CN102142411A - 一种印刷电路组装板芯片封装部件以及焊接部件 - Google Patents
一种印刷电路组装板芯片封装部件以及焊接部件 Download PDFInfo
- Publication number
- CN102142411A CN102142411A CN2010101045406A CN201010104540A CN102142411A CN 102142411 A CN102142411 A CN 102142411A CN 2010101045406 A CN2010101045406 A CN 2010101045406A CN 201010104540 A CN201010104540 A CN 201010104540A CN 102142411 A CN102142411 A CN 102142411A
- Authority
- CN
- China
- Prior art keywords
- pad
- welding
- welding zone
- chip packaging
- zone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/0939—Curved pads, e.g. semi-circular or elliptical pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/042—Remote solder depot on the PCB, the solder flowing to the connections from this depot
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
Claims (10)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010101045406A CN102142411B (zh) | 2010-02-01 | 2010-02-01 | 一种印刷电路组装板芯片封装部件以及焊接部件 |
EP11736603.9A EP2533617B1 (en) | 2010-02-01 | 2011-01-10 | Printed circuit board with chip package component |
PCT/CN2011/070120 WO2011091721A1 (zh) | 2010-02-01 | 2011-01-10 | 一种印刷电路组装板芯片封装部件以及焊接部件 |
US13/564,483 US8908386B2 (en) | 2010-02-01 | 2012-08-01 | Printed circuit board assembly chip package component and soldering component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010101045406A CN102142411B (zh) | 2010-02-01 | 2010-02-01 | 一种印刷电路组装板芯片封装部件以及焊接部件 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102142411A true CN102142411A (zh) | 2011-08-03 |
CN102142411B CN102142411B (zh) | 2012-12-12 |
Family
ID=44318662
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010101045406A Active CN102142411B (zh) | 2010-02-01 | 2010-02-01 | 一种印刷电路组装板芯片封装部件以及焊接部件 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8908386B2 (zh) |
EP (1) | EP2533617B1 (zh) |
CN (1) | CN102142411B (zh) |
WO (1) | WO2011091721A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102801005A (zh) * | 2012-08-07 | 2012-11-28 | 北京汇冠新技术股份有限公司 | 一种连接件及包含该连接件的电子装置 |
CN104899637A (zh) * | 2015-06-11 | 2015-09-09 | 深圳市科信通信技术股份有限公司 | 一种智能电子标签的生产工艺 |
CN107509319A (zh) * | 2016-06-14 | 2017-12-22 | 华为终端(东莞)有限公司 | 一种底部有焊端的模块 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8480411B1 (en) * | 2012-03-01 | 2013-07-09 | Htc Corporation | Electrical connector and electrical assembly |
JP2014216123A (ja) * | 2013-04-24 | 2014-11-17 | タイコエレクトロニクスジャパン合同会社 | 電気コネクタ組立体及びその実装構造 |
CN103269565B (zh) * | 2013-05-02 | 2015-10-28 | 广东威创视讯科技股份有限公司 | 一种电源模块的封装设计方法 |
CN104320910A (zh) * | 2014-11-13 | 2015-01-28 | 镇江市中协电气有限公司 | 一种电路板焊接结构 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2044494B2 (de) * | 1970-09-08 | 1972-01-13 | Siemens AG, 1000 Berlin u 8000 München | Anschlussflaechen zum anloeten von halbleiterbausteinen in flip chip technik |
US6159608A (en) * | 1995-09-28 | 2000-12-12 | Saint-Gobain Performance Plastics Corporation | Thermoplastic interlayer film |
JP2825085B2 (ja) * | 1996-08-29 | 1998-11-18 | 日本電気株式会社 | 半導体装置の実装構造、実装用基板および実装状態の検査方法 |
JPH11297889A (ja) * | 1998-04-16 | 1999-10-29 | Sony Corp | 半導体パッケージおよび実装基板、ならびにこれらを用いた実装方法 |
JP3681542B2 (ja) * | 1998-07-01 | 2005-08-10 | 富士通株式会社 | プリント回路基板および多段バンプ用中継基板 |
WO2000019532A1 (en) * | 1998-09-30 | 2000-04-06 | Conexant Systems, Inc. | Package for providing improved electrical contact and methods for forming the same |
WO2002039802A2 (en) * | 2000-11-10 | 2002-05-16 | Unitive Electronics, Inc. | Methods of positioning components using liquid prime movers and related structures |
US6867493B2 (en) * | 2000-11-15 | 2005-03-15 | Skyworks Solutions, Inc. | Structure and method for fabrication of a leadless multi-die carrier |
DE10111389A1 (de) * | 2001-03-09 | 2002-09-12 | Heidenhain Gmbh Dr Johannes | Verbund aus flächigen Leiterelementen |
US20030047348A1 (en) * | 2001-09-10 | 2003-03-13 | Rebecca Jessep | Grid array mounting arrangements |
JP3780996B2 (ja) * | 2002-10-11 | 2006-05-31 | セイコーエプソン株式会社 | 回路基板、バンプ付き半導体素子の実装構造、バンプ付き半導体素子の実装方法、電気光学装置、並びに電子機器 |
TWI255156B (en) * | 2005-03-25 | 2006-05-11 | Promise Technology Inc | Circuit board for surface-mount device to be mounted thereon |
KR100726458B1 (ko) * | 2006-01-16 | 2007-06-11 | 삼성전자주식회사 | 기판조립체 |
US7821346B2 (en) * | 2007-08-24 | 2010-10-26 | Cts Corporation | Ovenized oscillator |
JP5393986B2 (ja) * | 2008-01-31 | 2014-01-22 | ピーエスフォー ルクスコ エスエイアールエル | 半導体装置の配線基板、半導体装置、電子装置及びマザーボード |
-
2010
- 2010-02-01 CN CN2010101045406A patent/CN102142411B/zh active Active
-
2011
- 2011-01-10 WO PCT/CN2011/070120 patent/WO2011091721A1/zh active Application Filing
- 2011-01-10 EP EP11736603.9A patent/EP2533617B1/en active Active
-
2012
- 2012-08-01 US US13/564,483 patent/US8908386B2/en active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102801005A (zh) * | 2012-08-07 | 2012-11-28 | 北京汇冠新技术股份有限公司 | 一种连接件及包含该连接件的电子装置 |
CN104899637A (zh) * | 2015-06-11 | 2015-09-09 | 深圳市科信通信技术股份有限公司 | 一种智能电子标签的生产工艺 |
CN104899637B (zh) * | 2015-06-11 | 2018-04-03 | 深圳市科信通信技术股份有限公司 | 一种智能电子标签的生产工艺 |
CN107509319A (zh) * | 2016-06-14 | 2017-12-22 | 华为终端(东莞)有限公司 | 一种底部有焊端的模块 |
Also Published As
Publication number | Publication date |
---|---|
CN102142411B (zh) | 2012-12-12 |
US8908386B2 (en) | 2014-12-09 |
US20120295454A1 (en) | 2012-11-22 |
EP2533617B1 (en) | 2017-12-13 |
EP2533617A4 (en) | 2013-02-13 |
WO2011091721A1 (zh) | 2011-08-04 |
EP2533617A1 (en) | 2012-12-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102142411B (zh) | 一种印刷电路组装板芯片封装部件以及焊接部件 | |
CN202873193U (zh) | 一种pcb板的工艺边及pcb拼板 | |
CN104093268A (zh) | 一种可防止相邻焊盘连锡的pcb板结构 | |
CN204168610U (zh) | 波峰焊治具 | |
CN209283623U (zh) | 一种连接架板及移动终端 | |
CN103415162A (zh) | 钢网开孔的方法 | |
CN202364474U (zh) | 一种手机的pcb板结构 | |
CN202907341U (zh) | 通孔回流焊接器件的焊接结构 | |
CN105578762B (zh) | 一种软硬结合板和移动终端 | |
CN204964822U (zh) | 一种防短路的bosa封装结构 | |
US8780536B2 (en) | Motherboard capable of reducing electromagnetic interference | |
CN202014438U (zh) | 一种smt印刷模板结构 | |
CN103957663A (zh) | 一种组装板间中空焊柱垂直互联结构及制作方法 | |
CN207765639U (zh) | 排针母座和pcb板组件 | |
CN102969292B (zh) | 集成电源模块 | |
CN204392693U (zh) | 一种高密度超密节距焊接板 | |
CN103325712A (zh) | Igbt模块封装焊接辅助装置及系统 | |
CN203084011U (zh) | 一种具有测试接口的柔性印刷线路板及lcd液晶模组 | |
CN110798971A (zh) | 低成本防连锡pcb板 | |
CN208460706U (zh) | 印刷钢网 | |
CN202949654U (zh) | 一种波峰焊炉内的波峰焊治具 | |
CN104979095A (zh) | 一种贴片式led灯电容器 | |
CN101804523B (zh) | 对接型材的焊接方法 | |
CN201846525U (zh) | 一种电路主板散热片及一种电路主板 | |
CN104363698A (zh) | 线路板的列引脚封装结构及封装设计方法和线路板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong. Patentee after: Huawei terminal (Shenzhen) Co.,Ltd. Address before: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong. Patentee before: HUAWEI DEVICE Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20181218 Address after: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee after: HUAWEI DEVICE Co.,Ltd. Address before: 518129 Building 2, B District, Bantian HUAWEI base, Longgang District, Shenzhen, Guangdong. Patentee before: Huawei terminal (Shenzhen) Co.,Ltd. |