CN102164333A - 音响传感器 - Google Patents

音响传感器 Download PDF

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Publication number
CN102164333A
CN102164333A CN2011100033783A CN201110003378A CN102164333A CN 102164333 A CN102164333 A CN 102164333A CN 2011100033783 A CN2011100033783 A CN 2011100033783A CN 201110003378 A CN201110003378 A CN 201110003378A CN 102164333 A CN102164333 A CN 102164333A
Authority
CN
China
Prior art keywords
substrate
electrode plate
acoustic
detection element
rear chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011100033783A
Other languages
English (en)
Chinese (zh)
Inventor
大村英一
小泽尚志
若林秀一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp filed Critical Omron Corp
Publication of CN102164333A publication Critical patent/CN102164333A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00182—Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/031—Anodic bondings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/036—Fusion bonding
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Pressure Sensors (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
CN2011100033783A 2010-02-24 2011-01-10 音响传感器 Pending CN102164333A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP038289/10 2010-02-24
JP2010038289A JP4947168B2 (ja) 2010-02-24 2010-02-24 音響センサ

Publications (1)

Publication Number Publication Date
CN102164333A true CN102164333A (zh) 2011-08-24

Family

ID=44065016

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011100033783A Pending CN102164333A (zh) 2010-02-24 2011-01-10 音响传感器

Country Status (5)

Country Link
US (1) US8300857B2 (https=)
EP (1) EP2360942A3 (https=)
JP (1) JP4947168B2 (https=)
KR (1) KR101205645B1 (https=)
CN (1) CN102164333A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112146789A (zh) * 2020-09-15 2020-12-29 南京慧卉飞电子商务有限公司 一种利用磁流变液的智能化音响检测装置

Families Citing this family (16)

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JP5454345B2 (ja) * 2010-05-11 2014-03-26 オムロン株式会社 音響センサ及びその製造方法
US8969980B2 (en) * 2011-09-23 2015-03-03 Knowles Electronics, Llc Vented MEMS apparatus and method of manufacture
US20130101143A1 (en) * 2011-10-21 2013-04-25 Hung-Jen Chen Micro-electro-mechanical system microphone chip with an expanded back chamber
JP2013143651A (ja) * 2012-01-10 2013-07-22 Nippon Dempa Kogyo Co Ltd ディスク振動子及び電子部品
JP5861497B2 (ja) * 2012-02-29 2016-02-16 オムロン株式会社 センサ装置
ITTO20130247A1 (it) * 2013-03-26 2014-09-27 St Microelectronics Srl Metodo di incapsulamento di un dispositivo trasduttore mems e dispositivo trasduttore mems incapsulato
US9491531B2 (en) 2014-08-11 2016-11-08 3R Semiconductor Technology Inc. Microphone device for reducing noise coupling effect
JP2016058880A (ja) * 2014-09-09 2016-04-21 晶▲めい▼電子股▲ふん▼有限公司 ノイズカップリングの影響を低減させるマイクロフォン装置
EP3195358A4 (en) 2014-09-17 2018-04-25 Intel Corporation DIE WITH INTEGRATED MICROPHONE DEVICE USING THROUGH-SILICON VIAS (TSVs)
US10648879B2 (en) * 2016-02-22 2020-05-12 Kathirgamasundaram Sooriakumar Capacitive pressure sensor
JP2019106616A (ja) * 2017-12-12 2019-06-27 新日本無線株式会社 Ｍｅｍｓ素子
KR102499855B1 (ko) * 2018-05-03 2023-02-13 주식회사 디비하이텍 멤스 마이크로폰 이를 포함하는 멤스 마이크로폰 패키지 및 이의 제조 방법
KR102486584B1 (ko) * 2018-05-03 2023-01-10 주식회사 디비하이텍 멤스 마이크로폰, 이를 포함하는 멤스 마이크로폰 패키지 및 이의 제조 방법
JP2020022038A (ja) * 2018-07-31 2020-02-06 Tdk株式会社 Ｍｅｍｓマイクロフォン
CN111189531B (zh) * 2020-03-09 2025-01-24 西南交通大学 一种用于正弦波面样品轻气炮加载试验的检测系统
US11787690B1 (en) 2020-04-03 2023-10-17 Knowles Electronics, Llc. MEMS assembly substrates including a bond layer

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020172382A1 (en) * 2001-05-18 2002-11-21 Mitsubishi Denki Kabushiki Kaisha Pressure responsive device and method of manufacturing semiconductor substrate for use in pressure responsive device
CN1728888A (zh) * 2004-07-30 2006-02-01 三洋电机株式会社 声敏元件
CN101426164A (zh) * 2007-11-01 2009-05-06 财团法人工业技术研究院 电声感知装置

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US6522762B1 (en) * 1999-09-07 2003-02-18 Microtronic A/S Silicon-based sensor system
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
EP1722596A4 (en) * 2004-03-09 2009-11-11 Panasonic Corp electret
JP4539450B2 (ja) * 2004-11-04 2010-09-08 オムロン株式会社 容量型振動センサ及びその製造方法
JP4188325B2 (ja) * 2005-02-09 2008-11-26 ホシデン株式会社 防塵板内蔵マイクロホン
DE102005053765B4 (de) * 2005-11-10 2016-04-14 Epcos Ag MEMS-Package und Verfahren zur Herstellung
JP4742972B2 (ja) * 2006-04-27 2011-08-10 オムロン株式会社 マイクロフォンの製造方法
TWI319690B (en) * 2006-09-08 2010-01-11 Ind Tech Res Inst Structure and manufacturing method of inversed microphone module and microphone chip component
US7550828B2 (en) * 2007-01-03 2009-06-23 Stats Chippac, Inc. Leadframe package for MEMS microphone assembly
JP2008278476A (ja) 2007-04-05 2008-11-13 Yamaha Corp コンデンサマイク装置のｓｎ比改善方法およびコンデンサマイク装置並びにコンデンサマイク装置搭載機器
KR101008399B1 (ko) * 2007-09-03 2011-01-14 주식회사 비에스이 내벽을 금속성 혹은 전도성 물질로 감싼 세라믹 패키지를이용한 콘덴서 마이크로폰
WO2009051183A1 (ja) * 2007-10-19 2009-04-23 Nhk Spring Co., Ltd. 接続端子、半導体パッケージ、配線基板、コネクタ、およびマイクロコンタクタ
JP2009246779A (ja) * 2008-03-31 2009-10-22 Funai Electric Advanced Applied Technology Research Institute Inc マイクロホンユニット及びその製造方法
EP2252077B1 (en) * 2009-05-11 2012-07-11 STMicroelectronics Srl Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020172382A1 (en) * 2001-05-18 2002-11-21 Mitsubishi Denki Kabushiki Kaisha Pressure responsive device and method of manufacturing semiconductor substrate for use in pressure responsive device
CN1728888A (zh) * 2004-07-30 2006-02-01 三洋电机株式会社 声敏元件
CN101426164A (zh) * 2007-11-01 2009-05-06 财团法人工业技术研究院 电声感知装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112146789A (zh) * 2020-09-15 2020-12-29 南京慧卉飞电子商务有限公司 一种利用磁流变液的智能化音响检测装置

Also Published As

Publication number Publication date
US20110204745A1 (en) 2011-08-25
JP4947168B2 (ja) 2012-06-06
JP2011176531A (ja) 2011-09-08
KR20110097614A (ko) 2011-08-31
EP2360942A3 (en) 2012-03-28
KR101205645B1 (ko) 2012-11-27
EP2360942A2 (en) 2011-08-24
US8300857B2 (en) 2012-10-30

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Application publication date: 20110824