CN102248163A - 用于减小激光烧结设备的下结构空间的装置 - Google Patents

用于减小激光烧结设备的下结构空间的装置 Download PDF

Info

Publication number
CN102248163A
CN102248163A CN2011101094106A CN201110109410A CN102248163A CN 102248163 A CN102248163 A CN 102248163A CN 2011101094106 A CN2011101094106 A CN 2011101094106A CN 201110109410 A CN201110109410 A CN 201110109410A CN 102248163 A CN102248163 A CN 102248163A
Authority
CN
China
Prior art keywords
structure space
size
reducing
new
construction chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN2011101094106A
Other languages
English (en)
Other versions
CN102248163B (zh
Inventor
W.迪克曼
M.格雷布
S.阿尔坎佩尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evonik Operations GmbH
Original Assignee
Evonik Degussa GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Evonik Degussa GmbH filed Critical Evonik Degussa GmbH
Publication of CN102248163A publication Critical patent/CN102248163A/zh
Application granted granted Critical
Publication of CN102248163B publication Critical patent/CN102248163B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • B29C67/02—Moulding by agglomerating
    • B29C67/04—Sintering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/141—Processes of additive manufacturing using only solid materials
    • B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/25—Housings, e.g. machine housings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49716—Converting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/52—Plural diverse manufacturing apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Powder Metallurgy (AREA)
  • Furnace Details (AREA)
  • Furnace Housings, Linings, Walls, And Ceilings (AREA)

Abstract

通过减小结构空间到达到使材料需求降低到特殊要求。此外，通过在下结构空间内的温度控制获得新的自由度。根据温度控制方式和所选择的结构空间表面，这对构件质量和结构空间粉末具有影响。

Description

用于减小激光烧结设备的下结构空间的装置
激光烧结设备(Lasersinteranlage)能够在各种实施方式中在市场上可被支配，所述实施方式另外在结构空间体积中不同。但是在可支配的设备中不利的是，结构空间体积不能够可变地适应各自需求。这导致了不能够减少在激光烧结设备中，甚至在具有少量件数的非常小的部件的构造中所需的粉末量。如果构件体积与结构空间体积的比例变差，那么由于额外所需的粉末，增加了每个构件情况的成本。 
因此，本发明的目的是，克服了现有技术中的缺点。为了能够使粉末量适应于构件大小，现在发现一种如在权利要求中所述的装置，其使得结构空间的减小成为可能。 
下面的草图1至3示出减小结构空间的各种实施方式的原理，其中 
草图1为简化的总图； 
草图2为简化的侧示图，其示出了实施方式变形方案1； 
草图2a为简化的侧示图，其示出了实施方式变形方案1a； 
草图3为简化的侧示图，其示出了实施方式变形方案2。 
草图1、2和2a示出通过附加的侧壁和在已有的构造平台上的附加件(Aufsatz)来减小结构空间的可能性。在此，草图1为简化的总图，而草图2和2a简化地示出结构空间的剖视图。通过构造平台的下降，刚性的附加件也以相同的程度下沉，从而减小的粉末表面同样按层厚度降低。对于构造过程可支配的面积通过附加的结构空间壁和底板附加件的尺寸来确定。附加的结构空间壁能够固定地相互连接，或者也能够通过滑动机构和固定机构相互连接。后一种情况具有的优点是，结构空间的大小能够可变地设计。那么只是底板附加件的大小必须与通过附加的结构空间壁预先确定的大小相 适应。 
草图3示出来自具有新的构造平台的结构空间的中心的剖面。通过该新的构造平台支配结构空间的总高度。侧壁相应地在结构空间的总高度上安装。 
所有在这里示出的可能性是共同的，使得确定用于各自减小的新的结构空间表面。 
通过减小可利用的结构空间，也获得沿着z轴的温度控制的可能性。与加热和冷却元件一样，温度传感器能够安装在新的结构空间壁上。为此能够利用在原有的构造容器和减小插入件之间的距离。因此，有针对性的温控，例如更均匀的冷却，以及构件的有针对性的加温(Temperieren)是可能的。通过更均匀的冷却例如可达到更低的延迟倾斜(Verzugsneigung)。此外，下结构空间温度可适应于所使用的材料。特别是在具有较高熔点的材料中，这是工序的必需适应。通过安装多个分开可调节的加热元件，能够调节不同的温度区。 
如果除了热电偶(Thermoelement)还存在冷却研磨(Kühlschleifen)，那么能够更快速地降低温度，并且因此减少直至去除构件的时间。此外，视所使用的材料而定，更快速的冷却阶段和因此相关的更低的热负载对于粉末的重新利用而言可以是积极的。 
结构空间减小的实施形式适应于各所需的结构空间要求并且不局限于一种大小。在所示实施形式中，已有的构造平台的利用将支配的高度降至大约原有高度的一半以下。通过更换底板也能够利用总的结构空间高度。在任何情况下，能够利用已有的设备控制。 
对于工序可靠性而言，从上结构空间到下结构空间的良好的热解耦是有利的。因此，构造区板(Baufeldplatte)应该由除了具有良好的耐热性外还具有良好的热绝缘特性的材料组成。因此提供如耐热的聚合物、纤维复合材料或耐火石的材料。通过在结构上的设计，如夹层结构形式，能够进一步改善热绝缘，或者也能够使用具有差的绝缘特性的材料，例如金属。 

Claims (7)

1.一种用于减小激光烧结设备的下结构空间的装置，其特征在于，在已有的激光烧结设备中，将附加的或新的侧壁装入到下结构空间中。
2.如权利要求1所述的装置，其特征在于，在所述设备的已有的构造平台上装上适应于附加的或新的侧壁的附加件。
3.如权利要求1所述的装置，其特征在于，所述设备的已有的构造平台通过适应于附加的或新的侧壁的新的构造平台来替代。
4.如权利要求1所述的装置，其特征在于，存在在所述新的侧壁的不同区域中不同或相同程度的加热的附加可能性。
5.如权利要求1所述的装置，其特征在于，存在在不同区域中不同或相同程度的冷却的附加可能性。
6.如权利要求1所述的装置，其特征在于，所述结构空间能够通过滑动机构和固定机构可变地调节。
7.如权利要求1所述的装置，其特征在于，上结构空间和下结构空间通过具有良好的热绝缘特性的构造区板分开。
CN201110109410.6A 2010-04-17 2011-04-14 用于减小激光烧结设备的下结构空间的装置 Active CN102248163B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE202010005162U DE202010005162U1 (de) 2010-04-17 2010-04-17 Vorrichtung zur Verkleinerung des unteren Bauraums einer Lasersinteranlage
DE202010005162.2 2010-04-17

Publications (2)

Publication Number Publication Date
CN102248163A true CN102248163A (zh) 2011-11-23
CN102248163B CN102248163B (zh) 2016-06-22

Family

ID=43049623

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110109410.6A Active CN102248163B (zh) 2010-04-17 2011-04-14 用于减小激光烧结设备的下结构空间的装置

Country Status (7)

Country Link
US (1) US20110252618A1 (zh)
EP (1) EP2377672B1 (zh)
JP (1) JP5780814B2 (zh)
CN (1) CN102248163B (zh)
DE (1) DE202010005162U1 (zh)
ES (1) ES2860696T3 (zh)
PL (1) PL2377672T3 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105170977A (zh) * 2014-05-15 2015-12-23 株式会社沙迪克 三维形状积层造形物的制造装置
CN107952956A (zh) * 2016-10-16 2018-04-24 北京金属增材制造创新中心有限公司 用于激光增材制造的气氛保护系统及激光增材制造设备
CN108349163A (zh) * 2015-12-18 2018-07-31 惠普发展公司，有限责任合伙企业 数字打印的构造材料的提取

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004012682A1 (de) * 2004-03-16 2005-10-06 Degussa Ag Verfahren zur Herstellung von dreidimensionalen Objekten mittels Lasertechnik und Auftragen eines Absorbers per Inkjet-Verfahren
DE102004020452A1 (de) * 2004-04-27 2005-12-01 Degussa Ag Verfahren zur Herstellung von dreidimensionalen Objekten mittels elektromagnetischer Strahlung und Auftragen eines Absorbers per Inkjet-Verfahren
DE102011003610A1 (de) 2011-02-03 2012-08-09 Evonik Degussa Gmbh Vorrichtung zur besseren Inertisierung von Lasersinteranlagen
DE102011014610B3 (de) * 2011-03-19 2012-05-03 Hochschule Mittweida (Fh) Einrichtung zum Auftrag von Pulver für additive Fertigungsverfahren
DE102011005929A1 (de) * 2011-03-23 2012-09-27 Bayerische Motoren Werke Aktiengesellschaft Vorrichtung und Verfahren zum Herstellen eines Bauteils in Schichtbauweise
DE102011079521A1 (de) 2011-07-21 2013-01-24 Evonik Degussa Gmbh Verbesserte Bauteileigenschaften durch Strahlformung im Laser-Sintern
DE102011085154A1 (de) 2011-10-25 2013-04-25 Evonik Industries Ag Vorrichtung zur Vermeidung von Ablagerungen an optischen Komponenten im Laser-Sintern
GB2503215A (en) * 2012-06-18 2013-12-25 Rolls Royce Plc Method of making an object using a deposition control plate
US9149870B2 (en) 2012-09-14 2015-10-06 Aerojet Rocketdyne Of De, Inc. Additive manufacturing chamber with reduced load
US20140077422A1 (en) * 2012-09-19 2014-03-20 Pratt & Whitney Rocketdyne, Inc. Reduced build mass additive manufacturing chamber
ITVR20120231A1 (it) * 2012-11-20 2014-05-21 Sisma Spa Macchina per produrre oggetti tridimensionali a partire da materiali in polvere
GB201417687D0 (en) * 2014-10-07 2014-11-19 Renishaw Plc A module for additive manufacturing apparatus
WO2016163861A1 (ko) * 2015-04-06 2016-10-13 우정현 분말 소결형 프린팅 장치
KR101791543B1 (ko) * 2015-04-06 2017-11-20 우정현 분말 소결형 프린팅 장치
DE102015109525A1 (de) * 2015-06-15 2016-12-15 Cl Schutzrechtsverwaltungs Gmbh Vorrichtung zum Herstellen von dreidimensionalen Objekten sowie ein zugehöriges Verfahren
DE102015212420A1 (de) * 2015-07-02 2017-01-05 Siemens Aktiengesellschaft Vorrichtung zur additiven Fertigung eines Bauteils
WO2017044833A1 (en) * 2015-09-10 2017-03-16 Materialise N.V. Systems and methods for thermal cycle control in additive manufacturing environments
US10843266B2 (en) * 2015-10-30 2020-11-24 Seurat Technologies, Inc. Chamber systems for additive manufacturing
JP6459912B2 (ja) * 2015-11-09 2019-01-30 トヨタ自動車株式会社 積層造形装置
US10882253B2 (en) 2015-12-18 2021-01-05 Hewlett-Packard Development Company, L.P. Removable cassette for 3D printers
EP3397491A4 (en) * 2016-01-02 2019-12-04 Sd3D Inc. HEATED AND ADAPTIVE CONSTRUCTION FOR 3D PRINTERS
JP2017132073A (ja) * 2016-01-26 2017-08-03 株式会社リコー 三次元造形装置、三次元造形用チャンバー及び三次元造形方法
DE102016114057A1 (de) * 2016-07-29 2018-02-01 Cl Schutzrechtsverwaltungs Gmbh Baukammer für eine Vorrichtung zur additiven Herstellung dreidimensionaler Objekte
DE102016219080A1 (de) 2016-09-30 2018-04-05 Evonik Degussa Gmbh Polyamidpulver für selektive Sinterverfahren
KR20180052225A (ko) * 2016-11-10 2018-05-18 현대자동차주식회사 3d 프린터의 가공챔버 분할 장치
WO2018101908A1 (en) * 2016-11-29 2018-06-07 Hewlett-Packard Development Company, L.P. Accessory for three-dimensional printing
DE102017110650A1 (de) * 2017-05-16 2018-11-22 Ald Vacuum Technologies Gmbh Verfahren und Vorrichtung für die additive Herstellung von Werkstücken
KR101990308B1 (ko) * 2017-08-18 2019-06-18 (주)센트롤 삼차원 프린터
US11571743B2 (en) * 2017-11-13 2023-02-07 General Electric Company Systems and methods for additive manufacturing
EP3501695A1 (de) 2017-12-22 2019-06-26 Evonik Degussa GmbH Vorrichtung zur schichtweisen herstellung von dreidimensionalen objekten sowie herstellungsverfahren dazu
DE102018202644A1 (de) * 2018-02-21 2019-08-22 Trumpf Laser- Und Systemtechnik Gmbh Verfahren und Maschine zum schnellen Inertisieren einer Prozesskammer zur additiven Fertigung von Bauteilen
US10065242B1 (en) * 2018-03-01 2018-09-04 King Saud University Adjustable build envelope for powder bed fusion machines
US11712848B2 (en) * 2018-09-27 2023-08-01 Eos Of North America, Inc. Modifying a building space in an apparatus for powder bed additive manufacturing a three-dimensional object
US10994483B2 (en) * 2018-10-01 2021-05-04 Eos Of North America, Inc. Dual roller assembly for spreading material in additive manufacturing apparatus
US11667075B2 (en) 2018-10-04 2023-06-06 Ralf Lampalzer Apparatus and method for selective laser melting and/or laser sintering of powdery material
DE102018007813A1 (de) * 2018-10-04 2020-04-09 Ralf Lampalzer Verfahren und Vorrichtung zur Anpassung der Bauraumgeometrie bei Selektivem Laserschmelzen ode Selektivem Lasersintern
DE102021119465A1 (de) 2021-07-27 2023-02-02 Airbus Operations Gmbh Verfahren und Vorrichtung zur additiven Fertigung eines Bauteils innerhalb einer Aufnahmeeinheit unter Verwendung eines pulverartigen Materials
JP7279234B1 (ja) * 2022-04-27 2023-05-22 株式会社ソディック 積層造形装置および積層造形装置用の小領域造形ユニット

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995015842A1 (fr) * 1993-12-09 1995-06-15 Laser International S.A. Procede et installation pour la fabrication de pieces par phototransformation de matiere
CN1135731A (zh) * 1993-10-20 1996-11-13 联合技术公司 多束激光烧结
CN1334158A (zh) * 2000-06-16 2002-02-06 松下电工株式会社 制造三维物体的方法
US20060032838A1 (en) * 2004-08-10 2006-02-16 Muylaert Neal W Selective laser sintering reduced volume feed mechanism
US20070026099A1 (en) * 2005-07-26 2007-02-01 Aspect Inc. Powder sinter layered manufacturing apparatus
US20100090374A1 (en) * 2008-10-14 2010-04-15 David Michael Dietrich Geometry adaptive laser sintering system

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3521849A (en) * 1966-10-22 1970-07-28 Schloemann Ag Continuous metal-casting mold
US4273581A (en) * 1978-04-07 1981-06-16 Inoue-Japax Research Incorporated Sintering method
JPS57112997A (en) * 1980-12-29 1982-07-14 Yoshitsuka Seiki:Kk Die set exchanging device for powder molding press
JPS5930519B2 (ja) * 1980-12-29 1984-07-27 株式会社ヨシツカ精機 粉末成形プレスのダイセット交換装置
JPS57112998A (en) * 1980-12-29 1982-07-14 Yoshitsuka Seiki:Kk Die set exchanging device for powder molding press
JPS60116702A (ja) * 1983-11-29 1985-06-24 Kobe Steel Ltd 高能率熱間静水圧成形方法および装置
JPH0825077B2 (ja) * 1990-12-28 1996-03-13 株式会社ヨシツカ精機 粉末成形プレスのツールセットの交換装置
US5731013A (en) * 1995-09-13 1998-03-24 The Whitaker Corporation Reconfigurable mold having travelling separator assist
DE19846478C5 (de) * 1998-10-09 2004-10-14 Eos Gmbh Electro Optical Systems Laser-Sintermaschine
JP4015796B2 (ja) * 1999-03-31 2007-11-28 Ｓｐｓシンテックス株式会社 自動パルス通電加圧焼結方法及びそのシステム
NL1014262C2 (nl) * 2000-02-02 2001-08-03 Beheermij De Boer Nijmegen Bv Vormbak met verwisselbaar vormbakdeel.
JP2001334580A (ja) * 2000-05-24 2001-12-04 Minolta Co Ltd 三次元造形装置および三次元造形方法
DE10047615A1 (de) * 2000-09-26 2002-04-25 Generis Gmbh Wechselbehälter
US7220365B2 (en) * 2001-08-13 2007-05-22 New Qu Energy Ltd. Devices using a medium having a high heat transfer rate
US6822194B2 (en) * 2002-05-29 2004-11-23 The Boeing Company Thermocouple control system for selective laser sintering part bed temperature control
US6815636B2 (en) * 2003-04-09 2004-11-09 3D Systems, Inc. Sintering using thermal image feedback
JP4141379B2 (ja) * 2003-12-12 2008-08-27 日立造船株式会社 三次元物体の造形方法および造形装置
US7357629B2 (en) * 2005-03-23 2008-04-15 3D Systems, Inc. Apparatus and method for aligning a removable build chamber within a process chamber
US7790096B2 (en) * 2005-03-31 2010-09-07 3D Systems, Inc. Thermal management system for a removable build chamber for use with a laser sintering system
DE102005030854B3 (de) * 2005-07-01 2007-03-08 Eos Gmbh Electro Optical Systems Vorrichtung zum Herstellen eines dreidimensionalen Objektes
JP4917381B2 (ja) * 2006-08-09 2012-04-18 株式会社アスペクト 粉末焼結積層造形装置及び粉末焼結積層造形方法
DE102006055075A1 (de) * 2006-11-22 2008-05-29 Eos Gmbh Electro Optical Systems Vorrichtung zum schichtweisen Herstellen eines dreidimensionalen Objekts
DE102006055052A1 (de) * 2006-11-22 2008-05-29 Eos Gmbh Electro Optical Systems Vorrichtung zum schichtweisen Herstellen eines dreidimensionalen Objekts
DE102006055054A1 (de) * 2006-11-22 2008-05-29 Eos Gmbh Electro Optical Systems Vorrichtung zum schichtweisen Herstellen eines dreidimensionalen Objekts
DE102006055056A1 (de) * 2006-11-22 2008-05-29 Eos Gmbh Electro Optical Systems Beschichter zum Auftragen einer Schicht eines pulverförmigen Aufbaumaterials in einer Vorrichtung zum schichtweisen Herstellen eines dreidimensionalen Objekts
DE102006055076A1 (de) * 2006-11-22 2008-05-29 Eos Gmbh Electro Optical Systems Baubehälter für eine Vorrichtung zum schichtweisen Herstellen eines dreidimensionalen Objekts
DE102006055077A1 (de) * 2006-11-22 2008-05-29 Eos Gmbh Electro Optical Systems Vorrichtung zum schichtweisen Herstellen eines dreidimensionalen Objekts und Verfahren zum Einsetzen bzw. Entnehmen eines Behälters
DE102006055073A1 (de) * 2006-11-22 2008-05-29 Eos Gmbh Electro Optical Systems Vorrichtung und Verfahren zum schichtweisen Herstellen eines dreidimensionalen Objekts
US7968044B2 (en) * 2007-04-30 2011-06-28 Spraying Systems Co. Sinter processing system
WO2008143106A1 (ja) * 2007-05-14 2008-11-27 Panasonic Electric Works Co., Ltd. 三次元形状造形物の製造方法及び製造装置
US8007708B2 (en) * 2008-12-12 2011-08-30 Innoventor Incorporated Apparatus and methods for automating movement of mold drawers
US20100155985A1 (en) * 2008-12-18 2010-06-24 3D Systems, Incorporated Apparatus and Method for Cooling Part Cake in Laser Sintering
JP5452072B2 (ja) * 2009-05-07 2014-03-26 株式会社エイチ・ティー・エル 電子ビーム造形方法
DE102009020987A1 (de) * 2009-05-12 2010-11-18 Cl Schutzrechtsverwaltungs Gmbh Vorrichtung zur Herstellung von dreidimensionalen Objekten
US9522501B2 (en) * 2010-09-21 2016-12-20 The Boeing Company Continuous linear production in a selective laser sintering system

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1135731A (zh) * 1993-10-20 1996-11-13 联合技术公司 多束激光烧结
WO1995015842A1 (fr) * 1993-12-09 1995-06-15 Laser International S.A. Procede et installation pour la fabrication de pieces par phototransformation de matiere
CN1334158A (zh) * 2000-06-16 2002-02-06 松下电工株式会社 制造三维物体的方法
US20060032838A1 (en) * 2004-08-10 2006-02-16 Muylaert Neal W Selective laser sintering reduced volume feed mechanism
US20070026099A1 (en) * 2005-07-26 2007-02-01 Aspect Inc. Powder sinter layered manufacturing apparatus
US20100090374A1 (en) * 2008-10-14 2010-04-15 David Michael Dietrich Geometry adaptive laser sintering system

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105170977A (zh) * 2014-05-15 2015-12-23 株式会社沙迪克 三维形状积层造形物的制造装置
CN105170977B (zh) * 2014-05-15 2018-11-23 株式会社沙迪克 三维形状积层造形物的制造装置
CN108349163A (zh) * 2015-12-18 2018-07-31 惠普发展公司，有限责任合伙企业 数字打印的构造材料的提取
US10913208B2 (en) 2015-12-18 2021-02-09 Hewlett-Packard Development Company, L.P. Extraction of digitally printed build material
US11701830B2 (en) 2015-12-18 2023-07-18 Hewlett-Packard Development Company, L.P. Extraction of digitally printed build material
CN107952956A (zh) * 2016-10-16 2018-04-24 北京金属增材制造创新中心有限公司 用于激光增材制造的气氛保护系统及激光增材制造设备
CN107952956B (zh) * 2016-10-16 2019-10-15 北京煜鼎增材制造研究院有限公司 用于激光增材制造的气氛保护系统及激光增材制造设备

Also Published As

Publication number Publication date
JP2011225994A (ja) 2011-11-10
EP2377672A3 (de) 2013-01-02
EP2377672A2 (de) 2011-10-19
PL2377672T3 (pl) 2021-07-26
US20110252618A1 (en) 2011-10-20
ES2860696T3 (es) 2021-10-05
DE202010005162U1 (de) 2010-11-04
CN102248163B (zh) 2016-06-22
EP2377672B1 (de) 2021-02-24
JP5780814B2 (ja) 2015-09-16

Similar Documents

Publication Publication Date Title
CN102248163A (zh) 用于减小激光烧结设备的下结构空间的装置
Li et al. Experimental investigation of vapor chambers with different wick structures at various parameters
Giuntini et al. Advancement of tooling for spark plasma sintering
US8729380B2 (en) Use of porous metallic materials as contact connection in thermoelectric modules
US20210161029A1 (en) Systems and methods for additive manufacturing of wick structure for vapor chamber
McWilliams et al. Fully coupled thermal–electric-sintering simulation of electric field assisted sintering of net-shape compacts
EP2854190B1 (en) Thermoelectric generator
US11342490B2 (en) Thermoelectric leg and thermoelectric element comprising same
Mohanta et al. Low cost porous alumina with tailored microstructure and thermal conductivity prepared using rice husk and sucrose
Akhtar et al. Development of a ceramic-based composite for direct bonded copper substrate
CN105236982A (zh) 氮化铝增强的石墨基复合材料及制备工艺
US9417013B2 (en) Heat transfer systems including heat conducting composite materials
Lara Ramos et al. Design Guidelines for Micro‐Thermoelectric Devices by Finite Element Analysis
CN108475720A (zh) 用于热电元件的粉末冶金生产的合理方法
US11258002B2 (en) Thermoelectric sintered body and thermoelectric element
Rajkumar et al. Nonisothermal sintering of Cr2AlC powder
CN100395057C (zh) 多孔结构的制造方法
CN105728719A (zh) 一种高导热铜基电子封装基板的制备方法
Nizhegorodov et al. Transformation of vermiculite energy into mechanical transformation energy during firing in electric furnaces with a “zero” module
KR20190068612A (ko) 적외선 방사체
CN103108938B (zh) 用于热循环仪的低热容复合物
KR102385208B1 (ko) 냉온장치
Dai et al. Thermal modeling of selective area laser deposition (SALD) and SALD vapor infiltration of silicon carbide
JP2021529431A (ja) 熱電素子
CN106163213A (zh) 高导热盖及其制作方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant