JP5384639B2 - アクティブマトリックスデバイス - Google Patents

アクティブマトリックスデバイス Download PDF

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Publication number
JP5384639B2
JP5384639B2 JP2011522964A JP2011522964A JP5384639B2 JP 5384639 B2 JP5384639 B2 JP 5384639B2 JP 2011522964 A JP2011522964 A JP 2011522964A JP 2011522964 A JP2011522964 A JP 2011522964A JP 5384639 B2 JP5384639 B2 JP 5384639B2
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Japan
Prior art keywords
connection pad
chiplet
active matrix
matrix device
substrate
Prior art date
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Application number
JP2011522964A
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English (en)
Japanese (ja)
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JP2011530723A (ja
JP2011530723A5 (enExample
Inventor
コック、ロナルド・スティーヴン
ヘイマー、ジョン・ウィリアム
ウィンターズ、ダスティン・リー
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Global OLED Technology LLC
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Global OLED Technology LLC
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Publication date
Application filed by Global OLED Technology LLC filed Critical Global OLED Technology LLC
Publication of JP2011530723A publication Critical patent/JP2011530723A/ja
Publication of JP2011530723A5 publication Critical patent/JP2011530723A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/129—Chiplets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2011522964A 2008-08-14 2009-07-21 アクティブマトリックスデバイス Active JP5384639B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/191,462 US8115380B2 (en) 2008-08-14 2008-08-14 Display device with chiplets
US12/191,462 2008-08-14
PCT/US2009/004201 WO2010019183A1 (en) 2008-08-14 2009-07-21 Display device with embedded chip driving

Publications (3)

Publication Number Publication Date
JP2011530723A JP2011530723A (ja) 2011-12-22
JP2011530723A5 JP2011530723A5 (enExample) 2012-11-29
JP5384639B2 true JP5384639B2 (ja) 2014-01-08

Family

ID=41066776

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011522964A Active JP5384639B2 (ja) 2008-08-14 2009-07-21 アクティブマトリックスデバイス

Country Status (7)

Country Link
US (1) US8115380B2 (enExample)
EP (1) EP2324505A1 (enExample)
JP (1) JP5384639B2 (enExample)
KR (1) KR101235203B1 (enExample)
CN (1) CN102187461B (enExample)
TW (1) TWI381339B (enExample)
WO (1) WO2010019183A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012518199A (ja) * 2009-02-13 2012-08-09 グローバル・オーエルイーディー・テクノロジー・リミテッド・ライアビリティ・カンパニー ディスプレイデバイス内のチップレット間のピクセルの分割

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GB0819449D0 (en) * 2008-10-23 2008-12-03 Cambridge Display Tech Ltd Display drivers
WO2010088553A2 (en) * 2009-01-30 2010-08-05 Ndsu Research Foundation Infra-extensible led array controller for light emission and/or light sensing
WO2011034586A2 (en) * 2009-09-16 2011-03-24 Semprius, Inc. High-yield fabrication of large-format substrates with distributed, independent control elements
US8587501B2 (en) * 2011-02-17 2013-11-19 Global Oled Technology Llc Electroluminescent display device with optically communicating chiplets
DE102011016308A1 (de) * 2011-04-07 2012-10-11 Osram Opto Semiconductors Gmbh Anzeigevorrichtung
GB2500579B (en) * 2012-03-23 2015-10-14 Cambridge Display Tech Ltd Semiconductor Application Method and Product
TWI565048B (zh) 2012-05-22 2017-01-01 友達光電股份有限公司 有機發光顯示單元結構與有機發光顯示單元電路
US9601517B2 (en) 2014-10-01 2017-03-21 Apple Inc. Hybrid pixel control circuits for light-emitting diode display
EP3288012B1 (en) 2015-04-20 2022-04-27 Pi-Crystal Incorporation Method for manufacturing active matrix array device, and active matrix array device manufactured thereby
US9640108B2 (en) 2015-08-25 2017-05-02 X-Celeprint Limited Bit-plane pulse width modulated digital display system
TWI624961B (zh) * 2015-11-18 2018-05-21 晶元光電股份有限公司 發光元件及其製造方法，及發光陣列
US10360846B2 (en) 2016-05-10 2019-07-23 X-Celeprint Limited Distributed pulse-width modulation system with multi-bit digital storage and output device
US10453826B2 (en) 2016-06-03 2019-10-22 X-Celeprint Limited Voltage-balanced serial iLED pixel and display
US10832609B2 (en) * 2017-01-10 2020-11-10 X Display Company Technology Limited Digital-drive pulse-width-modulated output system
KR102420079B1 (ko) * 2017-06-16 2022-07-13 삼성디스플레이 주식회사 디스플레이 장치
KR102448482B1 (ko) 2017-12-29 2022-09-27 엘지디스플레이 주식회사 마이크로 칩을 포함하는 표시장치
US11263963B2 (en) 2018-05-09 2022-03-01 Apple Inc. Local passive matrix display
TWI811451B (zh) * 2019-01-15 2023-08-11 范文昌 顯示裝置用的導電板
CN112928108B (zh) * 2019-12-05 2025-02-07 同方威视技术股份有限公司 用于探测器的读出芯片
CN111741601B (zh) * 2020-07-09 2021-07-30 复旦大学 一种通用的可配置的有源基板电路结构

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JPS5921055A (ja) * 1982-07-26 1984-02-02 Nec Corp 半導体装置
US4769292A (en) 1987-03-02 1988-09-06 Eastman Kodak Company Electroluminescent device with modified thin film luminescent zone
US5061569A (en) 1990-07-26 1991-10-29 Eastman Kodak Company Electroluminescent device with organic electroluminescent medium
US6384529B2 (en) 1998-11-18 2002-05-07 Eastman Kodak Company Full color active matrix organic electroluminescent display panel having an integrated shadow mask
US6291896B1 (en) 1999-02-16 2001-09-18 Alien Technology Corporation Functionally symmetric integrated circuit die
JP2003273082A (ja) 2002-03-14 2003-09-26 Tokyo Electron Ltd プラズマ処理装置及びプラズマ処理方法
JP5022552B2 (ja) 2002-09-26 2012-09-12 セイコーエプソン株式会社 電気光学装置の製造方法及び電気光学装置
JP3474187B1 (ja) * 2002-11-19 2003-12-08 英樹 松村 画素制御素子の選択転写方法、及び、画素制御素子の選択転写方法に使用される画素制御素子の実装装置
JP3617522B2 (ja) * 2002-11-19 2005-02-09 英樹 松村 平面ディスプレイ基板
CN100365673C (zh) * 2002-11-19 2008-01-30 株式会社石川制作所 像素控制元件选择转印后的布线形成方法
AU2003284410A1 (en) 2002-11-19 2004-06-15 Ishikawa Seisakusho, Ltd. Pixel control element selection transfer method, pixel control element mounting device used for pixel control element selection transfer method, wiring formation method after pixel control element transfer, and planar display substrate
US7230594B2 (en) 2002-12-16 2007-06-12 Eastman Kodak Company Color OLED display with improved power efficiency
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ITTO20040244A1 (it) 2004-04-20 2004-07-20 St Microelectronics Srl Procedimento per la fabbricazione di dispositivi integrati in piastrine semiconduttrici a basso spessore
US8217381B2 (en) 2004-06-04 2012-07-10 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
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JP4423285B2 (ja) * 2006-12-19 2010-03-03 新光電気工業株式会社 電子部品内蔵基板および電子部品内蔵基板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012518199A (ja) * 2009-02-13 2012-08-09 グローバル・オーエルイーディー・テクノロジー・リミテッド・ライアビリティ・カンパニー ディスプレイデバイス内のチップレット間のピクセルの分割

Also Published As

Publication number Publication date
EP2324505A1 (en) 2011-05-25
CN102187461A (zh) 2011-09-14
KR101235203B1 (ko) 2013-02-20
US20100039357A1 (en) 2010-02-18
JP2011530723A (ja) 2011-12-22
TWI381339B (zh) 2013-01-01
TW201030698A (en) 2010-08-16
US8115380B2 (en) 2012-02-14
CN102187461B (zh) 2013-11-13
KR20110044289A (ko) 2011-04-28
WO2010019183A1 (en) 2010-02-18

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