CN102209437A - Circuit board with polyimide and aluminum substrate composite structure and manufacturing method thereof - Google Patents
Circuit board with polyimide and aluminum substrate composite structure and manufacturing method thereof Download PDFInfo
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- CN102209437A CN102209437A CN 201010511527 CN201010511527A CN102209437A CN 102209437 A CN102209437 A CN 102209437A CN 201010511527 CN201010511527 CN 201010511527 CN 201010511527 A CN201010511527 A CN 201010511527A CN 102209437 A CN102209437 A CN 102209437A
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- circuit board
- insulating layer
- polyimides
- heat conductive
- conductive insulating
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Abstract
The invention discloses a circuit board with a polyimide and aluminum substrate composite structure. The circuit board comprises a metal substrate (10), a polyimide or polyimide adhesive heat-conducting insulating layer (20) and a conductive layer (30), wherein the heat-conducting insulating layer (20) is laid on at least one surface of the metal substrate (10); and the conductive layer is laid on the surface of the heat-conducting insulating layer (20). In the circuit board, the conventional adhesive with high heat conductivity coefficient is substituted by using a polyimide type substance; the polyimide (PI) type aluminum substrate can resist a higher environment temperature, so that the service life and the stability of the circuit board are improved; and some structures have certain flexibility, so that the application range of the aluminum substrate is further expanded; meanwhile, great convenience is brought for overall design of the circuit board.
Description
Technical field
The present invention relates to the circuit board of aluminium base, particularly have the circuit board of polyimides and aluminium base composite construction.
Background technology
The aluminum current base circuit board adopts the structural design of rigid wiring board, the sort circuit plate is ground with the metal substrate, with the high thermal conductivity coefficient bonded adhesives is heat-conducting insulation material, metal conducting layer is laid on the surface again, the circuit board of this structure can not satisfy the requirement in operational environment continuous operation more than 150 ℃ of FPC or PCB product, and more can not satisfy the requirement that increasing product requirement has good bending performance, certain limitation is arranged in the use.
Summary of the invention
The invention provides a kind of structural design of using new material, adopt polyimides glue (PI glue) or polyimides (PI) to add bonded adhesives (the glue system of bonded adhesives comprises polyimides glue system, prepreg, acrylic acid glue system, modified epoxy system) and replace existing heat conductive insulating layer, not only can make circuit board have the good temperature resistance energy, but also can bend, solve the little technical problem of traditional hardboard circuit board scope of application in the prior art.
Originally the circuit board invention that has polyimides and aluminium base composite construction comprises metal substrate, is laid in the heat conductive insulating layer of at least one lip-deep polyimides (PI) class of metal substrate and the conductive layer that is laid in the heat conductive insulating laminar surface, conductive layer can adopt Copper Foil, aluminium foil or silver foil etc., metal substrate is an aluminum or aluminum alloy, and the heat conductive insulating layer of PI class is laid on positive and negative two surfaces of metal substrate.
The heat conductive insulating layer is a PI glue, and perhaps the heat conductive insulating layer is PI, is connected by first glue line between described heat conductive insulating layer and the metal substrate, is connected by second glue line between described heat conductive insulating layer and the conductive layer.
And the construction manufacturing method of this polyimides (PI) type aluminium base can be according to the actual needs and the condition design of each enterprise, and method for optimizing may further comprise the steps, and: A. lays the heat conductive insulating layer of PI class on metallic substrate surfaces; B. on the heat conductive insulating layer, lay conductive layer.
The heat conductive insulating layer of described PI class can be a PI glue.
The heat conductive insulating layer of described PI class can also be PI, at this moment, also comprises step by step following in the steps A: A1. at first lays first glue line on metallic substrate surfaces; A2. on first glue line, lay the heat conductive insulating layer.Then also can be divided into step by step following among the step B: B1. at first lays second glue line on the heat conductive insulating layer; B2. on second glue line, lay conductive layer.
Adopt PI class material to replace traditional high thermal conductivity coefficient bonded adhesives among the present invention, make the sort circuit plate not only can tolerate higher ambient temperature, the useful life and the stability of product have been improved, and the 5th kind of structure also has certain flexibility, further expanded the scope of application of circuit board, also provided great convenience simultaneously for the global design of product.
Description of drawings
Fig. 1 is the structural representation that the present invention has the circuit board single face use of polyimides and aluminium base composite construction.Fig. 2 is the structural representation that the present invention has the two-sided use of circuit board of polyimides and aluminium base composite construction.Fig. 3 is that the present invention has the single sided board structural representation that the circuit board of polyimides and aluminium base composite construction adopts adhesive glue to be connected.Fig. 4 is that the present invention has the double sided board structural representation that the circuit board of polyimides and aluminium base composite construction adopts adhesive glue to be connected.
Fig. 5 is that the present invention has the structural representation that the circuit board of polyimides and aluminium base composite construction adopts the metal-based layer of segment bonding to combine with FPC.
Embodiment
In conjunction with above-mentioned description of drawings specific embodiments of the invention.
Embodiments of the invention one (as shown in Figure 1): heat conductive insulating layer 20 adopts PI glue, at this moment, directly lays PI glue on the metal substrate 10, lays conductive layer 30 again on PI glue, utilizes the direct fixing metal substrate 10 of cementitiousness and the conductive layer 30 of PI glue.
Embodiments of the invention two (as shown in Figure 2): heat conductive insulating layer 20 still adopts PI glue, and different with embodiment one is, PI glue 20 is laid on positive and negative two surfaces of metal substrate 10, and conductive layer 30 also is two-sided laying, and constitutes the circuit board of two-sided use.
Embodiments of the invention three (as shown in Figure 3): heat conductive insulating layer 20 adopts PI, at this moment, be connected by first glue line 40 between PI and the metal substrate 10,40 of first glue lines can adopt polyimides glue system, prepreg, acrylic acid glue system or modified epoxy system or the like.
Embodiments of the invention four (as shown in Figure 4): heat conductive insulating layer 20 still adopts PI, and different is with embodiment three, and first glue line 40 and PI are that the tow sides at metal substrate 10 lay, with embodiment two in like manner, constitute the circuit board of two-sided use.
In embodiment three and four, can also adopt mode to be connected between PI and the conductive layer 30 by second glue line 50, second glue line 50 can adopt acrylic acid glue or modified epoxy.
Can also adopt the mode by second glue line 50 to be connected between embodiments of the invention five (as shown in Figure 5): PI and the conductive layer 30, second glue line 50 can adopt acrylic acid glue or modified epoxy.The metal-based layer 10 of segment bonding is connected on the PI 20 by bonded adhesives 40, and wherein the glue of the metal-based layer (aluminum or aluminum alloy) 10 and first glue line 40(bonded adhesives system comprises polyimides glue system, prepreg, acrylic acid glue system, modified epoxy system) according to the moulding in advance of design needs.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1. circuit board manufacturing method with polyimides and aluminium base composite construction, it is characterized in that: this method may further comprise the steps: A. lays the heat conductive insulating layer of polyimide on metallic substrate surfaces; B. on the heat conductive insulating layer, lay conductive layer.
2. according to the described circuit board manufacturing method with polyimides and aluminium base composite construction of claim 1, it is characterized in that: in the steps A, the heat conductive insulating layer of described polyimide is a polyimides glue.
3. according to the described circuit board manufacturing method of claim 1 with polyimides and aluminium base composite construction, it is characterized in that: the heat conductive insulating layer of described polyimide is a polyimides, also comprises step by step following in the steps A: A1. at first lays first glue line on metallic substrate surfaces; A2. on first glue line, lay the heat conductive insulating layer.
4. the circuit board manufacturing method that has polyimides and aluminium base composite construction according to claim 1 or 3, it is characterized in that: the heat conductive insulating layer of described polyimide is a polyimides, also comprises step by step following among the step B: B1. at first lays second glue line on the heat conductive insulating layer; B2. on second glue line, lay conductive layer.
5. the circuit board with polyimides and aluminium base composite construction is characterized in that: the conductive layer (30) that this circuit board comprises metal substrate (10), is laid in the heat conductive insulating layer (20) of at least one lip-deep polyimide of metal substrate (10) and is laid in heat conductive insulating layer (20) surface.
6. the circuit board with polyimides and aluminium base composite construction according to claim 5 is characterized in that: the heat conductive insulating layer (20) of described polyimide is laid on positive and negative two surfaces of metal substrate (10).
7. according to claim 5 or 6 described circuit boards with polyimides and aluminium base composite construction, it is characterized in that: described heat conductive insulating layer (20) is a polyimides glue.
8. the circuit board with polyimides and aluminium base composite construction according to claim 7, it is characterized in that: described heat conductive insulating layer (20) is a polyimides, is connected by first glue line (40) between described heat conductive insulating layer (20) and the metal substrate (10).
9. the circuit board with polyimides and aluminium base composite construction according to claim 7, it is characterized in that: described heat conductive insulating layer (20) is a polyimides, is connected by second glue line (50) between described heat conductive insulating layer (20) and the conductive layer (30).
10. the circuit board with polyimides and aluminium base composite construction according to claim 5 is characterized in that: described metal substrate (10) is the aluminum or aluminum alloy plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105115272A CN102209437B (en) | 2010-10-19 | 2010-10-19 | Circuit board with polyimide and aluminum substrate composite structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105115272A CN102209437B (en) | 2010-10-19 | 2010-10-19 | Circuit board with polyimide and aluminum substrate composite structure and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102209437A true CN102209437A (en) | 2011-10-05 |
| CN102209437B CN102209437B (en) | 2012-11-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN2010105115272A Active CN102209437B (en) | 2010-10-19 | 2010-10-19 | Circuit board with polyimide and aluminum substrate composite structure and manufacturing method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN102209437B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103124468A (en) * | 2011-11-18 | 2013-05-29 | 三星电子株式会社 | Metal copper clad laminate and method of manufacturing metal core printed circuit board using the same |
| CN103770400A (en) * | 2014-01-09 | 2014-05-07 | 鹤山东力电子科技有限公司 | 3D (three-dimensional) metal-based copper-clad plate |
| CN113593841A (en) * | 2021-09-28 | 2021-11-02 | 广东力王高新科技股份有限公司 | High-power planar transformer and electronic equipment |
| CN115678421A (en) * | 2022-09-29 | 2023-02-03 | 浙江中科玖源新材料有限公司 | High-thermal-conductivity aluminum-based liquid cooling plate substrate and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1321407A (en) * | 1999-09-06 | 2001-11-07 | 铃木综业株式会社 | Substrate of circuit board |
| US20040247907A1 (en) * | 2001-11-01 | 2004-12-09 | Hideki Goda | Polyimide-metal layered products and polyamideimide-metal layered product |
| CN1571620A (en) * | 2003-07-14 | 2005-01-26 | 银河光电股份有限公司 | Structure of substrate, structure of insulating layer of substrate, and manufacturing method thereof |
| CN201479455U (en) * | 2009-04-16 | 2010-05-19 | 惠州国展电子有限公司 | Metal base flexible circuit copper-clad plate and metal base flexible circuit board |
| US20100215982A1 (en) * | 2007-10-18 | 2010-08-26 | Nippon Mining And Metals Co., Ltd. | Metal Covered Polyimide Composite, Process for Producing the Composite, and Apparatus for Producing the Composite |
-
2010
- 2010-10-19 CN CN2010105115272A patent/CN102209437B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1321407A (en) * | 1999-09-06 | 2001-11-07 | 铃木综业株式会社 | Substrate of circuit board |
| US20040247907A1 (en) * | 2001-11-01 | 2004-12-09 | Hideki Goda | Polyimide-metal layered products and polyamideimide-metal layered product |
| CN1571620A (en) * | 2003-07-14 | 2005-01-26 | 银河光电股份有限公司 | Structure of substrate, structure of insulating layer of substrate, and manufacturing method thereof |
| US20100215982A1 (en) * | 2007-10-18 | 2010-08-26 | Nippon Mining And Metals Co., Ltd. | Metal Covered Polyimide Composite, Process for Producing the Composite, and Apparatus for Producing the Composite |
| CN201479455U (en) * | 2009-04-16 | 2010-05-19 | 惠州国展电子有限公司 | Metal base flexible circuit copper-clad plate and metal base flexible circuit board |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103124468A (en) * | 2011-11-18 | 2013-05-29 | 三星电子株式会社 | Metal copper clad laminate and method of manufacturing metal core printed circuit board using the same |
| CN103770400A (en) * | 2014-01-09 | 2014-05-07 | 鹤山东力电子科技有限公司 | 3D (three-dimensional) metal-based copper-clad plate |
| CN113593841A (en) * | 2021-09-28 | 2021-11-02 | 广东力王高新科技股份有限公司 | High-power planar transformer and electronic equipment |
| CN113593841B (en) * | 2021-09-28 | 2021-12-07 | 广东力王高新科技股份有限公司 | High-power planar transformer and electronic equipment |
| CN115678421A (en) * | 2022-09-29 | 2023-02-03 | 浙江中科玖源新材料有限公司 | High-thermal-conductivity aluminum-based liquid cooling plate substrate and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102209437B (en) | 2012-11-14 |
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