CN204526301U - Be applicable to the Double-sided copper clad laminate of wireless charging device - Google Patents
Be applicable to the Double-sided copper clad laminate of wireless charging device Download PDFInfo
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- CN204526301U CN204526301U CN201520215926.2U CN201520215926U CN204526301U CN 204526301 U CN204526301 U CN 204526301U CN 201520215926 U CN201520215926 U CN 201520215926U CN 204526301 U CN204526301 U CN 204526301U
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Abstract
The utility model discloses a kind of Double-sided copper clad laminate being applicable to wireless charging device, comprise thick Copper Foil, dielectric film, adhesive layer and thin copper foil, dielectric film and adhesive layer are between thick Copper Foil and thin copper foil, the thickness of thick Copper Foil is 35 μm-210 μm, the thickness of thin copper foil is 6 μm-35 μm, the thickness of adhesive layer is 5 μm-50 μm, and the thickness of dielectric film is 7.5 μm-150 μm.Double-sided copper clad laminate one side of the present utility model adopts thin copper, one side uses thick copper, thick Copper Foil is mainly used to carry high current, more long-range wireless charging can be realized, and do not need charging equipment and cradle to lean on very near, thin copper foil can ensure to apply the meticulous of soft board circuit, the miniaturization of charging equipment, facilitation can be realized, this Double-sided copper clad laminate also has excellent electrical property, good scolding tin heat resistance and good dimensional stability, and making technology is simple, yield is high, tool cost advantage.
Description
Technical field
The utility model relates to a kind of copper clad laminate, is specifically related to a kind of Double-sided copper clad laminate being applicable to wireless charging device.
Background technology
Information age, smart mobile phone, panel computer, notebook computer have become people's daily necessities, and because it is small-sized, being easy to carry, it is more convenient that people are lived, it's a pity they neither can continuous operation for a long time.The 3-5 hour that mostly works of Mainstream Notebook, smart mobile phone and panel computer, be also difficult to more than 8 hours in situation more frequently using, must find charging socket nearby when electricity is not enough.And the mode of charging at present is all wired charging modes, owing to being subject to the restriction of charging wire length, the especially more long-range wireless charging mode of wireless charging mode will become main flow.In addition, electric automobile, medicine equipment, the futures such as family expenses small electric apparatus also will realize wireless charging.Wireless charging is a breathtaking new technology, without the need to using electric wire, connector or appliance plug can to equipment charge.Power supply can be wirelessly transmitted to charging receiver from charging transmitter by wireless charging technology.
Utility model content
In order to solve the problems of the technologies described above, the utility model provides a kind of Double-sided copper clad laminate and the manufacture method thereof that are suitable for wireless charging device, Double-sided copper clad laminate one side of the present utility model adopts thin copper, one side uses thick copper, thick Copper Foil be mainly used to carry high current, can more long-range wireless charging be realized, and do not need charging equipment and cradle to lean on very near, thin copper foil can ensure to apply the meticulous of soft board circuit, can realize the miniaturization of charging equipment, facilitation; This Double-sided copper clad laminate also has excellent electrical property, good scolding tin heat resistance and good dimensional stability, and making technology is simple, yield is high, tool cost advantage.
The utility model in order to the technical scheme solving its technical problem and adopt is:
A kind of Double-sided copper clad laminate being applicable to wireless charging device, comprise thick Copper Foil, dielectric film, adhesive layer and thin copper foil, described dielectric film and described adhesive layer are between described thick Copper Foil and thin copper foil, the thickness of described thick Copper Foil is 35 μm-210 μm, the thickness of described thin copper foil is 6 μm-35 μm, the thickness of described adhesive layer is 5 μm-50 μm, and the thickness of described dielectric film is 7.5 μm-150 μm.
Say further, described thick Copper Foil and described thin copper foil are RA copper (rolled copper foil), ED copper (electrolytic copper foil) or HD copper (high extension Copper Foil) separately.
Say further, described adhesive layer is at least one (preferably epoxy resin or esters of acrylic acid) in epoxy resin, acrylic acid series, poly-silica system, phenolic resins system and polyurethane system.Preferably, described adhesive layer is the heat-conducting glue adhensive layer containing heat radiation powder, and described heat radiation powder is at least one in carborundum, boron nitride, aluminium oxide and aluminium nitride, and described heat radiation powder accounts for the 3%-80% of described resin solid content.
Say further, described dielectric film is at least one in Kapton (PI), black heat conduction Kapton, thermoplastic polyimide film (TPI), polyester (PET) film, poly-naphthalene ester (PEN) film and liquid crystal polymer (LCP) film.
Say further, the thickness of described thin copper foil is 12 μm-18 μm, and the thickness of described adhesive layer is 5 μm-25 μm, and the thickness of described dielectric film is 7.5 μm-50 μm.
The utility model specifically provides following three kinds of concrete structures meeting above-mentioned utility model and conceive to solve its technical problem:
The first: described Double-sided copper clad laminate has two-layer described adhesive layer, and be respectively the first adhesive layer and the second adhesive layer, described dielectric film has two relative surfaces, described thin copper foil adheres to a surface of described dielectric film by the first adhesive layer, described thick Copper Foil adheres to another surface of described dielectric film by the second adhesive layer, forms the Double-sided copper clad laminate be made up of thin copper foil, the first adhesive layer, dielectric film, the second adhesive layer and thick Copper Foil.In this kind of structure, the thickness of thick Copper Foil is 35 μm-210 μm, and preferred thickness is 70 μm-140 μm.
The second: described dielectric film has two relative surfaces, described thin copper foil is positioned at a surface of described dielectric film, described thick Copper Foil adheres to another surface of described dielectric film by adhesive layer, forms the Double-sided copper clad laminate be made up of thin copper foil, dielectric film, adhesive layer and thick Copper Foil.Wherein, the thickness of described thick Copper Foil is 70 μm-210 μm, preferably 70 μm-140 μm.
The third: described dielectric film has two relative surfaces, described thin copper foil adheres to a surface of described dielectric film by adhesive layer, described thick Copper Foil is positioned at another surface of described dielectric film, forms the Double-sided copper clad laminate be made up of thin copper foil, adhesive layer, dielectric film and thick Copper Foil.Wherein, the thickness of described thick Copper Foil is 70 μm-210 μm, preferably 70 μm-140 μm.
The beneficial effects of the utility model are: the Double-sided copper clad laminate being applicable to wireless charging device of the present utility model comprises thick Copper Foil, dielectric film, adhesive layer and thin copper foil, dielectric film and adhesive layer are between thick Copper Foil and thin copper foil, wherein, the thickness of thick Copper Foil is 35 μm-210 μm, and the thickness of thin copper foil is 6 μm-35 μm.The thick copper-clad surface of Double-sided copper clad laminate of the present utility model is used for carrying high current, when etching identical live width as 100 μm of copper conductors, the copper conductor current load value of existing ordinary copper foil substrate is generally at about 10mA, and the copper conductor current load of the thick Copper Foil of utility model Double-sided copper clad laminate can reach more than 80mA, be beneficial to and realize comparatively long distance wireless charging, thin copper foil face can ensure to apply the meticulous of soft board circuit, can realize the miniaturization of charging equipment, facilitation; Double-sided copper clad laminate manufacture craft of the present utility model is easy, adjusts Copper Foil, insulating barrier and adhesive layer thickness in the thickness range that can specify if necessary in the utility model, to realize the optimization of client charging equipment; Double-sided copper clad laminate of the present utility model, due to the selection of its material and thickness, makes the electrical property of its tool excellence, fire resistance and size harmomegathus; Double-sided copper clad laminate manufacture craft of the present utility model is simple, and yield is high, the low tool price advantage of cost; Can also, by adding heat radiation powder in adhesive, make copper clad laminate have good thermal conductivity, the heat produced in can effectively being run by electronic circuit be discharged in time.
Accompanying drawing explanation
Fig. 1 is the structural representation being applicable to the Double-sided copper clad laminate of wireless charging device of the utility model embodiment 1 and embodiment 2;
Fig. 2 is the structural representation being applicable to the Double-sided copper clad laminate of wireless charging device of the utility model embodiment 3;
Fig. 3 is the structural representation being applicable to the Double-sided copper clad laminate of wireless charging device of the utility model embodiment 4.
Detailed description of the invention
Below by way of specific instantiation, detailed description of the invention of the present utility model is described, those skilled in the art can understand advantage of the present utility model and effect easily by content disclosed in the present specification.The utility model also can be implemented in further, different ways, that is, under the category do not disclosed departing from the utility model, can give different modifications and change.
Embodiment 1: a kind of Double-sided copper clad laminate being applicable to wireless charging device, as shown in Figure 1, there is two-layer adhesive layer 102, and be respectively the first adhesive layer and the second adhesive layer, dielectric film 103 has two relative surfaces, thin copper foil 101 adheres to a surface of described dielectric film by the first adhesive layer, thick Copper Foil 104 adheres to another surface of described dielectric film by the second adhesive layer, forms the Double-sided copper clad laminate be made up of thin copper foil 101, first adhesive layer 102, dielectric film 103, second adhesive layer 102 and thick Copper Foil 104.In this kind of structure, the thickness of thick Copper Foil is 35 μm-210 μm, and preferred thickness is 70 μm-140 μm; The thickness of thin copper foil is 6 μm-35 μm, preferably 12 μm-18 μm; The thickness of the first adhesive layer and the second adhesive layer is 5 μm-50 μm separately, preferably 5 μm-25 μm, and the thickness of two-layer adhesive layer can be identical, also can be different; The thickness of dielectric film is 7.5 μm-150 μm, preferably 7.5 μm-50 μm.
Wherein, described thick Copper Foil and described thin copper foil are RA copper (rolled copper foil), ED copper (electrolytic copper foil) or HD copper (high extension Copper Foil) separately.
Described adhesive layer is one or more the mixing in epoxy resin, acrylic acid series, poly-silica system, phenolic resins system and polyurethane system, preferably epoxy resin or esters of acrylic acid.For realizing base material heat sinking function, can add heat radiation powder, heat radiation powder is at least one in carborundum, boron nitride, aluminium oxide and aluminium nitride, and described heat radiation powder accounts for the 3%-80% of described resin solid content.
Described dielectric film is one or more mixing in Kapton (PI), black heat conduction Kapton, thermoplastic polyimide film (TPI), polyester (PET) film, poly-naphthalene ester (PEN) film and liquid crystal polymer (LCP) film or compound.
The manufacture method of the Double-sided copper clad laminate of the present embodiment 1 is as follows: be that the polyimide film of 12.5um to apply such as thickness be the adhesive layer of 10um at such as thickness, through short time prebake conditions, pressing such as 1/3oz Copper Foil M/S face (slightly making face/light face) again, by the pressure that the gap between roller and roller give, make polyimides and Copper Foil by middle adhesive layer close adhesion, to form one side copper clad laminate.One side copper clad laminate is through low temperature precuring.Re-using this single sided board, to apply such as thickness be the adhesive layer of 16um, through short time prebake conditions, then pressing such as 3oz Copper Foil M/S face, the pressure given by the gap between roller and roller, make polyimides and Copper Foil by middle adhesive layer close adhesion, to form Double-sided copper clad laminate.Finally, toast this Double-sided copper clad laminate, resin bed is solidified, to form copper clad laminate of the present utility model.Wherein adhesive layer can adopt self-control modified epoxy glue.
Embodiment 2: a kind of Double-sided copper clad laminate being applicable to wireless charging device, as shown in Figure 1, there is two-layer adhesive layer 102, and be respectively the first adhesive layer and the second adhesive layer, dielectric film 103 has two relative surfaces, thin copper foil 101 adheres to a surface of described dielectric film by the first adhesive layer, thick Copper Foil 104 adheres to another surface of described dielectric film by the second adhesive layer, forms the Double-sided copper clad laminate be made up of thin copper foil 101, first adhesive layer 102, dielectric film 103, second adhesive layer 102 and thick Copper Foil 104.In this kind of structure, the thickness of thick Copper Foil is 35 μm-210 μm, and preferred thickness is 70 μm-140 μm; The thickness of thin copper foil is 6 μm-35 μm, preferably 12 μm-18 μm; The thickness of the first adhesive layer and the second adhesive layer is 5 μm-50 μm separately, preferably 5 μm-25 μm, and the thickness of two-layer adhesive layer can be identical, also can be different; The thickness of dielectric film is 7.5 μm-150 μm, preferably 7.5 μm-50 μm.
Wherein, described thick Copper Foil and described thin copper foil are RA copper (rolled copper foil), ED copper (electrolytic copper foil) or HD copper (high extension Copper Foil) separately.
Described adhesive layer is one or more the mixing in epoxy resin, acrylic acid series, poly-silica system, phenolic resins system and polyurethane system, preferably epoxy resin or esters of acrylic acid.For realizing base material heat sinking function, can add heat radiation powder, heat radiation powder is at least one in carborundum, boron nitride, aluminium oxide and aluminium nitride, and described heat radiation powder accounts for the 3%-80% of described resin solid content.
Described dielectric film is one or more mixing in Kapton (PI), black heat conduction Kapton, thermoplastic polyimide film (TPI), polyester (PET) film, poly-naphthalene ester (PEN) film and liquid crystal polymer (LCP) film or compound.
The manufacture method of the Double-sided copper clad laminate of the present embodiment 2 is as follows: be that the polyimide film of 12.5um to apply such as thickness be the adhesive layer of 13um at such as thickness, through short time prebake conditions, pressing such as 1/3oz Copper Foil M/S face again, by the pressure that the gap between roller and roller give, make polyimides and Copper Foil by middle adhesive layer close adhesion, to form one side copper clad laminate.One side copper clad laminate is through low temperature precuring.Re-using this single sided board, to apply such as thickness be the adhesive layer of 13um, through short time prebake conditions, then pressing such as 2oz Copper Foil M/S face, the pressure given by the gap between roller and roller, make polyimides and Copper Foil by middle adhesive layer close adhesion, to form Double-sided copper clad laminate.Finally, toast this Double-sided copper clad laminate, resin bed is solidified, to form copper clad laminate of the present utility model.Wherein adhesive layer can adopt the epoxide-resin glue from fixture thermal diffusivity.
Embodiment 3: a kind of Double-sided copper clad laminate being applicable to wireless charging device, as shown in Figure 2, dielectric film 103 has two relative surfaces, thin copper foil 101 is positioned at a surface of described dielectric film, thick Copper Foil 104 adheres to another surface of described dielectric film by adhesive layer 102, forms the Double-sided copper clad laminate be made up of thin copper foil 101, dielectric film 103, adhesive layer 102 and thick Copper Foil 104.Wherein, the thickness of described thick Copper Foil is 70 μm-210 μm, preferably 70 μm-140 μm; The thickness of thin copper foil is 6 μm-35 μm, preferably 12 μm-18 μm; The thickness of adhesive layer is 5 μm-50 μm, preferably 5 μm-25 μm; The thickness of dielectric film is 7.5 μm-150 μm, preferably 7.5 μm-50 μm.
Wherein, described thick Copper Foil and described thin copper foil are RA copper (rolled copper foil), ED copper (electrolytic copper foil) or HD copper (high extension Copper Foil) separately.
Described adhesive layer is one or more the mixing in epoxy resin, acrylic acid series, poly-silica system, phenolic resins system and polyurethane system, preferably epoxy resin or esters of acrylic acid.For realizing base material heat sinking function, can add heat radiation powder, heat radiation powder is at least one in carborundum, boron nitride, aluminium oxide and aluminium nitride, and described heat radiation powder accounts for the 3%-80% of described resin solid content.
Described dielectric film is one or more mixing in Kapton (PI), black heat conduction Kapton, thermoplastic polyimide film (TPI), polyester (PET) film, poly-naphthalene ester (PEN) film and liquid crystal polymer (LCP) film or compound.
The manufacture method of the Double-sided copper clad laminate of the present embodiment 3 is as follows: get the Copper Foil that such as 12um is thick, and be coated with such as polyimides colloid in this Copper Foil matsurface, and dried and form the thick polyimide layer one side copper clad laminate of such as 12um, be coated with in the PI face of one side copper clad laminate again and such as have the modified epoxy glue of thermal diffusivity, through short time prebake conditions, pressing such as 105um Copper Foil M/S face again, by the pressure that the gap between roller and roller give, make one side copper clad laminate and 105um Copper Foil by middle adhesion coating close adhesion, to form Double-sided copper clad laminate.Finally, toast this Double-sided copper clad laminate, resin bed is solidified, to form Double-sided copper clad laminate of the present utility model.Wherein adhesive layer is self-control modified epoxy glue.
Embodiment 4: a kind of Double-sided copper clad laminate being applicable to wireless charging device, as shown in Figure 3, dielectric film 103 has two relative surfaces, thin copper foil 101 adheres to a surface of described dielectric film by adhesive layer 102, thick Copper Foil 104 is positioned at another surface of described dielectric film, forms the Double-sided copper clad laminate be made up of thin copper foil 101, adhesive layer 102, dielectric film 102 and thick Copper Foil 104.Wherein, the thickness of described thick Copper Foil is 70 μm-210 μm, preferably 70 μm-140 μm; The thickness of thin copper foil is 6 μm-35 μm, preferably 12 μm-18 μm; The thickness of adhesive layer is 5 μm-50 μm, preferably 5 μm-25 μm; The thickness of dielectric film is 7.5 μm-150 μm, preferably 7.5 μm-50 μm.
Wherein, described thick Copper Foil and described thin copper foil are RA copper (rolled copper foil), ED copper (electrolytic copper foil) or HD copper (high extension Copper Foil) separately.
Described adhesive layer is one or more the mixing in epoxy resin, acrylic acid series, poly-silica system, phenolic resins system and polyurethane system, preferably epoxy resin or esters of acrylic acid.For realizing base material heat sinking function, can add heat radiation powder, heat radiation powder is at least one in carborundum, boron nitride, aluminium oxide and aluminium nitride, and described heat radiation powder accounts for the 3%-80% of described resin solid content.
Described dielectric film is one or more mixing in Kapton (PI), black heat conduction Kapton, thermoplastic polyimide film (TPI), polyester (PET) film, poly-naphthalene ester (PEN) film and liquid crystal polymer (LCP) film or compound.
The manufacture method of the Double-sided copper clad laminate of the present embodiment 4 is as follows: get the Copper Foil that such as 105um is thick, and be coated with such as polyimides colloid in this Copper Foil matsurface, and dried and form the thick polyimide layer one side copper clad laminate of such as 12um, be coated with in the PI face of one side copper clad laminate again and such as have the modified epoxy glue of thermal diffusivity, through short time prebake conditions, pressing such as 12um Copper Foil M/S face again, by the pressure that the gap between roller and roller give, make one side copper clad laminate and 12um Copper Foil by middle adhesive layer close adhesion, to form Double-sided copper clad laminate.Finally, toast this Double-sided copper clad laminate, resin bed is solidified, to form Double-sided copper clad laminate of the present utility model.Wherein adhesive layer is the epoxide-resin glue from fixture thermal diffusivity.
The Double-sided copper clad laminate sample of the utility model embodiment 1-4 and the Performance comparision of prior art Double-sided copper clad laminate comparative sample are as following table 1:
Table 1:
Be can be clearly seen that by the data of table 1, Double-sided copper clad laminate of the present utility model is bearing the Double-sided copper clad laminate far above prior art in current value performance, has breakthrough, tremendous progress; The utility model is slightly better than existent technique Double-sided copper clad laminate at thermal conductivity aspect of performance; The utility model is roughly fair with prior art in the adhesion of adhesive layer and Copper Foil.
Claims (9)
1. one kind is applicable to the Double-sided copper clad laminate of wireless charging device, it is characterized in that: comprise thick Copper Foil, dielectric film, adhesive layer and thin copper foil, described dielectric film and described adhesive layer are between described thick Copper Foil and thin copper foil, the thickness of described thick Copper Foil is 35 μm-210 μm, the thickness of described thin copper foil is 6 μm-35 μm, the thickness of described adhesive layer is 5 μm-50 μm, and the thickness of described dielectric film is 7.5 μm-150 μm.
2. be applicable to the Double-sided copper clad laminate of wireless charging device as claimed in claim 1, it is characterized in that: described thick Copper Foil and described thin copper foil are RA copper, ED copper or HD copper separately.
3. be applicable to the Double-sided copper clad laminate of wireless charging device as claimed in claim 1, it is characterized in that: described adhesive layer is the one in epoxy resin adhesive layer, acrylic acid series adhesive layer, poly-silica system adhesive layer, phenolic resins system adhesive layer and polyurethane system adhesive layer.
4. be applicable to the Double-sided copper clad laminate of wireless charging device as claimed in claim 1, it is characterized in that: described dielectric film is the one in Kapton, black heat conduction Kapton, thermoplastic polyimide film, polyester film, poly-naphthalene ester film and liquid crystalline polymer film.
5. be applicable to the Double-sided copper clad laminate of wireless charging device as claimed in claim 1, it is characterized in that: described adhesive layer is heat-conducting glue adhensive layer.
6. be applicable to the Double-sided copper clad laminate of wireless charging device as claimed in claim 1, it is characterized in that: the thickness of described thin copper foil is 12 μm-18 μm, the thickness of described adhesive layer is 5 μm-25 μm, and the thickness of described dielectric film is 7.5 μm-50 μm.
7. the Double-sided copper clad laminate being applicable to wireless charging device according to any one of claim 1 to 6, it is characterized in that: described Double-sided copper clad laminate has two-layer described adhesive layer, and be respectively the first adhesive layer and the second adhesive layer, described dielectric film has two relative surfaces, described thin copper foil adheres to a surface of described dielectric film by the first adhesive layer, described thick Copper Foil adheres to another surface of described dielectric film by the second adhesive layer, formed by thin copper foil, first adhesive layer, dielectric film, the Double-sided copper clad laminate that second adhesive layer and thick Copper Foil are formed.
8. the Double-sided copper clad laminate being applicable to wireless charging device according to any one of claim 1 to 6, it is characterized in that: described dielectric film has two relative surfaces, described thin copper foil is positioned at a surface of described dielectric film, described thick Copper Foil adheres to another surface of described dielectric film by adhesive layer, form the Double-sided copper clad laminate be made up of thin copper foil, dielectric film, adhesive layer and thick Copper Foil, wherein, the thickness of described thick Copper Foil is 70 μm-210 μm.
9. the Double-sided copper clad laminate being applicable to wireless charging device according to any one of claim 1 to 6, it is characterized in that: described dielectric film has two relative surfaces, described thin copper foil adheres to a surface of described dielectric film by adhesive layer, described thick Copper Foil is positioned at another surface of described dielectric film, form the Double-sided copper clad laminate be made up of thin copper foil, adhesive layer, dielectric film and thick Copper Foil, wherein, the thickness of described thick Copper Foil is 70 μm-210 μm.
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| CN201520215926.2U CN204526301U (en) | 2015-04-10 | 2015-04-10 | Be applicable to the Double-sided copper clad laminate of wireless charging device |
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| CN201520215926.2U CN204526301U (en) | 2015-04-10 | 2015-04-10 | Be applicable to the Double-sided copper clad laminate of wireless charging device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104742426A (en) * | 2015-04-10 | 2015-07-01 | 松扬电子材料(昆山)有限公司 | Double-sided copper clad laminate applicable to wireless charging equipment and producing method of copper clad laminate |
| US9673646B1 (en) | 2016-08-19 | 2017-06-06 | Chang Chun Petrochemical Co., Ltd. | Surface-treated electrolytic copper foil and method for wireless charging of flexible printed circuit board |
-
2015
- 2015-04-10 CN CN201520215926.2U patent/CN204526301U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104742426A (en) * | 2015-04-10 | 2015-07-01 | 松扬电子材料(昆山)有限公司 | Double-sided copper clad laminate applicable to wireless charging equipment and producing method of copper clad laminate |
| US9673646B1 (en) | 2016-08-19 | 2017-06-06 | Chang Chun Petrochemical Co., Ltd. | Surface-treated electrolytic copper foil and method for wireless charging of flexible printed circuit board |
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