CN102272878B - 样本厚度的测量和终点确定 - Google Patents

样本厚度的测量和终点确定 Download PDF

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Publication number
CN102272878B
CN102272878B CN200980153190.8A CN200980153190A CN102272878B CN 102272878 B CN102272878 B CN 102272878B CN 200980153190 A CN200980153190 A CN 200980153190A CN 102272878 B CN102272878 B CN 102272878B
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sample
tem
thickness
signal
value
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Chinese (zh)
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CN102272878A (zh
Inventor
R.J.杨
B.彼得森
M.莫里亚蒂
R.J.P.G.尚珀斯
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FEI Co
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
    • H01J37/3053Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
    • H01J37/3056Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching for microworking, e. g. etching of gratings or trimming of electrical components
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00Sampling; Preparing specimens for investigation
    • G01N1/28Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/304Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/244Detection characterized by the detecting means
    • H01J2237/24455Transmitted particle detectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30Electron or ion beam tubes for processing objects
    • H01J2237/304Controlling tubes
    • H01J2237/30466Detecting endpoint of process
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30Electron or ion beam tubes for processing objects
    • H01J2237/317Processing objects on a microscale
    • H01J2237/3174Etching microareas
    • H01J2237/31745Etching microareas for preparing specimen to be viewed in microscopes or analyzed in microanalysers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30Electron or ion beam tubes for processing objects
    • H01J2237/317Processing objects on a microscale
    • H01J2237/31749Focused ion beam

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
CN200980153190.8A 2008-10-31 2009-11-02 样本厚度的测量和终点确定 Active CN102272878B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US11039408P 2008-10-31 2008-10-31
US61/110394 2008-10-31
US61/110,394 2008-10-31
PCT/US2009/063007 WO2010051546A2 (en) 2008-10-31 2009-11-02 Measurement and endpointing of sample thickness

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201110252293.9A Division CN102394209B (zh) 2008-10-31 2009-11-02 样本厚度的测量和终点确定

Publications (2)

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CN102272878A CN102272878A (zh) 2011-12-07
CN102272878B true CN102272878B (zh) 2014-07-23

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CN200980153190.8A Active CN102272878B (zh) 2008-10-31 2009-11-02 样本厚度的测量和终点确定
CN201110252293.9A Active CN102394209B (zh) 2008-10-31 2009-11-02 样本厚度的测量和终点确定

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Country Status (5)

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US (2) US8170832B2 (enExample)
EP (2) EP2351062A4 (enExample)
JP (2) JP5649583B2 (enExample)
CN (2) CN102272878B (enExample)
WO (1) WO2010051546A2 (enExample)

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US10204762B2 (en) 2012-07-16 2019-02-12 Fei Company Endpointing for focused ion beam processing

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Also Published As

Publication number Publication date
JP5852725B2 (ja) 2016-02-03
CN102394209A (zh) 2012-03-28
US20120187285A1 (en) 2012-07-26
JP5649583B2 (ja) 2015-01-07
US8170832B2 (en) 2012-05-01
WO2010051546A3 (en) 2010-08-05
EP2351062A4 (en) 2012-10-31
JP2015038509A (ja) 2015-02-26
CN102394209B (zh) 2015-01-14
EP2351062A2 (en) 2011-08-03
US20100116977A1 (en) 2010-05-13
EP2367195A3 (en) 2012-11-21
US9184025B2 (en) 2015-11-10
EP2367195A2 (en) 2011-09-21
CN102272878A (zh) 2011-12-07
WO2010051546A2 (en) 2010-05-06
JP2012507728A (ja) 2012-03-29
EP2367195B1 (en) 2014-03-12

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