CN102256445A - 一种有机基板的制造方法 - Google Patents
一种有机基板的制造方法 Download PDFInfo
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- CN102256445A CN102256445A CN2011101315325A CN201110131532A CN102256445A CN 102256445 A CN102256445 A CN 102256445A CN 2011101315325 A CN2011101315325 A CN 2011101315325A CN 201110131532 A CN201110131532 A CN 201110131532A CN 102256445 A CN102256445 A CN 102256445A
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CN 201110131532 CN102256445B (zh) | 2011-05-19 | 2011-05-19 | 一种有机基板的制造方法 |
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CN 201110131532 CN102256445B (zh) | 2011-05-19 | 2011-05-19 | 一种有机基板的制造方法 |
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CN102256445A true CN102256445A (zh) | 2011-11-23 |
CN102256445B CN102256445B (zh) | 2013-07-31 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05291751A (ja) * | 1992-04-14 | 1993-11-05 | Hitachi Chem Co Ltd | 金属芯入り印刷配線用基板の製造方法 |
JPH08181417A (ja) * | 1994-12-26 | 1996-07-12 | Furukawa Electric Co Ltd:The | 回路材の製造方法 |
CN1465213A (zh) * | 2001-07-18 | 2003-12-31 | 松下电器产业株式会社 | 电路形成基板及电路形成基板的制造方法 |
JP3962295B2 (ja) * | 2002-07-29 | 2007-08-22 | 株式会社日本製鋼所 | 電子基板のインサート射出成形用金型 |
CN101850593A (zh) * | 2009-03-31 | 2010-10-06 | 本田技研工业株式会社 | 嵌件成型方法及装置 |
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- 2011-05-19 CN CN 201110131532 patent/CN102256445B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05291751A (ja) * | 1992-04-14 | 1993-11-05 | Hitachi Chem Co Ltd | 金属芯入り印刷配線用基板の製造方法 |
JPH08181417A (ja) * | 1994-12-26 | 1996-07-12 | Furukawa Electric Co Ltd:The | 回路材の製造方法 |
CN1465213A (zh) * | 2001-07-18 | 2003-12-31 | 松下电器产业株式会社 | 电路形成基板及电路形成基板的制造方法 |
JP3962295B2 (ja) * | 2002-07-29 | 2007-08-22 | 株式会社日本製鋼所 | 電子基板のインサート射出成形用金型 |
CN101850593A (zh) * | 2009-03-31 | 2010-10-06 | 本田技研工业株式会社 | 嵌件成型方法及装置 |
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Owner name: CHENGDU RHOPTICS OPTOELECTRONIC TECHNOLOGY CO., LT Free format text: FORMER OWNER: INST OF MICROELECTRONICS, C. A. S Effective date: 20140806 |
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Free format text: CORRECT: ADDRESS; FROM: 100029 CHAOYANG, BEIJING TO: 610041 CHENGDU, SICHUAN PROVINCE |
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Effective date of registration: 20140806 Address after: 610041, Sichuan, Chengdu hi tech Development Zone, 188 Rui Rui Road, No. 6, No. 2 building Patentee after: Chengdu Rhoptics Optoelectronic Technology Co., Ltd. Address before: 100029 Beijing city Chaoyang District Beitucheng West Road No. 3 Institute of Microelectronics Patentee before: Institute of Microelectronics, Chinese Academy of Sciences |
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Effective date of registration: 20210218 Address after: 214028 building D1, China Sensor Network International Innovation Park, No. 200, Linghu Avenue, New District, Wuxi City, Jiangsu Province Patentee after: National Center for Advanced Packaging Co.,Ltd. Address before: 2 / F, no.188-6, Zirui Avenue, Chengdu hi tech Development Zone, Sichuan 610041 Patentee before: CHENGDU RUIHUA OPTICS Co.,Ltd. |
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