CN102198670A - 板材裁切系统 - Google Patents
板材裁切系统 Download PDFInfo
- Publication number
- CN102198670A CN102198670A CN2010101300880A CN201010130088A CN102198670A CN 102198670 A CN102198670 A CN 102198670A CN 2010101300880 A CN2010101300880 A CN 2010101300880A CN 201010130088 A CN201010130088 A CN 201010130088A CN 102198670 A CN102198670 A CN 102198670A
- Authority
- CN
- China
- Prior art keywords
- sheet material
- module
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- input
- button
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/06—Arrangements for feeding or delivering work of other than sheet, web, or filamentary form
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D5/005—Computer numerical control means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/06—Arrangements for feeding or delivering work of other than sheet, web, or filamentary form
- B26D7/0625—Arrangements for feeding or delivering work of other than sheet, web, or filamentary form by endless conveyors, e.g. belts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/04—Processes
- Y10T83/0405—With preparatory or simultaneous ancillary treatment of work
- Y10T83/0443—By fluid application
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/04—Processes
- Y10T83/0448—With subsequent handling [i.e., of product]
- Y10T83/0467—By separating products from each other
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Details Of Cutting Devices (AREA)
- Supply And Installment Of Electrical Components (AREA)
- General Factory Administration (AREA)
Abstract
Description
Claims (13)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010101300880A CN102198670B (zh) | 2010-03-22 | 2010-03-22 | 板材裁切系统 |
US12/914,971 US8554355B2 (en) | 2010-03-22 | 2010-10-28 | System and method for cutting substrate into workpieces |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010101300880A CN102198670B (zh) | 2010-03-22 | 2010-03-22 | 板材裁切系统 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102198670A true CN102198670A (zh) | 2011-09-28 |
CN102198670B CN102198670B (zh) | 2013-10-02 |
Family
ID=44647850
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010101300880A Expired - Fee Related CN102198670B (zh) | 2010-03-22 | 2010-03-22 | 板材裁切系统 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8554355B2 (zh) |
CN (1) | CN102198670B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111791300A (zh) * | 2019-04-04 | 2020-10-20 | 柯尼卡美能达株式会社 | 后处理装置以及图像形成系统 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013202445A1 (de) * | 2013-02-14 | 2014-08-14 | Hilti Aktiengesellschaft | Verfahren zur Steuerung eines Gerätesystems beim Trennen eines Werkstückes entlang einer Trennlinie |
CN103561543A (zh) * | 2013-11-13 | 2014-02-05 | 惠州中京电子科技股份有限公司 | Pcb板沉槽加工方法 |
CN110900698B (zh) * | 2018-09-17 | 2022-02-15 | 荣成纸业股份有限公司 | 裁切计算装置与裁切计算方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06120334A (ja) * | 1992-10-08 | 1994-04-28 | Mitsubishi Electric Corp | シリコンウエハ切断装置 |
CN2410847Y (zh) * | 2000-01-26 | 2000-12-13 | 和椿事业股份有限公司 | 印刷电路板自动切割机 |
JP2003224336A (ja) * | 2001-11-26 | 2003-08-08 | Murata Mfg Co Ltd | モジュール用基板の親基板およびモジュール用基板の端面電極形成方法 |
US20040091141A1 (en) * | 2002-11-13 | 2004-05-13 | Chiu-Tien Hsu | Automatic accurate alignment method for a semiconductor wafer cutting apparatus |
JP2005342813A (ja) * | 2004-05-31 | 2005-12-15 | Yamaha Fine Technologies Co Ltd | 処理装置およびプリント基板の生産方法 |
TWM290359U (en) * | 2005-11-25 | 2006-05-01 | Cheng Uei Prec Ind Co Ltd | Printed circuit board scrap edge removal apparatus |
US7243325B2 (en) * | 2004-07-21 | 2007-07-10 | Bae Systems Information And Electronic Systems Integration Inc. | Method and apparatus for generating a wafer map |
US20080159800A1 (en) * | 2006-12-28 | 2008-07-03 | Fuji Xerox Co., Ltd. | Printing system, cutting device, and cuttting method |
CN201287350Y (zh) * | 2008-02-26 | 2009-08-12 | 英业达股份有限公司 | 板材裁切治具 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2991593B2 (ja) * | 1993-08-19 | 1999-12-20 | 株式会社東京精密 | ダイシング装置の半導体ウェハ形状認識装置 |
US20040112360A1 (en) * | 1998-02-12 | 2004-06-17 | Boucher John N. | Substrate dicing method |
US20020054800A1 (en) * | 1999-12-22 | 2002-05-09 | Hwu Tzong Her | PCB separator having monitoring system for route finding and adjusting purposes |
JP2001308034A (ja) * | 2000-04-19 | 2001-11-02 | Disco Abrasive Syst Ltd | 切削装置 |
IL161627A0 (en) * | 2001-11-06 | 2004-09-27 | Tokyo Seimitsu Co Ltd | Wafer observation position designating apparatus, and wafer display position designating method |
US6960813B2 (en) * | 2002-06-10 | 2005-11-01 | New Wave Research | Method and apparatus for cutting devices from substrates |
US20040092048A1 (en) * | 2002-11-13 | 2004-05-13 | Chiu-Tien Hsu | Angle control system including a display device configured with two imaging windows that simultaneously display the same image captured by a single camera |
TW200512060A (en) | 2003-09-24 | 2005-04-01 | Aurotek Corp | System and method for automatically generating cutting path |
JP2007081037A (ja) * | 2005-09-13 | 2007-03-29 | Disco Abrasive Syst Ltd | デバイスおよびその製造方法 |
DE102006007290B3 (de) | 2006-02-16 | 2007-11-22 | Texmag Gmbh Vertriebsgesellschaft Gmbh | Verfahren zur Einbringung von RFID-Tags in Wellpappe und Materialstück aus Pappe mit RFID-Tag |
US20080003559A1 (en) * | 2006-06-20 | 2008-01-03 | Microsoft Corporation | Multi-User Multi-Input Application for Education |
KR20090054983A (ko) * | 2006-08-08 | 2009-06-01 | 지멘스 에너지 앤드 오토메이션 인코포레이티드 | Plc 모듈 주소를 할당하기 위한 장치들, 시스템들, 및 방법들 |
TW200904287A (en) | 2007-07-06 | 2009-01-16 | Hans Laser Technology Co Ltd | An apparatus and a method for cutting prepreg |
JP2010062375A (ja) * | 2008-09-04 | 2010-03-18 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
US8289388B2 (en) * | 2009-05-14 | 2012-10-16 | Asm Assembly Automation Ltd | Alignment method for singulation system |
-
2010
- 2010-03-22 CN CN2010101300880A patent/CN102198670B/zh not_active Expired - Fee Related
- 2010-10-28 US US12/914,971 patent/US8554355B2/en not_active Expired - Fee Related
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06120334A (ja) * | 1992-10-08 | 1994-04-28 | Mitsubishi Electric Corp | シリコンウエハ切断装置 |
CN2410847Y (zh) * | 2000-01-26 | 2000-12-13 | 和椿事业股份有限公司 | 印刷电路板自动切割机 |
JP2003224336A (ja) * | 2001-11-26 | 2003-08-08 | Murata Mfg Co Ltd | モジュール用基板の親基板およびモジュール用基板の端面電極形成方法 |
US20040091141A1 (en) * | 2002-11-13 | 2004-05-13 | Chiu-Tien Hsu | Automatic accurate alignment method for a semiconductor wafer cutting apparatus |
JP2005342813A (ja) * | 2004-05-31 | 2005-12-15 | Yamaha Fine Technologies Co Ltd | 処理装置およびプリント基板の生産方法 |
US7243325B2 (en) * | 2004-07-21 | 2007-07-10 | Bae Systems Information And Electronic Systems Integration Inc. | Method and apparatus for generating a wafer map |
TWM290359U (en) * | 2005-11-25 | 2006-05-01 | Cheng Uei Prec Ind Co Ltd | Printed circuit board scrap edge removal apparatus |
US20080159800A1 (en) * | 2006-12-28 | 2008-07-03 | Fuji Xerox Co., Ltd. | Printing system, cutting device, and cuttting method |
CN201287350Y (zh) * | 2008-02-26 | 2009-08-12 | 英业达股份有限公司 | 板材裁切治具 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111791300A (zh) * | 2019-04-04 | 2020-10-20 | 柯尼卡美能达株式会社 | 后处理装置以及图像形成系统 |
US11345562B2 (en) | 2019-04-04 | 2022-05-31 | Konica Minolta, Inc. | Post-processing apparatus and image forming system |
Also Published As
Publication number | Publication date |
---|---|
US20110230997A1 (en) | 2011-09-22 |
CN102198670B (zh) | 2013-10-02 |
US8554355B2 (en) | 2013-10-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: 223005 Foxconn Road, Huaian Economic Development Zone, Jiangsu, No. 168 Applicant after: Wang Heng Sheng Electronic Technology (Huaian) Co. Ltd. Co-applicant after: Zhending Technology Co., Ltd. Address before: 223005 Foxconn Road, Huaian Economic Development Zone, Jiangsu, No. 168 Applicant before: Wang Heng Sheng Electronic Technology (Huaian) Co. Ltd. Co-applicant before: Honsentech Co., Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131002 Termination date: 20140322 |