CN102210024B - 生长衬底移除的串联连接的倒装芯片led - Google Patents
生长衬底移除的串联连接的倒装芯片led Download PDFInfo
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- CN102210024B CN102210024B CN200980144371.4A CN200980144371A CN102210024B CN 102210024 B CN102210024 B CN 102210024B CN 200980144371 A CN200980144371 A CN 200980144371A CN 102210024 B CN102210024 B CN 102210024B
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- 238000005530 etching Methods 0.000 claims abstract description 33
- 238000005468 ion implantation Methods 0.000 claims abstract description 19
- 238000002955 isolation Methods 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 31
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- 238000010276 construction Methods 0.000 claims description 5
- 230000005518 electrochemistry Effects 0.000 claims description 5
- 238000000407 epitaxy Methods 0.000 claims 2
- 238000009413 insulation Methods 0.000 claims 2
- 229910052594 sapphire Inorganic materials 0.000 abstract description 21
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- 229910052757 nitrogen Inorganic materials 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
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- 229910000838 Al alloy Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/2654—Bombardment with radiation with high-energy radiation producing ion implantation in AIIIBV compounds
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Devices (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (11)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/266162 | 2008-11-06 | ||
US12/266,162 US8062916B2 (en) | 2008-11-06 | 2008-11-06 | Series connected flip chip LEDs with growth substrate removed |
PCT/IB2009/054809 WO2010052622A1 (en) | 2008-11-06 | 2009-10-29 | Series connected flip chip leds with growth substrate removed |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102210024A CN102210024A (zh) | 2011-10-05 |
CN102210024B true CN102210024B (zh) | 2015-11-25 |
Family
ID=41667219
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200980144371.4A Active CN102210024B (zh) | 2008-11-06 | 2009-10-29 | 生长衬底移除的串联连接的倒装芯片led |
Country Status (7)
Country | Link |
---|---|
US (2) | US8062916B2 (zh) |
EP (1) | EP2356684B1 (zh) |
JP (1) | JP2012507848A (zh) |
KR (1) | KR101632768B1 (zh) |
CN (1) | CN102210024B (zh) |
TW (1) | TWI527205B (zh) |
WO (1) | WO2010052622A1 (zh) |
Families Citing this family (110)
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TWI778917B (zh) * | 2018-04-03 | 2022-09-21 | 晶元光電股份有限公司 | 半導體元件 |
TWI797044B (zh) * | 2018-04-03 | 2023-03-21 | 晶元光電股份有限公司 | 半導體元件 |
TWI736756B (zh) * | 2018-04-03 | 2021-08-21 | 晶元光電股份有限公司 | 半導體元件 |
TWI648875B (zh) * | 2018-04-23 | 2019-01-21 | 進化光學有限公司 | 基材、電子裝置、以及發光元件及其製造方法 |
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CN112802869A (zh) * | 2021-03-19 | 2021-05-14 | 中国科学院长春光学精密机械与物理研究所 | 单片集成氮化物发光波长可调节的白光led及制备方法 |
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JP3904571B2 (ja) * | 2004-09-02 | 2007-04-11 | ローム株式会社 | 半導体発光装置 |
US7736945B2 (en) * | 2005-06-09 | 2010-06-15 | Philips Lumileds Lighting Company, Llc | LED assembly having maximum metal support for laser lift-off of growth substrate |
JP2007324576A (ja) * | 2006-05-01 | 2007-12-13 | Mitsubishi Chemicals Corp | 集積型半導体発光装置およびその製造方法 |
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EP2356684B1 (en) | 2018-12-12 |
US20100109030A1 (en) | 2010-05-06 |
US8450754B2 (en) | 2013-05-28 |
US8062916B2 (en) | 2011-11-22 |
WO2010052622A1 (en) | 2010-05-14 |
KR101632768B1 (ko) | 2016-06-22 |
JP2012507848A (ja) | 2012-03-29 |
US20120025231A1 (en) | 2012-02-02 |
CN102210024A (zh) | 2011-10-05 |
EP2356684A1 (en) | 2011-08-17 |
KR20110086724A (ko) | 2011-07-29 |
TWI527205B (zh) | 2016-03-21 |
TW201025683A (en) | 2010-07-01 |
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