股份有限公司 | 一种利用金属线纳米薄膜制备覆铜氮化物陶瓷板的方法 |
CN117460174A (zh) * | 2023-12-25 | 2024-01-26 | 广州先艺电子科技有限公司 | 一种图案化amb陶瓷覆铜板的制备方法 |
CN117460174B (zh) * | 2023-12-25 | 2024-04-02 | 广州先艺电子科技有限公司 | 一种图案化amb陶瓷覆铜板的制备方法 |
Also Published As
Publication number | Publication date |
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KR20110081889A (ko) | 2011-07-14 |
EP2352709A2 (de) | 2011-08-10 |
DE102009041574A1 (de) | 2010-05-12 |
JP5656088B2 (ja) | 2015-01-21 |
WO2010049771A3 (de) | 2010-08-19 |
JP2012507459A (ja) | 2012-03-29 |
KR101319755B1 (ko) | 2013-10-17 |
US20110274888A1 (en) | 2011-11-10 |
WO2010049771A2 (de) | 2010-05-06 |
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