CN102187461B - 具有嵌入的芯片驱动部的显示装置 - Google Patents

具有嵌入的芯片驱动部的显示装置 Download PDF

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Publication number
CN102187461B
CN102187461B CN2009801404584A CN200980140458A CN102187461B CN 102187461 B CN102187461 B CN 102187461B CN 2009801404584 A CN2009801404584 A CN 2009801404584A CN 200980140458 A CN200980140458 A CN 200980140458A CN 102187461 B CN102187461 B CN 102187461B
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display unit
connection gasket
unit according
substrate
little chip
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Chinese (zh)
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CN102187461A (zh
Inventor
罗纳德·史蒂文·科克
约翰·威廉·哈默
达斯廷·李·温特斯
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Global OLED Technology LLC
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Global OLED Technology LLC
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/129—Chiplets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K99/00—Subject matter not provided for in other groups of this subclass

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
CN2009801404584A 2008-08-14 2009-07-21 具有嵌入的芯片驱动部的显示装置 Active CN102187461B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/191,462 US8115380B2 (en) 2008-08-14 2008-08-14 Display device with chiplets
US12/191,462 2008-08-14
PCT/US2009/004201 WO2010019183A1 (en) 2008-08-14 2009-07-21 Display device with embedded chip driving

Publications (2)

Publication Number Publication Date
CN102187461A CN102187461A (zh) 2011-09-14
CN102187461B true CN102187461B (zh) 2013-11-13

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CN2009801404584A Active CN102187461B (zh) 2008-08-14 2009-07-21 具有嵌入的芯片驱动部的显示装置

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US (1) US8115380B2 (enExample)
EP (1) EP2324505A1 (enExample)
JP (1) JP5384639B2 (enExample)
KR (1) KR101235203B1 (enExample)
CN (1) CN102187461B (enExample)
TW (1) TWI381339B (enExample)
WO (1) WO2010019183A1 (enExample)

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TWI811451B (zh) * 2019-01-15 2023-08-11 范文昌 顯示裝置用的導電板

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US8619008B2 (en) * 2009-02-13 2013-12-31 Global Oled Technology Llc Dividing pixels between chiplets in display device
WO2011034586A2 (en) * 2009-09-16 2011-03-24 Semprius, Inc. High-yield fabrication of large-format substrates with distributed, independent control elements
US8587501B2 (en) * 2011-02-17 2013-11-19 Global Oled Technology Llc Electroluminescent display device with optically communicating chiplets
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GB2500579B (en) * 2012-03-23 2015-10-14 Cambridge Display Tech Ltd Semiconductor Application Method and Product
TWI565048B (zh) 2012-05-22 2017-01-01 友達光電股份有限公司 有機發光顯示單元結構與有機發光顯示單元電路
US9601517B2 (en) 2014-10-01 2017-03-21 Apple Inc. Hybrid pixel control circuits for light-emitting diode display
EP3288012B1 (en) 2015-04-20 2022-04-27 Pi-Crystal Incorporation Method for manufacturing active matrix array device, and active matrix array device manufactured thereby
US9640108B2 (en) 2015-08-25 2017-05-02 X-Celeprint Limited Bit-plane pulse width modulated digital display system
TWI624961B (zh) * 2015-11-18 2018-05-21 晶元光電股份有限公司 發光元件及其製造方法，及發光陣列
US10360846B2 (en) 2016-05-10 2019-07-23 X-Celeprint Limited Distributed pulse-width modulation system with multi-bit digital storage and output device
US10453826B2 (en) 2016-06-03 2019-10-22 X-Celeprint Limited Voltage-balanced serial iLED pixel and display
US10832609B2 (en) * 2017-01-10 2020-11-10 X Display Company Technology Limited Digital-drive pulse-width-modulated output system
KR102420079B1 (ko) * 2017-06-16 2022-07-13 삼성디스플레이 주식회사 디스플레이 장치
KR102448482B1 (ko) 2017-12-29 2022-09-27 엘지디스플레이 주식회사 마이크로 칩을 포함하는 표시장치
US11263963B2 (en) 2018-05-09 2022-03-01 Apple Inc. Local passive matrix display
CN112928108B (zh) * 2019-12-05 2025-02-07 同方威视技术股份有限公司 用于探测器的读出芯片
CN111741601B (zh) * 2020-07-09 2021-07-30 复旦大学 一种通用的可配置的有源基板电路结构

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US20070141809A1 (en) * 2004-04-20 2007-06-21 Stmicroelectronics S.R.L. Process for the singulation of integrated devices in thin semiconductor chips

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CN1692389A (zh) * 2002-11-19 2005-11-02 株式会社石川制作所 像素控制元件的选择转印方法、在像素控制元件的选择转印方法中使用的像素控制元件的安装装置、像素控制元件转印后的布线形成方法和平面显示器基片
US20060055864A1 (en) * 2002-11-19 2006-03-16 Ishikawa Seisakusho, Ltd. Pixel control element selection transfer method, pixel control device mounting device used for pixel control element selection transfer method, wiring formation method after pixel control element transfer, and planar display substrate
US20070141809A1 (en) * 2004-04-20 2007-06-21 Stmicroelectronics S.R.L. Process for the singulation of integrated devices in thin semiconductor chips

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI811451B (zh) * 2019-01-15 2023-08-11 范文昌 顯示裝置用的導電板

Also Published As

Publication number Publication date
EP2324505A1 (en) 2011-05-25
CN102187461A (zh) 2011-09-14
KR101235203B1 (ko) 2013-02-20
US20100039357A1 (en) 2010-02-18
JP5384639B2 (ja) 2014-01-08
JP2011530723A (ja) 2011-12-22
TWI381339B (zh) 2013-01-01
TW201030698A (en) 2010-08-16
US8115380B2 (en) 2012-02-14
KR20110044289A (ko) 2011-04-28
WO2010019183A1 (en) 2010-02-18

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