CN102108488A - Film coating device - Google Patents
Film coating device Download PDFInfo
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- CN102108488A CN102108488A CN2009103124575A CN200910312457A CN102108488A CN 102108488 A CN102108488 A CN 102108488A CN 2009103124575 A CN2009103124575 A CN 2009103124575A CN 200910312457 A CN200910312457 A CN 200910312457A CN 102108488 A CN102108488 A CN 102108488A
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- plated film
- film coating
- coating apparatus
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Abstract
The invention provides a film coating device, which is used for coating films on a plurality of substrates. The film coating device comprises a film coating cavity and a pumping system, wherein the film coating cavity has a center shaft in the vertical direction; the pumping system is communicated with the center on the top of the film coating cavity and is positioned on the center shaft; and the plurality of substrates are arranged in the direction parallel to the center shaft, and distributed around the center shaft. Therefore, the pumping rates at positions of the plurality of substrates are approximately same, the substrates are positioned in an environment that gas concentration is relative uniform, and the uniformity of the coated films is high.
Description
Technical field
The present invention relates to coating technique, particularly a kind of film coating apparatus.
Background technology
At present, film coating apparatus generally comprises a plated film cavity, an air-bleed system and a target.The plated film cavity comprises the axis of a vertical direction.Target generally is placed on the central authorities of plated film cavity along central axis direction, and a plurality of substrate to be coated is placed along central axis direction, is periphery around target (edge section of plated film cavity).Air-bleed system generally is communicated to the middle part of plated film cavity along central axis direction by a conduit.When plated film began, air-bleed system was evacuated the plated film cavity, and then fed reactant gases to carry out plated film in the plated film cavity.In coating process, the reactant gases that air-bleed system is used for continuing taking away the plated film cavity to be maintaining certain air pressure with the plated film cavity, and then keeps the homogeneity of plated film.Yet, in the pumping process, position (middle part) pumping speed of close conduit is than the pumping speed height away from conduit position (top and the bottom of plated film housing depth direction) in the plated film cavity, caused the gas concentration at plated film cavity middle part littler, and then caused the inhomogeneous of rete than the gas concentration of top and the bottom.
Summary of the invention
In view of this, be necessary to provide a kind of raising plated film inhomogeneity film coating apparatus.
A kind of film coating apparatus, it is used for a plurality of substrates are carried out plated film, and this film coating apparatus comprises a plated film cavity and an air-bleed system.This plated film cavity has the axis of a vertical direction.This air-bleed system is communicated to the central authorities at this plated film cavity top, and is positioned on this axis.These a plurality of substrates are placed along the direction of parallel this axis, and are periphery around this axis.
So, the pumping speed of described a plurality of substrates present position is roughly the same, is in the uniform relatively environment of a gas concentration good uniformity of plated film.
Description of drawings
Fig. 1 is the schematic cross-section of the film coating apparatus of better embodiment of the present invention.
Fig. 2 is the schematic cross-section of the film coating apparatus II-II along the line of Fig. 1.
The main element nomenclature
Embodiment
Please refer to Fig. 1 and Fig. 2, the film coating apparatus 10 of better embodiment of the present invention comprises a plated film cavity 102 and an air-bleed system 200.Plated film cavity 102 has the axis 111 of a vertical direction.This air-bleed system 200 is communicated to the central authorities at plated film cavity 102 tops, and is positioned on the axis 111.
Plated film cavity 102 comprises that an end face 101, bottom surface 107 and one connect the side 105 of end face 101 and bottom surface 107.Side 105 is parallel to axis 111.The central authorities of end face 101 offer an opening 103, and opening 103 is symmetry axis with axis 111, that is, opening 103 is opened in the central authorities at plated film cavity 102 tops.Side 105 successively, evenly offers one first pore 104, second pore 106 and one the 3rd pore 108 downwards along axis 111 directions from end face 101.First pore 104 is connected to one first air feeder, 110, the second pores 106 and is connected to one second air feeder, 112, the three pores 108 and is connected to one the 3rd air feeder 114.Plated film cavity 102 also includes an air inlet port (figure does not show), is used for introducing rare gas element to plated film cavity 102.
Air-bleed system 200 comprises a vacuum fan 202 and a conduit 204, and conduit 204 is connected to opening 103, thereby air-bleed system 200 is communicated to the central authorities at plated film cavity 102 tops.
Be appreciated that first pore 104, second pore 106 and the 3rd pore 108 that can offer greater amt, its position also is not limited to evenly offering of present embodiment.
When plated film began, the central part along axis 111 directions in plated film cavity 102 was placed a cylindric target 116 (as aliging with opening 103), as titanium (Ti); In plated film cavity 102, be placed with a plurality of substrates to be coated 20 along axis 111 directions, a plurality of substrates 20 to be coated and being periphery at (also be periphery around axis 111 simultaneously) around the target 116, thus substrate 20 is arranged on around position around this central part.The negative electrode of a power supply (figure does not show) is connected target 116, and the ground end connects a positive plate (figure does not show) that is positioned at plated film cavity 102 near side 105, to form an electric field between positive plate and target 116.Introduce rare gas element (as argon gas) to plated film cavity 102, simultaneously, first air feeder 110, second air feeder 112 and the 3rd air feeder 114 continue to feed reactant gases in plated film cavity 102 by first pore 104, second pore 106 and the 3rd pore 108 respectively, as nitrogen (N
2).Because effect of electric field, argon gas is ionized into argon ion and electronics, argon ion quickens bombardment target 116 surfaces, make target 116 sputter a large amount of target particles, target particle and reactant gas react, generation is used to be deposited on the compound (figure does not show) on substrate 20 surfaces, as titanium nitride (TiN), and is deposited on substrate 20 surfaces.In this process, for plated film cavity 102 is maintained certain air pressure, air-bleed system 200 continues to take away the gas in the plated film cavity 102.In pumping process, because substrate 20 is periphery around axis 111, its horizontal throw to the center of top of plated film cavity 102 is basic identical, therefore the pumping speed of the position at substrate 20 places is basic identical, so, compound concentrations is also basic identical, and then makes that 20 coatings of substrate are even.
Preferably, film coating apparatus 10 also comprises a cooling unit 300.Cooling unit 300 comprises a body 302 and a kind of cooling fluid 304, as, water.Body 302 comprises 306 and outlets 308 of an inlet, inlet 306 and export 308 and be positioned at outside the bottom surface 107.Body 302 is arranged in the target 116 and with the inwall of target 116 and contacts.Cooling fluid 304 306 enters and from exporting 308 flow processs from entering the mouth, thereby carries out heat exchange with target 116, to reduce the temperature of target 116.
Those skilled in the art will be appreciated that; above embodiment only is to be used for illustrating the present invention; and be not to be used as limitation of the invention; as long as within connotation scope of the present invention, appropriate change and the variation that above embodiment did all dropped within the scope of protection of present invention.
Claims (5)
1. film coating apparatus, be used for a plurality of substrates are carried out plated film, this film coating apparatus comprises a plated film cavity and an air-bleed system, this plated film cavity has the axis of a vertical direction, it is characterized in that: this air-bleed system is communicated to the central authorities at this plated film cavity top, and be positioned on this axis, these a plurality of substrates are placed along the direction of parallel this axis, and are periphery around this axis.
2. film coating apparatus as claimed in claim 1 is characterized in that, this plated film cavity comprises that an end face, bottom surface and one connect this end face and this bottom surface and side that be parallel to this axis.
3. film coating apparatus as claimed in claim 2 is characterized in that, this air-bleed system comprises a vacuum fan and a conduit; The central authorities of this end face offer an edge should in axisymmetric opening, this conduit is communicated with this vacuum fan and this opening.
4. film coating apparatus as claimed in claim 2 is characterized in that, this side offers three pores along this central axis direction, and each inlet mouth is connected to an air feeder.
5. film coating apparatus as claimed in claim 1 is characterized in that, this film coating apparatus also comprises a cylindric target and a cooling unit; This cylindric target is arranged at the central authorities of this plated film cavity along this central axis direction; This cooling unit comprises that a body reaches the cooling fluid at this body internal recycle; This body is arranged in this target and with the inwall of this target and contacts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103124575A CN102108488A (en) | 2009-12-29 | 2009-12-29 | Film coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103124575A CN102108488A (en) | 2009-12-29 | 2009-12-29 | Film coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102108488A true CN102108488A (en) | 2011-06-29 |
Family
ID=44172773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009103124575A Pending CN102108488A (en) | 2009-12-29 | 2009-12-29 | Film coating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102108488A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105369214A (en) * | 2014-10-13 | 2016-03-02 | 蒋绍洪 | Optical-level diamond-like film interval type cylinder coating device and method |
| CN106637140A (en) * | 2016-11-30 | 2017-05-10 | 无锡荣坚五金工具有限公司 | Planetary rotary goods shelf device of nanometer coating equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54105173A (en) * | 1978-02-06 | 1979-08-17 | Anelva Corp | Method of coating formed plastics with metal films |
| JPH03162574A (en) * | 1989-11-17 | 1991-07-12 | Kobe Steel Ltd | Rf sputtering device |
| JPH04228566A (en) * | 1990-05-01 | 1992-08-18 | Uk Atomic Energy Authority | Conductive fiber coating method and apparatus by sputter ion plating |
| JPH10287977A (en) * | 1997-04-14 | 1998-10-27 | Ricoh Co Ltd | Sputtering device |
| CN101469405A (en) * | 2007-12-28 | 2009-07-01 | 北京有色金属研究总院 | Tubular target sputtering equipment with lengthened tubular anode |
-
2009
- 2009-12-29 CN CN2009103124575A patent/CN102108488A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54105173A (en) * | 1978-02-06 | 1979-08-17 | Anelva Corp | Method of coating formed plastics with metal films |
| JPH03162574A (en) * | 1989-11-17 | 1991-07-12 | Kobe Steel Ltd | Rf sputtering device |
| JPH04228566A (en) * | 1990-05-01 | 1992-08-18 | Uk Atomic Energy Authority | Conductive fiber coating method and apparatus by sputter ion plating |
| JPH10287977A (en) * | 1997-04-14 | 1998-10-27 | Ricoh Co Ltd | Sputtering device |
| CN101469405A (en) * | 2007-12-28 | 2009-07-01 | 北京有色金属研究总院 | Tubular target sputtering equipment with lengthened tubular anode |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105369214A (en) * | 2014-10-13 | 2016-03-02 | 蒋绍洪 | Optical-level diamond-like film interval type cylinder coating device and method |
| CN106637140A (en) * | 2016-11-30 | 2017-05-10 | 无锡荣坚五金工具有限公司 | Planetary rotary goods shelf device of nanometer coating equipment |
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Application publication date: 20110629 |