CN102203965A - 用于led的过模磷光体透镜 - Google Patents

用于led的过模磷光体透镜 Download PDF

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CN102203965A
CN102203965A CN2009801443019A CN200980144301A CN102203965A CN 102203965 A CN102203965 A CN 102203965A CN 2009801443019 A CN2009801443019 A CN 2009801443019A CN 200980144301 A CN200980144301 A CN 200980144301A CN 102203965 A CN102203965 A CN 102203965A
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lens
saturating
clear
tube core
led
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J·C·巴特
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Koninklijke Philips NV
Lumileds LLC
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Koninklijke Philips Electronics NV
Philips Lumileds Lighing Co LLC
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Abstract

矩形LED管芯安装在基座晶片上。第一模具在其中具有与基座晶片上的LED管芯的位置大体相对应的矩形凹口。这些凹口填充有硅树脂，该硅树脂在固化时在每个LED上形成清透的第一透镜。由于晶片与模具精确地对准，因而第一透镜的顶部表面全部处于单一参考平面内，而与晶片上LED的任何x、y和z错位无关。第二模具具有矩形凹口，这些凹口填充有磷光体注入硅树脂以便在清透的第一透镜上形成精确限定的磷光体层，其内外表面与LED的任何错位完全无关。第三模具形成外硅树脂透镜。得到的PC-LED在基座晶片内从PC-LED到PC LED以及从晶片到晶片具有高的色度均匀性，并且在宽视角上具有高的颜色均匀性。

Description

用于LED的过模磷光体透镜
技术领域
本发明涉及发光二极管(LED)，并且特别涉及用于形成磷光体转换LED(PC-LED)的技术。
背景技术
在LED上形成硅树脂透镜是已知的，其中透镜被注入磷光体粉末。例如，LED管芯可以发射蓝色光，并且磷光体可以发射黄绿色光(例如YAG磷光体)，或者磷光体可以是红色和绿色磷光体的组合。通过透镜泄漏的蓝色光以及由磷光体发射的光的组合产生白色光。按照这种方式，可以通过使用适当的磷光体产生许多其他颜色。然而，由于以下原因中的一个或多个原因，这样的磷光体转换LED(PC-LED)在所有视角从LED到LED并没有可复现的颜色：磷光体涂层厚度的变化，磷光体在不同的视角距LED管芯的平均距离不同，光学效应，LED管芯相对于透镜的定位的错位以及变化和其他因素。转让给本受让人并且通过引用合并于此的美国专利No.7322902描述了一种用于在LED上形成硅树脂透镜的模制工艺。该专利描述了一种用于在半球形清透(clear)透镜上形成半球形的磷光体注入透镜的模制工艺。然而，该实施例仍然没有产生具有非常一致的颜色-视角关系的PC-LED。
一致的颜色-视角关系在光不被混合和漫射的情况下是极为重要的，例如在投影仪、闪光灯(flashlight)、汽车灯中或者在其中光源被直接放大且投射到表面上的相机闪光灯(camera flash)中。在多个PC-LED一起使用并且需要匹配以便跨过屏幕创建均匀的颜色时，一致的颜色-视角关系也是极为重要的。
因此，所需要的是一种具有非常高度可控的颜色-视角关系的PC-LED。
发明内容
描述了一种形成用于PC-LED的多个透镜(包括磷光体注入透镜)的技术，其中与在美国专利No.7322902中相比，更仔细地控制磷光体透镜的特性和效果。
将LED管芯(例如发射可见蓝色光的GaN LED)成阵列地安装到基座晶片上。可以存在数百个安装在晶片上的LED管芯。基座晶片可以是陶瓷衬底、硅衬底或者其他类型的支撑结构，其中LED管芯电连接到该支撑结构上的金属垫。
第一模具在其中具有与基座晶片上的LED管芯的理想位置相对应的第一凹口。这些凹口填充有液态或软化的硅树脂。基座晶片相对于第一模具精确地对准，使得LED浸没到硅树脂中。然后，将硅树脂固化以形成硬化的透镜材料。凹口基本上是具有平坦表面的矩形，因而在每个LED上形成第一清透透镜，其具有大体与LED形状成比例的矩形形状。凹口的深度和宽度足够大，使得在x、y和z方向上基座晶片上LED的最坏情况的错位下透镜也将覆盖LED。z方向上的错位由基座晶片表面的变化以及LED与基座晶片之间的金属结合体的厚度的变化造成。由于基座晶片与模具精确地对准，因而平坦透镜的“顶部”表面将全部处于单一参考平面内。
第二模具具有与第一模具中的第一凹口精确对准的更大的凹口。这些第二凹口具有与LED和第一凹口的形状成比例的基本上矩形的形状。这些第二凹口填充有硅树脂和磷光体的液态或者软化的混合物。然后，将基座晶片相对于第二模具精确地对准，使得LED和第一透镜浸没到硅树脂/磷光体中。然后，使硅树脂固化以形成硬化的第二透镜材料。
由于第一透镜的顶部表面全部处于相同的参考平面内，并且第一和第二凹口彼此精确地对准，因而第二透镜(包含磷光体)的内外表面完全由模具确定，而不是由LED的任何x、y、z错位确定。因此，第二透镜(包含磷光体)的厚度是可预测的且对于基座晶片上的所有LED精确地相同，并且所有透镜同时形成。此外，磷光体层基本上均匀地被蓝色LED照射，使得蓝色光均匀地通过磷光体透镜层泄漏。因此，得到的PC-LED的颜色(或者色度)从LED到LED将是可复现的并且跨过大范围的视角是均匀的。
然后，在磷光体注入第二透镜上模制第三基本上矩形的透镜，其可以比其他透镜更硬并且具有更低的折射率。
基座晶片然后被切割以便分离出各单独的PC-LED。基座/PC-LED然后可以被安装在电路板上或者被封装。
本发明的技术同样适用于其中大多数或者几乎所有LED光(例如蓝色或UV)被磷光体层吸收并且得到的光主要是磷光体层发射的光的PC-LED。这样的PC-LED将在磷光体透镜层中使用高密度的磷光体颗粒。
附图说明
图1为安装在基座晶片上的四个LED管芯的侧视图，其中LED管芯被示为不经意地安装在不同高度和/或稍微错位。
图2为LED管芯插入到第一模具内的凹口中的侧视图，所述第一模具内的凹口填充有(或者部分地填充有)液态(或软化的)内透镜材料以便形成平坦化的第一清透透镜。
图3为浸没到液态透镜材料中的LED管芯以及透镜材料被固化的侧视图。
图4为从第一模具移除之后LED管芯插入到第二模具内的凹口中的侧视图，所述第二模具内的凹口填充有(或者部分地填充有)包含磷光体粉末的液态(或软化的)透镜材料，其中第一清透透镜使得得到的磷光体填充透镜具有精确的内外尺寸。
图5为从第二模具移除之后LED管芯插入到第三模具内的凹口中的侧视图，所述第三模具内的凹口填充有(或者部分地填充有)液态(或软化的)外透镜材料。
图6为在固化外透镜材料的同时浸没到外透镜材料中的LED管芯的侧视图。
图7为具有三个模制透镜的LED管芯的侧视图。
图8为存在有具有三个模制透镜的LED管芯的阵列的基座晶片的前视图。
图9为与基座晶片分开且安装到电路板上的单个倒装芯片LED/基座的截面图。
标记有相同数字的元件是相同或等效的。
具体实施方式
作为初步的问题，常规的LED在生长衬底上形成。在所使用的实例中，LED是用于产生蓝色或UV光的基于GaN的LED，例如AlInGaNLED。典型地，相对较厚的n型GaN层使用常规的技术在蓝宝石生长衬底上生长。该相对较厚的GaN层典型地包括低温成核层以及一个或多个附加层，以便为n型包覆层和有源层提供低缺陷晶格结构。然后，在厚的n型层上形成一个或多个n型包覆层，之后是有源层、一个或多个p型包覆层以及p型接触层(用于金属化)。
各种技术用来获得对于n层的电学接入。在倒装芯片实例中，蚀刻掉p层和有源层的若干部分以暴露n层供金属化。通过这种方式，p接触和n接触处于芯片的相同侧并且可以直接地电附接到基座接触垫。来自n金属接触的电流最初横向流经n层。形成对照的是，在垂直注入(非倒装芯片)LED中，n接触形成于芯片的一侧，并且p接触形成于芯片的另一侧。到p接触或n接触之一的电接触典型地利用导线或金属桥制成，并且另一个接触直接结合到封装(或基座)接触垫。在图1-9的实例中为了简单起见使用了倒装芯片LED。
美国专利No.6649440和No.6274399中描述了形成LED的实例，这两个专利都转让给Philips Lumileds Lighting，LLC并且通过引用合并于此。
图1为安装在基座晶片12上的四个LED管芯10的侧视图。基座晶片12典型地为陶瓷或硅，具有用于连接到印刷电路板的金属引线、封装引线框架或者任何其他结构。衬底晶片12可以是圆形或矩形。在安装到基座晶片12上之前，通过标准的锯切或者划片断裂操作将LED管芯10与生长衬底(例如蓝宝石)上生长的其他LED分开并且通过自动放置机器置于基座晶片12上。LED管芯10上的金属垫通过超声结合而结合到基座晶片12上的相应金凸块。组合的金属垫和金凸块被示为金属结合体14。金凸块通过穿过基座晶片12的导电通路而连接到基座晶片12的底部表面上的结合垫，以便表面安装到电路板。在基座晶片12上可以使用任何金属配置以便提供到电源的连接的端子。在该优选的实施例中，在安装到晶片12上之后，将生长衬底从倒装芯片LED移除。
基座晶片12上的LED管芯10由于公差的原因而存在一定的错位，并且晶片12表面上方的LED管芯10的高度由于金属垫、金凸块和超声结合的公差的原因而在一定程度上变化。图1中示出了这样的非均匀性。
在图2中，第一模具16具有与每个LED管芯10上的第一透镜的期望形状相对应的凹口18。模具16优选地由金属形成。如果需要的话，具有模具16的大体形状的非常薄的不粘膜(未示出)可以置于模具16上以防止硅树脂粘附到金属。如果使用了不粘模具涂层，或者如果使用了导致不粘界面的模制工艺，则不需要该膜。在该优选的实施例中，每个凹口的形状基本上为矩形，以便实现第一透镜的平坦化顶部表面。为了更容易脱离的目的并且为了避免任何亮点，对基本上矩形的凹口的边缘稍微圆化。
在图2中，模具凹口18填充有(或者部分地填充以减少浪费)可热固化液态(或软化的)透镜材料20。透镜材料20可以是任何适当的光学透明材料，比如硅树脂、环氧树脂或者混合硅树脂/环氧树脂。混合物可以用来实现匹配的热膨胀系数(CTE)。硅树脂和环氧树脂具有足够高的折射率(大于1.4)以大大地改善从AlInGaN或AlInGaPLED的光提取。一种类型的适当硅树脂具有1.76的折射率。在该优选的实施例中，透镜材料20在被固化时是柔软的以吸收LED管芯10与固化的透镜材料20之间的CTE之差。
在图3中，衬底晶片12的边缘与模具16上的边缘(或其他参考点)精确对准。应当指出的是，由于LED管芯10安装的公差的原因，LED管芯10在x、y和z方向上不与凹口18精确对准。
真空密封在模具16与基座晶片12的外围之间形成，并且将这两件向彼此挤压，使得每个LED管芯10插入到液态透镜材料20中且透镜材料20受压。
然后，将模具16加热到大约150摄氏度(或其他适当温度)达一定时间以便使透镜材料20硬化。
然后，将基座晶片12与模具16分开，并且透镜材料20可以进一步通过UV或热量固化以便在每个LED管芯10上形成第一清透透镜22(图4)。透镜22封装LED管芯10以便用于保护和热移除并且具有相对于基座晶片12的边缘(或者晶片12上的其他参考点)精确对准的外尺寸。第一清透透镜22具有与LED管芯近似相同的形状，但是稍微更大，以便在LED管芯的最坏情况定位下覆盖整个LED。重要的是，LED管芯10上所有第一清透透镜22的外“顶部”表面处于相同的平坦化参考平面内，因为所有的凹口18是相同的。
在图4中，在与第一模制工艺相同的第二模制工艺中，第二模具26中的模具凹口24填充有(或者部分地填充以便减少浪费)包含磷光体粉末的可热固化液态(或软化的)透镜材料28。除了该磷光体，透镜材料28可以类似于用于内透镜材料20的材料或者可以固化以形成更硬的透镜。取决于要产生的光的期望颜色，磷光体可以是发射黄绿色光的常规YAG磷光体，或者可以是红色磷光体、绿色磷光体、红色磷光体和绿色磷光体的组合或者任何其他磷光体。来自LED管芯10的蓝色光通过磷光体泄漏以将蓝色分量添加到总体光。磷光体的密度以及磷光体层的厚度确定PC-LED的总体颜色。对于从LED到LED的可复现颜色必不可少的是，至少跨过LED的顶部表面，磷光体层厚度从一个LED到下一个LED总是相同的。此外，对于大范围的视角上的颜色均匀性而言，磷光体厚度应当跨过每个LED管芯的整个表面是均匀的，并且基本上相同量的LED光应当照射磷光体层的所有部分。因此，磷光体层的形状应当具有与LED管芯10近似相同的相对尺寸，其基本上是矩形的。
像第一模制工艺一样，基座晶片12的边缘与模具26上的边缘(或其他参考点)精确地对准。应当指出的是，由于凹口18和24相对于模具的边缘(或者用于与基座晶片12对准的其他参考点)精确对准的原因，第一清透透镜22现在与凹口24精确对准。
真空密封在模具26与基座晶片12的外围之间形成，并且将这两件向彼此挤压，使得每个LED管芯10和第一清透透镜22插入到液态透镜材料28中且透镜材料28受压。
然后，将模具26加热到大约150摄氏度(或其他适当温度)达一定时间以便使透镜材料28硬化。
然后，将基座晶片12与模具26分开，并且透镜材料28可以进一步通过UV或热量固化以便在每个第一清透透镜22上形成具有精确的内外尺寸的磷光体注入第二透镜32(图5)。内尺寸由第一清透透镜22规定。外尺寸由凹口24规定，因而第二透镜32全部具有相同的厚度。
在图5和图6中，执行与前面的模制步骤相同的第三模制步骤，但是外透镜材料34(例如硅树脂)应当具有比两种内透镜材料更低的折射率以便更好地将光耦合到空气(n＝1)中。第三模具36的凹口38稍微大于第二模具26的凹口24。凹口38填充有清透液态(或软化的)透镜材料34，并且在真空下使基座晶片12与模具36在一起。图6示出了基座晶片12，其与第三模具36对准，使得凹口38与内清透透镜22和磷光体注入第二透镜32二者对准。得到的外透镜40(图7)应当由硅树脂形成，该硅树脂固化变硬以提供保护和保持清洁。
在一个实施例中，第一清透透镜22的硬度范围为肖氏00 5-90(Shore 00 5-90)，并且清透外透镜40的硬度大于肖氏A 30(Shore A 30)。第二透镜32可以是硬的或者具有中间硬度以吸收CTE之差。
图7示出了与模具36分开之后且在完全固化之后的基座晶片12，其中完全固化以产生硬的外透镜40以用于保护以及改进从PC-LED 50的光提取。外透镜40也可以包含模制的特征，例如粗糙化、棱镜、或者来自凹口38的其他特征，所述特征增大光的提取或者漫射光以实现跨过宽的视角的改进的颜色和亮度均匀性。外透镜40可以是任何形状，例如矩形、半球形、准直的、侧面发射的，或者特定应用所期望的其他形状。
第一和第二透镜层中的每一个的厚度典型地将介于100-200微米之间；然而，在一些实例中，该范围可以是50-250微米或者更厚，这取决于所需磷光体的量和其他因素。外清透透镜可以具有任何厚度，例如从50微米到大于数毫米，这取决于其期望的光学性质。
图8为具有图7的完成的经过晶片加工的PC-LED 50的基座晶片12的前视图。然后，将基座晶片12切割以分离出单独的LED/基座以便安装到电路板上或者用于封装。
图9为通过锯切与基座晶片12分离的基座52上的单个倒装芯片PC-LED 50的一个实施例的简化特写视图。PC-LED 50具有底部p金属接触54、p接触层55、p型层56、发光有源层57、n型层58以及接触n型层58的n金属接触59。基座52上的金属垫直接金属结合到接触54和59。穿过基座52的通路62终止于基座52的底部表面上的金属垫，这些金属垫结合到印刷电路板66上的金属引线64和65。金属引线64和65连接到其他LED或者电源。电路板66可以是具有覆盖绝缘层的金属引线64和65的金属板(例如铝)。
本发明的技术同样适用于其中大多数或者几乎所有LED光(例如蓝色或UV)被磷光体层吸收并且得到的光主要是磷光体层发射的光的PC-LED。这样的PC-LED将在磷光体层中使用高密度的磷光体。这样的PC-LED可以发射琥珀色、红色、绿色或与白色光不同的另一颜色的光。
尽管已经示出和描述了本发明的特定实施例，但是对于本领域技术人员显然的是，可以在不脱离本发明的情况下在其更宽的方面做出若干改变和修改，并且因此所附权利要求应当在其范围内涵盖落入本发明的真实精神和范围之内的所有这样的改变和修改。

Claims (15)

1.一种用于形成磷光体转换发光二极管(PC-LED)的方法，包括：
将多个基本上矩形的LED管芯安装到基座晶片上；
通过压缩模制直接在每个LED管芯上模制基本上矩形的清透的第一透镜，其中，首先用第一透镜材料填充第一模具，然后在将基座晶片与第一模具对准的同时使LED管芯在受压下浸没到第一透镜材料中，之后固化清透的第一透镜材料，并且将LED管芯和清透的第一透镜与第一模具分开，清透的第一透镜封装LED管芯；
通过压缩模制直接在每个清透的第一透镜上模制包含磷光体的基本上矩形的第二透镜以便基本上完全覆盖清透的第一透镜的外表面，其中，首先用包含磷光体的第二透镜材料填充第二模具，然后使LED管芯和清透的第一透镜在受压下浸没到第二透镜材料中，之后固化第二透镜材料，并且将LED管芯、清透的第一透镜和第二透镜与第二模具分开，第二透镜具有与基座晶片上LED管芯在x、y和z方向上的任何错位无关的尺寸，所有第二透镜的顶部表面基本上在单一参考平面内，并且第二透镜的厚度基本上是均匀的；
通过压缩模制直接在每个第二透镜上模制清透的第三透镜以便基本上完全覆盖第二透镜的外表面，其中，首先用第三透镜材料填充第三模具，然后使LED管芯、清透的第一透镜和第二透镜在受压下浸没到第三材料中，之后固化第三透镜材料，并且将LED管芯、清透的第一透镜、第二透镜和清透的第三透镜与第三模具分开；以及
分离基座晶片以形成各单独的PC-LED。
2.权利要求1的方法，其中清透的第三透镜比清透的第一透镜更硬。
3.权利要求1的方法，其中清透的第三透镜具有比清透的第一透镜的折射率更低的折射率。
4.权利要求1的方法，其中基座晶片具有与LED管芯上的金属接触电接触的金属引线。
5.权利要求1的方法，其中清透的第三透镜具有用于影响清透的第三透镜的光学性质的模制特征。
6.权利要求1的方法，其中清透的第一透镜基本上为具有圆化边缘的矩形。
9.权利要求1的方法，其中清透的第一透镜的硬度的范围为肖氏00 5-90，并且清透的第三透镜的硬度大于肖氏A 30。
10.权利要求1的方法，其中LED管芯发射可见蓝色光，并且由PC-LED发射的总体颜色是蓝色光和由第二透镜中的磷光体发射的光的组合。
11.权利要求1的方法，其中LED管芯发射第一光颜色，并且由PC-LED发射的总体颜色主要是由第二透镜中的磷光体发射的光。
12.权利要求1的方法，其中第二透镜包含多种磷光体类型。
13.一种通过下述方法形成的磷光体转换发光二极管(PC-LED)，该方法包括：
将多个基本上矩形的LED管芯安装在基座晶片上；
通过压缩模制直接在每个LED管芯上模制基本上矩形的清透的第一透镜，其中，首先用第一透镜材料填充第一模具，然后在将基座晶片与第一模具对准的同时使LED管芯在受压下浸没到第一透镜材料中，之后固化清透的第一透镜材料，并且将LED管芯和清透的第一透镜与第一模具分开，清透的第一透镜封装LED管芯；
通过压缩模制直接在每个清透的第一透镜上模制包含磷光体的基本上矩形的第二透镜以便基本上完全覆盖清透的第一透镜的外表面，其中，首先用包含磷光体的第二透镜材料填充第二模具，然后使LED管芯和清透的第一透镜在受压下浸没到第二透镜材料中，之后固化第二透镜材料，并且将LED管芯、清透的第一透镜和第二透镜与第二模具分开，第二透镜具有与基座晶片上LED管芯在x、y和z方向上的任何错位无关的尺寸，所有第二透镜的顶部表面基本上在单一参考平面内，并且第二透镜的厚度基本上是均匀的；
通过压缩模制直接在每个第二透镜上模制清透的第三透镜以便基本上完全覆盖第二透镜的外表面，其中，首先用第三透镜材料填充第三模具，然后使LED管芯、清透的第一透镜和第二透镜在受压下浸没到第三材料中，之后固化第三透镜材料，并且将LED管芯、清透的第一透镜、第二透镜和清透的第三透镜与第三模具分开；以及
分离基座晶片以形成各单独的PC-LED。
14.权利要求13的PC-LED，其中清透的第三透镜比清透的第一透镜更硬。
15.权利要求13的PC-LED，其中清透的第三透镜具有比清透的第一透镜的折射率更低的折射率。
16.权利要求13的PC-LED，其中LED管芯发射可见蓝色光，并且由PC-LED发射的总体颜色是蓝色光和由第二透镜中的磷光体发射的光的组合。
17.一种制造期间的中间发光二极管(LED)结构，包括：
基座晶片，其在切割之前具有多个安装于其上的基本上矩形的倒装芯片LED管芯，
每个LED管芯在其上直接模制有基本上矩形的清透的第一透镜，其中每个清透的第一透镜相对于基座晶片而不是相对于LED管芯对准，使得基座上LED管芯的错位不影响每个LED管芯上的清透的第一透镜的位置，
每个清透的透镜在其上直接模制有包含磷光体的基本上矩形的第二透镜以便基本上完全覆盖每个清透的第一透镜的外表面，其中每个第二透镜相对于基座晶片而不是相对于LED管芯对准，由此每个第二透镜具有与基座晶片上LED管芯在x、y和z方向上的任何错位无关的尺寸，所有第二透镜的顶部表面基本上在单一参考平面内，并且第二透镜的厚度从LED管芯到LED管芯基本上是均匀的，以及
每个第二透镜在其上模制有清透的第三透镜以便基本上完全覆盖第二透镜的外表面。
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