KR101235203B1 - 임베디드 구동 칩을 갖는 디스플레이 디바이스 - Google Patents

임베디드 구동 칩을 갖는 디스플레이 디바이스 Download PDF

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KR101235203B1
KR101235203B1 KR1020117005710A KR20117005710A KR101235203B1 KR 101235203 B1 KR101235203 B1 KR 101235203B1 KR 1020117005710 A KR1020117005710 A KR 1020117005710A KR 20117005710 A KR20117005710 A KR 20117005710A KR 101235203 B1 KR101235203 B1 KR 101235203B1
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chiplet
substrate
line
control
lines
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Korean (ko)
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KR20110044289A (ko
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로널드 스티븐 코크
존 윌리엄 해머
더스틴 리 윈터스
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글로벌 오엘이디 테크놀러지 엘엘씨
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/129—Chiplets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K99/00—Subject matter not provided for in other groups of this subclass

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1020117005710A 2008-08-14 2009-07-21 임베디드 구동 칩을 갖는 디스플레이 디바이스 Active KR101235203B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/191,462 US8115380B2 (en) 2008-08-14 2008-08-14 Display device with chiplets
US12/191,462 2008-08-14
PCT/US2009/004201 WO2010019183A1 (en) 2008-08-14 2009-07-21 Display device with embedded chip driving

Publications (2)

Publication Number Publication Date
KR20110044289A KR20110044289A (ko) 2011-04-28
KR101235203B1 true KR101235203B1 (ko) 2013-02-20

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117005710A Active KR101235203B1 (ko) 2008-08-14 2009-07-21 임베디드 구동 칩을 갖는 디스플레이 디바이스

Country Status (7)

Country Link
US (1) US8115380B2 (enExample)
EP (1) EP2324505A1 (enExample)
JP (1) JP5384639B2 (enExample)
KR (1) KR101235203B1 (enExample)
CN (1) CN102187461B (enExample)
TW (1) TWI381339B (enExample)
WO (1) WO2010019183A1 (enExample)

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GB0819449D0 (en) * 2008-10-23 2008-12-03 Cambridge Display Tech Ltd Display drivers
WO2010088553A2 (en) * 2009-01-30 2010-08-05 Ndsu Research Foundation Infra-extensible led array controller for light emission and/or light sensing
US8619008B2 (en) * 2009-02-13 2013-12-31 Global Oled Technology Llc Dividing pixels between chiplets in display device
WO2011034586A2 (en) * 2009-09-16 2011-03-24 Semprius, Inc. High-yield fabrication of large-format substrates with distributed, independent control elements
US8587501B2 (en) * 2011-02-17 2013-11-19 Global Oled Technology Llc Electroluminescent display device with optically communicating chiplets
DE102011016308A1 (de) * 2011-04-07 2012-10-11 Osram Opto Semiconductors Gmbh Anzeigevorrichtung
GB2500579B (en) * 2012-03-23 2015-10-14 Cambridge Display Tech Ltd Semiconductor Application Method and Product
TWI565048B (zh) 2012-05-22 2017-01-01 友達光電股份有限公司 有機發光顯示單元結構與有機發光顯示單元電路
US9601517B2 (en) 2014-10-01 2017-03-21 Apple Inc. Hybrid pixel control circuits for light-emitting diode display
EP3288012B1 (en) 2015-04-20 2022-04-27 Pi-Crystal Incorporation Method for manufacturing active matrix array device, and active matrix array device manufactured thereby
US9640108B2 (en) 2015-08-25 2017-05-02 X-Celeprint Limited Bit-plane pulse width modulated digital display system
TWI624961B (zh) * 2015-11-18 2018-05-21 晶元光電股份有限公司 發光元件及其製造方法，及發光陣列
US10360846B2 (en) 2016-05-10 2019-07-23 X-Celeprint Limited Distributed pulse-width modulation system with multi-bit digital storage and output device
US10453826B2 (en) 2016-06-03 2019-10-22 X-Celeprint Limited Voltage-balanced serial iLED pixel and display
US10832609B2 (en) * 2017-01-10 2020-11-10 X Display Company Technology Limited Digital-drive pulse-width-modulated output system
KR102420079B1 (ko) * 2017-06-16 2022-07-13 삼성디스플레이 주식회사 디스플레이 장치
KR102448482B1 (ko) 2017-12-29 2022-09-27 엘지디스플레이 주식회사 마이크로 칩을 포함하는 표시장치
US11263963B2 (en) 2018-05-09 2022-03-01 Apple Inc. Local passive matrix display
TWI811451B (zh) * 2019-01-15 2023-08-11 范文昌 顯示裝置用的導電板
CN112928108B (zh) * 2019-12-05 2025-02-07 同方威视技术股份有限公司 用于探测器的读出芯片
CN111741601B (zh) * 2020-07-09 2021-07-30 复旦大学 一种通用的可配置的有源基板电路结构

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WO2000049658A1 (en) 1999-02-16 2000-08-24 Alien Technology Corporation Functionally symmetric integrated circuit die
US20060055864A1 (en) 2002-11-19 2006-03-16 Ishikawa Seisakusho, Ltd. Pixel control element selection transfer method, pixel control device mounting device used for pixel control element selection transfer method, wiring formation method after pixel control element transfer, and planar display substrate

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Patent Citations (2)

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WO2000049658A1 (en) 1999-02-16 2000-08-24 Alien Technology Corporation Functionally symmetric integrated circuit die
US20060055864A1 (en) 2002-11-19 2006-03-16 Ishikawa Seisakusho, Ltd. Pixel control element selection transfer method, pixel control device mounting device used for pixel control element selection transfer method, wiring formation method after pixel control element transfer, and planar display substrate

Also Published As

Publication number Publication date
EP2324505A1 (en) 2011-05-25
CN102187461A (zh) 2011-09-14
US20100039357A1 (en) 2010-02-18
JP5384639B2 (ja) 2014-01-08
JP2011530723A (ja) 2011-12-22
TWI381339B (zh) 2013-01-01
TW201030698A (en) 2010-08-16
US8115380B2 (en) 2012-02-14
CN102187461B (zh) 2013-11-13
KR20110044289A (ko) 2011-04-28
WO2010019183A1 (en) 2010-02-18

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